Liquid cooling radiator suitable for high-density chip

Abstract

The utility model discloses a liquid cooling radiator suitable for a high-density chip, which comprises a radiating main body, a radiating cavity is arranged in the radiating main body, the bottom of the radiating main body is fixedly connected with a radiating assembly, one side of the radiating main body is fixedly connected with a liquid return joint and a liquid inlet joint respectively, one end of the liquid return joint is fixedly connected with a liquid return pipe, and the other end of the liquid inlet joint is fixedly connected with a liquid outlet pipe. One end of the liquid inlet connector is fixedly connected with a liquid inlet pipe, one end of the liquid inlet pipe and one end of the liquid return pipe are fixedly connected with a heat dissipation water tank, the front face of the heat dissipation water tank is fixedly connected with a heat dissipation fan and a cold guide plate, the inner side of the heat dissipation fan is fixedly connected with a heat dissipation mechanism, and the front face of the cold guide plate is fixedly connected with a semiconductor chilling plate. Through the arrangement of the cooling fan, the semiconductor chilling plate and the cold guide plate, the liquid can be kept at a low temperature, the situation that the temperature of the liquid rises after absorbing a certain amount of heat, and the efficient cooling effect cannot be kept for a long time is avoided, and therefore the cooling effect of the liquid cooling radiator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling radiators, in particular to a liquid cooling radiator suitable for high-density chips. Background Art

[0002] A chip is an integrated circuit chip designed and manufactured to meet the needs of specific users and specific electronic systems. The characteristic of ASIC chips is that they are oriented to the needs of specific users. Compared with general integrated circuits, ASIC chips have the advantages of smaller size, lower power consumption, improved reliability, improved performance, enhanced confidentiality, and lower cost when mass-produced. Therefore, ASIC chips are currently widely used.

[0003] The patent document with the prior art publication number CN218730901 U provides a new type of high-density ASIC chip-specific grid-type liquid-cooling radiator, which relates to the technical field of heat dissipation equipment, including a metal frame, on which a liquid inlet pipe and a liquid outlet pipe are arranged, a tortuous channel is formed in the metal frame, the liquid inlet pipe is connected to one end of the tortuous channel, and the liquid outlet pipe is connected to the other end of the tortuous channel. The utility model is beneficial in that a tortuous channel is formed in the metal frame, the tortuous channel is for the circulation of heat dissipation liquid medium, the ASIC chip is connected to the bottom surface of the metal frame, and the heat transferred from the ASIC chip to the metal frame will be taken away by the flow of the heat dissipation liquid medium to achieve the purpose of heat dissipation, and there is no need to use a fan for heat dissipation as in the traditional way, and silent operation can be achieved with a long service life.

[0004] However, during the use of existing liquid-cooled radiators, although the purpose of heat dissipation can be achieved through the circulation of liquid and the heat absorption effect of liquid, the temperature of the liquid will rise after absorbing a certain amount of heat. The liquid cannot maintain an efficient heat dissipation effect for a long time, resulting in poor heat dissipation effect of the liquid-cooled radiator. For this reason, we propose a liquid-cooled radiator suitable for high-density chips. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies of the prior art, the utility model provides a liquid cooling radiator suitable for high-density chips to solve the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a liquid-cooled radiator suitable for high-density chips, comprising a heat dissipation body, a heat dissipation cavity is opened inside the heat dissipation body, a heat dissipation assembly is fixedly connected to the bottom of the heat dissipation body, a liquid return joint and a liquid inlet joint are respectively fixedly connected to one side of the heat dissipation body, one end of the liquid return joint is fixedly connected to a liquid return pipe, one end of the liquid inlet joint is fixedly connected to a liquid inlet pipe, one end of the liquid inlet pipe and the liquid return pipe are both fixedly connected to a heat dissipation water tank, a heat dissipation fan and a cold conduction plate are respectively fixedly connected to the front side of the heat dissipation water tank, a heat dissipation mechanism is fixedly connected to the inner side of the heat dissipation fan, and a semiconductor refrigeration sheet is fixedly connected to the front side of the cold conduction plate.

[0009] Preferably, the heat dissipation assembly includes a heat dissipation plate and fixing bolts, the heat dissipation plate is fixedly connected to the bottom of the heat dissipation body, and the fixing bolts are threadedly connected through the four corners of the top of the heat dissipation plate.

[0010] Preferably, the heat dissipation mechanism includes a mounting frame, a fan motor, a fan wheel and fan blades. The mounting frame is fixedly connected to the inner side of the heat dissipation fan, the inner side of the mounting frame is fixedly connected to the fan motor, the driving end of the fan motor is fixedly connected to the fan wheel, and the outer side of the fan wheel is fixedly connected to the fan blades.

[0011] Preferably, a water filling cap is threadedly connected to the top of the heat dissipation water tank, a pump is fixedly connected to the inside of the heat dissipation water tank, and the pump is fixedly connected to the liquid inlet pipe.

[0012] Preferably, the heat dissipation body and the heat dissipation water tank are both hollow structures, and the outer surfaces of the heat dissipation body and the heat dissipation water tank are smooth.

[0013] Preferably, the cold conduction plate is made of copper material, and the cold conduction plate is located in the center of the front side of the heat dissipation water tank.

[0014] (III) Beneficial effects

[0015] The utility model provides a liquid cooling radiator suitable for high-density chips, which has the following beneficial effects:

[0016] (1) This type of liquid-cooled radiator suitable for high-density chips has a cooling fan, a semiconductor cooling sheet and a cooling plate. When using the liquid-cooled radiator, the staff opens the water filling cover and adds cooling liquid to the cooling water tank. After adding, the pump will start to operate, and the pump will extract the liquid in the cooling water tank. The liquid enters the cooling body through the liquid inlet pipe. At this time, the heat applied by the chip to the cooling plate will be absorbed by the liquid, and the liquid will flow back to the cooling water tank through the return pipe. At the same time, the semiconductor cooling sheet will start to operate, and the heating surface of the semiconductor cooling sheet will emit heat. At this time, the fan motor in the cooling fan drives the fan blades on the fan wheel to operate and generate suction. The suction will absorb and diffuse the heat of the semiconductor cooling sheet. At the same time, the cooling surface of the semiconductor cooling sheet will cool and transfer it to the cooling plate, and the cooling plate will cool the liquid so that the liquid can be kept at a low temperature, avoiding the temperature of the liquid rising after absorbing a certain amount of heat, and failing to maintain efficient heat dissipation for a long time, thereby improving the heat dissipation effect of the liquid-cooled radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a cross-sectional view of the heat dissipation water tank of the utility model;

[0019] Figure 3 It is a partial structural schematic diagram of the heat dissipation body of the utility model;

[0020] Figure 4 It is a partial structural schematic diagram of the heat dissipation water tank of the utility model.

[0021] In the figure: 1. heat dissipation body; 101. heat dissipation chamber; 2. heat dissipation plate; 3. fixing bolt; 4. liquid return joint; 5. liquid inlet joint; 6. liquid inlet pipe; 7. liquid return pipe; 8. heat dissipation water tank; 801. pump; 9. water filling cover; 10. heat dissipation fan; 11. mounting frame; 12. fan motor; 13. fan wheel; 14. fan blade; 15. semiconductor refrigeration sheet; 16. cold guide plate. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4The utility model provides a technical solution: a liquid cooling radiator suitable for high-density chips, including a heat dissipation body 1, a heat dissipation cavity 101 is opened inside the heat dissipation body 1, a heat dissipation component is fixedly connected to the bottom of the heat dissipation body 1, a liquid return joint 4 and a liquid inlet joint 5 are respectively fixedly connected to one side of the heat dissipation body 1, one end of the liquid return joint 4 is fixedly connected to a liquid return pipe 7, one end of the liquid inlet joint 5 is fixedly connected to a liquid inlet pipe 6, one end of the liquid inlet pipe 6 and the liquid return pipe 7 are both fixedly connected to a heat dissipation water tank 8, a heat dissipation fan 10 and a cold conduction plate 16 are respectively fixedly connected to the front of the heat dissipation water tank 8, a heat dissipation mechanism is fixedly connected to the inner side of the heat dissipation fan 10, and a semiconductor refrigeration sheet 15 is fixedly connected to the front of the cold conduction plate 16.

[0024] In this embodiment, specifically, the heat dissipation assembly includes a heat sink 2 and fixing bolts 3. The heat sink 2 is fixedly connected to the bottom of the heat dissipation body 1. The fixing bolts 3 are threadedly connected through the four corners of the top of the heat sink 2. By installing the heat sink 2 on the chip and then fixing the fixing bolts 3 in the installation position, the heat sink 2 and the chip can be firmly fixed together.

[0025] In this embodiment, specifically, the heat dissipation mechanism includes a mounting frame 11, a fan motor 12, a fan wheel 13 and fan blades 14. The mounting frame 11 is fixedly connected to the inner side of the heat dissipation fan 10, the inner side of the mounting frame 11 is fixedly connected to the fan motor 12, the driving end of the fan motor 12 is fixedly connected to the fan wheel 13, and the outer side of the fan wheel 13 is fixedly connected to the fan blades 14. By starting the fan motor 12, the fan blades 14 on the fan wheel 13 are driven to operate and generate suction, which will absorb and diffuse the heat of the semiconductor refrigeration plate 15.

[0026] In the present embodiment, specifically, a water filling cover 9 is threadedly connected to the top of the heat dissipation water tank 8, a pump 801 is fixedly connected to the interior of the heat dissipation water tank 8, and the pump 801 is fixedly connected to the liquid inlet pipe 6. By starting the pump 801, the pump 801 extracts the liquid in the heat dissipation water tank 8, and the liquid enters the heat dissipation body 1 through the liquid inlet pipe 6.

[0027] In this embodiment, specifically, the heat dissipation body 1 and the heat dissipation water tank 8 are both hollow structures, and the outer surfaces of the heat dissipation body 1 and the heat dissipation water tank 8 are smooth. The heat dissipation body 1 and the heat dissipation water tank 8 with a hollow structure can better store liquid and make the liquid circulate.

[0028] In this embodiment, specifically, the cold conduction plate 16 is made of copper material, and is located in the center of the front of the heat sink 8. The cold conduction plate 16 made of copper material has a better cooling effect and can better cool the liquid in the heat sink 8.

[0029] Working principle: After the utility model is installed, first check the installation and safety protection of the utility model. When using the liquid cooling radiator, the staff opens the water filling cover 9 and adds the cooling liquid to the cooling water tank 8. After adding, the pump 801 will start to operate, and the pump 801 extracts the liquid in the cooling water tank 8. The liquid enters the cooling body 1 through the liquid inlet pipe 6. At this time, the heat applied by the chip to the heat sink 2 will be absorbed by the liquid, and the liquid will flow back to the cooling water tank 8 through the return pipe 7. At the same time, the semiconductor refrigeration sheet 15 The cooling surface of the semiconductor refrigeration sheet 15 will start to operate, and the heating surface of the semiconductor refrigeration sheet 15 will emit heat. At this time, the fan motor 12 in the heat dissipation fan 10 drives the fan blades 14 on the fan wheel 13 to operate and generate suction. The suction absorbs and diffuses the heat of the semiconductor refrigeration sheet 15. At the same time, the cooling surface of the semiconductor refrigeration sheet 15 will cool and transfer it to the cold conduction plate 16, and the cold conduction plate 16 will cool the liquid to keep the liquid at a lower temperature. This completes the use process of the utility model. The utility model has a simple structure and is safe and convenient to use.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A liquid cooling radiator suitable for high-density chips, comprising a heat dissipation body (1), characterized in that: A heat dissipation cavity (101) is provided inside the heat dissipation body (1), a heat dissipation assembly is fixedly connected to the bottom of the heat dissipation body (1), a liquid return joint (4) and a liquid inlet joint (5) are fixedly connected to one side of the heat dissipation body (1), one end of the liquid return joint (4) is fixedly connected to a liquid return pipe (7), one end of the liquid inlet joint (5) is fixedly connected to a liquid inlet pipe (6), one end of the liquid inlet pipe (6) and the liquid return pipe (7) are fixedly connected to a heat dissipation water tank (8), a heat dissipation fan (10) and a cold conduction plate (16) are fixedly connected to the front of the heat dissipation water tank (8), a heat dissipation mechanism is fixedly connected to the inner side of the heat dissipation fan (10), and a semiconductor refrigeration plate (15) is fixedly connected to the front of the cold conduction plate (16).

2. The liquid cooling radiator suitable for high-density chips according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation plate (2) and fixing bolts (3); the heat dissipation plate (2) is fixedly connected to the bottom of the heat dissipation body (1); and the fixing bolts (3) are threadedly connected through the four corners of the top of the heat dissipation plate (2).

3. The liquid cooling radiator suitable for high-density chips according to claim 1, characterized in that: The heat dissipation mechanism comprises a mounting frame (11), a fan motor (12), a fan wheel (13) and a fan blade (14); the mounting frame (11) is fixedly connected to the inner side of the heat dissipation fan (10); the inner side of the mounting frame (11) is fixedly connected to the fan motor (12); the driving end of the fan motor (12) is fixedly connected to the fan wheel (13); and the outer side of the fan wheel (13) is fixedly connected to the fan blade (14).

4. The liquid cooling radiator suitable for high-density chips according to claim 1, characterized in that: The top of the heat dissipation water tank (8) is threadedly connected to a water filling cap (9), the interior of the heat dissipation water tank (8) is fixedly connected to a pump (801), and the pump (801) is fixedly connected to a liquid inlet pipe (6).

5. The liquid cooling radiator suitable for high-density chips according to claim 1, characterized in that: The heat dissipation body (1) and the heat dissipation water tank (8) are both hollow structures, and the outer surfaces of the heat dissipation body (1) and the heat dissipation water tank (8) are smooth.

6. The liquid cooling radiator suitable for high-density chips according to claim 1, characterized in that: The cold conduction plate (16) is made of copper material and is located in the middle of the front of the heat dissipation water tank (8).

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