High-power high-density power supply module and device

Abstract

The utility model belongs to the technical field of power supply modules, and particularly relates to a high-power high-density power supply module and device, which comprises a shell, radiating fins and a turntable, a heat dissipation cover is arranged at the top of the shell, a power supply module circuit board and a power supply back plate are arranged in an inner cavity of the shell, the power supply module circuit board and the power supply back plate are connected through golden fingers, and heat conduction layers are arranged on the top surfaces of the power supply module circuit board and the power supply back plate; the heat dissipation fins are arranged at the top of the heat dissipation cover, heat dissipation holes are formed in the surfaces of the heat dissipation fins, the bottoms of the heat dissipation fins penetrate through the heat dissipation cover and are provided with heat conduction columns, heat conduction pieces are arranged at the bottoms of the heat conduction columns, and the heat conduction pieces make contact with the heat conduction layer; the rotating discs are arranged at the four corners of the shell, and a curved frame is arranged on one side of each rotating disc. The LED lamp is reasonable in structure, convenient to mount and dismount in the using process, good in stability, high in flexibility, good in heat dissipation performance and long in service life.

Description

Technical Field

[0001] The utility model relates to the technical field of power modules, in particular to a high-power and high-density power module and a device. Background Art

[0002] The power module is a power supply on a circuit board. Its characteristic is that it can provide power for application-specific integrated circuits, digital signal processors, microprocessors, memories, field programmable gate arrays and other digital or analog loads. Generally speaking, this type of module is called a point-of-load power supply system or a point-of-use power supply system. Due to the many advantages of the modular structure, modular power supplies are widely used in switching equipment, access equipment, mobile communications, microwave communications, optical transmission, routers and other communication fields, as well as automotive electronics, aerospace, etc.

[0003] The existing high-power and high-density power supply module has some shortcomings during use, such as poor heat dissipation performance, inconvenient installation and disassembly, and low flexibility. For this reason, we propose a new type of high-power and high-density power supply module and device. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the problems existing in the prior art, the present utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a high-power and high-density power supply module and device, which is easy to install and disassemble during use, has good stability and high flexibility, and at the same time has good heat dissipation performance and long service life.

[0007] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0008] A high-power and high-density power supply module and device, comprising a housing, a heat dissipation fin and a rotating disk;

[0009] in,

[0010] A heat dissipation cover is provided on the top of the shell, a power module circuit board and a power backplane are provided in the inner cavity of the shell, and the power module circuit board and the power backplane are connected through gold fingers, and a heat conductive layer is provided on the top surfaces of the power module circuit board and the power backplane;

[0011] The heat dissipation fins are arranged on the top of the heat dissipation cover, the surfaces of the heat dissipation fins are provided with heat dissipation holes, the bottoms of the heat dissipation fins penetrate the heat dissipation cover and are provided with heat conduction columns, the bottoms of the heat conduction columns are provided with heat conduction sheets, and the heat conduction sheets are in contact with the heat conduction layer;

[0012] The turntable is arranged at the four corners of the shell, a curved frame is arranged on one side of the turntable, a threaded sleeve is arranged on one side of the curved frame, a threaded rod is arranged in the inner cavity of the threaded sleeve, a knob is arranged at one end of the threaded rod, and a clamp is arranged at the other end of the threaded rod.

[0013] As a preferred solution of the high-power and high-density power supply module and device described in the utility model, a sealing ring is provided at the connection between the heat dissipation cover and the shell.

[0014] As a preferred solution of the high-power and high-density power supply module and device described in the utility model, the heat-conducting layer is a silicone grease coating.

[0015] As a preferred solution of a high-power and high-density power supply module and device described in the utility model, a bracket is arranged on one side of the top of the shell, a mounting plate is arranged on the top of the bracket, and a cooling fan is arranged on one side of the mounting plate.

[0016] As a preferred solution of the high-power and high-density power supply module and device described in the utility model, the surface of the knob is provided with anti-slip convex patterns.

[0017] As a preferred solution of the high-power and high-density power supply module and device described in the utility model, a rubber gasket is provided on the surface of the clamping plate, and the clamping plate is connected to the threaded rod through a shaft sleeve.

[0018] As a preferred solution of a high-power and high-density power supply module and device described in the utility model, it includes a high-power and high-density power supply module described in any one of the above.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] A heat dissipation cover is arranged on the top of the shell, heat dissipation fins are arranged on the heat dissipation cover, heat dissipation holes are arranged on the surface of the heat dissipation fins, heat conduction columns and heat conduction sheets are arranged on the bottom of the heat dissipation fins, and the heat conduction sheets are attached to the power module circuit board and the heat conduction layer on the top of the power backplane, so as to ensure that the heat generated by the system can be dissipated in time within a limited space;

[0021] In addition, through the coordination of the turntable, the curved frame, the threaded sleeve, the threaded rod, the knob and the clamping plate, it is convenient to install and disassemble, has good stability and high flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0023] Figure 1 It is a schematic diagram of the structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0025] Figure 3 It is a schematic diagram of the bottom structure of the heat dissipation cover of the utility model.

[0026] In the figure; 100 housing, 110 heat dissipation cover, 120 power module circuit board, 130 power backplane, 140 gold finger, 150 thermal conductive layer, 200 heat dissipation fins, 210 heat dissipation holes, 220 thermal conductive columns, 230 thermal conductive sheets, 240 brackets, 250 mounting plates, 260 cooling fans, 300 turntables, 310 curved frames, 320 threaded sleeves, 330 threaded rods, 340 knobs, and 350 splints. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0030] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] The utility model provides the following technical solutions: a high-power and high-density power supply module and device, which is easy to install and disassemble during use, has good stability and high flexibility, and at the same time has good heat dissipation performance and long service life;

[0032] Figures 1 to 3 The figure shows a schematic diagram of the structure of a high-power and high-density power supply module and device according to an embodiment of the utility model, wherein the main body thereof includes a housing 100, heat dissipation fins 200 and a rotating disk 300;

[0033] Please refer again Figures 1 to 3 : A heat dissipation cover 110 is installed on the top of the shell 100, and a sealing ring is installed at the connection between the heat dissipation cover 110 and the shell 100. The inner cavity of the shell 100 is provided with a power module circuit board 120 and a power backplane 130, and the power module circuit board 120 and the power backplane 130 are connected by a gold finger 140. The top surfaces of the power module circuit board 120 and the power backplane 130 are coated with a heat conductive layer 150, and the heat conductive layer 150 is a silicone grease coating. Further, the shell 100 is used to carry the power module circuit board 120 and the power backplane 130, the heat dissipation cover 110 is used to carry the heat dissipation fins 200 and the sealed shell 100, and the heat conductive layer 150 is used for heat transfer;

[0034] Please refer again Figures 1 to 3 :The heat dissipation fin 200 is installed on the top of the heat dissipation cover 110, and the surface of the heat dissipation fin 200 is provided with a heat dissipation hole 210. The bottom of the heat dissipation fin 200 penetrates the heat dissipation cover 110 and is provided with a heat conducting column 220. The bottom of the heat conducting column 220 is provided with a heat conducting sheet 230, and the heat conducting sheet 230 is in contact with the heat conducting layer 150. A bracket 240 is installed on one side of the top of the shell 100, and a mounting plate 250 is fixed on the top of the bracket 240. A heat dissipation fan 260 is installed on one side of the mounting plate 250, and the heat dissipation fan 260 is directly facing the heat dissipation fin 200. Further, the heat dissipation fin 200 and the heat dissipation hole 210 are used to improve the heat dissipation performance, the heat conducting column 220 and the heat conducting sheet 230 are used to conduct the internal heat to the outside, the bracket 240 and the mounting plate 250 are used to carry the heat dissipation fan 260, and the heat dissipation fan 260 is used to dissipate the heat of the heat dissipation fin 200;

[0035] Please refer again Figures 1 to 3: The turntable 300 is installed at the four corners of the shell 100, and a curved frame 310 is installed on one side of the turntable 300, and a threaded sleeve 320 is installed on one side of the curved frame 310. A threaded rod 330 is installed in the inner cavity of the threaded sleeve 320, and a knob 340 is installed at one end of the threaded rod 330. A clamping plate 350 is installed at the other end of the threaded rod 330. The surface of the knob 340 is provided with anti-slip convex grooves, and a rubber gasket is bonded to the surface of the clamping plate 350. The clamping plate 350 is connected to the threaded rod 330 through a shaft sleeve. Further, the turntable 300 is used to adjust the angle of the curved frame 310 to facilitate installation at different angles. The curved frame 310 is used to carry the threaded sleeve 320, and the threaded sleeve 320, the threaded rod 330, the knob 340 and the clamping block are used for clamping and fixing.

[0036] Working principle: During the use of the utility model, a heat dissipation cover 110 is arranged on the top of the shell 100, heat dissipation fins 200 are arranged on the heat dissipation cover 110, heat dissipation holes 210 are arranged on the surface of the heat dissipation fins 200, and heat conductive columns 220 and heat conductive sheets 230 are arranged at the bottom of the heat dissipation fins 200. The heat conductive sheets 230 are in contact with the power module circuit board 120 and the heat conductive layer 150 on the top of the power backplane 130, thereby ensuring that the heat generated by the system can be dissipated in time within a limited space. In addition, through the cooperation of the turntable 300, the curved frame 310, the threaded sleeve 320, the threaded rod 330, the knob 340 and the clamping plate 350, it is convenient to install and disassemble, with good stability and high flexibility.

[0037] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A high-power and high-density power module, characterized in that: It comprises a housing (100), heat dissipation fins (200) and a rotating disk (300); in, A heat dissipation cover (110) is arranged on the top of the housing (100), a power module circuit board (120) and a power back plate (130) are arranged in the inner cavity of the housing (100), and the power module circuit board (120) and the power back plate (130) are connected via a gold finger (140), and a heat conductive layer (150) is arranged on the top surface of the power module circuit board (120) and the power back plate (130); The heat dissipation fin (200) is arranged on the top of the heat dissipation cover (110), the surface of the heat dissipation fin (200) is provided with a heat dissipation hole (210), the bottom of the heat dissipation fin (200) penetrates the heat dissipation cover (110) and is provided with a heat conduction column (220), the bottom of the heat conduction column (220) is provided with a heat conduction sheet (230), and the heat conduction sheet (230) is in contact with the heat conduction layer (150); The turntable (300) is arranged at four corners of the housing (100); a curved frame (310) is arranged on one side of the turntable (300); a threaded sleeve (320) is arranged on one side of the curved frame (310); a threaded rod (330) is arranged in the inner cavity of the threaded sleeve (320); a knob (340) is arranged at one end of the threaded rod (330); and a clamping plate (350) is arranged at the other end of the threaded rod (330).

2. A high-power and high-density power supply module according to claim 1, characterized in that: A sealing ring is provided at the connection between the heat dissipation cover (110) and the housing (100).

3. The high-power and high-density power module according to claim 1, characterized in that: The heat-conducting layer (150) is a silicone grease coating.

4. The high-power and high-density power module according to claim 1, characterized in that: A bracket (240) is arranged on one side of the top of the housing (100), a mounting plate (250) is arranged on the top of the bracket (240), and a heat dissipation fan (260) is arranged on one side of the mounting plate (250).

5. The high-power and high-density power module according to claim 1, characterized in that: The surface of the knob (340) is provided with anti-slip convex patterns.

6. The high-power and high-density power module according to claim 1, characterized in that: A rubber gasket is provided on the surface of the clamping plate (350), and the clamping plate (350) is connected to the threaded rod (330) via a shaft sleeve.

7. A device, characterized in that: A high-power and high-density power supply module comprising any one of claims 1-6.

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