Air-conditioning garment with double-layer structure

Through the double-layer structure air conditioning suit, the design of the inner layer fabric of the ventilation mesh cloth and the airflow circulation chamber, combined with the connection of the refrigeration and heat dissipation ends of the semiconductor refrigeration components, the problem of poor heat dissipation effect of existing air conditioning suits in high temperature environments is solved. , achieving double cooling and effective heat dissipation.

CN222236774UActive Publication Date: 2024-12-27GONGQINGCHENG CHAONENG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202323665051.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2024-12-27
Estimated Expiration
2033-12-29

AI Technical Summary

Technical Problem

The existing air-conditioning clothes have poor heat dissipation effect in high-temperature environments. The single-layer structure causes the refrigeration device to be directly exposed to the sun. The fan and cooling device are installed on the single-layer clothing, resulting in expansion and heat not being dissipated. The air circulation is insufficient, and effective cooling cannot be achieved.

Method used

The air-conditioning suit adopts a double-layer structure, the inner layer fabric is an air-permeable mesh cloth, the refrigeration end of the semiconductor refrigeration component is close to the body, and an air flow circulation cavity is formed between the outer layer fabric and the inner layer fabric. The air blower fan works to circulate and flow. Combined with the heat dissipation end of the semiconductor refrigeration component, it is connected to the outer fabric to achieve air circulation and heat dissipation.

Benefits of technology

The dual cooling effect is achieved, the expansion and heat dissipation problems caused by the single-layer structure are overcome, the heat dissipation efficiency is improved, and the refrigeration device is effectively cooled in the outdoor environment.

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Abstract

The utility model relates to the technical field of air-conditioning clothes, in particular to an air-conditioning clothes with a double-layer structure, which comprises a clothes main body and a semiconductor refrigeration assembly, the clothes main body comprises an outer layer fabric and an inner layer fabric, an air flow circulation cavity is formed between the outer layer fabric and the inner layer fabric, and the semiconductor refrigeration assembly is positioned in the air flow circulation cavity; the outer layer fabric is provided with a blower fan, one end of the semiconductor refrigeration assembly is arranged as a refrigeration end, the other end of the semiconductor refrigeration assembly is arranged as a heat dissipation end, the refrigeration end of the semiconductor refrigeration assembly is connected with the inner layer fabric, and the heat dissipation end of the semiconductor refrigeration assembly is connected with the outer layer fabric. The air conditioner is novel in structure, the refrigerating end of the semiconductor refrigerating assembly is tightly attached to the body of a user, and the refrigerating and cooling effects are achieved; the air blowing fan works to blow air into the air flow circulating cavity, and air circularly flows in the air flow circulating cavity; due to the arrangement of the double-layer structure of the inner-layer fabric and the outer-layer fabric, the double-cooling effect can be achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of air-conditioning clothing, in particular to an air-conditioning clothing with a double-layer structure. Background Art

[0002] For workers who work outdoors for a long time, such as construction workers, sanitation workers on duty, traffic police, miners, etc., due to the limitations and requirements of working conditions, they need to wear thick special clothing with poor air permeability. In addition, the outdoor temperature is too high, and they cannot dissipate heat and cool down in time, which affects their work efficiency and health. Existing air-conditioned clothing usually uses air cooling to dissipate heat. By installing a fan on the clothes, the air-conditioned clothing is only equipped with a fan to blow natural wind to cool down. The cooling effect depends on the room temperature. Often, hot air is blown in a high-temperature outdoor environment, and the heat dissipation effect is not obvious. At present, there are air-conditioning clothes with semiconductors on the market. They only simply fix the cooling sheet on the air-conditioning clothes and put it close to the human body for cooling. Because there is no air circulation outside, the heat dissipation effect is not obvious, resulting in unsatisfactory cooling effect. When wearing the air-conditioning clothes, only the cooling sheet is cooled, and other parts will be stuffy and hot, with poor cooling effect. Furthermore, some air-conditioning clothes currently install fans and cooling devices on single-layer air-conditioning clothes at the same time. The operation of the fan causes the clothes to expand, and the cooling sheet cannot be close to the human body, resulting in poor cooling effect. If the fan is close to the human body, there is no channel for air flow, and a good cooling effect cannot be achieved. In addition, the air-conditioning clothes with cooling devices on the market are all single-layer, resulting in the cooling device being directly exposed to the sun when worn outdoors in summer, and the cooling sheet heats up. The high outdoor temperature environment is superimposed on the direct sunlight, and the temperature of the hot surface of the cooling device is difficult to dissipate. The working principle of the cooling sheet is temperature difference cooling. The heat of the hot surface is not dissipated but directly transferred to the cold surface, resulting in the cooling sheet having no cooling effect in the outdoor high temperature environment. Summary of the invention

[0003] In view of the problems in the prior art, the utility model provides an air-conditioning suit with a double-layer structure. The utility model has a novel structure and utilizes the cooling end of a semiconductor refrigeration component to be close to the user's body to achieve a cooling and temperature reduction effect. When the blower fan works, it blows air into the air circulation cavity, and the air circulates in the air circulation cavity, and passes through the air-permeable mesh structure of the inner fabric to remove sweat from the user's body and cool down the user. Due to the double-layer structure of the inner fabric and the outer fabric, a double cooling effect can be achieved.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] The utility model provides an air-conditioning clothing with a double-layer structure, comprising a clothing body and a semiconductor refrigeration component, the clothing body comprising an outer fabric layer and an inner fabric layer, the outer fabric layer and the inner fabric layer being connected to form an airflow circulation cavity, the semiconductor refrigeration component being located in the airflow circulation cavity; the outer fabric layer is provided with a blower fan, one end of the semiconductor refrigeration component is set as a cooling end, the other end of the semiconductor refrigeration component is set as a heat dissipation end, the cooling end of the semiconductor refrigeration component is connected to the inner fabric layer, and the heat dissipation end of the semiconductor refrigeration component is connected to the outer fabric layer.

[0006] Wherein, the cooling end of the semiconductor refrigeration component is detachably connected to the inner layer of fabric, and the heat dissipation end of the semiconductor refrigeration component is detachably connected to the outer layer of fabric.

[0007] Wherein, the inner layer fabric is configured as a breathable mesh structure.

[0008] The semiconductor refrigeration component includes a main shell, a heat dissipation fan, a semiconductor refrigeration sheet, a semiconductor heat sheet cold surface copper foil cover, a radiator and a heat dissipation motor. The main shell is provided with an inner cavity, a refrigeration sheet bracket is installed at one end of the inner cavity, the semiconductor refrigeration sheet is installed on the refrigeration sheet bracket, the semiconductor heat sheet cold surface copper foil cover is installed at one end of the main shell, the radiator is installed at one end of the inner cavity, the semiconductor refrigeration sheet is located between the radiator and the conductor heat sheet cold surface copper foil cover, the heat dissipation motor is installed in the main shell, the heat dissipation fan is rotatably arranged in the main shell, the output end of the heat dissipation motor is coaxially driven and connected to the heat dissipation fan, the other end of the main shell is provided with a hot surface exhaust port connected to the inner cavity, the outer wall of the main shell is annularly provided with a plurality of cooling air inlets, and the cooling air inlet is connected to the inner cavity of the main shell; the heat dissipation fan is used to inhale air from the cooling air inlet and discharge it from the hot surface exhaust port.

[0009] Preferably, the position of the radiator is arranged corresponding to the position of the cooling air inlet.

[0010] Preferably, the heat sink is an aluminum heat sink.

[0011] Among them, the inner layer of fabric is provided with a first opening, and the outer layer of fabric is provided with a second opening, the first opening and the second opening are arranged correspondingly, an inner clamping ring is installed in the first opening, and an outer clamping ring is installed in the second opening, the cooling end of the semiconductor refrigeration component is detachably connected to the inner clamping ring, and the heat dissipation end of the semiconductor refrigeration component is detachably connected to the outer clamping ring.

[0012] Wherein, a neck air outlet is formed between the upper end of the outer layer fabric and the upper end of the inner layer fabric, and the neck air outlet is connected to the airflow circulation cavity through the semiconductor refrigeration component.

[0013] The outer fabric layer is provided with a mounting hole, the blower fan is installed in the mounting hole, and a zipper slot is also provided in the outer fabric layer near the mounting hole, and the zipper body is installed in the zipper slot.

[0014] Preferably, a heat-insulating coating is provided on the outer fabric.

[0015] Beneficial effects of the utility model:

[0016] The utility model has a novel structure. When in use, the user wears the main body of the clothing, the inner fabric contacts the user's body, and the refrigeration end of the semiconductor refrigeration component is close to the user's body, so as to achieve the effect of cooling and cooling; the outer fabric is located on the outside of the inner fabric, and the blower fan blows air into the air flow circulation cavity, and the air circulates in the air flow circulation cavity, and the user's body is sweated and cooled through the air-permeable mesh structure of the inner fabric; since a double-layer structure of the inner fabric and the outer fabric is provided, a double cooling effect can be achieved, and at the same time, the technical problem that the fan and the cooling device are installed on the air-conditioning clothing with a single-layer structure at the same time, resulting in the expansion of the clothing and the inability of the cooling plate to be close to the human body, can be overcome; it can also solve the technical problem that the air-conditioning clothing in the prior art is that the single-layer structure leads to the cooling device being directly exposed to the sun when worn outdoors in summer, affecting the cooling effect, and the technical problem that the cooling plate is simply fixed on the air-conditioning clothing close to the human body for cooling, because there is no air circulation outside, resulting in only the cooling plate being cooled when the air-conditioning clothing is worn, and other parts will be relatively stuffy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model is a schematic structural diagram of a double-layer air-conditioning clothing.

[0018] Figure 2 The utility model is a schematic diagram of the working state of a double-layer air-conditioning clothing.

[0019] Figure 3 It is a schematic diagram of the air flow state of the air circulation cavity, the semiconductor refrigeration component and the blower fan of the utility model.

[0020] Figure 4 It is a schematic diagram of the structure of the utility model after the outer fabric, the blower fan and the semiconductor refrigeration component are hidden.

[0021] Figure 5 It is a schematic structural diagram of the outer fabric of the utility model.

[0022] Figure 6This is a structural exploded diagram of the cooperation between the semiconductor refrigeration component and the inner layer fabric and the outer layer fabric of the utility model.

[0023] Figure 7 It is a structural cross-sectional view of the semiconductor refrigeration component of the utility model in cooperation with the inner clamping ring and the outer clamping ring.

[0024] exist Figures 1 to 7 Reference numerals in the drawings include:

[0025] 1. Garment body; 2. Semiconductor refrigeration component; 3. Outer fabric; 4. Inner fabric; 5. Air circulation cavity; 6. Blower fan; 7. Main shell; 8. Cooling fan; 9. Semiconductor refrigeration plate; 10. Semiconductor heat plate cold surface copper foil cover; 11. Radiator; 12. Cooling motor; 13. Refrigeration plate bracket; 14. Hot surface exhaust port; 15. Cooling air inlet; 16. First opening; 17. Second opening; 18. Inner retaining ring; 19. Outer retaining ring; 20. Neck air outlet; 21. Internal thread; 22. External thread; 23. Mounting hole; 24. Zipper slot; 25. Battery pocket; 26. Shoulder strap; 27. Elastic buckle. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiment is only one embodiment of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the utility model. It is understandable that the drawings are only provided for reference and illustration, and are not used to limit the utility model. The connection relationship shown in the drawings is only for the convenience of clear description and does not limit the connection method.

[0027] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component, or there may be an intermediate component at the same time. Unless otherwise defined, all technical and scientific terms used in this document have the same meaning as those generally understood by technicians in the technical field of the present invention. It should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The terms used in this document in the specification of the present utility model are only for the purpose of describing specific embodiments, and are not intended to limit the present utility model.

[0028] It should also be noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0029] like Figures 1 to 7 As shown, a double-layer air-conditioning clothing includes a clothing body 1 and a semiconductor refrigeration component 2, the clothing body 1 includes an outer fabric 3 and an inner fabric 4, the outer fabric 3 and the inner fabric 4 are connected to form an airflow circulation cavity 5, and the semiconductor refrigeration component 2 is located in the airflow circulation cavity 5; the outer fabric 3 is equipped with a blower fan 6, one end of the semiconductor refrigeration component 2 is set as a cooling end, and the other end of the semiconductor refrigeration component 2 is set as a heat dissipation end, the cooling end of the semiconductor refrigeration component 2 is connected to the inner fabric 4, and the heat dissipation end of the semiconductor refrigeration component 2 is connected to the outer fabric 3; wherein, the inner fabric 4 is set as a breathable mesh structure. Specifically, the utility model has a novel structure. When in use, the user wears the clothing body 1, the inner fabric 4 is in contact with the user's body, and the refrigeration end of the semiconductor refrigeration component 2 is close to the user's body to achieve a cooling and cooling effect; the outer fabric 3 is located on the outside of the inner fabric 4, and the blower fan 6 works to blow air into the air circulation cavity 5, and the air circulates in the air circulation cavity 5, and the user's body is sweated and cooled through the air-permeable mesh structure of the inner fabric 4; due to the double-layer structure of the inner fabric 4 and the outer fabric 3, a double cooling effect can be achieved, and at the same time, the technical problem that the fan and the cooling device are installed on the single-layer air-conditioning clothes at the same time, resulting in the expansion of the clothes and the inability of the cooling plate to get close to the human body, can be overcome; it can also solve the technical problem that the air-conditioning clothes in the prior art are all single-layer structures, which leads to the cooling device being directly exposed to the sun when worn outdoors in summer, affecting the cooling effect, and the technical problem that the cooling plate is simply fixed on the air-conditioning clothes close to the human body for cooling, because there is no air circulation outside, resulting in only the cooling plate being cooled when wearing the air-conditioning clothes, and other parts will be relatively stuffy.

[0030] Furthermore, in the embodiment of the present application, the semiconductor refrigeration component 2 includes a main shell 7, a heat dissipation fan 8, a semiconductor refrigeration sheet 9, a semiconductor heat sheet cold surface copper foil cover sheet 10, a radiator 11 and a heat dissipation motor 12, the main shell 7 is provided with an inner cavity, a refrigeration sheet bracket 13 is installed at one end of the inner cavity, the semiconductor refrigeration sheet 9 is installed on the refrigeration sheet bracket 13, the semiconductor heat sheet cold surface copper foil cover sheet 10 is installed at one end of the main shell 7, the radiator 11 is installed at one end of the inner cavity, the semiconductor refrigeration sheet 9 is located between the radiator 11 and the conductor heat sheet cold surface copper foil cover sheet, and the heat dissipation motor 12 is installed In the main shell 7, the heat dissipation fan 8 is rotatably arranged in the main shell 7, the output end of the heat dissipation motor 12 is coaxially driven and connected to the heat dissipation fan 8, the other end of the main shell 7 is provided with a hot surface exhaust port 14 connected to the inner cavity, the outer wall of the main shell 7 is ringed with a plurality of cooling air inlets 15, and the cooling air inlet 15 is connected to the inner cavity of the main shell 7; the heat dissipation fan 8 is used to inhale air from the cooling air inlet 15 and discharge it from the hot surface exhaust port 14; the radiator 11 is attached to the hot surface of the semiconductor cooling plate 9, and the semiconductor hot plate cold surface copper foil cover plate 10 is attached to the cold surface of the semiconductor cooling plate 9. Specifically, during operation, the blower fan 6 blows air into the air circulation cavity 5. As the air circulates in the air circulation cavity 5 and passes through the semiconductor refrigeration component 2, it is sucked in from the cooling air inlet 15 on the outer periphery of the main shell 7 under the action of the heat dissipation fan 8, and the heat is dissipated to the radiator 11, so that the hot surface of the semiconductor refrigeration plate 9 is cooled. Under the action of the heat dissipation fan 8, the hot air is discharged from the hot surface exhaust port 14. Under the above-mentioned setting, the blower fan 6 and the semiconductor refrigeration component 2 can cooperate with each other in structure to achieve a dual cooling effect on the one hand, and on the other hand, the semiconductor refrigeration component 2 can dissipate heat in time to ensure the cooling effect of the semiconductor refrigeration component 2, thereby improving the cooling effect of the utility model.

[0031] Preferably, a plurality of cooling air inlets 15 are arranged at equal intervals on the outer wall of the main body shell 7 .

[0032] Preferably, the radiator 11 is a heat dissipation aluminum sheet, and the position of the radiator 11 is arranged corresponding to the position of the cooling air inlet 15 .

[0033] In the embodiment of the present application, the cooling end of the semiconductor refrigeration component 2 is detachably connected to the inner layer fabric 4, and the heat dissipation end of the semiconductor refrigeration component 2 is detachably connected to the outer layer fabric 3. The inner layer fabric 4 is provided with a first opening 16, and the outer layer fabric 3 is provided with a second opening 17. The first opening 16 and the second opening 17 are arranged correspondingly. An inner snap ring 18 is installed in the first opening 16, and an outer snap ring 19 is installed in the second opening 17. The cooling end of the semiconductor refrigeration component 2 is detachably connected to the inner snap ring 18, and the heat dissipation end of the semiconductor refrigeration component 2 is detachably connected to the outer snap ring 19; preferably, both the inner snap ring 18 and the outer snap ring 19 are provided with an internal thread 21, and both ends of the main body shell 7 are provided with an external thread 22. Both ends of the main body shell 7 are detachably connected to the inner snap ring 18 and the outer snap ring 19 through threaded connection, which is convenient for assembly and disassembly, replacement and maintenance.

[0034] In the embodiment of the present application, a neck vent 20 is formed between the upper end of the outer layer fabric 3 and the upper end of the inner layer fabric 4 , and the neck vent 20 is connected to the airflow circulation cavity 5 through the semiconductor refrigeration component 2 .

[0035] In the embodiment of the present application, the outer fabric 3 is provided with a mounting hole 23, the blast fan 6 is detachably mounted on the mounting hole 23, and the blast fan 6 can be mounted on the mounting hole 23 through a threaded connection structure. The outer fabric 3 is also provided with a zipper notch 24 near the mounting hole 23, and the zipper body is mounted on the zipper notch 24. Specifically, under the above arrangement, the zipper notch 24 is connected to the airflow circulation cavity 5, which facilitates the assembly and disassembly of the blast fan 6.

[0036] In the embodiment of the present application, a heat-insulating coating is provided on the outer fabric 3. Specifically, under this setting, direct sunlight outdoors can be effectively prevented, thereby improving the cooling effect of the semiconductor refrigeration component 2.

[0037] In the embodiment of the present application, the clothing body 1 is further provided with two shoulder straps 26, which are respectively located on both sides of the clothing body 1, and the upper ends of the shoulder straps 26 are connected to the upper end of the clothing body 1, and the lower ends of the shoulder straps 26 are connected to the lower end of the clothing body 1 with an elastic buckle 27. Specifically, under the action of the shoulder straps 26, it is convenient for the user to wear the clothing body 1, and the inner layer fabric 4 of the clothing body 1 is attached to the back of the user for cooling and heat dissipation, and the elastic buckle 27 is convenient for adjusting the tightness to adapt to users of different body shapes and improve the flexibility of use; wherein, a neck vent 20 is formed between the upper end of the outer layer fabric 3 and the upper end of the inner layer fabric 4, and the neck vent 20 is connected to the air circulation cavity 5, and the neck vent 20 is aimed at the neck of the user, and part of the air blown in by the blast fan 6 is cooled by the semiconductor refrigeration component 2 and then discharged from the neck vent 20, and the air flow passes through the back and then discharged through the neck, which is more conducive to sweating and cooling the back.

[0038] In the embodiment of the present application, a battery pocket 25 is provided on one side of the clothing body 1, and the battery pocket 25 is used to install a power source body, and the power source body is used to supply power to the blower fan 6 and the semiconductor refrigeration component 2. Specifically, under the above arrangement, it is convenient to store the power source body, and it is convenient to supply power to the blower fan 6 and the semiconductor refrigeration component 2.

[0039] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A double-layer air-conditioning suit, characterized in that: It includes a clothing body and a semiconductor refrigeration component, the clothing body includes an outer fabric and an inner fabric, the outer fabric and the inner fabric are connected to form an air circulation cavity, and the semiconductor refrigeration component is located in the air circulation cavity; the outer fabric is equipped with a blower fan, one end of the semiconductor refrigeration component is set as a cooling end, and the other end of the semiconductor refrigeration component is set as a heat dissipation end, the cooling end of the semiconductor refrigeration component is connected to the inner fabric, and the heat dissipation end of the semiconductor refrigeration component is connected to the outer fabric.

2. The double-layer air-conditioning clothing according to claim 1, characterized in that: The cooling end of the semiconductor refrigeration component is detachably connected to the inner layer of fabric, and the heat dissipation end of the semiconductor refrigeration component is detachably connected to the outer layer of fabric.

3. The double-layer air-conditioning clothing according to claim 1, characterized in that: The inner fabric is configured as a breathable mesh structure.

4. The double-layer air-conditioning clothing according to claim 1, characterized in that: The semiconductor refrigeration component includes a main shell, a heat dissipation fan, a semiconductor refrigeration sheet, a semiconductor heat sheet cold surface copper foil cover, a radiator and a heat dissipation motor. The main shell is provided with an inner cavity, a refrigeration sheet bracket is installed at one end of the inner cavity, the semiconductor refrigeration sheet is installed on the refrigeration sheet bracket, the semiconductor heat sheet cold surface copper foil cover is installed at one end of the main shell, the radiator is installed at one end of the inner cavity, the semiconductor refrigeration sheet is located between the radiator and the conductor heat sheet cold surface copper foil cover, the heat dissipation motor is installed in the main shell, the heat dissipation fan is rotatably arranged in the main shell, the output end of the heat dissipation motor is coaxially driven and connected to the heat dissipation fan, the other end of the main shell is provided with a hot surface exhaust port connected to the inner cavity, the outer wall of the main shell is annularly provided with a plurality of cooling air inlets, and the cooling air inlet is connected to the inner cavity of the main shell; the heat dissipation fan is used to inhale air from the cooling air inlet and discharge it from the hot surface exhaust port.

5. The double-layered air-conditioning clothing according to claim 4, characterized in that: The position of the radiator is arranged corresponding to the position of the cooling air inlet.

6. The double-layered air-conditioning clothing according to claim 4, characterized in that: The radiator is an aluminum fin.

7. The double-layered air-conditioning clothing according to claim 2, characterized in that: The inner layer of fabric is provided with a first opening, and the outer layer of fabric is provided with a second opening, the first opening is arranged corresponding to the second opening, an inner clamping ring is installed in the first opening, and an outer clamping ring is installed in the second opening, the cooling end of the semiconductor refrigeration component is detachably connected to the inner clamping ring, and the heat dissipation end of the semiconductor refrigeration component is detachably connected to the outer clamping ring.

8. The double-layered air-conditioning clothing according to claim 1, characterized in that: A neck air outlet is formed between the upper end of the outer layer fabric and the upper end of the inner layer fabric, and the neck air outlet is connected to the air flow circulation cavity through the semiconductor refrigeration component.

9. The double-layer air-conditioning clothing according to claim 1, characterized in that: The outer fabric layer is provided with a mounting hole, the blower fan is installed in the mounting hole, and a zipper notch is also provided in the outer fabric layer near the mounting hole, and the zipper body is installed in the zipper notch.

10. The double-layered air-conditioning clothing according to claim 1, characterized in that: The outer fabric is provided with a heat insulation coating.