Crystal support cleaning device

Abstract

The utility model discloses a crystal support cleaning device which comprises a support suitable for being arranged on an assembly line; the waste paper tube is rotatably arranged on the bracket; the new paper tube is arranged on the support in a rotatable mode; two ends of the wiping paper are respectively wound on the waste paper tube and the new paper tube; the wiping cylinder is arranged on the support and abuts against the wiping paper so as to be suitable for extruding the wiping paper on the crystal support conveyed by the assembly line; and the rotation driving device is in transmission connection with at least one of the waste paper tube and the new paper tube. The crystal support cleaning device has the advantages of being high in cleaning efficiency, labor-saving, high in automation degree, good in cleaning effect and the like.

Description

Technical Field

[0001] The utility model relates to the field of solar cell sheet manufacturing, in particular to a crystal support cleaning device. Background Art

[0002] The wafer tray used to carry the crystal rod will be contaminated by water vapor and silicon powder during transportation on the assembly line, which will affect the bonding quality of the subsequent stick bonding. If the bonding quality is not up to standard, silicon wafers are prone to fall off during the slicing process, and the wafer tray needs to be cleaned.

[0003] In the related art, the crystal tray cleaning method is that the operator manually wipes the crystal tray with a towel, which is inefficient and wastes manpower, resulting in high labor costs. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a wafer tray cleaning device, which has the advantages of high cleaning efficiency, labor saving, high degree of automation, good cleaning effect, etc.

[0005] To achieve the above-mentioned purpose, according to an embodiment of the utility model, a crystal tray cleaning device is proposed, and the crystal tray cleaning device includes: a bracket, which is suitable for being arranged on an assembly line; a waste paper tube, which is rotatably arranged on the bracket; a new paper tube, which is rotatably arranged on the bracket; wiping paper, with two ends of the wiping paper respectively wound on the waste paper tube and the new paper tube; a wiping tube, which is arranged on the bracket and abuts against the wiping paper so as to be suitable for squeezing the wiping paper onto the crystal tray conveyed on the assembly line; and a rotating drive device, which is transmission-connected to at least one of the waste paper tube and the new paper tube.

[0006] The wafer tray cleaning device according to the embodiment of the utility model has the advantages of high cleaning efficiency, labor saving, high degree of automation, good cleaning effect, etc.

[0007] In addition, the wafer tray cleaning device according to the above embodiment of the utility model may also have the following additional technical features:

[0008] According to an embodiment of the utility model, the wiping cylinder is liftably arranged on the bracket, a lifting drive device is provided on the bracket, and the wiping cylinder is transmission-connected to the lifting drive device.

[0009] According to an embodiment of the utility model, the bracket includes a main body and a lifting frame, the lifting frame is liftably arranged on the main body, the wiping cylinder is arranged on the lifting frame, and the lifting drive device is transmission-connected to the lifting frame.

[0010] According to an embodiment of the utility model, the crystal support cleaning device further includes a scraper, and the scraper is arranged on the lifting frame.

[0011] According to an embodiment of the utility model, the scraper is located upstream of the wiping cylinder in the conveying direction of the assembly line.

[0012] According to an embodiment of the utility model, the waste paper roll and the new paper roll are arranged at intervals in the horizontal direction, the wiping roll is located between the waste paper roll and the new paper roll in the horizontal direction, and the wiping roll abuts against the upper surface of the portion of the wiping paper located between the waste paper roll and the new paper roll.

[0013] According to an embodiment of the present utility model, the rotary drive device is transmission-connected to the waste paper drum.

[0014] According to an embodiment of the present invention, the waste paper roll is located upstream of the new paper roll in the conveying direction of the assembly line.

[0015] According to an embodiment of the utility model, the wiping cylinder is rotatably arranged on the bracket.

[0016] According to an embodiment of the utility model, the new paper tube is detachably arranged on the bracket.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 It is a structural schematic diagram of a wafer support cleaning device according to an embodiment of the utility model.

[0020] Figure 2 It is a structural schematic diagram of a wafer support cleaning device according to an embodiment of the utility model.

[0021] Figure 3 It is a structural schematic diagram of a wafer support cleaning device according to an embodiment of the utility model.

[0022] Figure 4 It is a structural schematic diagram of a wafer support cleaning device according to an embodiment of the utility model.

[0023] Figure 5 It is a structural schematic diagram of a wafer support cleaning device according to an embodiment of the utility model.

[0024] Figure numerals: crystal tray cleaning device 1, bracket 10, main body 11, lifting frame 12, lifting drive device 13, waste paper tube 20, new paper tube 30, wiping paper 40, wiping tube 50, rotating drive device 60, scraper 70, assembly line 2, crystal tray 3. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The wafer tray cleaning device 1 according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0029] like Figure 1-Figure 5 As shown, the wafer tray cleaning device 1 according to the embodiment of the utility model includes a bracket 10, a waste paper roll 20, a new paper roll 30, a wiping paper 40, a wiping roll 50 and a rotation driving device 60.

[0030] The support 10 is suitable for being arranged on the production line 2. The waste paper drum 20 is rotatably arranged on the support 10. The new paper drum 30 is rotatably arranged on the support 10. The two ends of the wiping paper 40 are respectively wound on the waste paper drum 20 and the new paper drum 30. The wiping drum 50 is arranged on the support 10 and abuts against the wiping paper 40 so as to be suitable for squeezing the wiping paper 40 on the wafer tray 3 transported by the production line 2. The rotation driving device 60 is transmission-connected with at least one of the waste paper drum 20 and the new paper drum 30.

[0031] Specifically, the wafer tray 3 is transported on the assembly line 2. Figure 1 The figure shows an implementation method of conveying the crystal tray 3 in the front-to-back direction (the front-to-back and up-down directions are shown by the arrows in the figure). When the crystal tray 3 passes through the crystal tray cleaning device 1, the rotation drive device 60 runs, the waste paper roll 20 and the new paper roll 30 rotate, and the waste paper roll 20 reels the waste paper while the new paper roll 30 unfolds and replenishes new paper to ensure that the wiping roll 50 always squeezes the clean wiping paper 40 on the surface of the crystal tray 3. The passing crystal tray 3 is wiped by the wiping paper 40 squeezed on the crystal tray 3 by the wiping roll 50, so as to clean the crystal tray 3 and remove contaminants on the crystal tray 3.

[0032] According to the crystal tray cleaning device 1 of the embodiment of the utility model, by setting the crystal tray cleaning device 1 on the assembly line 2, the crystal tray 3 can be automatically wiped with the wiping paper 40 when the crystal tray 3 passes by. Compared with the manual wiping method adopted in the related art, the crystal tray 3 can be automatically cleaned when the crystal tray 3 passes through the crystal tray cleaning device 1, which not only has higher cleaning efficiency, but also can save manpower, reduce labor costs, improve the degree of automation of the assembly line, and facilitate the full automation of the assembly line.

[0033] Furthermore, by providing the wiping cylinder 50 , the wiping paper 40 can be pressed onto the wafer tray 3 by the wiping cylinder 50 , so as to improve the cleaning effect when the wafer tray 3 passes by.

[0034] In addition, by providing the waste paper roll 20, the new paper roll 30 and the rotating drive device 60, the rotating drive device 60 can be used to drive the waste paper roll 20 and the new paper roll 30 to rotate, thereby replenishing the unwiped new paper while rolling up the wiped waste paper, ensuring that clean new paper is always used to wipe the crystal tray 3 each time, avoiding the waste paper that has been wiped from wiping multiple crystal trays continuously, which may affect the cleaning effect or even cause secondary pollution, thereby further improving the cleaning effect on the crystal tray 3.

[0035] Therefore, the wafer tray cleaning device 1 according to the embodiment of the utility model has the advantages of high cleaning efficiency, labor saving, high degree of automation, good cleaning effect, etc.

[0036] The wafer tray cleaning device 1 according to a specific embodiment of the utility model is described below with reference to the accompanying drawings.

[0037] In some specific embodiments of the present invention, Figure 1-Figure 5 As shown, the wafer tray cleaning device 1 according to the embodiment of the utility model includes a bracket 10, a waste paper roll 20, a new paper roll 30, a wiping paper 40, a wiping roll 50 and a rotation driving device 60.

[0038] Specifically, the wiping cylinder 50 is escalably disposed on the bracket 10, and a lifting drive device 13 is disposed on the bracket 10, and the wiping cylinder 50 is in transmission connection with the lifting drive device 13. In this way, when the wafer tray 3 approaches, the lifting drive device 13 drives the wiping cylinder 50 to descend, so that the wiping paper 40 can be pressed on the wafer tray 3, thereby not only being applicable to wafer trays 3 of different heights, but also being able to further facilitate improving the cleaning effect of the wafer tray 3.

[0039] Specifically, the lifting drive device 13 can be a cylinder, which can facilitate driving the wiping cylinder 50 and ensure the wiping force of the crystal holder 3.

[0040] Furthermore, the wafer tray cleaning device 1 may further include a proximity sensor for detecting the approach of the wafer tray 3. This makes it easy to detect whether the wafer tray 3 is approaching.

[0041] More specifically, Figure 1-Figure 5 As shown, the bracket 10 includes a main body 11 and a lifting frame 12, the lifting frame 12 is escalably arranged on the main body 11, the wiping cylinder 50 is arranged on the lifting frame 12, and the lifting drive device 13 is in transmission connection with the lifting frame 12. In this way, the lifting frame 12 can be driven to rise and fall by the lifting drive device 13, so as to facilitate the lifting and falling of the wiping cylinder 50.

[0042] Advantageously, if Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the wafer tray cleaning device 1 further includes a scraper 70, and the scraper 70 is arranged on the lifting frame 12. In this way, the scraper 70 can be used to clean the wafer tray 3, and the cleaning effect of the wafer tray 3 is further improved.

[0043] More advantageously, if Figure 1 , Figure 2 and Figure 4 As shown, the scraper 70 is located upstream of the wiping cylinder 50 in the conveying direction of the assembly line 2. Specifically, the scraper 70 is located in front of the wiping cylinder 50 in the front-to-back direction. In this way, when the wafer tray 3 is conveyed to the wafer tray cleaning device 1, it first passes through the scraper 70, and the scraper 70 is used to preliminarily scrape off the water and pollutants on the wafer tray 3, and then the wafer tray 3 is further wiped with the wiping paper 40, so as to avoid a large amount of water affecting the wiping effect of the wiping paper 40 or even causing the wiping paper 40 to break, so as to improve the cleaning effect of the wafer tray 3. In addition, the scraper 70 is also arranged on the lifting frame 12, so that the scraper 70 and the wiping cylinder 50 can be raised and lowered synchronously, so as to be suitable for wafer trays 3 of different heights, and improve the cleaning effect of the wafer tray 3.

[0044] Figure 1-Figure 5 FIG. 1 shows a wafer support cleaning device 1 according to some examples of the present invention. Figure 1-Figure 5 As shown, the waste paper cylinder 20 and the new paper cylinder 30 are arranged at intervals in the horizontal direction, the wiping cylinder 50 is located between the waste paper cylinder 20 and the new paper cylinder 30 in the horizontal direction, and the wiping cylinder 50 abuts against the upper surface of the portion of the wiping paper 40 located between the waste paper cylinder 20 and the new paper cylinder 30. In this way, the wiping cylinder 50 can squeeze the wiping paper 40 onto the crystal support 3, further facilitating the improvement of the cleaning effect on the crystal support 3.

[0045] Alternatively, if Figure 1-Figure 5 As shown, the rotary drive device 60 is in transmission connection with the waste paper drum 20. In this way, the rotary drive device 60 can be used to drive the waste paper drum 20 to rotate, so as to reel in the wiping paper 40, thereby driving the new paper drum 30 to rotate, so as to unwind the wiping paper 40 wound on the new paper drum 30, thereby facilitating the driving of the waste paper drum 20 and the new paper drum 30.

[0046] Advantageously, if Figure 1-Figure 5 As shown, the waste paper drum 20 is located upstream of the new paper drum 30 in the conveying direction of the assembly line 2. In other words, the waste paper drum 20 is located in front of the new paper drum 30. In this way, the moving direction of the wiping paper 40 can be opposite to the moving direction of the wafer tray 3, thereby further improving the wiping effect on the wafer tray 3.

[0047] More advantageously, the wiping cylinder 50 is rotatably disposed on the bracket 10. This can reduce the resistance of the wiping paper 40 from the wiping cylinder 50, making the wiping paper 40 more smoothly rolled up and unrolled.

[0048] Specifically, the new paper roll 30 is detachably arranged on the bracket 10. In this way, after the wiping paper 40 is exhausted, the clean wiping paper 40 can be replenished by replacing the new paper roll 30 wound with new wiping paper 40, so that the wiping paper 40 is easily replaced and replenished.

[0049] Specifically, if Figure 1-Figure 5 As shown, the axes of the waste paper roll 20, the new paper roll 30 and the wiping roll 50 are parallel. This can avoid wrinkles on the wiping paper 40 and further improve the wiping effect.

[0050] The rotation driving device 60 is a motor and is connected to the waste paper barrel 20 via a coupling.

[0051] Reference below Figure 1-Figure 5 The working process of the wafer tray cleaning device 1 according to the embodiment of the utility model is described.

[0052] The assembly line 2 transports the wafer tray 3. When the wafer tray 3 approaches the wafer tray cleaning device 1, the proximity sensor senses that the wafer tray 3 is in place, and the cylinder extends. The cylinder drives the lifting frame 12 to descend, thereby driving the scraper 70 and the wiping cylinder 50 to descend at the same time. At this time, the motor rotates synchronously to drive the waste paper cylinder 20 to rotate, and the waste paper cylinder 20 reels the wiping paper 40, thereby driving the new paper cylinder 30 to rotate and unfold the clean wiping paper 40, ensuring that the wiping cylinder 50 is always clean. The scraper 70 first contacts the surface of the wafer tray 3 for the first cleaning, and the wiping paper 40 moving in the opposite direction performs the second surface wiping, thereby achieving the effect of thoroughly cleaning the surface of the wafer tray 3.

[0053] Other structures and operations of the wafer tray cleaning device 1 according to the embodiment of the utility model are known to ordinary technicians in the field and will not be described in detail here.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0055] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer cleaning device, characterized in that: include: A bracket, wherein the bracket is suitable for being arranged on an assembly line; A waste paper barrel, the waste paper barrel being rotatably arranged on the bracket; A new paper tube, the new paper tube being rotatably arranged on the bracket; Wiping paper, two ends of which are respectively wound on the waste paper roll and the new paper roll; A wiping cylinder, the wiping cylinder is arranged on the bracket and abuts against the wiping paper so as to be suitable for squeezing the wiping paper onto the wafer tray transported by the assembly line; A rotation drive device is drivingly connected to at least one of the waste paper roll and the new paper roll.

2. The wafer support cleaning device according to claim 1, characterized in that: The wiping cylinder is liftably arranged on the bracket, a lifting drive device is arranged on the bracket, and the wiping cylinder is drivingly connected to the lifting drive device.

3. The wafer cleaning device according to claim 2, characterized in that: The bracket comprises a main body and a lifting frame, the lifting frame is liftably arranged on the main body, the wiping cylinder is arranged on the lifting frame, and the lifting drive device is transmission-connected with the lifting frame.

4. The wafer support cleaning device according to claim 3, characterized in that: It also includes a scraper, which is arranged on the lifting frame.

5. The wafer support cleaning device according to claim 4, characterized in that: The scraper is located upstream of the wiping cylinder in the conveying direction of the assembly line.

6. The wafer support cleaning device according to claim 1, characterized in that: The waste paper roll and the new paper roll are arranged horizontally with an interval therebetween, the wiping roll is located horizontally between the waste paper roll and the new paper roll, and the wiping roll abuts against the upper surface of the portion of the wiping paper located between the waste paper roll and the new paper roll.

7. The wafer support cleaning device according to claim 1, characterized in that: The rotary drive device is transmission connected to the waste paper drum.

8. The wafer support cleaning device according to claim 1, characterized in that: The waste paper roll is located upstream of the new paper roll in the conveying direction of the assembly line.

9. The wafer support cleaning device according to claim 1, characterized in that: The wiping cylinder is rotatably arranged on the bracket.

10. The wafer support cleaning device according to claim 1, characterized in that: The new paper tube is detachably arranged on the bracket.

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