Adhesive removing structure for integrated circuit packaging

Abstract

The utility model discloses a degumming structure for integrated circuit packaging, which belongs to the technical field of degumming of integrated circuits and comprises a platform, two sides above the platform are fixedly connected with connecting plates, and one sides of the two connecting plates are fixedly connected with the same fixing plate. Through the arrangement of the rotating shaft, the half gear, the guide teeth, the first electric push rod and the cleaning shovel edge, when the rotating shaft drives the half gear to rotate, the guide teeth meshed with the half gear can drive the first electric push rod to reciprocate left and right through the connecting block; and meanwhile, a first electric push rod drives a cleaning shovel edge to move downwards to realize relatively fitting work with the integrated circuit, so that the cleaning shovel edge can perform efficient glue removal work on the integrated circuit, and the device throws the traditional manual cleaning, improves the cleaning simplicity and convenience, is relatively high in glue removal efficiency, and is suitable for popularization and application. The phenomenon that part of glue still exists is prevented, and meanwhile certain labor consumption is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit debonding, and in particular relates to a debonding structure for integrated circuit packaging. Background Art

[0002] An integrated circuit is a microelectronic device or component. A certain process is used to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. The components are made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a microstructure with the required circuit function. At present, the packaging of integrated circuits requires the cleaning of the solid glue adhered to the integrated circuits to ensure that they meet the packaging requirements. However, the glue removal of existing integrated circuits is usually done manually, which makes the manual glue removal more cumbersome and the manual removal efficiency is low, resulting in some glue still existing. At the same time, a certain amount of manual labor consumption will be generated. Therefore, a glue removal structure for integrated circuit packaging is needed to solve the above problems. Utility Model Content

[0003] The purpose of the utility model is to provide a debonding structure for integrated circuit packaging to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a glue removal structure for integrated circuit packaging, comprising a platform, connecting plates are fixedly connected on both sides above the platform, one side of the two connecting plates is fixedly connected to the same fixed plate, a bearing is clamped in the fixed plate, a rotating shaft is rotatably connected in the bearing, a half gear is fixedly connected outside the rotating shaft, a guide tooth is meshed outside the half gear, and sliders are fixedly connected on both sides of the guide tooth.

[0005] A connecting block is fixedly connected below the guide tooth, a first electric push rod is fixedly connected below the connecting block, a cleaning shovel edge is fixedly connected to the bottom end of the first electric push rod, two fixed blocks are fixedly connected above the platform, a second electric push rod is fixedly connected to the two fixed blocks, and a positioning plate is fixedly connected to the bottom ends of the two second electric push rods.

[0006] As a preferred implementation manner, a motor is fixedly connected to the top end of the rotating shaft, and an output shaft of the motor is fixedly connected to the top end of the rotating shaft.

[0007] As a preferred implementation manner, two motor fixing blocks are fixedly connected to the outside of the motor, and the bottoms of the two motor fixing blocks are fixedly connected to the top of the fixing plate.

[0008] As a preferred implementation, a through hole is opened in the connecting plate, and the two sliding blocks are respectively located in the two through holes.

[0009] As a preferred embodiment, two discharge ports are fixedly connected to the bottom of the platform, and switch baffles are provided in the discharge ports.

[0010] As a preferred embodiment, support legs are fixedly connected to the four corners of the bottom of the platform, and a friction layer is provided at the bottom of the support legs.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The utility model is provided with a rotating shaft, a half gear, a guide tooth, a first electric push rod and a cleaning shovel edge. When the rotating shaft drives the half gear to rotate, the guide tooth meshing with the half gear can drive the first electric push rod to move left and right repeatedly through the connecting block, so that the first electric push rod drives the cleaning shovel edge to move left and right repeatedly. At the same time, the first electric push rod drives the cleaning shovel edge to move downward to achieve a closer fit with the integrated circuit, so that the cleaning shovel edge can efficiently remove glue from the integrated circuit. Therefore, this device abandons traditional manual cleaning, improves the simplicity of cleaning, and has a high glue removal efficiency, thereby preventing the phenomenon that some glue still exists and avoiding a certain amount of manual consumption.

[0013] The utility model is provided with a second electric push rod and a positioning plate, and utilizes the two second electric push rods to respectively drive the positioning plates to move downward, so that the integrated circuit can be fixed when the two positioning plates move downward to a suitable position, thereby preventing the integrated circuit from being offset when being cleaned by a cleaning shovel, thereby effectively improving the accuracy of cleaning glue on the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0015] Figure 2 It is a three-dimensional structural diagram of the half gear and the guide gear of the utility model;

[0016] Figure 3 It is a three-dimensional structural diagram of the platform of the utility model;

[0017] In the figure: 1. platform; 2. connecting plate; 3. fixing plate; 4. bearing; 5. rotating shaft; 6. half gear; 7. guide gear; 8. slider; 9. connecting block; 10. first electric push rod; 11. cleaning shovel edge; 12. fixing block; 13. second electric push rod; 14. positioning plate; 15. motor; 16. motor fixing block; 17. through hole; 18. discharge port; 19. switch baffle; 20. supporting leg. DETAILED DESCRIPTION

[0018] The present invention will be further described below in conjunction with the embodiments.

[0019] The following examples are used to illustrate the present invention, but cannot be used to limit the scope of protection of the present invention. The conditions in the examples can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0020] See also Figure 1-3 The utility model provides a glue removal structure for integrated circuit packaging, including a platform 1, the bottom of the platform 1 is fixedly connected to two discharge ports 18, and a switch baffle 19 is arranged in the discharge port 18. The discharge port 18 allows the glue to have a discharge space, so that the cleaning shovel edge 11 can push the glue to the discharge port 18 for discharge after cleaning, preventing the glue from accumulating on the platform 1, and the switch baffle 19 can open or close the discharge port 18 to prevent the glue from accidentally falling to the ground through the discharge port 18 and requiring manual secondary cleaning;

[0021] The four corners of the bottom of the platform 1 are fixedly connected with support legs 20, and the bottom of the support legs 20 is provided with a friction layer. The support legs 20 use the friction layer to make the platform 1 have good stability when it is located on the ground, and effectively reduce the large vibration of the platform 1 when the structure inside the platform 1 is running;

[0022] Both sides above the platform 1 are fixedly connected with connecting plates 2, and through holes 17 are opened in the connecting plates 2. Two sliders 8 are respectively located in the two through holes 17. The through holes 17 provide the sliders 8 with supporting moving points, so that the guide teeth 7 have good stability when moving in the two through holes 17 using the two sliders 8, preventing the guide teeth 7 from hanging and falling, thereby ensuring the stability of the cleaning shovel edge 11 when it moves left and right repeatedly;

[0023] One side of the two connecting plates 2 is fixedly connected to the same fixing plate 3, a bearing 4 is clamped in the fixing plate 3, a rotating shaft 5 is rotatably connected in the bearing 4, a motor 15 is fixedly connected to the top of the rotating shaft 5, and the output shaft of the motor 15 is fixedly connected to the top of the rotating shaft 5. The output shaft of the motor 15 can drive the rotating shaft 5 to rotate smoothly, so as to achieve the purpose of rotating the half gear 6;

[0024] The motor 15 is externally fixedly connected to two motor fixing blocks 16, the bottoms of the two motor fixing blocks 16 are fixedly connected to the upper part of the fixing plate 3, and the motor fixing blocks 16 provide the motor 15 with a fixing point, thereby effectively reducing the adverse effects of the vibration generated by the motor 15 during operation;

[0025] A half gear 6 is fixedly connected to the outside of the rotating shaft 5, and a guide tooth 7 is meshed with the outside of the half gear 6. Slide blocks 8 are fixedly connected to both sides of the guide tooth 7. A connecting block 9 is fixedly connected to the bottom of the guide tooth 7. A first electric push rod 10 is fixedly connected to the bottom of the connecting block 9. A cleaning shovel edge 11 is fixedly connected to the bottom end of the first electric push rod 10. When the half gear 6 rotates, the guide tooth 7 meshing therewith can drive the first electric push rod 10 to smoothly move left and right repeatedly through the connecting block 9, so that the first electric push rod 10 can drive the cleaning shovel edge 11 to clean the solid glue on the integrated circuit. At the same time, the first electric push rod 10 enables the cleaning shovel edge 11 to have a height adjustment function to prevent the cleaning shovel edge 11 from failing to contact the integrated circuit or from excessively contacting the integrated circuit to cause damage to the integrated circuit;

[0026] Two fixed blocks 12 are fixedly connected above the platform 1, and second electric push rods 13 are fixedly connected inside the two fixed blocks 12. Positioning plates 14 are fixedly connected to the bottom ends of the two second electric push rods 13. When the integrated circuit is located on the platform 1, the two second electric push rods 13 can be used to drive the positioning plates 14 to move downward respectively, so that the integrated circuit can be positioned when the two positioning plates 14 move downward to a certain position, so as to improve the stability of the integrated circuit when removing glue.

[0027] The working principle and use process of this utility model:

[0028] When the solid glue on the integrated circuit needs to be cleaned, the integrated circuit is first placed at the center of the platform 1, and then the two second electric push rods 13 are used to drive the positioning plates 14 to move downward respectively, so that the integrated circuit can be fixed when the two positioning plates 14 move downward to a suitable position. At this time, the first electric push rod 10 can be used to drive the cleaning scraper 11 to move downward to the top of the integrated circuit, and then the motor 15 is started, so that the output shaft of the motor 15 drives the rotating shaft 5 to rotate, so that the rotating shaft 5 drives the half gear 6 to rotate;

[0029] When the half gear 6 is in a rotating state, the guide tooth 7 meshing with the half gear 6 can utilize the two sliders 8 to perform smooth left and right repetitive movements in the two through holes 17, prompting the guide tooth 7 to drive the first electric push rod 10 to perform left and right repetitive movements through the connecting block 9, so that the first electric push rod 10 drives the cleaning shovel edge 11 to clean the solid glue on the integrated circuit, so that the cleaning shovel edge 11 can push the cleaned glue into the two discharge ports 18 for discharge.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A debonding structure for integrated circuit packaging, comprising a platform (1), characterized in that: Both sides above the platform (1) are fixedly connected with connecting plates (2), one side of the two connecting plates (2) is fixedly connected with the same fixing plate (3), a bearing (4) is clamped inside the fixing plate (3), a rotating shaft (5) is rotatably connected inside the bearing (4), a half gear (6) is fixedly connected outside the rotating shaft (5), a guide tooth (7) is meshed outside the half gear (6), and sliders (8) are fixedly connected on both sides of the guide tooth (7); A connecting block (9) is fixedly connected below the guide tooth (7), a first electric push rod (10) is fixedly connected below the connecting block (9), a cleaning shovel edge (11) is fixedly connected to the bottom end of the first electric push rod (10), two fixed blocks (12) are fixedly connected above the platform (1), a second electric push rod (13) is fixedly connected inside the two fixed blocks (12), and a positioning plate (14) is fixedly connected to the bottom ends of the two second electric push rods (13).

2. The adhesive removal structure for integrated circuit packaging according to claim 1, characterized in that: The top end of the rotating shaft (5) is fixedly connected to a motor (15), and the output shaft of the motor (15) is fixedly connected to the top end of the rotating shaft (5).

3. The adhesive removal structure for integrated circuit packaging according to claim 2, characterized in that: The motor (15) is fixedly connected to two motor fixing blocks (16) outside, and the bottoms of the two motor fixing blocks (16) are fixedly connected to the top of the fixing plate (3).

4. The adhesive removal structure for integrated circuit packaging according to claim 1, characterized in that: A through hole (17) is provided in the connecting plate (2), and the two sliding blocks (8) are respectively located in the two through holes (17).

5. The adhesive removal structure for integrated circuit packaging according to claim 1, characterized in that: Two discharge ports (18) are fixedly connected to the bottom of the platform (1), and switch baffles (19) are arranged inside the discharge ports (18).

6. The adhesive removal structure for integrated circuit packaging according to claim 1, characterized in that: Support legs (20) are fixedly connected at the four corners of the bottom of the platform (1), and a friction layer is provided at the bottom of the support legs (20).

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