Quick-drainage cleaning tank
By designing a quick drain cleaning tank, using components such as spraying devices and flow balancing plates, uniform cleaning of the wafer surface is achieved, equipment corrosion and pollution caused by acid and alkali residues are solved, maintenance costs are reduced and crystallization is increased Circular surface quality.
Patent Information
- Application Number
- CN202420941113.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-05
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-05
AI Technical Summary
After the wafer is subjected to acid and alkali solution, it may cause corrosion and surface contamination of equipment components, affecting the quality of the wafer. It is difficult for the prior art to effectively remove liquid residues, resulting in a shortening of equipment life and an increase in maintenance costs.
A quick drain cleaning tank is designed, including a sink, spraying device, a flow balancing plate, a filter plate, a drain valve and a water resistance box. The cleaning solution is uniformly sprayed through the spraying device, and the flow balancing plate and a flow balancing hole control the water flow in. Ensure thorough cleaning without causing collisions to the wafer and monitor cleaning time with a water resistance meter.
It realizes uniform cleaning of the wafer surface in a short period of time, ensuring thorough cleaning, avoiding equipment corrosion, reducing maintenance costs, and avoiding wafer collisions through uniform water flow control, improving wafer surface quality.
Smart Images
Figure CN222241595U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer cleaning, in particular to a quick-discharge cleaning tank. Background Art
[0002] After the wafer has experienced acid and alkali solutions, the residual acid and alkali solutions may cause corrosion to equipment components, especially when the liquid remains on the surface or in the channel of the equipment, which may shorten the life of the equipment and increase maintenance costs. The residual acid and alkali solutions may cause surface contamination or chemical reactions, affecting the surface quality of the wafer. Therefore, to address the above problems, an ultrasonic water bath heating tank is proposed. Utility Model Content
[0003] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a quick-drain cleaning tank, comprising a water tank, wherein fixed brackets are arranged on the front and rear sides of the water tank, a spray device is symmetrically arranged above the water tank along the center of the water tank, the spray device comprises a spray pipe and a fixed plate, two of the spray pipes are respectively arranged above the front and rear side walls of the water tank, fixed plates are arranged at both ends of the spray pipes, the two fixed plates are respectively fixedly arranged on the left and right side surfaces of the water tank, and the spray pipe has a plurality of spray holes; a water resistance box is arranged on the left side of the water tank, and a water resistance meter is arranged in the water resistance box; a filter plate is arranged in the water tank and fixed to the bottom surface of the water tank through a fixing column, water inlet pipes are respectively arranged at the front and rear ends below the left side of the water tank, and two drain valves are arranged on the bottom surface of the water tank.
[0004] Furthermore, two flow balancing plates are arranged on the bottom surface of the water tank, the two flow balancing plates are connected to the two water inlet pipes, and a plurality of flow balancing holes are arranged on the side of the flow balancing plate.
[0005] Furthermore, the height of the flow balancing hole is lower than the height of the filter plate.
[0006] Furthermore, overflow ports are arranged on the upper surfaces of the four walls of the water tank. The overflow ports are conical and arranged in an array on the upper surfaces of the four walls of the water tank, so that the upper ends of the four walls of the water tank are serrated.
[0007] Furthermore, the upper surface of the water resistance box and the upper surface of the water tank are in the same horizontal plane.
[0008] Furthermore, a regulating valve is arranged on the spray pipe, and two regulating valves are arranged on both sides of the spray holes at both ends respectively.
[0009] The utility model has the following beneficial effects:
[0010] In the utility model, the spray pipe can clean the surface of the wafer in a shorter time, and can also ensure that the sprayed solution evenly covers the entire wafer surface, making the cleaning more thorough; the flow equalizing plate and the flow equalizing hole enable water to flow evenly into the water tank, and will not directly hit the wafer and cause the wafer to collide. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a structural schematic diagram of a quick-discharge cleaning tank proposed by the utility model;
[0012] Figure 2 A side sectional view of a quick-discharge cleaning tank proposed by the utility model;
[0013] Figure 3 The utility model is a side sectional structural diagram of a quick-discharge cleaning tank.
[0014] Legend:
[0015] 1. Water tank; 2. Fixed bracket; 3. Spray device; 4. Water resistance box; 5. Water resistance meter; 6. Filter plate; 7. Fixed column; 8. Water inlet pipe; 9. Drain valve; 11. Flow equalizing plate; 12. Flow equalizing hole; 31. Spray pipe; 32. Fixed plate; 33. Spray hole; 34. Regulating valve. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] Reference Figure 1-3As shown, an embodiment of the utility model is as follows: a quick-drain cleaning tank comprises a water tank 1, a fixing bracket 2 is arranged on the front and rear sides of the water tank 1, a spray device 3 is arranged symmetrically along the center of the water tank 1 above the water tank 1, the spray device 3 comprises a spray pipe 31 and a fixing plate 32, two spray pipes 31 are arranged above the front and rear side walls of the water tank 1 respectively, fixing plates 32 are arranged at both ends of the spray pipe 31, and the two fixing plates 32 are fixedly arranged on the left and right sides of the water tank 1 respectively, the fixing plates 32 are used to fix the spray pipe 31, and the spray pipe 31 has a plurality of spray holes 33; a water resistance box 4 is arranged on the left side of the water tank 1, and a water resistance meter 5 is arranged in the water resistance box 4; a filter plate 6 is arranged in the water tank 1 It is fixed to the bottom surface of the water tank 1 by a fixing column 7, water inlet pipes 8 are respectively arranged at the front and rear ends of the lower left side of the water tank 1, two drain valves 9 are arranged on the bottom surface of the water tank 1, and a regulating valve 34 is arranged on the spray pipe 31. The two regulating valves 34 are respectively arranged on both sides of the spray holes 33 at both ends. Water enters the spray pipe 31 from one end of the spray pipe 31. The regulating valve 34 adjusts the water pressure and water volume in the spray pipe 31 to spray the wafer through the spray hole 33, so as to quickly and evenly clean the surface of the wafer, which can save the cleaning cost to a certain extent. The drain valve 9 can control the flow rate in the water tank 1. The greater the drainage flow rate, the more conducive it is for water to carry away the particulate impurities on the surface of the wafer.
[0018] Furthermore, two flow equalizing plates 11 are arranged on the bottom surface of the water tank 1, and the two flow equalizing plates 11 are connected to the two water inlet pipes 8. A plurality of flow equalizing holes 12 are arranged on the sides of the flow equalizing plates 11. The height of the flow equalizing holes 12 is lower than the height of the filter plate 6. Water enters the water tank 1 through the water inlet pipe 8, and first passes through the flow equalizing plates 11 and the flow equalizing holes 12, so that the liquid level in the water tank 1 rises as a whole and will not directly hit the wafer through the flow equalizing holes 12, causing the wafer to move and collide.
[0019] Furthermore, overflow ports 13 are arranged on the upper surfaces of the four walls of the water tank 1. The overflow ports 13 are conical and arranged on the upper surfaces of the four walls of the water tank 1, so that the upper ends of the four walls of the water tank 1 are serrated. The upper surface of the water resistance box 4 and the upper surface of the water tank 1 are at the same horizontal plane. The solution in the water tank 1 gradually rises and flows out through the overflow port 13. When the solution enters the water resistance box 4 from the overflow port 13, the water resistance meter 5 measures the resistance of the solution to determine the cleaning time of the wafer.
[0020] Working principle: When the staff is cleaning, they put the wafer into the water tank 1, first let the cleaning solution enter the spray pipe 31, and then adjust the water pressure and water volume sprayed from the spray port through the regulating valve 34. After rinsing the wafer, close the drain valve 9, and let the cleaning solution into the water tank 1 from the water inlet pipe 8. The cleaning solution first passes through the flow equalizing plate 11 and the flow equalizing hole 12 to make the liquid level in the water tank 1 rise evenly and will not directly rush into the wafer. After the cleaning solution fills the water tank 1, it flows out from the overflow port 13 and enters the water resistance box 4. The water resistance meter 5 measures the resistance of the solution. Finally, open the drain valve 9 to discharge the solution, repeat the spraying of the wafer and the introduction of water into the water tank 1 through the water inlet pipe 8. When the water resistance box 4 is full of solution, the water resistance meter 5 measures the resistance until the resistance returns to normal.
[0021] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A quick-discharge cleaning tank, characterized in that: The invention comprises a water tank (1), wherein fixed brackets (2) are arranged on the front and rear sides of the water tank (1), a spray device (3) is symmetrically arranged above the water tank (1) along the center of the water tank (1), and the spray device (3) comprises a spray pipe (31) and a fixed plate (32), wherein two spray pipes (31) are arranged above the front and rear side walls of the water tank (1), respectively, and fixed plates (32) are arranged at both ends of the spray pipe (31), and the two fixed plates (32) are respectively fixedly arranged on the left and right side surfaces of the water tank (1), and the spray pipe (31) is provided with a plurality of spray holes (33); a water resistance box (4) is arranged on the left side of the water tank (1), and a water resistance meter (5) is arranged in the water resistance box (4); a filter plate (6) is arranged in the water tank (1) and is fixed to the bottom surface of the water tank (1) through a fixed column (7), and water inlet pipes (8) are arranged at the front and rear ends below the left side of the water tank (1), and two drain valves (9) are arranged on the bottom surface of the water tank (1).
2. A quick-discharge cleaning tank according to claim 1, characterized in that: Two flow balancing plates (11) are arranged on the bottom surface of the water tank (1), the two flow balancing plates (11) are connected to the two water inlet pipes (8), and a plurality of flow balancing holes (12) are arranged on the side of the flow balancing plate (11).
3. A quick-discharge cleaning tank according to claim 2, characterized in that: The height of the flow-balancing hole (12) is lower than the height of the filter plate (6).
4. A quick-discharge cleaning tank according to claim 1, characterized in that: Overflow ports (13) are arranged on the upper surfaces of the four walls of the water tank (1); the overflow ports (13) are conical and arranged in an array on the upper surfaces of the four walls of the water tank (1), so that the upper ends of the four walls of the water tank (1) are serrated.
5. A quick-discharge cleaning tank according to claim 1, characterized in that: The upper surface of the water resistance box (4) and the upper surface of the water tank (1) are on the same horizontal plane.
6. A quick-discharge cleaning tank according to claim 1, characterized in that: The spray pipe (31) is provided with a regulating valve (34), and the two regulating valves (34) are respectively arranged on both sides of the spray holes (33) at both ends.