Plastic product injection molding mold

Abstract

The plastic product injection molding mold comprises a base, a water tank and a cooling assembly, a lower mold is installed on the surface of the base, a heat conduction water pipe is movably installed on the outer side of the lower mold, a protection frame is fixedly installed on the outer side of the heat conduction water pipe, a water inlet is formed in one end of the heat conduction water pipe, and a water outlet is formed in the other end of the heat conduction water pipe. The water inlet extends into the water tank and is connected with a water pump in the water tank, a water return pipe is arranged at the other end of the heat conduction water pipe, extends to the upper surface of the water tank and communicates with the top of the water tank, and a cooling assembly is fixedly installed on the left side of the water tank and comprises a semiconductor chilling plate, cooling fins and a cooling fan. And by arranging the semiconductor chilling plate, water in the water tank can be cooled, the cooled water cools the lower mold through the heat conduction water pipe, the effect of rapidly cooling the mold can be achieved, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of injection molds, and in particular relates to an injection molding mold for plastic products. Background Art

[0002] Injection molds are tools for producing plastic products; they are also tools that give plastic products a complete structure and precise dimensions. Injection molding is a processing method used in mass production of certain parts with complex shapes. Specifically, it refers to the process of injecting heated and melted plastic into the mold cavity under high pressure by an injection molding machine, and then cooling and solidifying to obtain a molded product.

[0003] Chinese utility model patent 202320254026.3 discloses an injection mold for plastics, including a device main body, a base is provided at the lower end of the device main body, an L-shaped support plate is provided at the left end of the device main body, and the lower end of the L-shaped support plate is fixedly connected to the left end of the base, a groove is provided inside the base, and a lower mold is provided inside the groove, a cylinder is provided at the upper end of the L-shaped support plate, and the output end of the cylinder passes through the upper end of the L-shaped support plate, and the output end of the cylinder is fixedly connected to a connecting plate, an upper mold is provided inside the device main body, and is provided at the lower end of the connecting plate, the upper mold and the lower mold can be directly sealed and connected by the cylinder, and the upper mold and the lower mold can be conveniently disassembled, so that the device can replace molds with different internal shapes when using the mold, thereby improving the use efficiency of the device.

[0004] However, the above-mentioned injection mold does not have the function of cooling the mold. When the hot melted plastic is injected into the mold cavity by the injection molding machine at high pressure, if it cannot be cooled in time, the mold forming time will be extended and the work efficiency will be reduced. Utility Model Content

[0005] The utility model provides a plastic product injection molding mold to solve the problems in the background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A plastic product injection molding mold comprises a base, a water tank and a cooling component, wherein a lower mold is installed on the surface of the base, a hot water pipe is movably installed on the outer side of the lower mold, a protective frame is fixedly installed on the outer side of the hot water pipe, a water inlet is arranged at one end of the hot water pipe, the water inlet extends into the water tank and is connected to a water pump in the water tank, a return pipe is arranged at the other end of the hot water pipe, the return pipe extends to the upper surface of the water tank and is connected to the top of the water tank, and a cooling component is fixedly installed on one side of the water tank.

[0008] As a preferred embodiment of this embodiment, the cooling component includes a semiconductor refrigeration sheet, and a semiconductor refrigeration sheet is installed on the surface of one side of the cooling component close to the water tank. A heat-conducting copper tube is fixedly installed on the surface of one side of the semiconductor refrigeration sheet, and one end of the heat-conducting copper tube extends into the interior of the water tank.

[0009] As a preference of this embodiment, a heat dissipation fin is installed on the other side of the semiconductor refrigeration plate, and a heat dissipation fan is arranged on the left side of the heat dissipation fin.

[0010] As a preferred embodiment of the present invention, the heat dissipation fan is movably mounted on the inner wall of the cooling component housing, the outer surface of the cooling component housing is provided with air holes, and air permeable nets are installed in the air holes.

[0011] As a preference of this embodiment, an L-shaped support plate is provided on the surface of the base, a cylinder is provided on the upper surface of the L-shaped support plate, and an output end of the cylinder passes through the L-shaped support plate.

[0012] As a preferred embodiment of the present invention, a connecting plate is fixedly mounted on the output end of the cylinder, an injection hole is arranged inside the connecting plate, and an upper mold is mounted on the lower end of the connecting plate.

[0013] As a preferred embodiment of this embodiment, sliding holes are symmetrically arranged inside both ends of the connecting plate, and sliding rods are movably installed on the inner walls of the sliding holes, and the upper ends of the sliding rods are fixedly installed on the bottom surface of the L-shaped supporting plate.

[0014] As a preference of this embodiment, a filter cover is installed on the outside of the water pump.

[0015] As a preference of this embodiment, the lower end of the sliding rod is fixedly connected to the upper surface of the base, and the connecting plate is slidably connected to the sliding rod.

[0016] As a preference of this embodiment, a groove is provided inside the lower mold, and the position of the upper mold is adapted to the groove.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] The utility model can cool the water in the water tank by setting a semiconductor cooling sheet, and the cooled water can cool the lower mold through the hot water pipe, which can quickly cool the mold and improve the work efficiency. By setting a heat dissipation fan and heat dissipation fins, when the semiconductor cooling sheet works, it will emit heat, and the heat can be guided out by setting the heat dissipation fins, and then the heat can be dissipated by the heat dissipation fan, so as to achieve the effect of cooling the semiconductor cooling sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of the plastic product injection molding mold of the utility model;

[0020] Figure 2 It is a plan view of the injection molding mold for plastic products of the utility model;

[0021] Figure 3 This is an enlarged detail view of part A of the plastic product injection molding mold of the utility model.

[0022] As shown in the figure: 1. Base; 2. Lower mold; 3. Protection frame; 4. Heat conduction water pipe; 5. Water tank; 51. Water inlet; 52. Water pump; 53. Filter cover; 54. Return pipe; 10. Cooling component; 101. Semiconductor refrigeration plate; 102. Heat dissipation fins; 103. Heat dissipation fan; 104. Breathable net; 105. Heat conduction copper tube; 11. L-shaped support plate; 12. Cylinder; 13. Injection hole; 14. Connecting plate; 15. Slide rod; 16. Upper mold. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figures 1 to 3 As shown, the embodiment of the utility model provides a plastic product injection molding mold, specifically comprising a base 1, a lower mold 2 is installed on the surface of the base 1, a hot water pipe 4 is movably installed on the outer side of the lower mold 2, and a protective frame 3 is fixedly installed on the outer side of the hot water pipe 4. A water inlet 51 is provided at one end of the hot water pipe 4, and the water inlet 51 extends into the water tank 5 and is connected to the water pump 52 in the water tank 5. A return water pipe 54 is provided at the other end of the hot water pipe 4, and the return water pipe 54 extends to the upper surface of the water tank 5 and is connected to the top of the water tank 5. A cooling component 10 is fixedly installed on one side of the water tank 5, and the cooling component 10 includes a semiconductor cooling sheet 101, a heat dissipation fin 102 and a heat dissipation fan 103. A semiconductor cooling sheet 101 is installed on the surface of the cooling component 10 close to the water tank 5, and a heat-conducting copper pipe 105 is fixedly installed on the surface of one side of the semiconductor cooling sheet 101, and one end of the heat-conducting copper pipe 105 extends to the inside of the water tank 5. The other side of the semiconductor cooling sheet 101 is provided with a heat dissipation fin 102, and the left side of the heat dissipation fin 102 is provided with a heat dissipation fan 103, which is movably installed on the inner wall of the cooling component 10. The outer surface of the cooling component 10 is provided with a vent, and a vent net 104 is installed in the vent.

[0025] In this embodiment, by providing a semiconductor refrigeration sheet 101, the water in the water tank 5 can be cooled, and the cooled water can then cool the lower mold 2 through the hot water pipe 4, which can achieve the effect of quickly cooling the mold and improve work efficiency. By providing a heat dissipation fan 103 and heat dissipation fins 102, when the semiconductor refrigeration sheet 101 is working, it will emit heat. By providing the heat dissipation fins 102 to conduct the heat, and then by providing the heat dissipation fan 103 to dissipate the heat, the semiconductor refrigeration sheet 101 can be cooled. By installing a filter cover 53 on the outside of the water pump 52, the water pump 52 can be protected, thereby improving the safety of the water pump 52 and facilitating use by users.

[0026] See also Figures 1 to 3 As shown, the surface of the base 1 is provided with an L-shaped support plate 11, and the upper surface of the L-shaped support plate 11 is provided with a cylinder 12, the output end of the cylinder 12 passes through the L-shaped support plate 11, and the output end of the cylinder 12 is fixedly installed with a connecting plate 14. The connecting plate 14 is provided with an injection hole 13 inside, and the lower end of the connecting plate 14 is installed with an upper mold 16. In this embodiment, by providing the cylinder 12, the upper mold 16 can be directly sealed and connected with the lower mold 2, and the upper mold 16 and the lower mold 2 can be easily disassembled, so that the device can replace molds with different internal shapes when using the mold, thereby improving the use efficiency of the device. Sliding holes are symmetrically provided inside the two ends of the connecting plate 14, and the inner wall of the sliding hole is movably installed with a sliding rod 15, the upper end of the sliding rod 15 is fixedly installed on the bottom surface of the L-shaped support plate 11, and the lower end of the sliding rod 15 is fixedly connected to the upper surface of the base 1. By providing the sliding rod 15, the connection plate 14 can be more stable.

[0027] See also Figures 1 to 3 As shown, a filter cover 53 is installed on the outside of the water pump 52. By installing the filter cover 53 on the outside of the water pump 52, the water pump 52 can be protected, the safety of the water pump 52 is improved, and it is convenient for users to use. The connecting plate 14 is slidably connected to the slide bar 15. By setting the sliding connection between the connecting plate 14 and the slide bar 15, the upper mold 16 and the lower mold 2 can be more accurately docked, and the connecting plate 14 can also be made more stable. A groove is provided inside the lower mold 2, and the upper mold 16 is adapted to the position of the groove and is sealed. Through the sealed connection between the upper mold 16 and the lower mold 2, the mold can be extruded.

[0028] During use, when the mold needs to be cooled, the semiconductor refrigeration sheet 101 is started to cool the water in the water tank 5, and then the water pump 52 is started to fill the hot water pipe 4 with cooling water, and water circulation is performed to quickly cool the lower mold 2. When the semiconductor refrigeration sheet 101 needs to be cooled, the heat dissipation fan 103 is started. At this time, the heat on the back of the semiconductor refrigeration sheet 101 is discharged through the heat dissipation fins 102, and then dissipated through the heat dissipation fan 103, which can achieve the effect of cooling the semiconductor refrigeration sheet 101.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plastic product injection molding mold, comprising a base (1), characterized in that: A lower mold (2) is installed on the surface of the base (1); a hot water pipe (4) is movably installed on the outer side of the lower mold (2); a protective frame (3) is fixedly installed on the outer side of the hot water pipe (4); a water inlet (51) is provided at one end of the hot water pipe (4); the water inlet (51) extends into the water tank (5) and is connected to a water pump (52) in the water tank (5); a water return pipe (54) is provided at the other end of the hot water pipe (4); the water return pipe (54) extends to the upper surface of the water tank (5) and is connected to the top of the water tank (5); a cooling component (10) is fixedly installed on one side of the water tank (5); The cooling component (10) comprises a semiconductor cooling sheet (101), a semiconductor cooling sheet (101) being installed on a surface of one side of the cooling component (10) close to the water tank (5), a heat-conducting copper tube (105) being fixedly installed on a surface of one side of the semiconductor cooling sheet (101), one end of the heat-conducting copper tube (105) extending into the water tank (5), a heat-dissipating fin (102) being installed on the other side of the semiconductor cooling sheet (101), a heat-dissipating fan (103) being arranged on the left side of the heat-dissipating fin (102), the heat-dissipating fan (103) being movably installed on the inner wall of the cooling component (10) casing, and air vents being arranged on the outer surface of the cooling component (10) casing, and air vents being arranged in the air vents. Air permeable nets (104) are installed in the air vents.

2. The plastic product injection molding mold according to claim 1, characterized in that: An L-shaped support plate (11) is arranged on the surface of the base (1), a cylinder (12) is arranged on the upper surface of the L-shaped support plate (11), and an output end of the cylinder (12) passes through the L-shaped support plate (11).

3. The plastic product injection molding mold according to claim 2, characterized in that: A connecting plate (14) is fixedly mounted on the output end of the cylinder (12), a material injection hole (13) is arranged inside the connecting plate (14), and an upper mold (16) is mounted on the lower end of the connecting plate (14).

4. The plastic product injection molding mold according to claim 3, characterized in that: Sliding holes are symmetrically arranged inside the two ends of the connecting plate (14), and a sliding rod (15) is movably installed on the inner wall of the sliding hole. The upper end of the sliding rod (15) is fixedly installed on the bottom surface of the L-shaped supporting plate (11).

5. The plastic product injection molding mold according to claim 4, characterized in that: A filter cover (53) is installed on the outer side of the water pump (52).

6. The plastic product injection molding mold according to claim 5, characterized in that: The lower end of the sliding rod (15) is fixedly connected to the upper surface of the base (1), and the connecting plate (14) is slidably connected to the sliding rod (15).

7. The plastic product injection molding mold according to claim 6, characterized in that: The lower mold (2) is provided with a groove inside, and the upper mold (16) is adapted to the position of the groove.

Images