Gas condensation device and chip manufacturing equipment
By installing barriers in the pipelines of chip manufacturing equipment and combining cooling water pipe design, the problem of insufficient adsorption capacity of gas condensation devices in the prior art is solved, and more efficient gas substance adsorption and equipment performance improvement are achieved.
Patent Information
- Application Number
- CN202421094071.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-17
AI Technical Summary
The adsorption capacity of gas condensation devices in existing chip manufacturing equipment is limited, which makes it difficult to effectively adsorb by-products, affecting the performance and service life of the equipment.
Installing barriers in the pipes of chip manufacturing equipment, combined with cooling water pipe design, enhance the gas condensation effect through temperature difference and fluid dynamic optimization. The shape and quantity of barriers can be designed according to the shape and spatial layout of the pipes to improve adsorption efficiency.
It significantly enhances the adsorption capacity of the gas condensation device to the substances in the gas, prevents the loss of by-products, extends the service life of the equipment and reduces the risk of blockage.
Smart Images
Figure CN222250964U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor process gas processing technology, and in particular to a gas condensation device for chip manufacturing equipment and chip manufacturing equipment. Background Art
[0002] The ASM nitride machine is used for nitride deposition in semiconductor processes. The ASM nitride machine has a trap pipe, which is used to adsorb specific components in the gas. Specifically, there is a heating belt at the front end of the trap pipe, but there is no heating belt in the trap pipe, so as to create a temperature difference, so that by-products such as silicon nitride by-products are adsorbed in the trap pipe.
[0003] However, the trap pipe has a simple shape, just a cylinder, and its adsorption capacity is limited.
[0004] Therefore, how to enhance the adsorption capacity of the gas adsorption device in the chip manufacturing equipment is a technical problem that needs to be solved. Utility Model Content
[0005] The purpose of the present application is to provide a gas condensation device for chip manufacturing equipment and chip manufacturing equipment to enhance the adsorption capacity of the gas adsorption device in the chip manufacturing equipment.
[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions.
[0007] In a first aspect, an embodiment of the present application provides a gas condensation device for chip manufacturing equipment, including a pipeline and a blocking member;
[0008] The blocking member is installed on the inner wall of the pipeline;
[0009] The blocking member is used to block the gas when the gas passes through, and condense part of the substances in the gas on the blocking member.
[0010] Compared with the prior art, this application has the following beneficial effects:
[0011] The gas condensation device for chip manufacturing equipment provided in the embodiment of the present application has a baffle added in the pipeline, which can condense part of the substances in the gas on the baffle, thereby enhancing the adsorption capacity of the gas condensation device for chip manufacturing equipment for the substances in the gas.
[0012] Optionally, the number of the blocking members is greater than 2.
[0013] The increase in the number of blocking members can further enhance the adsorption capacity of the gas condensation device of the chip manufacturing equipment for substances in the gas.
[0014] Optionally, at least one edge of the blocking member is in close contact with the inner wall of the pipe.
[0015] The edge of the blocking member is in close contact with the inner wall of the pipeline, which can prevent the gas from flowing through the gap on the inner wall of the pipeline.
[0016] Optionally, the inner wall of the pipe is a cylindrical surface, and the blocking member is in a shape surrounded by an arc edge and a straight line, the arc edge is close to the inner wall of the pipe, and the length of the arc edge is greater than or equal to the arc length of a semicircle.
[0017] The circular pipe is easy to design and manufacture, and is matched with a blocking piece with an arc edge. The blocking piece with an arc edge is tightly attached to the inner wall of the pipe, and can prevent gas from flowing along the inner wall of the pipe.
[0018] Optionally, the cross-section of the pipeline is rectangular, the blocking member is rectangular, and three sides of the blocking member are in close contact with three inner walls of the pipeline.
[0019] The rectangular pipe is easy to design and manufacture, and is matched with a rectangular blocking piece, the three sides of which are in close contact with the inner wall of the pipe, so as to prevent the gas from flowing along the inner wall of the pipe.
[0020] Optionally, the chip manufacturing equipment gas condensation device further includes a cooling water pipe, and the cooling water pipe is closely attached to the outer wall of the pipeline.
[0021] The cooling water pipe has a cooling effect on the pipeline, and the lower temperature is conducive to the substances in the gas being adsorbed onto the blocking parts.
[0022] Optionally, the cooling water pipe is tightly attached to the outer wall of the pipeline in a spirally wound manner.
[0023] The cooling water pipe is tightly attached to the outer wall of the pipeline in a spirally wound manner, so that the cooling around the pipeline can be more comprehensive and uniform.
[0024] Optionally, the air inlet of the pipeline is arranged at the top, and the air outlet is arranged at the bottom.
[0025] This design allows the gas to flow from top to bottom. The higher temperature gas flows in, and the pipe has a heat dissipation effect. The lower it goes, the lower the temperature is, and the easier it is to adsorb. More substances are adsorbed at the bottom, and it is easy to use the adsorbed substances' own gravity to discharge the adsorbed substances from the bottom.
[0026] Optionally, the chip manufacturing equipment gas condensation device further includes an air pump connected to one end of the pipeline.
[0027] The vacuum pump can promote the flow of gas in the desired direction.
[0028] In a second aspect, an embodiment of the present application provides a chip manufacturing device, the chip manufacturing device comprising the chip manufacturing device gas condensation device of the first aspect. The optional implementation manner and beneficial effects are consistent with the above-mentioned chip manufacturing device gas condensation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0030] Figure 1 A schematic diagram of a trap pipeline of an ASM nitride machine in the prior art;
[0031] Figure 2 A schematic diagram of a gas condensation device for chip manufacturing equipment provided in an embodiment of the present application;
[0032] Figure 3 A schematic diagram of a gas condensation device for chip manufacturing equipment with a cooling water pipe provided in an embodiment of the present application;
[0033] Figure 4 A schematic diagram of a gas condensation device for chip manufacturing equipment having a blocking member provided in an embodiment of the present application;
[0034] Figure 5 A schematic diagram of a gas condensation device for chip manufacturing equipment with two blocking members provided in an embodiment of the present application;
[0035] Figure 6 A schematic diagram of a blocking member with arc edges in a gas condensation device of a chip manufacturing equipment provided in an embodiment of the present application;
[0036] Figure 7 A schematic diagram of a rectangular pipe and a rectangular blocking member provided in an embodiment of the present application;
[0037] Figure 8 A schematic diagram of an elliptical pipe and a blocking member adapted to the elliptical pipe provided in an embodiment of the present application;
[0038] Fig. 9 A schematic diagram of an elliptical pipe and a blocking member that is not compatible with the elliptical pipe provided in an embodiment of the present application;
[0039] Fig.10 A schematic diagram of a blocking member that is larger than a semicircle and adapted to a circular pipe provided in an embodiment of the present application.
[0040] Description of reference numerals:
[0041] 10 trap pipe
[0042] 20 Byproducts
[0043] 30 Pipe
[0044] 40 Blocking Pieces
[0045] 41 Upper straight line
[0046] 42 straight line below
[0047] 43 Left straight line
[0048] 44 Right straight line
[0049] 50 Cooling pipes
[0050] 51 Water Inlet
[0051] 52 Water outlet DETAILED DESCRIPTION
[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be noted that:
[0053] The described embodiments are some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described in the drawings herein can be arranged and designed in various different configurations;
[0054] The following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application as claimed, but merely represents selected embodiments of the present application;
[0055] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work shall fall within the scope of protection of this application;
[0056] In the absence of conflict, the following embodiments and features of the embodiments may be combined with each other;
[0057] Relational terms such as first and second, etc., are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations;
[0058] The term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0059] ASM nitride equipment is used for nitride deposition in semiconductor processes. Process gases carry many by-products after leaving the growth zone of the reactor. If not properly treated, these by-products will become dust and particles after cooling in the pipeline. Some will be adsorbed on the inner surface of the pipeline and valve, blocking the vacuum pipeline and valve, and may also seriously affect the sealing performance of the valve. Some will be sucked into the vacuum pump, affecting the performance and service life of the pump.
[0060] A trap pipeline of an ASM nitride machine Figure 1 , gas can be captured by condensation on the surface of the cooled trap pipe. The trap pipe is a trap used to adsorb gas or capture oil vapor. Due to the heat dissipation of the pipe, the trap pipe has the function of cold trap treatment and can be used to collect substances within a certain melting point range to play a separation role.
[0061] like Figure 1 , the by-products 20 in the gas flow through the trap pipe 10, and part of the by-products 20 are deposited on the trap pipe 10 to prevent the by-products in the gas from affecting subsequent pipes, valves, pumps, etc.
[0062] However, Figure 1 The trap pipe shown has a simple shape, which is just a cylinder, and has a limited adsorption capacity. Some by-products 20 can also pass through the trap pipe 10 directly, which has an adverse effect on the components in the subsequent pipelines.
[0063] like Figure 2 An embodiment of the present application provides a gas condensation device for chip manufacturing equipment. The gas condensation device for chip manufacturing equipment includes a pipeline 30 and a blocking member 40.
[0064] It should be noted that the pipe in the figure does not show the complete structure such as thickness, and does not show the size. This application does not limit the thickness, size, etc. in actual implementation.
[0065] The blocking member 40 is installed on the inner wall of the pipe 30, and the blocking member 40 mainly plays the following roles:
[0066] When the gas passes through, it forms a barrier to the gas and removes some of the substances in the gas (such as Figure 2 The byproducts 20) in the mixture are condensed on the blocking member 40.
[0067] Arrows in the figure show the flow direction of the gas. The gas first enters from the air inlet, passes through the cavity formed by the blocking member 40 and the inner wall of the pipe 30 in an "S" shape, and flows out from the air outlet.
[0068] The pipeline at the front end of the pipeline 30 has a heating belt, while the pipeline 30 has no heating belt, thereby creating a temperature difference, so that the by-products are adsorbed in the pipeline 30.
[0069] When a cooling pipe is provided outside the pipe 30, the pipe and the barrier inside it can be cooled down. A lower temperature is conducive to the substances in the gas being adsorbed onto the barrier, for example, oil vapor is liquefied onto the barrier. The cooling pipe can solve the following technical problems: once the temperature increases, the adsorption capacity of the gas condensation device decreases, which easily causes the back-end pipeline and pump pipeline of the gas condensation device to be blocked.
[0070] like Figure 3 The cooling pipe 50 can be spirally wound close to the outer wall of the pipe 30, which can make the cooling around the pipe more comprehensive and uniform.
[0071] The cooling medium in the cooling pipe can be water. Water as a cooling medium has the advantages of low cost and easy availability.
[0072] The water inlet 51 of the cooling pipe can be designed to be at one end close to the air inlet of the pipe 30 , and the water outlet 52 can be designed to be at one end close to the air outlet of the pipe 30 , which is conducive to rapid cooling of the gas just entering the pipe 30 .
[0073] The air inlet of the pipe 30 can be designed to be at the top and the air outlet at the bottom. The air inlet can be connected to the machine end interface, and the air outlet can be connected to the vacuum pump pipe interface. This design allows the gas to flow from the top to the bottom. The higher temperature gas flows in, and the pipe has a heat dissipation effect. The lower it goes, the lower the temperature is, and the easier it is to adsorb. There are more substances adsorbed at the bottom, and it is easy to discharge from the bottom using the self-gravity of the adsorbed substances.
[0074] Regarding the number of blocking pieces, this application does not limit the number of blocking pieces. Figure 4 , Figure 5 Different examples are shown:
[0075] like Figure 4 , the blocking piece can be one;
[0076] like Figure 5 , the blocking pieces can be 2.
[0077] More blocking members can be provided, and the greater the number of blocking members, the stronger the gas blocking effect is.
[0078] In addition, when there are too many blocking pieces, the following effects may occur:
[0079] (1) The gas flow rate decreases, which has a negative impact on the gas processing efficiency;
[0080] (2) Increased requirements for pumps, such as the need to use a pump with higher power;
[0081] (3) The energy consumption of the pump increases, and the energy cost rises.
[0082] The appropriate pipe size can be designed based on the space at the application site, the spacing of the blocking pieces can be designed, and the number of blocking pieces can be set according to the size of the pipe.
[0083] When the number of the blocking pieces is greater than 2, the gas flow can be made to include an "S" shape, which can form a strong barrier and limit the gas flow direction. For by-products, there is a larger effective attachment area, thereby achieving a better adsorption effect.
[0084] The shape of the blocking member 40 can be designed according to the shape of the pipe 30. The pipe can be designed as a circular pipe or a square pipe, or other shapes. The present application does not limit the shape of the pipe, and an example is given below.
[0085] The pipe 30 may be a circular pipe, the inner wall of the pipe 30 is a cylindrical surface, and the blocking member 40 may be in the form of a sheet, a sheet with uniform thickness, or a sheet with a thickness that varies regularly.
[0086] Figure 6 A top view of the shape of a blocking member is shown, the bold line represents the edge of the blocking member 40, and the dotted line represents the shape of the inner wall of the pipe 30. The blocking member 40 has two sides, one side is an arc, and the other side is a straight line. The overall top view of the blocking member 40 is a shape surrounded by an arc side and a straight line, and the arc side is close to the inner wall of the pipe 30.
[0087] The pipe 30 may be a pipe with a rectangular cross section, and the inner wall of the pipe 30 is a plane. Figure 7 A top view of the shape of a blocking member is shown. The blocking member 40 has two sides. The bold line represents the edge of the blocking member 40 , and the dotted line represents the shape of the inner wall of the pipe 30 .
[0088] The blocking member 40 has four sides, one side is an upper straight line 41, one side is a lower straight line 42, one side is a left straight line 43, and one side is a right straight line 44. The overall shape of the blocking member 40 in the top view is a rectangle, and the edges of the upper straight line 41, the lower straight line 42 and the right straight line 44 are close to the inner wall of the pipe 30.
[0089] The pipe 30 may be a pipe with an elliptical cross section, such as Figure 8 One edge of the blocking member 40 is in close contact with the pipe with an elliptical cross-section.
[0090] Taking the above-mentioned circular pipe and square pipe implementation methods as examples, at least one edge of the blocking member is in close contact with the inner wall of the pipe, which can prevent the gas from flowing through the gaps on the inner wall of the pipe, thereby forming a stronger blocking effect on the gas and limiting the flow path, ensuring a larger effective adsorption area.
[0091] On the contrary, if a gap is formed between the blocking member and the inner wall of the pipe, such as Fig. 9 The pipe has an elliptical cross-section while the edge of the baffle is an arc. A gap is formed between the arc edge of the baffle and the inner wall of the pipe, which is not conducive to the gas forming an "S"-shaped flow. Some gas will flow through the gap. If the next-level baffle also forms a gap at this position, then this part of the gas will not be blocked, and it will be difficult to complete the adsorption of the by-products therein.
[0092] The surface of the blocking member can be designed to be larger than half of the pipe cross section. For example, if the pipe cross section is circular, the shape of the blocking member is a shape that covers the semicircle, such as Fig.10 The top view shape of the blocking piece is a circle minus a small elliptical cut, and the blocking piece covers a semicircle of the same diameter. The small elliptical edge cut left thereby forms a smoother gas channel cross-section with the inner wall of the pipe, which is conducive to the orderly flow of gas and reduces the heat caused by gas vortex.
[0093] Regarding the material of the blocking member, the blocking member may be made of plastic, which is not easy to react with impurities in the gas and has a strong corrosion resistance.
[0094] The material of the blocking piece can be metal, and the material of the pipe can also be metal.
[0095] When the material of the blocking piece is metal and the material of the pipe is also metal, the two can be fixed by welding, which is a more secure fixing method.
[0096] The blocking piece can be fixed to the pipe in a detachable manner, such as screws and screw holes.
[0097] A coating can be added to the blocking member, and the material of the coating has corrosion resistance, thereby preventing corrosion by impurities in the gas and extending the service life.
[0098] The coating can also be non-stick, which is convenient for subsequent cleaning and maintenance and has a longer service life.
[0099] Based on the above embodiments, the embodiments of the present application also provide a chip manufacturing equipment, and the chip manufacturing equipment includes the above-mentioned chip manufacturing equipment gas condensation device.
[0100] In general, the present application proposes a gas condensation device for chip manufacturing equipment and chip manufacturing equipment, wherein a baffle is installed on the inner wall of a pipeline, and the design of the baffle enhances the adsorption capacity of the gas condensation device for chip manufacturing equipment for substances in the gas.
[0101] The above-described device and system embodiments are merely illustrative, and some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. A person skilled in the art may understand and implement the present embodiment without creative effort.
[0102] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A gas condensation device for chip manufacturing equipment, characterized in that: Including pipes and barriers; The blocking member is installed on the inner wall of the pipeline; The blocking member is used to block the gas when the gas passes through, and condense part of the substances in the gas on the blocking member.
2. The gas condensation device for chip manufacturing equipment according to claim 1, characterized in that: The number of the blocking members is greater than 2.
3. The gas condensation device for chip manufacturing equipment according to claim 1, characterized in that: At least one edge of the blocking member is in close contact with the inner wall of the pipeline.
4. The gas condensation device for chip manufacturing equipment according to claim 3, characterized in that: The inner wall of the pipe is a cylindrical surface, and the blocking member is in a shape surrounded by an arc edge and a straight line. The arc edge is close to the inner wall of the pipe, and the length of the arc edge is greater than or equal to the arc length of a semicircle.
5. The gas condensation device for chip manufacturing equipment according to claim 3, characterized in that: The cross section of the pipeline is rectangular, the blocking member is rectangular, and three sides of the blocking member are closely attached to three inner walls of the pipeline.
6. The gas condensation device for chip manufacturing equipment according to claim 1, characterized in that: The chip manufacturing equipment gas condensation device also includes a cooling water pipe, and the cooling water pipe is closely attached to the outer wall of the pipeline.
7. The gas condensation device for chip manufacturing equipment according to claim 6, characterized in that: The cooling water pipe is tightly attached to the outer wall of the pipeline in a spirally wound manner.
8. The gas condensation device for chip manufacturing equipment according to claim 1, characterized in that: The air inlet of the pipeline is arranged at the top, and the air outlet is arranged at the bottom.
9. The gas condensation device for chip manufacturing equipment according to claim 1, characterized in that: The chip manufacturing equipment gas condensation device further includes an air pump connected to one end of the pipeline.
10. A chip manufacturing device, characterized in that: The chip manufacturing equipment comprises the chip manufacturing equipment gas condensation device according to any one of claims 1 to 9.