Floor heat conduction groove structure
By adopting a multi-layer superposition structure of the floor thermal conduction groove, including the core panel heat dissipation channel and sound insulation groove, the heat dissipation and strength problems of solid wood floors in geothermal heating environments are solved, and good thermal insulation performance and service life are achieved.
Patent Information
- Application Number
- CN202420609406.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-27
AI Technical Summary
The existing solid wood floors have poor heat dissipation effect in geothermal heating environments, and are prone to bulging and drying joints. The layered structure leads to reduced strength and abnormal noise problems, and have a short service life.
The floor heat conduction grooves with a multi-layer superposition structure include a balance layer, a connecting layer and a wear-resistant layer. The connecting layer is equipped with a core plate and a heat dissipation channel. The balance layer is equipped with a sound insulation groove to form a ventilation and heat dissipation network to improve thermal conductivity and sound insulation effect.
It significantly improves the thermal conductivity and sound insulation of the floor, uniformizes the stress, extends the service life, and solves the problems of uneven stress and abnormal noise in traditional solid wood floors in the long term.
Smart Images
Figure CN222252920U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of floor, and more specifically to a floor heat conduction groove structure. Background Art
[0002] With the improvement of people's living standards, more and more houses are using geothermal heating. While bringing comfort and convenience to people's lives, it also brings about the problem of floor heat dissipation in floor decoration.
[0003] Solid wood flooring is loved by people for its natural, pollution-free and easy processing characteristics. However, since solid wood flooring is greatly affected by the temperature and humidity in the environment, it will expand and shrink. If it is used in a house with geothermal heating, if the structure design is unreasonable, not only will the heat dissipation effect be poor, but bulging and dry seams will also occur, which will affect both the use effect and the overall appearance. Although the existing heat dissipation wood flooring can solve the heat conduction problem of wood flooring, its layered structure and the setting of the heat-conducting middle layer will significantly reduce the strength of the wood flooring. In addition, under actual use conditions, wood flooring is usually unevenly stressed and deformed in various areas or parts for a long time, and will make strange noises when stepped on. Especially in occasions where solid wood flooring or solid wood composite flooring is required.
[0004] Therefore, it is an urgent problem for technical personnel in this field to provide a floor heat conduction groove structure with a simple structure, easy production, good heat dissipation performance and sound insulation effect, more uniform overall force and long service life. Utility Model Content
[0005] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a floor heat conduction groove structure which has a simple structure, is easy to produce, has guaranteed strength and has good heat conduction and sound insulation properties.
[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions, which mainly include:
[0007] A floor heat conduction groove structure adopts a multi-layer superposition structure, which includes a balance layer, a connection layer and a wear-resistant layer from bottom to top.
[0008] Preferably, the connection layer includes a core plate, one side of the core plate is provided with a female tenon, the other side of the core plate is provided with a male tenon, and a plurality of heat dissipation channels are opened on the connection plate.
[0009] Preferably, the balancing layer includes a bottom plate, and a plurality of sound insulation grooves are provided on the bottom surface of the floor.
[0010] Preferably, the wear-resistant layer includes a top plate and a wear-resistant coating.
[0011] Preferably, the core board adopts a 45° oblique heat dissipation channel, a single heat dissipation hole at the bottom corresponding to multiple heat dissipation holes at the top; the single heat conduction hole at the bottom is connected to multiple heat conduction holes at the top.
[0012] Preferably, the heat dissipation hole is in the shape of a cylinder with equal inner and outer diameters.
[0013] Preferably, the horizontal cross-section of the sound insulation groove is rectangular, and the groove opening faces the ground.
[0014] Preferably, the top plate can be made of oak, teak, walnut, etc., the core plate can be made of high-density fiberboard, and the bottom plate can be made of waterproof wood such as pine.
[0015] It can be seen from the above technical scheme that compared with the prior art, the utility model adopts a multi-layer composite structure, and the bottom plate is provided with a plurality of sound insulation grooves, which block the propagation of sound by reflection and isolation, thereby improving the sound insulation efficiency of the floor. The core plate is provided with a plurality of heat dissipation holes, and the structural design adopts a structure form that is interconnected with each other to form a ventilation and heat dissipation network. The thermal conductivity efficiency is significantly improved, and the installation process is also very convenient. The core plate adopts a 45° beveled heat dissipation channel to form a triangular support structure, which solves the problems of long-term uneven force and deformation of traditional solid wood thermal conductive floors, and abnormal noise when stepped on, thereby extending the service life of solid wood. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0017] Figure 1 It is a structural schematic diagram of the utility model.
[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the core plate of the present utility model.
[0019] Figure 3 It is a schematic diagram of the top view structure of the core plate of the utility model.
[0020] Figure 4 It is a schematic diagram of the cross-sectional structure of the bottom plate of the utility model.
[0021] Figure 5 This is a structural schematic diagram of Example 2 of the present utility model.
[0022] Explanation of the reference numerals: 1-wear-resistant layer, 2-connecting layer, 3-balancing layer, 4-female tenon, 5-male tenon, 6-heat-conducting hole, 7-sound insulation groove, 8-wear-resistant coating, 9-top plate, 10-core plate, 11-bottom plate. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example 1
[0024] A floor heat conduction groove structure, such as Figures 1 to 4 As shown, a multi-layer stacking structure is adopted, which includes a balancing layer 3, a connecting layer 2 and a wear-resistant layer 1 from bottom to top.
[0025] In order to further optimize the above solution, the connection layer 2 includes a core plate 10, one side of the core plate 10 is provided with a female tenon 4, the other side is provided with a male tenon 5, and a plurality of heat dissipation channels are opened on the connection plate.
[0026] In order to further optimize the above solution, the balancing layer 3 includes a bottom plate 11, and a plurality of sound insulation grooves 7 are provided on the bottom surface of the floor.
[0027] Preferably, the wear-resistant layer 1 includes a top plate 9 and a wear-resistant coating 8 .
[0028] In order to further optimize the above solution, the core board 10 adopts a 45° angled heat dissipation channel, a single heat conduction hole 6 at the bottom, and corresponding two heat conduction holes 6 at the top, which greatly improves the thermal conductivity of the wooden floor while enhancing the sound insulation performance.
[0029] In order to further optimize the above scheme, the horizontal cross-section of the sound insulation groove 7 is rectangular, and the groove surface is opened toward the ground, and plays a certain role in heat preservation.
[0030] In order to further optimize the above solution, the overall thickness of the present application is 10mm-15mm.
[0031] In order to further optimize the above solution, the wear-resistant layer 1 has a thickness of 2 mm to 4 mm, which reduces the loss of the floor surface and maintains the overall aesthetics and waterproofness of the floor.
[0032] In order to further optimize the above solution, the thickness of the connecting layer 2 is 6 mm to 8 mm, which has excellent air circulation performance and ensures the thermal conductivity of the floor.
[0033] In order to further optimize the above solution, the balancing layer 3 has a thickness of 2 mm to 3 mm and has good sound insulation and moisture-proof properties. Example 2
[0034] A floor heat conduction groove structure, such as Figure 5 As shown, a multi-layer stacking structure is adopted, which includes a balancing layer 3, a connecting layer 2 and a wear-resistant layer 1 from bottom to top.
[0035] In order to further optimize the above solution, the connection layer 2 includes a core plate 10, one side of the core plate 10 is provided with a female tenon 4, the other side is provided with a male tenon 5, and a plurality of heat dissipation channels are opened on the connection plate.
[0036] In order to further optimize the above solution, the balancing layer 3 includes a bottom plate 11, and a plurality of sound insulation grooves 7 are provided on the bottom surface of the floor.
[0037] In order to further optimize the above solution, the core board 10 adopts a 45° angled heat dissipation channel, a single heat conduction hole 6 at the bottom, and corresponding multiple heat conduction holes 6 at the top, which are interconnected, thereby greatly improving the thermal conductivity of the wooden floor while enhancing the sound insulation performance.
[0038] Working principle: After the device is installed, the sound insulation groove 7 opened on the bottom plate can effectively isolate most of the internal noise. The core plate is provided with a plurality of heat dissipation holes, and the structural design adopts a structure form that is interconnected with each other, forming a ventilation and heat dissipation network, and the thermal conductivity efficiency is significantly improved.
[0039] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.
[0040] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A floor heat conduction groove structure, characterized in that: A multi-layer stacked structure is adopted, which comprises, from bottom to top, a balancing layer (3), a connecting layer (2) and a wear-resistant layer (1); the balancing layer (3) comprises a bottom plate (11), and a plurality of sound insulation grooves (7) are provided on the bottom surface of the floor; the connecting layer (2) comprises a core plate (10), a female tenon (4) is provided on one side of the core plate (10), a male tenon (5) is provided on the other side, and a plurality of heat conduction holes (6) are provided on the connecting plate; the heat dissipation channel adopted by the core plate (10) is a 45° oblique heat dissipation channel, and a single heat conduction hole (6) at the bottom is connected to a plurality of heat conduction holes (6) at the top.
2. A floor heat conduction groove structure according to claim 1, characterized in that: The wear-resistant layer (1) comprises a top plate (9) and a wear-resistant coating (8).