Thermoelectric separation heat dissipation structure for LED
By setting an insulating layer and through-hole thermal conduction block on the substrate to connect the heat dissipation area of the LED lamp beads, the problems of poor thermal conductivity and high production costs of the LED lamp beads are solved, and efficient heat dissipation and cost savings are achieved.
Patent Information
- Application Number
- CN202421038480.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-13
AI Technical Summary
The thermal conductivity of existing LED lamp beads is poor, resulting in high production costs, and it requires etching or machining on the substrate to achieve thermoelectric separation and heat dissipation, which increases production costs.
An insulating layer is provided on the substrate and a thermal conduction block is formed through the through holes to connect the heat dissipation area of the LED lamp beads to avoid etching the thermal conduction platform and reduce production costs.
It realizes effective heat dissipation of LED lamp beads, while reducing the etching process and substrate thickness requirements, saving production costs.
Smart Images
Figure CN222256443U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED lamp bead heat dissipation, and in particular relates to a thermoelectric separation heat dissipation structure for LEDs. Background Art
[0002] With the development of science and technology in the field of lighting, advanced technology is constantly applied to semiconductor production, which continuously improves the luminous efficiency of LED lamp beads. In order to improve the heat dissipation efficiency and ensure the service life of LED lamp beads, engineers have developed a technology for directly performing thermoelectric separation on a metal substrate, so that the heat and electricity of the LED lamp beads are completely separated. After thermoelectric separation, the thermal conductivity is many times higher than that of an ordinary aluminum substrate, which successfully overcomes the current problem of poor thermal conductivity of LED lamp beads and extends the service life of LED lamp beads. However, the current thermoelectric separation technology requires etching or machining (CNC) a thermal conductive platform on the substrate, and the thermal conductive platform is used as the place that contacts the heat dissipation of the LED lamp beads later. However, the etching or machining (CNC) process leads to high production costs. In order to reduce production costs, a thermoelectric separation heat dissipation structure for LED is proposed. Utility Model Content
[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.
[0004] To this end, the utility model proposes a thermoelectric separation heat dissipation structure for LEDs, which has the advantages of avoiding etching of metal substrates and reducing production costs.
[0005] According to the embodiment of the utility model, the thermoelectric separation heat dissipation structure for LED includes: a substrate, which is used to dissipate heat for LED lamp beads; an insulating layer is formed on the substrate, and the insulating layer is used to isolate the LED lamp beads from the substrate; a through hole is formed on the insulating layer, and the through hole passes through the upper and lower surfaces of the insulating layer; a heat conductive block is formed in the through hole, and the heat conductive block is used to connect the heat dissipation area of the substrate and the LED lamp beads; a conductive layer is formed on a part of the insulating layer, and the conductive layer is used to connect the electrodes of the LED lamp beads.
[0006] According to an embodiment of the utility model, one end of the heat conductive block protrudes out of the insulating layer for subsequent connection with the heat dissipation area of the LED lamp bead.
[0007] According to one embodiment of the utility model, the heat conductive block is a metal heat conductive layer, and a solder paste layer is provided between the metal heat conductive layer and the heat dissipation area of the LED lamp bead, and the solder paste layer is used to connect the heat conductive block to the heat dissipation area of the LED lamp bead.
[0008] According to an embodiment of the present invention, the insulating layer is an ink layer to isolate the substrate and the conductive layer.
[0009] According to an embodiment of the present invention, the thickness of the insulating layer is not less than 30 μm.
[0010] According to an embodiment of the present invention, a protective layer is formed on another part of the insulating layer to protect the conductive layer.
[0011] According to an embodiment of the utility model, the protective layer is a photosensitive ink layer.
[0012] According to an embodiment of the present invention, the substrate is a copper substrate.
[0013] The beneficial effect of the utility model is that an insulating layer is arranged above the substrate, a heat-conducting block is arranged through a through hole, and the heat-conducting block is used to connect the heat dissipation area of the LED lamp bead, thereby realizing the heat dissipation of the LED lamp bead. At the same time, since the heat-conducting platform is avoided from being etched on the substrate, the etching process is reduced, the requirement for the thickness of the substrate is reduced, and the production cost is saved.
[0014] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.
[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments of the present invention, in which:
[0017] Figure 1 It is a cross-sectional schematic diagram of the overall structure of the utility model;
[0018] Reference numerals:
[0019] 1. Substrate; 2. Insulation layer; 22. Heat conducting block; 4. Conductive layer; 5. Protective layer; 6. LED lamp beads. DETAILED DESCRIPTION
[0020] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0021] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] The following is a detailed description of the thermoelectric separation heat dissipation structure for LEDs according to an embodiment of the utility model with reference to the accompanying drawings.
[0024] like Figure 1 As shown, the thermoelectric separation heat dissipation structure for LED according to the embodiment of the utility model includes: a substrate 1, the substrate 1 is used to dissipate heat for the LED lamp beads 6; an insulating layer 2 is formed on the substrate 1, the insulating layer 2 is used to isolate the LED lamp beads 6 from the substrate 1, a through hole is formed on the insulating layer 2, the through hole passes through the upper and lower surfaces of the insulating layer 2, a heat conductive block 22 is formed in the through hole, the heat conductive block 22 is used to connect the substrate 1 and the heat dissipation area of the LED lamp beads 6, a conductive layer 4 is formed on a part of the insulating layer 2, and the conductive layer 4 is used to connect the electrodes of the LED lamp beads 6.
[0025] In this embodiment, an insulating layer 2 is provided above the substrate 1, a heat conductive block 22 is provided through a through hole, and the heat conductive block 22 is utilized to connect the heat dissipation area of the LED lamp bead 6, thereby achieving heat dissipation of the LED lamp bead 6. At the same time, since etching a heat conductive platform on the substrate 1 is avoided, the etching process is reduced, the thickness requirement of the substrate 1 is reduced, and the production cost is saved.
[0026] One end of the heat conductive block 22 protrudes from the insulating layer 2 for subsequent connection with the heat dissipation area of the LED lamp bead 6 .
[0027] In this embodiment, the height of the heat conductive block 22 is close to the height of the conductive layer 4 , so as to reduce the height difference with the conductive layer 4 , and facilitate the subsequent connection with the heat dissipation area of the LED lamp bead 6 .
[0028] The heat conducting block 22 is a metal heat conducting layer. A solder paste layer is provided between the metal heat conducting layer and the heat dissipation area of the LED lamp bead 6 . The solder paste layer is used to connect the heat conducting block 22 and the heat dissipation area of the LED lamp bead 6 .
[0029] In this embodiment, the metal thermal conductive layer is prepared by copper paste or silver paste to react with the solder paste layer to achieve welding. The solder paste layer not only fully connects the metal thermal conductive layer with the heat dissipation area of the LED lamp bead 6, but also achieves a good thermal conductivity effect to transfer heat to the metal thermal conductive layer.
[0030] The insulating layer 2 is an ink layer to isolate the substrate 1 and the conductive layer 4 .
[0031] In this embodiment, since the insulating layer 2 is an ink layer, the insulating layer 2 can be prepared by a printing process, which avoids etching of the substrate 1 and facilitates the formation of through holes, thereby reducing the difficulty of production.
[0032] The thickness of the insulating layer 2 is not less than 30 μm, and the thickness of the insulating layer 2 can be selected according to the requirements of the working voltage.
[0033] A protective layer 5 is formed on another part of the insulating layer 2, and the protective layer 5 is printed on the exposed part of the conductive layer 4 to protect the conductive layer 4. That is to say, when printing, a blank area is left on the conductive layer 4 to facilitate the subsequent welding of the conductive layer 4 and the electrodes of the LED lamp beads 6.
[0034] The protective layer 5 is a photosensitive ink layer.
[0035] In this embodiment, the photosensitive ink layer can be produced by exposure and development when the pattern of the blank area is relatively fine, so as to meet the demand for a relatively fine pattern in the blank area and improve the scope of application.
[0036] The substrate 1 is a copper substrate to improve thermal conductivity.
[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0038] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A thermal and electrical separation heat dissipation structure for LED, characterized in that: include: A substrate (1), the substrate (1) being used to dissipate heat for an LED lamp bead (6); an insulating layer (2) is formed on the substrate (1), the insulating layer (2) being used to isolate the LED lamp bead (6) from the substrate (1); a through hole is formed on the insulating layer (2), the through hole passes through the upper and lower surfaces of the insulating layer (2); a heat conducting block (22) is formed in the through hole, the heat conducting block (22) being used to connect the substrate (1) and the heat dissipation area of the LED lamp bead (6); a conductive layer (4) is formed on a portion of the insulating layer (2), the conductive layer (4) being used to connect the electrodes of the LED lamp bead (6).
2. The thermal and electrical separation heat dissipation structure for LED according to claim 1, characterized in that: One end of the heat-conducting block (22) protrudes from the insulating layer (2) so as to be subsequently connected to the heat dissipation area of the LED lamp bead (6).
3. The thermal and electrical separation heat dissipation structure for LED according to claim 2, characterized in that: The heat conducting block (22) is a metal heat conducting layer, and a solder paste layer is provided between the metal heat conducting layer and the heat dissipation area of the LED lamp bead (6), and the solder paste layer is used to connect the heat conducting block (22) and the heat dissipation area of the LED lamp bead (6).
4. The LED heat dissipation structure according to claim 3, characterized in that: The insulating layer (2) is an ink layer to isolate the substrate (1) and the conductive layer (4).
5. The thermal and electrical separation heat dissipation structure for LED according to claim 4, characterized in that: The thickness of the insulating layer (2) is not less than 30 μm.
6. The thermal and electrical separation heat dissipation structure for LED according to claim 5, characterized in that: A protective layer (5) is formed on another part of the insulating layer (2) to protect the conductive layer (4).
7. The thermal and electrical separation heat dissipation structure for LED according to claim 6, characterized in that: The protective layer (5) is a photosensitive ink layer.
8. The thermal and electrical separation heat dissipation structure for LED according to claim 7, characterized in that: The substrate (1) is a copper substrate.