Steam condensation structure

Abstract

The utility model discloses a steam condensation structure, which relates to the technical field of gas condensation, and comprises a condensation cavity, the condensation cavity is provided with a plurality of channel units vertically penetrating through the top and the bottom, the top of the condensation cavity is provided with a steam inlet, and the bottom of the condensation cavity is provided with a liquid outlet. The condenser has the advantages that by arranging the channel units penetrating through the top and the bottom of the condensation cavity, the contact area between the inside and steam is increased, the contact area between the outside and heat transfer media is increased, and the condensation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of gas condensation, in particular to a steam condensation structure. Background Art

[0002] Invention patent CN2024103021893 discloses a solar distillation device, in which a regularly arranged metal sheet or metal mesh is arranged inside the condensing unit, which increases the contact area between the inside and the water vapor and improves the distillation efficiency. However, since the metal sheet and metal mesh are generally very thin, the heat transfer efficiency along the plane where the metal sheet is located is low, which is not conducive to heat dissipation. Summary of the invention

[0003] In view of the above problems, the utility model proposes a steam condensation structure, which mainly solves the problem that the heat dissipation efficiency of the condensation structure is low.

[0004] To solve the above technical problems, the utility model proposes a steam condensation structure, including a condensation cavity, characterized in that the condensation cavity has a plurality of channel units vertically penetrating the top and the bottom. The top of the condensation cavity is provided with a steam inlet, and the bottom is provided with a water outlet.

[0005] In some embodiments, it further comprises: an outer cavity, the outer cavity contains the condensation cavity, a gap is left between the outer cavity and each surface of the condensation cavity to form a closed space, the steam inlet and liquid outlet of the condensation cavity are extended outside the outer cavity, a support is provided at the bottom of the outer cavity for fixing and installing the condensation cavity, a liquid inlet is provided at the top of the outer cavity, and a sealing cover is provided at the liquid inlet.

[0006] In some embodiments, it further includes: a semiconductor refrigeration sheet, the surface of the outer cavity has a hollow portion that matches the size of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is installed at the hollow portion.

[0007] In some embodiments, a heat sink is installed on the heat dissipation surface of the semiconductor refrigeration sheet, and thermal conductive silicone grease is coated between the semiconductor refrigeration sheet and the heat sink.

[0008] In some embodiments, a cooling surface of the semiconductor refrigeration sheet is provided with a cooling block, and thermal conductive silicone grease is coated between the semiconductor refrigeration sheet and the cooling block.

[0009] In some embodiments, it also includes: a photovoltaic solar panel, wherein the photovoltaic solar panel is connected to the semiconductor refrigeration sheet through electric wires to provide direct current power to the semiconductor refrigeration sheet.

[0010] The beneficial effect of the utility model is that by setting a plurality of channel units penetrating the top and bottom of the condensation cavity, both the contact area between the interior and the steam and the contact area between the exterior and the heat transfer medium are increased, thereby improving the condensation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of a condensation cavity of a steam condensation structure disclosed in an embodiment of the utility model;

[0012] Figure 2 A schematic diagram of the outer cavity of the steam condensation structure disclosed in the embodiment of the utility model;

[0013] Figure 3 A schematic diagram of a semiconductor refrigeration sheet with a steam condensation structure disclosed in an embodiment of the utility model;

[0014] Among them: 1-condensation chamber, 2-external chamber, 3-semiconductor refrigeration plate, 101-channel unit, 102-steam inlet, 103-liquid outlet, 201-liquid inlet, 202-sealing cover, 301-radiator, 302-cooling block. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the utility model clearer and more specific, the content of the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It is understood that the specific embodiments described herein are only used to explain the utility model, rather than to limit the utility model. It should also be noted that, for the convenience of description, only the parts related to the utility model are shown in the accompanying drawings, rather than all the contents.

[0016] Example

[0017] This embodiment proposes a steam condensation structure, such as Figure 1 As shown, the condensation chamber 1 includes a condensation chamber 1, the size of the condensation chamber 1 is 500mm*500mm*400mm, and the condensation chamber 1 has 10 channel units 101 vertically running through the top and bottom, and the cross-sectional area of ​​the channel unit 101 is 460mm*20mm. A steam inlet 102 is provided at the top of the condensation chamber 1, and a liquid outlet 103 is provided at the bottom. The contact area between the inside of the steam condensation structure and the steam and the contact area between the outside and the heat transfer medium are increased to 3.8 times that when the channel unit 101 is not provided. When the volume is reduced by 36.8%, the condensation efficiency is increased by 280%.

[0018] An outer cavity 2 is arranged outside the condensation cavity 1, such as Figure 2As shown, the outer cavity 2 contains the condensation cavity 1, and a gap of 30 mm is left between each surface of the outer cavity 2 and the condensation cavity 1 to form a closed space for containing liquid heat transfer medium. The steam inlet 102 and the liquid outlet 103 of the condensation cavity 1 both extend outside the outer cavity 2, and are used to connect the steam pipe and the liquid pipe respectively. A support is provided at the bottom of the outer cavity 2 for fixing and installing the condensation cavity 1. A liquid inlet 201 is provided at the top of the outer cavity 2, and a sealing cover 202 is provided at the liquid inlet 201.

[0019] The top of the outer cavity 2 has a rectangular hollow, and a semiconductor cooling sheet 3 is installed at the hollow position. The semiconductor cooling sheet 3 is as shown in FIG. Figure 3 As shown, the heat dissipation surface of the semiconductor cooling sheet 3 is equipped with a heat sink 301, and thermal conductive silicone grease is applied between the semiconductor cooling sheet 3 and the heat sink 301 to ensure good contact between the two. The cooling surface of the semiconductor cooling sheet 3 is equipped with a cooling block 302, and thermal conductive silicone grease is also applied between the semiconductor cooling sheet 3 and the cooling block 302.

[0020] When in use, first unscrew the sealing cover 202, and inject a liquid heat transfer medium such as water into the outer cavity 2 from the liquid inlet 201, and tighten the sealing cover 202 after filling. The cooling block 302 is immersed in the liquid heat transfer medium, which can transfer more heat to the cooling surface of the semiconductor refrigeration sheet 3 more quickly. The steam inlet 102 is connected to the steam generating place through a pipeline, and the semiconductor refrigeration sheet 3 can be powered on to operate normally. If the water vapor used for solar distillation is condensed, the semiconductor refrigeration sheet 3 can be directly connected to the photovoltaic solar panel, which can provide direct current power to the semiconductor refrigeration sheet 3. Since the solar radiation intensity is also large when evaporation is strong, the power generation power of the photovoltaic solar panel provides a guarantee for the cooling power of the semiconductor refrigeration sheet.

[0021] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable ordinary technicians in the field to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the essence of the content of the utility model should be included in the protection scope of the utility model.

Claims

1. A steam condensation structure, comprising a condensation cavity and an outer cavity, characterized in that: The condensation cavity has a plurality of channel units vertically running through the top and the bottom, a steam inlet is arranged at the top of the condensation cavity, and a water outlet is arranged at the bottom. The outer cavity contains the condensation cavity, and gaps are left between the outer cavity and each surface of the condensation cavity to form a closed space, the steam inlet and the water outlet of the condensation cavity are extended outside the outer cavity, a support is arranged at the bottom of the outer cavity for fixing and installing the condensation cavity, a liquid inlet is arranged at the top of the outer cavity, and a sealing cover is arranged at the liquid inlet.

2. The steam condensation structure according to claim 1, characterized in that: Also includes: The semiconductor refrigeration sheet, the surface of the outer cavity has a hollowing out that matches the size of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is installed at the hollowing out position.

3. The steam condensation structure according to claim 2, characterized in that: The heat dissipation surface of the semiconductor refrigeration sheet is provided with a radiator, and thermal conductive silicone grease is coated between the semiconductor refrigeration sheet and the radiator.

4. The steam condensation structure according to claim 2, characterized in that: The cooling surface of the semiconductor refrigeration sheet is provided with a cooling block, and heat-conducting silicone grease is coated between the semiconductor refrigeration sheet and the cooling block.

5. The steam condensation structure according to claim 2, characterized in that: Also includes: Photovoltaic solar panels are connected to the semiconductor refrigeration sheet via electric wires to provide direct current power to the semiconductor refrigeration sheet.

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