Energy-saving structure of semiconductor refrigeration device

Abstract

The utility model relates to the technical field of refrigeration devices, and discloses an energy-saving structure of a semiconductor refrigeration device, which comprises a first semiconductor refrigeration body and a second semiconductor refrigeration body, the first semiconductor refrigeration body and the second semiconductor refrigeration body are arranged side by side, and a fixing mechanism is arranged between the first semiconductor refrigeration body and the second semiconductor refrigeration body. The bottom of the first semiconductor refrigeration body and the bottom of the second semiconductor refrigeration body are each provided with a plurality of evenly-distributed heat conduction grooves, air cavities are formed in the first semiconductor refrigeration body and the second semiconductor refrigeration body, and air holes are formed in the positions, corresponding to the heat conduction grooves, of the bottoms of the air cavities. The first semiconductor refrigeration body and the second semiconductor refrigeration body which are spliced can share one fan, or the three semiconductor refrigeration bodies can share one fan, so that the damage of energy is reduced, the refrigeration and heat dissipation efficiency is high, and the requirements of energy conservation and environmental protection are met.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration devices, in particular to an energy-saving structure of a semiconductor refrigeration device. Background Art

[0002] Semiconductor refrigerators, also called thermoelectric refrigerators, are used more and more widely with the development of society.

[0003] In order to adjust the use area, the existing semiconductor refrigeration device combines multiple semiconductor refrigeration devices. Although the applicability is improved, a fan needs to be installed on each semiconductor refrigeration device, which leads to a high manufacturing cost of the semiconductor refrigeration device. In addition, multiple fans work at the same time, which wastes a lot of energy and is not energy-saving and environmentally friendly. Therefore, an energy-saving structure of a semiconductor refrigeration device is proposed. Utility Model Content

[0004] The utility model aims to solve the problem that the semiconductor refrigeration device in the prior art is not energy-efficient, and proposes an energy-saving structure of a semiconductor refrigeration device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor refrigeration device energy-saving structure comprises a first semiconductor refrigeration body and a second semiconductor refrigeration body, wherein the first semiconductor refrigeration body and the second semiconductor refrigeration body are arranged side by side, and a fixing mechanism is provided between the first semiconductor refrigeration body and the second semiconductor refrigeration body, a plurality of evenly distributed heat conduction grooves are provided at the bottom of the first semiconductor refrigeration body and the bottom of the second semiconductor refrigeration body, an air cavity is provided inside the first semiconductor refrigeration body and the inside of the second semiconductor refrigeration body, and air holes are provided at the bottom of the air cavity corresponding to the positions of the plurality of heat conduction grooves, a wind hood connected to the wind cavity is fixedly provided on the top of the first semiconductor refrigeration body, a fan is fixedly installed inside the wind hood, fixed pipes are fixedly provided on both sides of the bottom of the wind hood, a connecting pipe is fixedly provided on the top of the second semiconductor refrigeration body, and the end of the connecting pipe is fixedly connected to the end of the fixed pipe.

[0007] Preferably, the fixing mechanism includes a fixing plate, both sides of the first semiconductor refrigeration body and both sides of the second semiconductor refrigeration body are fixed with screws, and the screw rod walls are provided with nuts, and the two ends of the fixing plate are respectively inserted into the rod walls of two adjacent screws and fixedly connected by nuts.

[0008] Preferably, one side of the first semiconductor refrigeration body and one side of the second semiconductor refrigeration body are both fixed with plug plates, the other side of the first semiconductor refrigeration body and the other side of the second semiconductor refrigeration body are both provided with slots, and the first semiconductor refrigeration body and the second semiconductor refrigeration body are connected through the matching of the plug plate and the slot.

[0009] Preferably, the plug board is a T-shaped board, and the slot is a T-shaped slot.

[0010] Preferably, a pipe joint is fixedly provided at the end of the connecting pipe, and the pipe joint is fixedly connected to one of the fixed pipes, and a pipe cap is threadedly provided at the end of the other fixed pipe.

[0011] Preferably, a mounting bracket is fixedly provided on the top of the first semiconductor refrigeration body and the top of the second semiconductor refrigeration body.

[0012] Compared with the prior art, the utility model provides an energy-saving structure of a semiconductor refrigeration device, which has the following beneficial effects:

[0013] 1. The energy-saving structure of the semiconductor refrigeration device is provided with a wind hood, a fan, a fixed pipe and a connecting pipe. After the connecting pipe is connected to the fixed pipe, the wind cavities inside the first semiconductor refrigeration body and the second semiconductor refrigeration body are connected, which can ensure that the fan simultaneously draws air from the wind cavities inside the first semiconductor refrigeration body and the second semiconductor refrigeration body, thereby discharging heat from the surfaces of the first semiconductor refrigeration body and the second semiconductor refrigeration body, so that the first semiconductor refrigeration body and the second semiconductor refrigeration body share a fan inside, thereby reducing energy loss.

[0014] 2. The energy-saving structure of the semiconductor refrigeration device is provided with a fixing plate, a screw rod and a nut. After the first semiconductor refrigeration body and the second semiconductor refrigeration body are put together, the two ends of the fixing plate are respectively inserted into the two screw rods, and then the position of the fixing plate is fixed by the cooperation of the nut and the screw rod.

[0015] 3. The energy-saving structure of the semiconductor refrigeration device is achieved by providing a plug-in board and a slot between the first semiconductor refrigeration body and the second semiconductor refrigeration body. When the first semiconductor refrigeration body and the second semiconductor refrigeration body are spliced, the plug-in board is inserted into the inside of the slot, which can increase the stability of the connection between the first semiconductor refrigeration body and the second semiconductor refrigeration body.

[0016] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The utility model can allow the spliced ​​first semiconductor refrigeration body and the second semiconductor refrigeration body to share a fan, or three semiconductor refrigeration bodies can share a fan, thereby reducing energy damage. At the same time, the efficiency of cooling and heat dissipation is high, which meets the requirements of energy saving and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of an energy-saving structure of a semiconductor refrigeration device proposed by the utility model;

[0018] Figure 2 for Figure 1 A cross-sectional view of

[0019] Figure 3 for Figure 1 A magnified view of the structure of part A in the middle.

[0020] In the figure: 1. first semiconductor refrigeration body; 2. second semiconductor refrigeration body; 3. heat conduction groove; 4. wind cavity; 5. wind hole; 6. wind cover; 7. fan; 8. fixing pipe; 9. connecting pipe; 10. fixing plate; 11. screw rod; 12. nut; 13. plug board; 14. slot; 15. pipe joint; 16. pipe cover; 17. mounting bracket. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-3 , an energy-saving structure of a semiconductor refrigeration device, comprising a first semiconductor refrigeration body 1 and a second semiconductor refrigeration body 2, the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 are arranged side by side, and a fixing mechanism is provided between the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2, a plurality of evenly distributed heat conduction grooves 3 are provided at the bottom of the first semiconductor refrigeration body 1 and the bottom of the second semiconductor refrigeration body 2, a wind cavity 4 is provided inside the first semiconductor refrigeration body 1 and the inside of the second semiconductor refrigeration body 2, and air holes 5 are provided at the bottom of the wind cavity 4 corresponding to the positions of the plurality of heat conduction grooves 3, a wind hood 6 connected to the wind cavity 4 is fixedly provided on the top of the first semiconductor refrigeration body 1, a fan 7 is fixedly installed inside the wind hood 6, and fixed pipes 8 are fixedly provided on both sides of the bottom of the wind hood 6, and the second semiconductor refrigeration body 1 is provided with a fan 7, and a fixed pipe 8 is fixedly provided on both sides of the bottom of the wind hood 6, and the second semiconductor refrigeration body 1 is provided with a fan 7, and the first semiconductor refrigeration body 1 is provided with a fan 7, and the second ... A connecting pipe 9 is fixedly provided on the top of the refrigeration body 2, and the end of the connecting pipe 9 is fixedly connected to the end of the fixed pipe 8. A pipe joint 15 is fixedly provided on the end of the connecting pipe 9, and the pipe joint 15 is fixedly connected to one of the fixed pipes 8. A pipe cover 16 is threadedly provided on the end of the other fixed pipe 8. The setting of the pipe cover 16 blocks the fixed pipe 8 that is not connected to the connecting pipe 9, thereby preventing the fixed pipe 8 from being connected to the outside. When the fan 7 is working, a negative pressure can be generated inside the wind hood 6, and at the same time, a negative pressure is generated in the wind cavity 4 inside the first semiconductor refrigeration body 1. Since the connecting pipe 9 connects the wind cavity 4 inside the second semiconductor refrigeration body 2, the heat on the surface of the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 can be extracted, thereby improving the refrigeration and heat dissipation efficiency of the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2.

[0023] Among them, the fixing mechanism includes a fixing plate 10, and screws 11 are fixedly provided on both sides of the first semiconductor refrigeration body 1 and both sides of the second semiconductor refrigeration body 2, and nuts 12 are provided on the rod walls of the screws 11. The two ends of the fixing plate 10 are respectively inserted into the rod walls of the two adjacent screws 11 and fixedly connected by the nuts 12. By loosening the nuts 12, the fixing plate 10 can be removed from the screws 11, so that the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 can be separated.

[0024] At the same time, one side of the first semiconductor refrigeration body 1 and one side of the second semiconductor refrigeration body 2 are fixedly provided with an insertion plate 13, and the other side of the first semiconductor refrigeration body 1 and the other side of the second semiconductor refrigeration body 2 are provided with a slot 14. The first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 are connected by the matching of the insertion plate 13 and the slot 14. The insertion plate 13 is a T-shaped plate, and the slot 14 is a T-shaped groove. When the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 are spliced, the insertion plate 13 is inserted into the inside of the slot 14, which can increase the stability of the connection between the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2.

[0025] In addition, a mounting bracket 17 is fixedly provided on the top of the first semiconductor refrigeration body 1 and the top of the second semiconductor refrigeration body 2 , and the first semiconductor refrigeration body 1 and the second semiconductor refrigeration body 2 can be fixedly installed by the mounting bracket 17 .

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An energy-saving structure of a semiconductor refrigeration device, comprising a first semiconductor refrigeration body (1) and a second semiconductor refrigeration body (2), characterized in that: The first semiconductor refrigeration body (1) and the second semiconductor refrigeration body (2) are arranged side by side, and a fixing mechanism is provided between the first semiconductor refrigeration body (1) and the second semiconductor refrigeration body (2); a plurality of evenly distributed heat conduction grooves (3) are provided at the bottom of the first semiconductor refrigeration body (1) and the bottom of the second semiconductor refrigeration body (2); a wind cavity (4) is provided inside the first semiconductor refrigeration body (1) and the inside of the second semiconductor refrigeration body (2); wind holes (5) are provided at the bottom of the wind cavity (4) at positions corresponding to the positions of the plurality of heat conduction grooves (3); a wind hood (6) connected to the wind cavity (4) is fixedly provided at the top of the first semiconductor refrigeration body (1); a fan (7) is fixedly installed inside the wind hood (6); fixed pipes (8) are fixedly provided on both sides of the bottom of the wind hood (6); a connecting pipe (9) is fixedly provided at the top of the second semiconductor refrigeration body (2), and the end of the connecting pipe (9) is fixedly connected to the end of the fixing pipe (8).

2. The energy-saving structure of a semiconductor refrigeration device according to claim 1, characterized in that: The fixing mechanism comprises a fixing plate (10), both sides of the first semiconductor refrigeration body (1) and both sides of the second semiconductor refrigeration body (2) are fixedly provided with screw rods (11), and the rod walls of the screw rods (11) are provided with nuts (12), and the two ends of the fixing plate (10) are respectively inserted into the rod walls of two adjacent screw rods (11) and fixedly connected by the nuts (12).

3. The energy-saving structure of a semiconductor refrigeration device according to claim 1, characterized in that: An insert plate (13) is fixedly provided on one side of the first semiconductor refrigeration body (1) and one side of the second semiconductor refrigeration body (2); a slot (14) is provided on the other side of the first semiconductor refrigeration body (1) and the other side of the second semiconductor refrigeration body (2); the first semiconductor refrigeration body (1) and the second semiconductor refrigeration body (2) are connected via the matching of the insert plate (13) and the slot (14).

4. The energy-saving structure of a semiconductor refrigeration device according to claim 3, characterized in that: The plug board (13) is a T-shaped board, and the slot (14) is a T-shaped slot.

5. The energy-saving structure of a semiconductor refrigeration device according to claim 1, characterized in that: A pipe joint (15) is fixedly provided at the end of the connecting pipe (9), and the pipe joint (15) is fixedly connected to one of the fixed pipes (8), and a pipe cover (16) is threadedly provided at the end of the other fixed pipe (8).

6. The energy-saving structure of a semiconductor refrigeration device according to claim 1, characterized in that: A mounting bracket (17) is fixedly provided on the top of the first semiconductor refrigeration body (1) and the top of the second semiconductor refrigeration body (2).

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