Mechanical shock test structure for semiconductor module
By designing a mechanical impact test structure of semiconductor modules including slide rods and triangle frames, the problem of disassembly and assembly time caused by frequent replacement of structures in the prior art is solved, and rapid disassembly and assembly and efficient testing are achieved, and the Module reliability and stability.
Patent Information
- Application Number
- CN202323605195.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-28
AI Technical Summary
The existing mechanical impact testing structure of semiconductor modules requires replacement of different structures when testing different semiconductor modules, resulting in long disassembly and assembly time and low working efficiency.
A mechanical impact test structure including module body, base, box, slide rod, C-shaped plate, impact mechanism and fixing mechanism is designed. The module body is quickly disassembled and fixed through sliding connection and triangular frame structure, and the module body is utilizing activities. The block and waveform generator generates pulse waveforms for testing.
It realizes rapid disassembly and efficient fixation of semiconductor module testing, saves experimental time, improves testing efficiency, and evaluates the reliability and stability of semiconductor modules through mechanical impact testing.
Smart Images
Figure CN222258654U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor module testing, in particular to a mechanical impact testing structure for a semiconductor module. Background Art
[0002] A semiconductor module is a semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Semiconductor modules include not only silicon modules, but also other semiconductor materials such as gallium arsenide and germanium. Semiconductor modules are a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.), and are often manufactured on the surface of semiconductor wafers. The electrical properties of semiconductors must be predictable and stable, so strict requirements must be imposed on the purity of dopants and the quality of the semiconductor lattice structure. Common quality problems include lattice dislocations, twin planes, or stacking faults that affect the properties of semiconductor materials.
[0003] Mechanical shock testing of semiconductor modules mainly evaluates devices in a free state and when assembled on printed circuit boards of electrical equipment to determine the adaptability of devices and printed circuit board assemblies to moderately severe shocks. This test is usually caused by sudden force applied and sudden force during loading and unloading, transportation or field operation, which may damage the working characteristics of the device, especially when the shock pulse is repeated. The existing semiconductor module mechanical shock test structure needs to replace different structures to fix the semiconductor module when testing different semiconductor modules. During the test, a lot of time is spent on disassembling and assembling the equipment, which is inefficient. Utility Model Content
[0004] The utility model discloses a mechanical shock test structure for a semiconductor module, aiming to solve the technical problems that, when testing different semiconductor modules, different structures need to be replaced to fix the semiconductor modules in the existing semiconductor module mechanical shock test structure, a lot of time is spent on disassembling and assembling equipment during testing, and the working efficiency is low.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A mechanical shock test structure for a semiconductor module, comprising a module body and a base, wherein a box is arranged on the top of the base, symmetrically distributed sliding bars are arranged on the top of the box, and C-shaped plates are arranged on the tops of two of the sliding bars, and further comprising:
[0007] An impact mechanism is arranged on the top of the box;
[0008] The fixing mechanism comprises a triangular frame, a mounting plate is fixed on one side outer wall of the triangular frame, the module body is fixedly mounted on one side outer wall of the mounting plate, four symmetrically distributed rectangular holes are opened on one side outer wall of the triangular frame, a circular hole is opened on one side outer wall of the triangular frame, a mounting block is arranged on one side outer wall of the mounting plate, the mounting block is matched with the rectangular hole, a mounting column is arranged on one side outer wall of the mounting plate, the mounting column is matched with the circular hole, a symmetrically distributed fixing plate is slidably connected to one side outer wall of the triangular frame, and a fixing block is arranged at one end of the mounting column.
[0009] In this scheme, the module body is fixed on one side of the mounting plate before the experiment. When testing multiple different module bodies, multiple mounting plates are prepared to fix module bodies of different sizes respectively, and the impact test is started. After testing one group, the mounting plate is directly replaced to test the next group of semiconductor modules. The disassembly and assembly are simple and the installation is firm, which improves the efficiency of semiconductor module testing and saves experimental time.
[0010] In a preferred embodiment, the impact mechanism includes a movable block, a second impact head is arranged at the bottom of the movable block, a connecting column is arranged at the top of the box body, a first impact head is arranged on the top of the connecting column, the first impact head is located directly below the second impact head, the triangular frame is fixed to the top of the movable block, a mounting hole is opened at the top of the movable block, a sliding sleeve is installed in the mounting hole, the sliding rod is slidably connected to the inner wall of the sliding sleeve, and a waveform generator is arranged in the box body.
[0011] By adopting the above scheme, the movable block is dropped from different heights to collide with the first impact head at the bottom to generate vibration, and a pulse waveform is generated by a waveform generator. The test data is recorded, and the pulse waveform is analyzed to obtain the mechanical impact test result of the semiconductor module, so as to detect the reliability and stability of the semiconductor module, ensure that these electronic products can work normally during transportation and use, predict the service life of the semiconductor module in different environments, provide an important reference basis for product design, production and application, and improve the stability and reliability of the product.
[0012] As can be seen from the above, a mechanical shock test structure for a semiconductor module includes a module body and a base, a box is provided on the top of the base, symmetrically distributed sliding rods are provided on the top of the box, and C-shaped plates are provided on the tops of two of the sliding rods, and also includes:
[0013] An impact mechanism is arranged on the top of the box;
[0014] The fixing mechanism comprises a triangular frame, a mounting plate is fixed on one side outer wall of the triangular frame, the module body is fixedly mounted on one side outer wall of the mounting plate, four symmetrically distributed rectangular holes are opened on one side outer wall of the triangular frame, a circular hole is opened on one side outer wall of the triangular frame, a mounting block is arranged on one side outer wall of the mounting plate, the mounting block is matched with the rectangular holes, a mounting column is arranged on one side outer wall of the mounting plate, the mounting column is matched with the circular hole, a symmetrically distributed fixing plate is slidably connected to one side outer wall of the triangular frame, and a fixing block is arranged at one end of the fixing column. The mechanical impact test structure for semiconductor modules provided by the utility model has the technical effects of simple disassembly and assembly, firm installation, improved efficiency of semiconductor module testing, and saving experimental time. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a schematic diagram of the overall structure of a mechanical impact test structure for a semiconductor module.
[0016] Figure 2 The utility model provides a schematic diagram of the impact mechanism structure of a mechanical impact test structure for a semiconductor module.
[0017] Figure 3 The present invention is a schematic diagram of a fixing mechanism structure for a mechanical impact test structure of a semiconductor module.
[0018] Figure 4 The utility model provides a schematic diagram of a mounting plate structure for a mechanical impact test structure of a semiconductor module.
[0019] In the attached figure: 1. triangular frame; 2. sliding rod; 3. mounting plate; 4. module body; 5. movable block; 6. first impact head; 7. box body; 8. base; 9. second impact head; 10. mounting groove; 11. connecting column; 12. fixing plate; 13. fixing block; 14. limiting block; 15. mounting block; 16. mounting column. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0022] The utility model discloses a mechanical shock test structure for a semiconductor module, which is mainly applied to the existing mechanical shock test structure for semiconductor modules. When testing different semiconductor modules, different structures need to be replaced to fix the semiconductor modules. During the test, a lot of time is spent on disassembling and assembling equipment, resulting in low work efficiency.
[0023] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 A mechanical shock test structure for a semiconductor module includes a module body 4 and a base 8, a box 7 is arranged on the top of the base 8, symmetrically distributed slide bars 2 are arranged on the top of the box 7, and a C-shaped plate is arranged on the top of the two slide bars 2, and also includes:
[0024] The impact mechanism is arranged on the top of the box 7;
[0025] The fixing mechanism includes a triangular frame 1, a mounting plate 3 is fixed on one side outer wall of the triangular frame 1, a module body 4 is fixedly installed on one side outer wall of the mounting plate 3, four symmetrically distributed rectangular holes are opened on one side outer wall of the triangular frame 1, a circular hole is opened on one side outer wall of the triangular frame 1, a mounting block 15 is provided on one side outer wall of the mounting plate 3, the mounting block 15 is matched with the rectangular hole, a mounting column 16 is provided on one side outer wall of the mounting plate 3, the mounting column 16 is matched with the circular hole, a symmetrically distributed fixing plate 12 is slidably connected to one side outer wall of the triangular frame 1, a fixing block 13 is provided at one end of the mounting column 16, a mounting groove 10 is provided on one side outer wall of the mounting plate 3, and the module body 4 is fixed in the mounting groove 10.
[0026] Specifically, the module body 4 is fixed on one side of the mounting plate 3 before the experiment. When testing multiple different module bodies 4, multiple mounting plates 3 are prepared to fix module bodies 4 of different sizes respectively. The mounting plate 3 is installed on the triangular frame 1, and the fixing plate 12 is pushed upward to fix the position of the mounting block 15. The fixing block 13 is fixed on the mounting column 16. After the mounting plate 3 is fixed, the impact test is started. After testing one group, the mounting plate 3 is directly replaced to test the next group of semiconductor modules.
[0027] Reference Figure 3 and Figure 4In a preferred embodiment, a rectangular groove is opened on the outer wall of one side of the mounting block 15, and the rectangular groove is adapted to the fixing plate 12. The outer wall of one side of the triangular frame 1 is slidably connected to the limiting block 14 close to the fixing plate 12, and a return spring is arranged at the bottom of the limiting block 14.
[0028] Specifically, the limit block 14 is pushed to move to both sides respectively, pushing the fixed plate 12 into the rectangular groove. Under the push of the return spring, the limit block 14 moves in the opposite direction to the side close to the mounting block 15, supporting one side outer wall of the fixed plate 12, fixing the position of the fixed plate 12, and fixing the fixing block 13 on the mounting column 16, thereby fixing the mounting plate 3 on the triangular frame 1.
[0029] Reference Figure 1 and Figure 2 In a preferred embodiment, the impact mechanism includes a movable block 5, a second impact head 9 is arranged at the bottom of the movable block 5, a connecting column 11 is arranged at the top of the box body 7, a first impact head 6 is arranged on the top of the connecting column 11, and the first impact head 6 is located directly below the second impact head 9. The triangular frame 1 is fixed to the top of the movable block 5, a mounting hole is opened at the top of the movable block 5, a sliding sleeve is installed in the mounting hole, the sliding rod 2 is slidably connected to the inner wall of the sliding sleeve, and a waveform generator is arranged in the box body 7.
[0030] Specifically, the movable block 5 is dropped from different heights to collide with the first impact head 6 at the bottom to generate vibration, and a pulse waveform is generated by a waveform generator. The test data is recorded and the pulse waveform is analyzed to obtain the mechanical impact test result of the semiconductor module, so as to detect the reliability and stability of the semiconductor module, ensure that these electronic products can work normally during transportation and use, predict the service life of the semiconductor module in different environments, provide an important reference for product design, production and application, and improve the stability and reliability of the product.
[0031] Working principle: Before the experiment, fix the triangular frame 1 on the movable block 5, install the module body 4 on the mounting plate 3, push the limit block 14 to move to both sides respectively, push the fixed plate 12 into the rectangular groove, and under the push of the reset spring, the limit block 14 moves in the opposite direction to the side close to the mounting block 15, supports the outer wall of one side of the fixed plate 12, fixes the position of the fixed plate 12, and fixes the fixed block 13 on the mounting column 16, so as to fix the mounting plate 3 on the triangular frame 1, and the module body 4 is fixed on one side of the mounting plate 3. When testing multiple different module bodies 4, prepare multiple mounting plates 3 to fix module bodies 4 of different sizes respectively. After fixing the mounting plates 3, start the impact test. After testing one group, directly replace the mounting plate 3 to test the next group of semiconductor modules.
[0032] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited to this. The replacement can be a replacement of part of the structure, device, method step, or a complete technical solution. Equivalent replacement or change based on the technical solution of the utility model and its utility model concept should be included in the protection scope of the utility model.
Claims
1. A mechanical shock test structure for a semiconductor module, comprising a module body (4) and a base (8), wherein a box (7) is arranged on the top of the base (8), symmetrically distributed slide bars (2) are arranged on the top of the box (7), and C-shaped plates are arranged on the tops of two of the slide bars (2), characterized in that: Also includes: An impact mechanism, arranged on the top of the box (7); A fixing mechanism comprises a triangular frame (1), a mounting plate (3) being fixed to one side outer wall of the triangular frame (1), a module body (4) being fixedly mounted on one side outer wall of the mounting plate (3), four symmetrically distributed rectangular holes being opened on one side outer wall of the triangular frame (1), a circular hole being opened on one side outer wall of the triangular frame (1), a mounting block (15) being arranged on one side outer wall of the mounting plate (3), the mounting block (15) being matched with the rectangular holes, a mounting column (16) being arranged on one side outer wall of the mounting plate (3), the mounting column (16) being matched with the circular holes, a symmetrically distributed fixing plate (12) being slidably connected to one side outer wall of the triangular frame (1), and a fixing block (13) being arranged at one end of the fixing column (16).
2. A mechanical shock test structure for a semiconductor module according to claim 1, characterized in that: A rectangular groove is formed on one side outer wall of the mounting block (15), and the rectangular groove is matched with the fixing plate (12). One side outer wall of the triangular frame (1) is slidably connected to a limiting block (14) close to the fixing plate (12), and a return spring is provided at the bottom of the limiting block (14).
3. The mechanical shock test structure for a semiconductor module according to claim 1, characterized in that: The impact mechanism comprises a movable block (5), and a second impact head (9) is provided at the bottom of the movable block (5).
4. A mechanical shock test structure for a semiconductor module according to claim 3, characterized in that: A connecting column (11) is provided on the top of the box body (7), and a first impact head (6) is provided on the top of the connecting column (11), wherein the first impact head (6) is located directly below the second impact head (9).
5. A mechanical shock test structure for a semiconductor module according to claim 4, characterized in that: The triangular frame (1) is fixed to the top of the movable block (5); a mounting hole is provided on the top of the movable block (5); a sliding sleeve is installed in the mounting hole; and the sliding rod (2) is slidably connected to the inner wall of the sliding sleeve.
6. The mechanical shock test structure for a semiconductor module according to claim 1, characterized in that: A waveform generator is arranged in the box (7).
7. The mechanical shock test structure for a semiconductor module according to claim 1, characterized in that: An outer wall of the mounting plate (3) is provided with a mounting groove (10), and the module body (4) is fixed in the mounting groove (10).