Optical module

Abstract

The utility model relates to the technical field of optical communication, and provides an optical module, which comprises a shell and a PCB (printed circuit board) arranged in the shell, a functional chip is arranged on the PCB, the optical module further comprises a vapor chamber arranged outside the shell and a heat conduction piece used for transferring heat of the functional chip to the vapor chamber, and the shell is provided with an opening for the heat conduction piece to penetrate through. Compared with a traditional mode that the vapor chamber of the optical module is arranged in the shell, and the vapor chamber firstly receives heat and then transmits the heat to the shell to dissipate the heat, the vapor chamber of the optical module is arranged outside the shell, so that the heat dissipation capability of the vapor chamber is utilized to the maximum extent; the heat conduction piece penetrates through the opening of the shell to directly transfer heat to the vapor chamber to be dissipated outside the shell, the heat dissipation path directly avoids the shell, heat dissipation is more direct, and the heat dissipation effect is better; by adopting the heat dissipation mode, heat accumulation can be reduced, a chip in the shell is ensured to be at a normal working temperature, high-frequency packaging matching of an optical chip, an electric chip and a PCBA (Printed Circuit Board Assembly) is realized, and a series of problems caused by heat dissipation are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to an optical module. Background Art

[0002] Optical modules, optical components and electronic components are usually integrated together. In order to ensure that network data can meet the requirements of 8×200G rate and low latency, the heat generated by module power consumption is one of the problems that must be solved.

[0003] Currently, most DSP chip manufacturers of 800G and above solutions directly provide bare die chips (unpackaged chips). The chips need to be bonded to the PCB or adapter board, and their internal layout needs to be carefully considered. Through thermal design, it is necessary to ensure that the heat of the module can be dissipated quickly and efficiently, reduce heat accumulation, and ensure that the chips inside the module are at normal operating temperature.

[0004] In the prior art, there is a form of using a heat spreader for heat dissipation, but most of the time the heat spreader is arranged in a shell. After the heat spreader receives the heat, it needs to be transferred to the shell, and finally the shell dissipates the heat. On the one hand, since the heat spreader needs to first conduct the heat to the shell, and then the shell dissipates the heat, the heat dissipation efficiency is low. When the speed of the optical module becomes faster and faster, the chip power consumption becomes higher and higher, and the heat generation becomes greater and greater. The heat cannot be dissipated in time, which can easily lead to heat accumulation and affect the operation of the chip. On the other hand, the heat spreader is also prone to inadequate restraint in the shell, affecting its heat dissipation effect. Utility Model Content

[0005] The purpose of the utility model is to provide an optical module, which can at least solve some of the defects in the prior art.

[0006] To achieve the above-mentioned purpose, an embodiment of the utility model provides the following technical solution: an optical module, comprising a shell and a PCB board placed in the shell, the PCB board is provided with a functional chip, and also includes a heat spreader arranged outside the shell and a heat conductor for transferring the heat of the functional chip to the heat spreader, the shell having an opening for the heat conductor to pass through.

[0007] Furthermore, the heat spreader is covered with a heat sink, and the heat spreader is sandwiched between the heat sink and the shell.

[0008] Furthermore, the heat sink has a plurality of heat dissipation channels.

[0009] Furthermore, the radiator includes a panel and a plurality of partitions, each of the partitions is vertically arranged on the panel, and the interval between adjacent partitions is the heat dissipation channel.

[0010] Furthermore, baffles are provided on opposite outer edges of the shell, and an installation area for installing the radiator is provided between two baffles.

[0011] Furthermore, the heat conducting member includes a heat sink, which is disposed at the bottom of the heat spreader and passes through the opening.

[0012] Furthermore, the functional chip is covered with a first heat-conducting layer, and the heat-conducting member is arranged in contact with the first heat-conducting layer.

[0013] Furthermore, the shell includes a base and an upper cover arranged on the base, and the upper cover is provided with the opening.

[0014] Furthermore, at the electrical port, the upper cover and the base are snap-connected.

[0015] Furthermore, the function chip on the side of the PCB board facing away from the function chip is covered with a second heat conducting layer.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Compared with the traditional optical module in which the heat spreader is set inside the shell, and the heat spreader first receives heat and then transfers it to the shell to dissipate the heat, this optical module sets the heat spreader outside the shell to maximize the heat dissipation capacity of the heat spreader, and directly transfers the heat to the heat spreader through the opening of the shell through the heat conductor to dissipate the heat outside the shell. The heat dissipation path directly avoids the shell, the heat dissipation is more direct, and the heat dissipation effect is better.

[0018] 2. This heat dissipation method can reduce heat accumulation, ensure that the chip inside the shell is at normal operating temperature, achieve high-frequency packaging matching of optical chips, electrical chips and PCBA, and avoid a series of problems caused by heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of an optical module provided by an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of an optical module provided by an embodiment of the present invention with the upper cover removed;

[0021] Figure 3 for Figure 2 Schematic diagram without the heat sink;

[0022] Figure 4 for Figure 3 Schematic diagram without the vapor chamber;

[0023] Figure 5 for Figure 4 Schematic diagram without heat sink;

[0024] Figure 6 for Figure 5 Schematic diagram of removing the first heat-conducting layer;

[0025] Figure 7 A schematic diagram of a second heat-conducting layer on the bottom surface of a PCB board of an optical module provided by an embodiment of the present invention;

[0026] Figure 8 A schematic diagram of an upper cover of an optical module provided by an embodiment of the present invention;

[0027] Fig. 9 A schematic diagram of a heat sink of an optical module provided in an embodiment of the present invention being arranged on a heat spreader;

[0028] Fig.10 A schematic diagram of a heat sink for an optical module provided in an embodiment of the present invention;

[0029] In the accompanying drawings: 1-shell; 10-upper cover; 100-opening; 101-baffle; 11-base; 2-PCB board; 3-functional chip; 4-heat sink; 5-heat sink; 50-heat dissipation channel; 51-panel; 52-partition; 6-heat sink; 7-first thermal conductive layer; 8-second thermal conductive layer; 9-hook. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 8The embodiment of the present invention provides an optical module, including a shell 1 and a PCB board 2 placed in the shell 1, a functional chip 3 is arranged on the PCB board 2, the optical module also includes a heat spreader 4 arranged outside the shell 1 and a heat conductive member for transferring the heat of the functional chip 3 to the heat spreader 4, the shell 1 has an opening 100 for the heat conductive member to pass through, the heat spreader 4 has a cavity, and the cavity is provided with a capillary structure and a heat dissipation medium. In this embodiment, compared with the traditional optical module in which the heat spreader 4 is arranged in the shell 1, and the heat spreader 4 first receives heat and then transfers it to the shell 1 to dissipate the heat, the optical module arranges the heat spreader 4 outside the shell 1 to maximize the use of the heat dissipation capacity of the heat spreader 4, and directly transfers the heat to the heat spreader 4 through the opening 100 of the shell 1 through the heat conductive member to dissipate the heat outside the shell 1, the heat dissipation path directly avoids the shell 1, the heat dissipation is more direct, and the heat dissipation effect is better. Specifically, the functional chip 3 can be called the main chip, that is, the chip with the highest heat generation. For the main chip, its heat is first transferred to the heat conductor, and the heat conductor directly transfers the heat to the heat spreader 4 outside the shell 1 for heat dissipation. The heat spreader's capillary structure, working fluid absorption and evaporation, and circulating heat dissipation characteristics are utilized to achieve rapid diffusion of the heat source to the nearby area, and then the heat is quickly taken away by the integrated closed radiator, thereby reducing the heat flux density in the optical engine area and greatly improving the heat dissipation performance of the module. Experiments have verified that under the same conditions, the heat spreader 4 is arranged in the shell 1, and the method of transferring heat to the shell 1 for heat dissipation is compared with the method of directly conducting the heat to the heat spreader 4 outside the shell 1 for heat dissipation. Under the same time, the temperature difference is very large. It is obvious that the heat dissipation efficiency of this embodiment is higher.

[0032] As an optimization solution of the embodiment of the present invention, please refer to FIG. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Fig. 9 and Fig.10 , the optical module also includes a heat sink 5 covering the thermal conductor. In the present embodiment, in order to further accelerate the heat dissipation of the heat spreader 4, the heat sink 5 can be covered on the heat spreader 4. On the one hand, the heat sink 5 can accelerate the heat dissipation of the heat spreader 4, and on the other hand, it can cooperate with the shell 1 to constrain both sides of the heat spreader 4, which can prevent the heat spreader 4 from expanding due to heat and affecting the performance. In the prior art, the heat spreader 4 is arranged in the shell 1, and usually only one side can be constrained. Preferably, the heat sink 5 is welded to the heat spreader 4 or bonded with a high thermal conductivity glue to constrain the heat spreader. Preferably, the thermal conductor and the heat spreader can also be fixed by welding or bonding with a high thermal conductivity glue.

[0033] To further optimize the above solution, please refer to Figure 1, Figure 2 , Fig. 9 and Fig.10 The heat sink 5 has a plurality of heat dissipation channels 50, each of which extends in the direction from the optical port to the electrical port. In this embodiment, the heat sink 5 may have a plurality of heat dissipation channels 50, and the heat dissipation channels 50 guide the airflow to pass through and take away the heat, thereby increasing the heat dissipation area of ​​the air duct and the air flow rate of the duct, so as to enhance the natural convection heat dissipation between the internally generated heat and the surrounding air.

[0034] To further optimize the above solution, please refer to Figure 1 , Figure 2 , Fig. 9 and Fig.10 The radiator 5 includes a panel 51 and a plurality of partitions 52, each of which is vertically arranged on the panel 51, and the interval between adjacent partitions 52 is the heat dissipation channel 50. In this embodiment, the radiator 5 can be composed of a panel 51 and partitions 52, the partitions 52 separate a plurality of heat dissipation channels 50, and the panel 51 is used for vertical installation of each partition 52.

[0035] As an optimization solution of the embodiment of the present invention, please refer to Figure 1 and Figure 8 , baffles 101 are provided on opposite outer edges of the housing 1, and a mounting area for the radiator 5 is provided between the two baffles 101. In this embodiment, the radiator 5 is provided in the mounting area between the two baffles 101, and the size of the mounting area matches the size of the radiator 5. Preferably, the two heat dissipation channels 50 on both sides are composed of baffles 101 and partitions 52.

[0036] As an optimization solution of the embodiment of the present invention, please refer to Figures 1 to 3 , the heat conducting member includes a heat sink 6, the heat sink 6 is disposed at the bottom of the heat spreader 4, and the heat sink 6 passes through the opening 100. In this embodiment, the heat sink 6 can be quickly transferred to the heat spreader 4, and the heat sink 6 is in a block shape and can pass through the opening 100 of the upper cover 10 from the opening 100. Preferably, the heat sink 6 can be made of a high thermal conductivity metal such as copper, aluminum, and aluminum-magnesium alloy.

[0037] As an optimization solution of the embodiment of the present invention, please refer to Figure 5 The functional chip 3 is covered with a heat-conducting layer, and the heat-conducting member is arranged in contact with the heat-conducting layer. In this embodiment, the heat-conducting layer is defined as a first heat-conducting layer 7, and some heat-conducting materials are used to enhance the heat-conducting effect of the heat sink 6. For chips other than the main chip, such as Figure 7 As shown, the chip on the back of the PCB board 2 does not release much heat, and the heat can be transferred to the base 11 for heat dissipation only through the second heat conducting layer 8. Preferably, the first heat conducting layer 7 and the second heat conducting layer 8 can be made of heat conducting pads, heat conducting gel or phase change material.

[0038] As an optimization solution of the embodiment of the present invention, please refer to Figure 8 The housing 1 includes a base 11 and an upper cover 10 covering the base 11, and the upper cover 10 is provided with the opening 100. In this embodiment, the upper cover 10 is provided with the opening 100 for the heat sink 6 to pass through, so that one end of the heat sink 6 directly contacts the functional chip 3, and the other end conducts heat to the heat spreader 4 outside the housing 1.

[0039] As an optimization solution of the embodiment of the present invention, please refer to Figure 1 At the electrical port, the upper cover 10 and the base 11 are snap-fitted. In this embodiment, the upper cover 10 and the base 11 at the electrical port are snap-fitted, which can save the positioning column designed at the electrical port for screw installation, so that the space of the PCB board 2 at the electrical port can be freed up, providing more space for the installation of devices. Preferably, the snap-fitting form can be that the base 11 has a hook 9, and the upper cover 10 has a slot, and the hook 9 is snapped into the slot to realize the snap-fitting of the upper cover 10 and the base 11.

[0040] The embodiment of the present invention provides a heat dissipation method for an optical module, comprising the following steps: S1, transferring the heat of the functional chip to a heat conducting member; S2, the heat conducting member transfers the heat to a heat spreader, and the heat spreader quickly diffuses the received heat to its body, obtaining a larger heat dissipation area to reduce the heat flux density of the functional chip; S3, transferring the heat diffused by the heat spreader to a radiator, and the radiator dissipates the heat. In this embodiment, the heat emitted by the functional chip 3 will go up all the time, and will be dissipated through the heat conducting member, the heat spreader 4, and the radiator 5 in turn, wherein the heat spreader 4 and the radiator 5 are both arranged outside the housing 1, and the heat can be dissipated as quickly as possible, greatly improving the heat dissipation efficiency. The heat spreader 4 quickly diffuses the heat of the functional chip to its body. Since the heat spreader 4 and the radiator 5 both have a large area, the heat transfer area and the heat dissipation area are increased, and the heat transfer efficiency and the heat dissipation efficiency are improved, which is equivalent to expanding the heating point of the functional chip 3 by N times, thereby greatly reducing the heat flux density of the functional chip, and finally the heat is dissipated through the radiator. The heat dissipation path has also been expanded from a narrow path to a highway, achieving high-speed heat dissipation.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical module, comprising a housing and a PCB board placed in the housing, wherein the PCB board is provided with a functional chip, characterized in that: It also includes a heat spreader arranged outside the shell and a heat conducting member used to transfer the heat of the functional chip to the heat spreader, and the shell has an opening for the heat conducting member to pass through.

2. An optical module according to claim 1, characterized in that: The heat spreader is covered with a heat sink, and the heat spreader is sandwiched between the heat sink and the housing.

3. An optical module as claimed in claim 2, characterized in that: The heat sink has a plurality of heat dissipation channels.

4. An optical module as claimed in claim 3, characterized in that: The radiator comprises a panel and a plurality of partitions, each of which is vertically arranged on the panel, and the interval between adjacent partitions is the heat dissipation channel.

5. An optical module as claimed in claim 2, characterized in that: Baffles are arranged on opposite outer edges of the shell, and an installation area for installing the radiator is provided between two baffles.

6. An optical module according to claim 1, characterized in that: The heat conducting member comprises a heat sink, which is arranged at the bottom of the heat spreader and passes through the opening.

7. An optical module according to claim 1, characterized in that: The functional chip is covered with a first heat-conducting layer, and the heat-conducting member is arranged in contact with the first heat-conducting layer.

8. An optical module as claimed in claim 1, characterized in that: The shell comprises a base and an upper cover arranged on the base, and the upper cover is provided with the opening.

9. An optical module as claimed in claim 8, characterized in that: At the electrical port, the upper cover and the base are snap-connected.

10. The optical module according to claim 1, characterized in that: The function chip on the side of the PCB board facing away from the function chip is covered with a second heat conducting layer.

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