Photoresist stripping tool

By designing a vehicle and fixing piece to fix the substrate and flip it into the stripping liquid, the problem of substrate damage during photoresist peeling is solved, and the effect of reducing damage is achieved.

CN222259845UActive Publication Date: 2024-12-27安徽光智科技有限公司
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Patent Information

Application Number
CN202420407637.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-04
Publication Date
2024-12-27
Estimated Expiration
2034-03-04

AI Technical Summary

Technical Problem

In the existing photoresist peeling process, the substrate is susceptible to damage to gravity and metal elements in the peeling liquid during the immersion and rinsing process, resulting in damage to the substrate and metal patterns.

Method used

A photoresist peeling tool is designed, including a vehicle and a fixing member. By setting a limiting column and fixing member in the substrate placement area, the substrate is fixed and then flipped to be placed in the stripping liquid face downward to prevent metal elements from falling into the On the substrate and control the pressure during rinsing to reduce damage to the substrate and metal patterns.

Benefits of technology

It effectively reduces damage to the substrate during photoresist peeling, prevents metal elements from falling on the substrate, and ensures the integrity of the substrate and metal patterns.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip preparation, and particularly discloses a photoresist stripping tool which comprises a carrier and a fixing part, the carrier is provided with a placing area for placing a substrate; and the fixing piece is connected with the carrier and is used for fixing the substrate after the substrate is placed in the placing area. According to the scheme, after the substrate abuts against the carrier, the substrate can be fixed through the fixing piece, and therefore the carrier can be overturned to be placed in stripping liquid in the mode that the substrate faces downwards; metal elements stripped in the soaking process sink under the action of gravity, so that the metal elements are prevented from falling on the substrate; moreover, when the surface of the substrate is washed, the substrate and the metal pattern are not damaged due to impact on metal elements in the stripping liquid and metal elements on the surface of the substrate, so that the damage to the substrate in the photoresist stripping process is effectively reduced.
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Description

Technical Field

[0001] The present application relates to the technical field of chip preparation, and in particular to a photoresist stripping tool. Background Art

[0002] The metal stripping process refers to coating a layer of photoresist on the surface of the substrate, then forming a mask pattern in the area where metal is not needed through pre-baking, exposure, development, etc., and then coating a metal film on the surface of the substrate by sputtering or evaporation. Finally, the substrate is immersed in a stripping solution to dissolve and remove the photoresist, so that the metal on the surface of the photoresist also falls off with it, leaving only the required metal pattern.

[0003] The existing stripping method is that the staff places the substrate on a supporting carrier, immerses the supporting carrier in a stripping solution, and rinses the surface of the substrate after immersion; during the soaking process, the metal elements stripped off after the photoresist is dissolved fall onto the substrate due to gravity, which can easily cause damage to the surface of the substrate; at the same time, during the rinsing process, since the stripping solution contains dissolved metal elements, it is also easy to cause damage to the substrate and the metal pattern when rinsing the substrate surface. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide a photoresist stripping tool for reducing damage to the substrate during the photoresist stripping process.

[0005] In order to achieve the above technical purpose, the present application provides a photoresist stripping tool, including: a carrier and a fixing member;

[0006] The carrier is provided with a placement area for placing the substrate;

[0007] The fixing member is connected to the carrier and is used to fix the substrate after the substrate is placed in the placement area.

[0008] Furthermore, the fixing members include a plurality of fixing members, and are distributed at intervals along the periphery of the placement area.

[0009] Furthermore, it also includes a limiting column;

[0010] The limiting column is arranged on the carrier and is located on the outer periphery of the placement area;

[0011] The limiting column is provided with a limiting groove for the edge of the substrate to be inserted into.

[0012] Furthermore, the limiting columns include a plurality of limiting columns, and are distributed at intervals along the outer periphery of the placement area.

[0013] Furthermore, the limiting column and the fixing member are respectively arranged on two sides of the placement area;

[0014] The fixing member is detachably connected to the carrier.

[0015] Furthermore, the limiting column is a polyetheretherketone column.

[0016] Furthermore, a handle is provided on the outer periphery of the carrier.

[0017] Furthermore, the carrier is provided with a through hole penetrating in the vertical direction;

[0018] The through hole is connected to the placement area.

[0019] Furthermore, the fixing member is a frustum bolt with a conical end.

[0020] Further, it also includes a quartz tank;

[0021] The quartz tank is used for placing stripping liquid.

[0022] It can be seen from the above technical solution that the present application provides a photoresist stripping tool, including: a carrier and a fixing part; the carrier is provided with a placement area for placing a substrate; the fixing part is connected to the carrier and is used to fix the substrate after the substrate is placed in the placement area.

[0023] In the present solution, after the substrate abuts against the carrier, the substrate can be fixed by a fixing part, so that the carrier can be flipped over to place the substrate facing downward in the stripping solution; during the immersion process, the stripped metal elements will sink due to gravity, preventing the metal elements from falling on the substrate; and when the surface of the substrate is rinsed, the substrate and the metal pattern will not be lost due to the impact on the metal elements in the stripping solution and the metal elements on the surface of the substrate, thereby effectively reducing the damage to the substrate during the photoresist stripping process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 A schematic diagram of the structure of a photoresist stripping tool provided in an embodiment of the present application;

[0026] Figure 2 A schematic diagram of a photoresist stripping tool structure provided in another embodiment of the present application

[0027] Figure 3 A disassembly diagram of a photoresist stripping tool provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of a fixing part of a photoresist stripping tool provided in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of a quartz tank of a photoresist stripping tool provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0031] In the description of the embodiments of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present application.

[0032] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0033] See also Figure 1 or Figure 2 A photoresist stripping tool provided in an embodiment of the present application includes: a carrier 10 and a fixing member 20; a placement area 11 for placing a substrate 30 is provided on the carrier 10; the fixing member 20 is connected to the carrier 10 and is used to fix the substrate 30 after the substrate 30 is placed in the placement area 11.

[0034] In application, the substrate 30 can be placed in the placement area 11 and fixed by the fixing member 20, so that the carrier 10 can be flipped over to face the substrate 30 downward, so that the metal elements stripped during the immersion process will sink into the stripping liquid instead of falling on the substrate, avoiding damage to the substrate and metal patterns during the immersion and rinsing processes.

[0035] In one embodiment, see Figure 1 The fixing member 20 may be a detachable member, and after the substrate 30 is placed, the fixing member 20 is installed to fix the substrate 30. The fixing member 20 may include a plurality of fixing members 20, and the fixing members 20 are spaced apart along the periphery of the placement area 11.

[0036] In another embodiment, see Figure 2 The fixing member 20 can be fixed on the carrier 10, and a slot can be provided on the fixing member 20 so that the substrate 30 can be inserted into the slot; in this embodiment, the fixing member 20 can fix the substrate 30 in the vertical direction so that the substrate 30 will not fall after the carrier 10 is turned over.

[0037] For more specific examples, see Figure 1 and Figure 3 The photoresist stripping tool provided in this embodiment also includes a limiting column 50; the limiting column 50 is arranged on the carrier 10 and is located on the outer peripheral edge of the placement area 11; the limiting column 50 is provided with a limiting groove 51 for the edge of the substrate 30 to be inserted into the side along the horizontal direction.

[0038] In this embodiment, the limiting groove 51 on the limiting column 50 can be inserted into the substrate 30, and then the substrate 30 is fixed in cooperation with the fixing member 20.

[0039] There may be a plurality of limiting posts 50 , which are spaced apart along the periphery of the placement area 11 , and can fix the substrate 30 from a plurality of positions on the periphery.

[0040] In one embodiment, the limiting column 50 and the fixing member 20 are respectively disposed on two sides of the placement area 11 ; the fixing member 20 and the carrier 10 are detachably connected.

[0041] Specifically, in the application process, taking the substrate 30 as a circular sheet as an example, the placement area 11 is also a circular area; the plurality of limiting columns 50 can be surrounded by a semicircle. When installing the substrate 30, the substrate 30 is first inserted into the plurality of limiting grooves 51 so that one side of the substrate 30 is fixed, and then the fixing member 20 is installed on the other side of the substrate 30 to fix both sides of the substrate 30.

[0042] It should be noted that, in this embodiment, fixing the substrate 30 by the fixing member 20 and the limiting column 50 can reduce the area covered by the fixed substrate 30, thereby increasing the contact surface between the substrate 30 and the stripping liquid as much as possible to avoid affecting the stripping effect.

[0043] In application, the limiting column 50 may be a polyetheretherketone column.

[0044] Furthermore, a handle 12 is provided on the outer periphery of the carrier 10 to facilitate the staff to clamp it with a clamp.

[0045] In one embodiment, a through hole 13 penetrating in the vertical direction is disposed on the carrier 10 ; the through hole 13 is connected to the placement area 11 .

[0046] The through hole 13 can balance the pressure on both sides of the carrier 10 when the carrier 10 is placed in the stripping liquid, thereby preventing the substrate from being compressed.

[0047] In one embodiment, see Figure 4 The fixing member 20 is a cone-shaped frustum bolt with a conical end. Correspondingly, the carrier 10 is provided with a bolt hole for installing the fixing member 20 .

[0048] Specifically, in this embodiment, the use of a cone bolt as the fixing member 20 can fix the substrate 30 through the cone at its end while reducing the coverage area of ​​the electrode 30, thereby maximizing the contact area between the substrate 30 and the stripping liquid.

[0049] In one embodiment, see Figure 5 , further comprising a quartz tank 40; the quartz tank 40 is used for placing the stripping liquid.

[0050] During use, the stripping liquid Remover300 can be first placed in the quartz tank 40, and then the quartz tank 40 can be placed in a water bath for heating; after the temperature of the stripping liquid reaches the preset temperature by measuring with a thermometer, the substrate 30 is mounted on the carrier 10 and fixed, and then the carrier 10 and the substrate 30 are placed in the quartz tank 40 through the handle 12; the carrier 10 is placed vertically in the quartz tank 40 so that the stripping liquid covers the carrier 10 and the substrate 30. Among them, the carrier 10 can initially place the substrate 30 in the quartz tank 40 with the substrate 30 facing downward, or it can be placed in the quartz tank 40 with the substrate 30 facing upward and then turned over. After soaking for a preset period of time, the front edge of the substrate 30 of the carrier 10 is sprayed with an alcohol spray gun, so that the metal elements on the surface such as indium wind bulge and separate from the surface of the substrate 30, and the bulging indium is clamped away with tweezers; because the carrier 10 is downward, under the action of gravity, the stripped metal elements will sink and will not fall on the surface of the substrate 30 to scratch the In column. After the stripping is completed, use an acetone spray gun to rinse the front and back sides of the readout substrate 30, and then use an alcohol spray gun to rinse the front and back sides of the readout substrate 30 for 2 minutes at a pressure of 0.5-1 kg; after rinsing, put it in an oven for drying to complete the metal stripping process.

[0051] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A photoresist stripping tool, characterized in that: include: A carrier (10) and a fixing member (20); The carrier (10) is provided with a placement area (11) for placing the substrate (30); The fixing member (20) is connected to the carrier (10) and is used to fix the substrate (30) after the substrate (30) is placed in the placement area (11).

2. The photoresist stripping tool according to claim 1, characterized in that: The fixing members (20) include a plurality of fixing members (20) which are distributed at intervals along the outer periphery of the placement area (11).

3. The photoresist stripping tool according to claim 1, characterized in that: Also includes a limiting column (50); The limiting column (50) is arranged on the carrier (10) and is located on the outer periphery of the placement area (11); The limiting column (50) is provided with a limiting groove (51) for the edge of the substrate (30) to be inserted into.

4. The photoresist stripping tool according to claim 3, characterized in that: The limiting posts (50) include a plurality of them, and are distributed at intervals along the outer periphery of the placement area (11).

5. The photoresist stripping tool according to claim 3, characterized in that: The limiting column (50) and the fixing member (20) are respectively arranged on two sides of the placement area (11); The fixing member (20) is detachably connected to the carrier (10).

6. The photoresist stripping tool according to claim 3, characterized in that: The limiting column (50) is a polyetheretherketone column.

7. The photoresist stripping tool according to claim 1, characterized in that: A handle (12) is provided on the outer periphery of the carrier (10).

8. The photoresist stripping tool according to claim 1, characterized in that: The carrier (10) is provided with a through hole (13) penetrating in the vertical direction; The through hole (13) is connected to the placement area (11).

9. The photoresist stripping tool according to any one of claims 1 to 8, characterized in that: The fixing member (20) is a frustum-shaped bolt with a conical end.

10. The photoresist stripping tool according to claim 1, characterized in that: Also includes a quartz tank (40); The quartz tank (40) is used for placing a stripping liquid.