Tower footing concrete curing environment monitoring equipment

Abstract

The utility model discloses tower footing concrete curing environment monitoring equipment which comprises a sensor module, a main control module, an interface conversion module, a communication module and a power supply module, wherein the interface conversion module comprises a first interface and a second interface, and the communication module comprises a 4G module and a Beidou module; the sensor module is connected with the main control module through the first interface; the 4G module is connected with the main control module; the Beidou module is connected with the main control module through a second interface; the sensor module is used for monitoring a tower footing concrete curing environment and collecting environment data; the main control module is used for reading environment data from the sensor module through the first interface and uploading the data through the 4G module or the Beidou module; the power supply module is used for supplying power to each module. According to the equipment, automatic monitoring and data acquisition of the tower footing concrete curing environment can be realized, 4G communication and Beidou short message communication are supported, monitoring data can still be uploaded in a remote environment, and the real-time performance of the data is improved.

Description

Technical Field

[0001] The utility model belongs to the field of environmental monitoring, and in particular relates to a tower base concrete maintenance environment monitoring device. Background Art

[0002] The tower base is the basic component of the transmission line tower, and the reliability of the tower base concrete is the fundamental factor affecting the stability of the transmission line. In the early stage of tower base concrete curing under the mechanized construction mode, it is necessary to continuously monitor the temperature and humidity of the concrete curing environment, which is directly related to the quality and performance of the finished product.

[0003] Traditional concrete maintenance environment monitoring equipment often relies on manual recording of temperature and humidity data. Due to the lack of communication means in remote areas such as deserts and neighboring areas, it is almost impossible to upload environmental monitoring data in real time. With the continuous and in-depth application of mechanized construction in power transmission and transformation projects, tower foundation construction has gradually shown the characteristics of short construction period and few construction personnel. The problems of traditional tower foundation concrete maintenance environment monitoring equipment in remote areas that rely on manual labor, lack of communication means, and poor data real-time performance are more prominent. Utility Model Content

[0004] In order to solve the above problems existing in the prior art, the utility model provides a tower foundation concrete maintenance environment monitoring device. The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0005] The utility model proposes a tower foundation concrete maintenance environment monitoring device, comprising a sensor module, a main control module, an interface conversion module, a communication module and a power module; wherein the interface conversion module comprises a first interface and a second interface, and the communication module comprises a 4G module and a Beidou module;

[0006] The sensor module is connected to the main control module via the first interface;

[0007] The 4G module is connected to the main control module;

[0008] The Beidou module is connected to the main control module through the second interface;

[0009] The sensor module is used to monitor the tower foundation concrete curing environment and collect environmental data;

[0010] The main control module is used to read environmental data from the sensor module through the first interface and upload the data through the 4G module or the Beidou module;

[0011] The power module is connected to the sensor module, main control module, 4G module and Beidou module to provide power to each module.

[0012] In one embodiment of the present utility model, the power module includes a power management module and a battery module;

[0013] Wherein, the battery module is connected to the power supply management module to provide direct current to the power supply management module;

[0014] The power supply management module is connected to the sensor module, main control module, 4G module, Beidou module and display module, and is used to provide different sizes of DC power supply to different modules according to actual needs.

[0015] Beneficial effects of the utility model:

[0016] 1. The tower foundation concrete maintenance environment monitoring device provided by the utility model is designed with a sensor module that can automatically monitor and collect tower foundation concrete maintenance environment data, reducing dependence on manual labor. On the other hand, a 4G module and a Beidou module are added as communication modules, which can support 4G communication and Beidou short message communication, thereby enhancing the communication capability of the device, so that the device can still complete the monitoring data upload in the field environment where communication means are scarce, such as in the desert and next door, thereby improving the real-time nature of the data.

[0017] 2. The tower base concrete maintenance environment monitoring equipment provided by the utility model is also designed with a power supply management module, which manages the power supply of different modules of the equipment separately, especially the sensor module and Beidou module with high power consumption, which are powered only when needed, saving power consumption and extending the working time of the equipment.

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a general structural block diagram of a tower foundation concrete maintenance environment monitoring device provided by an embodiment of the utility model;

[0020] Figure 2 It is a structural block diagram of the power supply management module provided by the embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of a basic power supply unit provided in an embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of a sensor power supply unit provided in an embodiment of the utility model;

[0023] Figure 5 It is a schematic diagram of a Beidou power supply unit provided by an embodiment of the utility model;

[0024] Figure 6 It is a schematic diagram of the MCU unit provided by the embodiment of the utility model;

[0025] Description of reference numerals:

[0026] 10-sensor module, 20-main control module, 30-interface conversion module, 31-first interface, 32-second interface, 40-communication module, 41-4G module, 42-Beidou module, 50-power module, 51-power supply management module, 511-first power supply unit, 512-second power supply unit, 513-third power supply unit, 514-fourth power supply unit, 515-fifth power supply unit, 516-MCU unit, 52-battery module, 60-display module, 70-TF module. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment 1

[0029] See also Figure 1 , Figure 1 The figure is a general structural block diagram of a tower foundation concrete maintenance environment monitoring device provided by the embodiment of the utility model. The tower foundation concrete maintenance environment monitoring device provided by the embodiment specifically includes: a sensor module 10, a main control module 20, an interface conversion module 30, a communication module 40 and a power module 50; wherein the interface conversion module 30 includes a first interface 31 and a second interface 32, and the communication module 40 includes a 4G module 41 and a Beidou module 42;

[0030] The sensor module 10 is connected to the main control module 20 via the first interface 31;

[0031] The 4G module 41 is connected to the main control module 20;

[0032] The Beidou module 42 is connected to the main control module 20 via the second interface 32;

[0033] The sensor module 10 is used to monitor the tower foundation concrete curing environment and collect environmental data;

[0034] The main control module 20 is used to read environmental data from the sensor module 10 through the first interface 31 and upload the data through the 4G module 41 or the Beidou module 42;

[0035] The power module 50 is connected to the sensor module 10 , the main control module 20 , the 4G module 41 and the Beidou module 42 to supply power to each module.

[0036] Optionally, in this embodiment, the sensor module 10 includes a temperature and humidity sensor. For example, in this embodiment, the digital temperature and humidity sensor SHT30 can be used to collect temperature and humidity data of the tower foundation concrete curing environment. In addition, other sensors can be set according to actual needs to collect environmental data, such as wind speed, wind direction, etc.

[0037] After the sensor module 10 collects the environmental data, it needs to transfer the data to the main control module 20 through the first interface 31 for subsequent data upload. The first interface 31 is a USB to RS485 interface, with the USB end connected to the main control module 20 and the RS485 end connected to the sensor module 10.

[0038] Specifically, the sensor module 10 communicates with the main control module 20 based on the Modbus RTU protocol, wherein the baud rate of the sensor module 10 is 9600 bps. The power module 50 provides a DC 24V power supply to the sensor module 10 .

[0039] For further information, please see Figure 1 The tower foundation concrete maintenance environment monitoring device provided in this embodiment further includes a display module 60; wherein the display module 60 adopts a touch screen;

[0040] The display module 60 is connected to the main control module 20 via a display interface to obtain and display environmental data;

[0041] The display module 60 is also connected to the main control module 20 through a touch interface to control the display and extinguishing of the touch screen according to the screen extinguishing time and touch screen action preset by the main control module 20;

[0042] The display module 60 is also connected to the power module 50 .

[0043] Specifically, this embodiment can use a 7-inch capacitive touch screen, the display module 60 uses the HDMI interface as a display interface to connect to the main control module 20, the display module 60 uses the USB interface as a touch interface to connect to the main control module 20, and the power module 50 provides a DC 5V power supply to the display module 60. The display module 60 can display environmental data such as temperature and humidity collected by the sensor module 10. The screen-off time of the display module 60 can be set through the main control module 20. When the no-touch time of the display module 60 exceeds the screen-off time of the display module 60, the display module 60 is turned off to save power; touching the display module 60 in the screen-off state can wake up the display screen and view the temperature and humidity data.

[0044] For further information, please see Figure 1The tower foundation concrete maintenance environment monitoring device provided in this embodiment also includes a TF module 70; the TF module 70 is connected to the main control module 20 through a TF card interface and is used to record data transmission logs.

[0045] Optionally, in this embodiment, the main control module 20 runs the Linux operating system, which includes a main control SOC RK3566, a memory RAM chip, a storage EMMC chip, a network port chip YT8531C, a power management chip RK809-5 and a matching power supply circuit.

[0046] Specifically, the optional model of the main control module 20 is Orange Pi 3B. The interfaces provided by the main control module 20 include an HDMI interface, a TF card interface, a USB interface, and an Ethernet interface. The main control module 20 is connected to the display module 60 through the HDMI interface and the USB interface, and the main control module 20 is connected to the TF module 70 through the TF card interface. The main control module 20 is connected to the first interface 31, the second interface 32, and the 4G module 41 through the USB interface, and the main control module 20 is connected to the power module 50 through the Ethernet interface. The power module 50 provides a DC 5V power supply to the main control module 20.

[0047] Further, in the communication module 40, the 4G module 41 includes a 4G module SLM750 with a MINIPCIe interface and a MINIPCIe interface to USB interface adapter board, and the 4G module SLM750 is connected to the USB interface of the main control module 20 through the MINIPCIe interface to USB interface adapter board. The power module 50 provides a DC 4V power supply to the 4G module 41.

[0048] Further, the Beidou module 42 is a data transmission terminal supporting the Beidou third-generation protocol, and supports transparent transmission of Beidou short message data. The Beidou module 42 communicates with the main control module 20 through the second interface 32, wherein the second interface 32 is a USB to RS485 interface, the USB end of which is connected to the main control module 20, and the RS485 end is connected to the Beidou module 42. The baud rate of the Beidou module 42 is 9600bps. The power module 50 provides a DC 24V power supply to the Beidou module 42.

[0049] The tower base concrete maintenance environment monitoring equipment provided by the utility model is designed with a sensor module on the one hand to automatically monitor and collect tower base concrete maintenance environment data, reducing dependence on manual labor; on the other hand, a 4G module and a Beidou module are added as communication modules, which can support 4G communication and Beidou short message communication, thereby enhancing the communication capability of the equipment, so that the equipment can still complete the uploading of monitoring data in field environments such as deserts and next door where communication means are scarce, thereby improving the real-time nature of the data.

[0050] For further information, please see Figure 1, wherein the power module 50 includes a power supply management module 51 and a battery module 52;

[0051] The battery module 52 is connected to the power supply management module 51 and is used to provide direct current to the power supply management module 51;

[0052] The power supply management module 51 is connected to the sensor module 10 , the main control module 20 , the 4G module 41 , the Beidou module 42 and the display module 60 , and is used to provide different DC power supplies of different sizes to different modules according to actual needs.

[0053] Optionally, the battery module 52 uses a 18650 lithium battery pack with a capacity of 60000 mAh, and the battery module 52 provides a DC 24V power supply to the power management module 51 .

[0054] Specifically, the structural block diagram of the power supply management module 51 is as follows: Figure 2 As shown, it includes a first power supply unit 511, a second power supply unit 512, a third power supply unit 513, a fourth power supply unit 514, a fifth power supply unit 515 and an MCU unit 516; wherein,

[0055] The first power supply unit 511, also called a 3.3V power supply unit, is connected to the battery module 52 and the MCU unit 516, and is used to provide a DC 3.3V power supply to the MCU unit 516;

[0056] The second power supply unit 512, also called a 4V power supply unit, is connected to the battery module 52 and the 4G module 41, and is used to provide a DC 4V power supply to the 4G module 41;

[0057] The third power supply unit 513, also called a 5V power supply unit, is connected to the battery module 52, the main control module 20 and the display module 60, and is used to provide a DC 5V power supply to the main control module 20 and the display module 60;

[0058] The fourth power supply unit 514, also called the sensor power supply unit, is connected to the battery module 52 and the sensor module 10, and is used to provide a DC 24V power supply to the sensor module 10;

[0059] The fifth power supply unit 515, also called the Beidou power supply unit, is connected to the battery module 52 and the Beidou module 42, and is used to provide a DC 24V power supply to the Beidou module 42;

[0060] The MCU unit 516 is connected to the main control module 20 , the fourth power supply unit 514 and the fifth power supply unit 515 , and is used to control the power supply status of the sensor module 10 and the Beidou module 42 .

[0061] Optionally, as an implementation manner, the first power supply unit 511, the second power supply unit 512, and the third power supply unit 513 in this embodiment can be implemented by using the same basic power supply unit.

[0062] The following describes the structure of the basic power supply unit. Figure 3 , Figure 3 This is a schematic diagram of a basic power supply unit provided by an embodiment of the utility model. The basic power supply unit uses a DC-DC power supply chip with peripheral circuits to realize a voltage conversion function, specifically including: a DC-DC power supply chip U2, capacitors C16, C14, C4, C23, C39, C7, C28, C35, C32, C24, C21, resistors R5, R6, R9, R10, R11, R12, R13, R27, R8, inductor L2, Schottky diode D3, and light-emitting diode LED1; wherein capacitors C4, C24, and C21 are all polar capacitors;

[0063] The first ends of capacitors C16, C14, C23, and C39 are connected to the positive electrode of capacitor C4, and the common end after connection is connected to the positive electrode 24V-BAT of the external DC 24V output of the battery module 52 as an input end; the second ends of capacitors C16, C14, C23, and C39 and the negative electrode of capacitor C4 are all connected to the GND end;

[0064] A first end of the resistor R5 is connected to a first end of the capacitor C39 and a pin 2 of U2; a second end of the resistor R5 is connected to a pin 3 of U2;

[0065] Resistor R6 is connected between pin 4 of U2 and the GND terminal;

[0066] Capacitor C7 is connected between pin 1 and pin 8 of U2;

[0067] Capacitor C28 is connected between pin 6 of U2 and the GND terminal;

[0068] The positive electrode of Schottky diode D3 is connected to GND terminal, and the negative electrode is connected to pin 8 of U2;

[0069] A first end of the inductor L2 is connected to pin 8 of U2;

[0070] A first end of resistor R27 is connected to pin 5 of U2;

[0071] The second end of the inductor L2, the second end of the resistor R27, the first ends of the capacitors C35 and C32, the positive electrodes of the capacitors C24 and C21, and the first end of the resistor R8 are connected, and the common end after the connection serves as the output end VOUT;

[0072] The second ends of the capacitors C35 and C32 and the negative electrodes of the capacitors C24 and C21 are all connected to the GND terminal;

[0073] The positive electrode of the light emitting diode LED1 is connected to the second end of the resistor R8, and the negative electrode is connected to the GND end;

[0074] The first ends of the resistors R9, R10, R11, R12, and R13 are all connected to the pin 5 of the DC-DC power chip U2;

[0075] Pins 7 and 9 of U2 are connected to the GND terminal;

[0076] The second end of the resistor R9 is recorded as a1, the second end of the resistor R10 is recorded as b1, the second end of the resistor R11 is recorded as c1, the second end of the resistor R12 is recorded as d1, and the second end of the resistor R13 is recorded as e1; and the terminals a2, b2, c2, d2, and e2 are connected to the GND terminal;

[0077] By connecting a1 and a2, the basic power supply unit can form a first power supply unit 511, and output 3.3V DC at the output terminal VOUT;

[0078] By connecting c1 and c2, the basic power supply unit can form a second power supply unit 512, and output 4V DC at the output terminal VOUT;

[0079] By connecting d1 and d2, the basic power supply unit can form a third power supply unit 513, and output 5V DC power at the output terminal VOUT.

[0080] Optionally, in this embodiment, the DC-DC power chip U2 can be implemented by a power chip model LMR14050SDDA, C16 is a 10uF capacitor, C14 is a 10uF capacitor, C4 is a 47uF polar capacitor, C23 is a 100nF capacitor, C39 is a 100nF capacitor, C7 is a 100nF capacitor, C28 is a 22nF capacitor, C35 is a 10uF capacitor, C32 is a 100nF capacitor, and C24 is a 220 uF polar capacitor, C21 is a 220uF polar capacitor; R5 is a 100KΩ resistor, R6 is a 22KΩ resistor, R9 is a 29.4KΩ resistor, R10 is a 24.3KΩ resistor, R11 is a 23.2KΩ resistor, R12 is a 16.5KΩ resistor, R13 is a 6.8KΩ resistor, R27 is a 100KΩ resistor, and R8 is a 100KΩ resistor; L2 is a 10uH inductor, and the model of Schottky diode D3 is B540C-13-F.

[0081] On the basis of the above basic power supply unit circuit structure, a 0Ω resistor is connected between a1 and a2 to make a1 and a2 conductive, thereby obtaining a first power supply unit 511, i.e., a 3.3V power supply unit, and the VOUT output is connected to the power supply end of the MCU unit to output a 3.3V voltage thereto.

[0082] On the basis of the above-mentioned basic power supply unit circuit structure, a 0Ω resistor is connected between c1 and c2 to make c1 and c2 conductive, thereby obtaining a second power supply unit 512, that is, a 4V power supply unit, and the VOUT output is connected to the power supply end of the adapter board of the MINIPCIe interface to the USB interface of the 4G module 41 to output a 4V voltage thereto.

[0083] On the basis of the above-mentioned basic power supply unit circuit structure, a 0Ω resistor is connected between d1 and d2 so that d1 and d2 are turned on, thereby obtaining a third power supply unit 513, that is, a 5V power supply unit, and the VOUT terminal output is connected to the power supply terminal of the main control module 20 and the power supply terminal of the display module 60 to output a 5V voltage thereto.

[0084] For further information, see Figure 4 , Figure 4 : is a schematic diagram of a sensor power supply unit provided in an embodiment of the utility model; the sensor power supply unit, that is, the fourth power supply unit 514 specifically includes: a load switch chip U4, a Schottky diode D8, capacitors C11, C12, C13, and resistors R83, R82; wherein,

[0085] The positive electrode of the Schottky diode D8 is connected to the positive electrode 24V-BAT of the external DC 24V output of the battery module 52 as the input end of the fourth power supply unit 514, and the negative electrode of the Schottky diode D8 is connected to the first end of the capacitor C11 and the pins 1 and 2 of U4; the second end of the capacitor C11 is connected to the GND end;

[0086] Capacitor C13 is connected between pin 4 of U4 and the GND terminal;

[0087] Resistor R83 is connected between pin 6 of U4 and the GND terminal;

[0088] Resistor R82 is connected between pin 5 of U4 and the GND terminal;

[0089] Pins 8 and 7 of U4 and the first end of capacitor C12 are connected and serve as the output terminal 24V-SENSOR of the fourth power supply unit 514 to output 24V DC power;

[0090] Pin 5 of U4 serves as a control terminal of the fourth power supply unit 514 and is connected to a first control terminal of the MCU unit 516 .

[0091] Optionally, in this embodiment, the load switch chip U4 can be a chip of model AOZ1360AIL, and the Schottky diode D8 can be a diode of model SS54. C11 is a 1uF capacitor, C12 is a 1uF capacitor, C13 is a 10nF capacitor, R83 is a 100KΩ resistor, and R82 is a 1kΩ resistor.

[0092] When the first control terminal of the MCU unit 516 outputs a high level, the load switch chip U4 output is enabled, the 24V-SENSOR outputs a DC 24V voltage, and the sensor module 10 works; when the first control terminal of the MCU unit 516 outputs a low level, the AOZ1360AIL is not enabled, the 24V-SENSOR has no voltage output, and the sensor module 10 does not work.

[0093] For further information, see Figure 5 , Figure 5 : is a schematic diagram of a Beidou power supply unit provided in an embodiment of the utility model; the Beidou power supply unit, that is, the fifth power supply unit 515 specifically includes: a load switch chip U3, a Schottky diode D7, capacitors C8, C9, C10, and resistors R79, R78; wherein,

[0094] The positive electrode of the Schottky diode D7 is connected to the positive electrode 24V-BAT of the external DC 24V output of the battery module 52 as the input end of the fifth power supply unit 515, and the negative electrode of the Schottky diode D7 is connected to the first end of the capacitor C8 and the pins 1 and 2 of U3; the second end of the capacitor C8 is connected to the GND end;

[0095] Capacitor C10 is connected between pin 4 of U3 and the GND terminal;

[0096] Resistor R79 is connected between pin 6 of U3 and the GND terminal;

[0097] Resistor R78 is connected between pin 5 of U3 and the GND terminal;

[0098] Pins 8 and 7 of U3 and the first end of capacitor C9 are connected and serve as the output terminal 24V-BD of the fifth power supply unit 515 to output 24V DC power;

[0099] Pin 5 of U3 serves as a control terminal of the fifth power supply unit 515 and is connected to a second control terminal of the MCU unit 516 .

[0100] Optionally, in this embodiment, the load switch chip U3 can be a chip of model AOZ1360AIL, and the Schottky diode D7 can be a diode of model SS54. C8 is a 1uF capacitor, C9 is a 1uF capacitor, C10 is a 10nF capacitor, R79 is a 56KΩ resistor, and R78 is a 1KΩ resistor.

[0101] When the second control end of the MCU unit 516 outputs a high level, the load switch chip U3 output is enabled, 24V-BD outputs a DC 24V voltage, and the Beidou module 42 works; when the second control end of the MCU unit 516 outputs a low level, AOZ1360AIL is not enabled, 24V-BD has no voltage output, and the Beidou module 42 does not work.

[0102] For further information, see Figure 6 , Figure 6 It is a schematic diagram of the MCU unit provided in an embodiment of the utility model; the MCU unit realizes power supply control of the sensor module 10 and the Beidou module 42 based on the STM32 single-chip microcomputer STM32F103VET6, and specifically includes: STM32 single-chip microcomputer U1, W5500 network expansion board U5, resistors R25, R24, R1, capacitors C31, C63, C62, C59, C6, C25, C26, C22, C5, C20, C64, C65, button SW1, inductor L1, passive crystal oscillator X3; wherein,

[0103] The first end of the resistor R25, the first end of the inductor L1, the first ends of the capacitors C25, C26, C22, C5, C20, and the pins 4 and 6 of U5 are all connected to the output end of the first power supply unit 511 as the input end of the MCU unit 516 to access the 3.3V DC power. Figure 6 3V3 in the circuit is the 3.3V power supply terminal; the second end of the resistor R25 is connected to the pin 14 of U1; the second end of the inductor L1 is connected to the pins 21 and 22 of U1; the second ends of the capacitors C25, C26, C22, C5, and C20 are all connected to the GND terminal;

[0104] Capacitor C31 is connected between pin 14 of U1 and the GND terminal, and button SW1 is connected across the two ends of capacitor C31;

[0105] Capacitor C63 is connected between pin 12 of U1 and the GND terminal;

[0106] Capacitor C62 is connected between pin 13 of U1 and the GND terminal;

[0107] Passive crystal oscillator X3 and resistor R1 are connected across pins 13 and 12 of U1;

[0108] The first ends of capacitors C59 and C6 are connected to pins 21 and 22 of U1, and the second ends of capacitors C59 and C6 are connected to the GND terminal;

[0109] Resistor R24 ​​is connected between pin 94 of U1 and the GND terminal;

[0110] The first ends of capacitors C64 and C65 are connected to pins 4 and 6 of U5, and the second ends of capacitors C64 and C65 are connected to the GND terminal;

[0111] Pins 1, 2, and 3 of U5 are all connected to the GND terminal; Pin 5 of U5 is connected to the PB15 pin of U1, and Pin 7 of U5 is connected to the PB13 pin of U1; Pin 9 of U5 is connected to the PB12 pin of U1; Pin 11 of U5 is connected to the PC6 pin of U1; Pin 10 of U5 is connected to the PC7 pin of U1; Pin 12 of U5 is connected to the PB14 pin of U1;

[0112] The PD15 pin of U1 is connected to the control end of the fourth power supply unit 514 as the first control end of the MCU unit 516;

[0113] The PD12 pin of U1 serves as the second control terminal of the MCU unit 516 and is connected to the control terminal of the fifth power supply unit 515 .

[0114] Pin 11, pin 28, pin 50, pin 75, and pin 100 of U1 are connected to the input end of the MCU unit 516 and the output end of the first power supply unit 511 to receive 3.3V DC power.

[0115] Optionally, in this embodiment, the specific model of the STM32 microcontroller U1 is STM32F103VET6, R25 is a 10KΩ resistor, R24 is a 10KΩ resistor, and R1 is a 1MΩ resistor; C31 is a 100nF capacitor, C63 is a 20pF capacitor, C62 is a 20pF capacitor, C59 is a 10uF capacitor, C6 is a 100nF capacitor, C25 is a 100nF capacitor, C26 is a 100nF capacitor, C22 is a 100nF capacitor, C5 is a 100nF capacitor, C20 is a 100nF capacitor, C64 is a 100nF capacitor, and C65 is a 10uF capacitor; L1 is a 10uH inductor, and X3 is an 8MHz passive crystal oscillator.

[0116] Furthermore, Figure 6 U5 in the figure is the W5500 network expansion board, which includes the W5500 chip supporting the TCP / IP network protocol stack and the Ethernet interface HR911105A with a network transformer. Pins 1 and 3 of U5 are connected to GND; Pin 5 of U5 is connected to the PB15 pin of U1; Pin 7 of U5 is connected to the PB13 pin of U1; Pin 9 of U5 is connected to the PB12 pin of U1; Pin 11 of U5 is connected to the PC6 pin of U1; Pin 2 of U5 is connected to GND; Pins 4 and 6 of U5 are connected to 3V3, that is, the 3.3V power supply terminal; Pin 10 of U5 is connected to the PC7 pin of U1; Pin 12 of U5 is connected to the PB14 pin of U1; C64 is a 100nF capacitor, one end of C64 is connected to 3V3, and the other end of C64 is connected to GND; C65 is a 10uF capacitor, one end of C65 is connected to 3V3, and the other end of C65 is connected to GND.

[0117] The MCU unit 516 communicates with the main control module 20 using Ethernet through the W5500 network expansion board. The STM32F103VET6 runs the HTTP server, and the main control module 20 runs the HTTP client. The main control module 20 controls the power supply of the sensor module 10 and the Beidou module 42 by sending HTTP requests to the STM32F103VET6.

[0118] The tower base concrete maintenance environment monitoring equipment provided by the utility model periodically uploads the temperature and humidity data to the platform at certain time intervals. During actual application, it is found that the sensor module 10 and the Beidou module 42 consume a lot of power. Therefore, the main control module 20 controls whether the sensor module 10 and the Beidou module 42 are working by controlling whether the power supply management module 51 outputs a DC 24V power supply voltage to the sensor module 10 and the Beidou module 42.

[0119] The following describes in detail the process of collecting and uploading temperature and humidity data.

[0120] Before uploading data to the platform, the main control module 20 controls the PD15 pin of the STM32F103VET6 microcontroller of the power supply management module 51 to output a high level, so that the sensor module 10 works. After that, the main control module 20 reads the temperature and humidity data of the tower base concrete curing environment from the sensor module 10 through the first interface 31. After the main control module 20 reads the temperature and humidity data, the PD15 pin of the STM32F103VET6 microcontroller outputs a low level to power off the sensor module 10. Then, the main control module 20 performs data transmission according to the following operations.

[0121] 1. The main control module 20 encapsulates the temperature and humidity data into an MQTT message through the 4G module 41 and sends it out. The topic of the MQTT message is the message ID, the payload of the MQTT message is the temperature and humidity data, and the message ID is a string of fixed length. It is necessary to ensure that the message ID of each MQTT message sent is different. Preferably, the message ID can be generated in the following way:

[0122] msg_id=md5(strcat(tower_base_id,timestamp)) (1);

[0123] In formula (1), msg_id is the message ID, md5 is the md5 function, strcat is the string concatenation function, tower_base_id is the tower base number of the transmission line tower, and timestamp is the Unix timestamp of the current moment in milliseconds; when tower_base_id is 1022B and timestamp is 1713771529619, the calculated message ID msg_id is CC7EDBD3D5F068AA.

[0124] 2. The main control module 20 sends an HTTP request to the platform through the 4G module 41, and the HTTP request carries the message ID generated above; after receiving the HTTP request, the platform searches the historical data of the platform to see whether there is an MQTT message with the message ID carried in the above HTTP request. If so, a message indicating that it exists is returned to the main control module 20; if not, a message indicating that it does not exist is returned to the main control module 20.

[0125] When the 4G network status is good, the main control module 20 can send MQTT messages normally in operation 1, and receive the existence message returned by the platform in operation 2. In this case, there is no need to use the Beidou module 42 to send data to the platform. When the 4G network status is poor, the main control module 20 may not be able to send MQTT messages normally in operation 1, or may not be able to send HTTP requests normally in operation 2, or may not be able to receive the existence message or non-existence message returned by the platform in operation 2, or may receive the non-existence message returned by the platform in operation 2. In this case, it is necessary to use the Beidou module 42 to send data to the platform. If and only if the main control module 20 receives the existence message returned by the platform in operation 2, the Beidou module 42 is not used to send data to the platform, otherwise it is necessary to use the Beidou module 42 to send data to the platform.

[0126] When it is necessary to use the Beidou module 42 to send data to the platform, the main control module 20 controls the PD12 pin of the STM32F103VET6 microcontroller of the power supply management module 51 to output a high level, so that the Beidou module 42 works, and then waits for a period of time Δt. During the Δt time period, the Beidou module 42 establishes a communication link with the Beidou satellite. After Δt, the main control module 20 sends the temperature and humidity data to the Beidou module 42 through the second interface 32, and the Beidou module 42 uploads the temperature and humidity data to the platform through a Beidou short message; when the Beidou module 42 uploads the temperature and humidity data to the platform through a Beidou short message, the main control module 20 controls the PD12 pin of the STM32F103VET6 microcontroller of the power supply management module 51 to output a low level, and the Beidou module 42 stops working, thereby achieving the purpose of saving power.

[0127] The tower base concrete maintenance environment monitoring equipment provided by the utility model is also designed with a power supply management module, which manages the power supply of different modules of the equipment separately, especially the sensor module and Beidou module with high power consumption, which are powered only when needed, saving power consumption and extending the working time of the equipment.

[0128] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A tower foundation concrete maintenance environment monitoring device, characterized in that: The system comprises a sensor module (10), a main control module (20), an interface conversion module (30), a communication module (40) and a power supply module (50); wherein the interface conversion module (30) comprises a first interface (31) and a second interface (32), and the communication module (40) comprises a 4G module (41) and a Beidou module (42); The sensor module (10) is connected to the main control module (20) via the first interface (31); The 4G module (41) is connected to the main control module (20); The Beidou module (42) is connected to the main control module (20) via the second interface (32); The sensor module (10) is used to monitor the tower foundation concrete maintenance environment and collect environmental data; The main control module (20) is used to read the environmental data from the sensor module (10) through the first interface (31), and upload the data through the 4G module (41) or the Beidou module (42); The power supply module (50) is connected to the sensor module (10), the main control module (20), the 4G module (41) and the Beidou module (42) and is used to supply power to each module.

2. A tower foundation concrete maintenance environment monitoring device according to claim 1, characterized in that: It also includes a display module (60); the display module (60) is a touch screen; The display module (60) is connected to the main control module (20) via a display interface to obtain and display the environmental data; The display module (60) is also connected to the main control module (20) via a touch interface, so as to control the display and extinguishing of the touch screen according to the screen extinguishing time preset by the main control module (20) and the touch screen operation; The display module (60) is also connected to the power module (50).

3. The tower foundation concrete maintenance environment monitoring device according to claim 1 is characterized in that: The first interface (31) and the second interface (32) are both USB to RS485 interfaces; wherein, The USB end of the first interface (31) is connected to the main control module (20), and the RS485 end is connected to the sensor module (10); The USB end of the second interface (32) is connected to the main control module (20), and the RS485 end is connected to the Beidou module (42).

4. The tower foundation concrete maintenance environment monitoring device according to claim 1 is characterized in that: It also comprises a TF module (70); the TF module (70) is connected to the main control module (20) via a TF card interface and is used to record a data transmission log.

5. The tower foundation concrete maintenance environment monitoring device according to claim 2 is characterized in that: The power module (50) comprises a power supply management module (51) and a battery module (52); Wherein, the battery module (52) is connected to the power supply management module (51) and is used to provide direct current to the power supply management module (51); The power supply management module (51) is connected to the sensor module (10), the main control module (20), the 4G module (41), the Beidou module (42) and the display module (60), and is used to provide different amounts of direct current power supply to different modules according to actual needs.

6. The tower foundation concrete maintenance environment monitoring device according to claim 5 is characterized in that: The power supply management module (51) comprises a first power supply unit (511), a second power supply unit (512), a third power supply unit (513), a fourth power supply unit (514), a fifth power supply unit (515) and an MCU unit (516); wherein: The first power supply unit (511) is connected to the battery module (52) and the MCU unit (516), and is used to provide a DC 3.3V power supply to the MCU unit (516); The second power supply unit (512) is connected to the battery module (52) and the 4G module (41), and is used to provide a DC 4V power supply to the 4G module (41); The third power supply unit (513) is connected to the battery module (52), the main control module (20) and the display module (60), and is used to provide a DC 5V power supply to the main control module (20) and the display module (60); The fourth power supply unit (514) is connected to the battery module (52) and the sensor module (10) and is used to provide a DC 24V power supply to the sensor module (10); The fifth power supply unit (515) is connected to the battery module (52) and the Beidou module (42), and is used to provide a DC 24V power supply to the Beidou module (42); The MCU unit (516) is connected to the main control module (20), the fourth power supply unit (514) and the fifth power supply unit (515), and is used to control the power supply status of the sensor module (10) and the Beidou module (42).

7. The tower foundation concrete maintenance environment monitoring device according to claim 6 is characterized in that: The first power supply unit (511), the second power supply unit (512) and the third power supply unit (513) have the same basic power supply unit; The basic power supply unit includes a DC-DC power chip U2, capacitors C16, C14, C4, C23, C39, C7, C28, C35, C32, C24, C21, resistors R5, R6, R9, R10, R11, R12, R13, R27, R8, inductor L2, Schottky diode D3 and light-emitting diode LED1; wherein capacitors C4, C24 and C21 are all polar capacitors; The first ends of capacitors C16, C14, C23, and C39 are connected to the positive electrode of capacitor C4, and the common end after connection is connected as an input end to the positive electrode 24V-BAT of the external output DC 24V of the battery module (52); the second ends of capacitors C16, C14, C23, and C39 and the negative electrode of capacitor C4 are all connected to the GND end; A first end of the resistor R5 is connected to a first end of the capacitor C39 and a pin 2 of U2; a second end of the resistor R5 is connected to a pin 3 of U2; Resistor R6 is connected between pin 4 of U2 and the GND terminal; Capacitor C7 is connected between pin 1 and pin 8 of U2; Capacitor C28 is connected between pin 6 of U2 and the GND terminal; The positive electrode of Schottky diode D3 is connected to GND terminal, and the negative electrode is connected to pin 8 of U2; A first end of the inductor L2 is connected to pin 8 of U2; A first end of resistor R27 is connected to pin 5 of U2; The second end of the inductor L2, the second end of the resistor R27, the first ends of the capacitors C35 and C32, the positive electrodes of the capacitors C24 and C21, and the first end of the resistor R8 are connected, and the common end after the connection serves as the output end VOUT; The second ends of the capacitors C35 and C32 and the negative electrodes of the capacitors C24 and C21 are all connected to the GND terminal; The positive electrode of the light emitting diode LED1 is connected to the second end of the resistor R8, and the negative electrode is connected to the GND end; The first ends of the resistors R9, R10, R11, R12, and R13 are all connected to the pin 5 of the DC-DC power chip U2; Pins 7 and 9 of U2 are connected to the GND terminal; The second end of the resistor R9 is recorded as a1, the second end of the resistor R10 is recorded as b1, the second end of the resistor R11 is recorded as c1, the second end of the resistor R12 is recorded as d1, and the second end of the resistor R13 is recorded as e1; and the a2, b2, c2, d2, and e2 ends are connected to the GND end; By connecting a1 and a2, the basic power supply unit can form a first power supply unit (511) and output 3.3V DC power at the output terminal VOUT; By connecting c1 and c2, the basic power supply unit can form a second power supply unit (512) and output 4V DC power at the output terminal VOUT; By connecting d1 and d2, the basic power supply unit can form a third power supply unit (513) to output 5V DC power at the output terminal VOUT.

8. The tower foundation concrete maintenance environment monitoring device according to claim 6 is characterized in that: The fourth power supply unit (514) includes a load switch chip U4, a Schottky diode D8, capacitors C11, C12, C13, and resistors R83, R82; wherein, The positive electrode of the Schottky diode D8 is connected to the positive electrode 24V-BAT of the external DC 24V output of the battery module (52) as the input end of the fourth power supply unit (514); the negative electrode of the Schottky diode D8 is connected to the first end of the capacitor C11 and the pins 1 and 2 of U4; the second end of the capacitor C11 is connected to the GND end; Capacitor C13 is connected between pin 4 of U4 and the GND terminal; Resistor R83 is connected between pin 6 of U4 and the GND terminal; Resistor R82 is connected between pin 5 of U4 and the GND terminal; Pins 8 and 7 of U4 and the first end of capacitor C12 are connected and serve as the output terminal 24V-SENSOR of the fourth power supply unit (514) to output 24V DC power; Pin 5 of U4 serves as the control end of the fourth power supply unit (514) and is connected to the first control end of the MCU unit (516).

9. The tower foundation concrete maintenance environment monitoring device according to claim 6, characterized in that: The fifth power supply unit (515) includes a load switch chip U3, a Schottky diode D7, capacitors C8, C9, C10, and resistors R79, R78; wherein: The positive electrode of the Schottky diode D7 is connected to the positive electrode 24V-BAT of the external DC 24V output of the battery module (52) as the input end of the fifth power supply unit (515); the negative electrode of the Schottky diode D7 is connected to the first end of the capacitor C8 and the pins 1 and 2 of U3; the second end of the capacitor C8 is connected to the GND end; Capacitor C10 is connected between pin 4 of U3 and the GND terminal; Resistor R79 is connected between pin 6 of U3 and the GND terminal; Resistor R78 is connected between pin 5 of U3 and the GND terminal; Pins 8 and 7 of U3 and the first end of capacitor C9 are connected and serve as the output terminal 24V-BD of the fifth power supply unit (515) to output 24V DC power; Pin 5 of U3 serves as the control end of the fifth power supply unit (515) and is connected to the second control end of the MCU unit (516).

10. The tower foundation concrete maintenance environment monitoring device according to claim 6, characterized in that: The MCU unit (516) includes an STM32 single-chip computer U1, a W5500 network expansion board U5, resistors R25, R24, and R1, capacitors C31, C63, C62, C59, C6, C25, C26, C22, C5, C20, C64, and C65, a button SW1, an inductor L1, and a passive crystal oscillator X3; wherein, The first end of the resistor R25, the first end of the inductor L1, the first ends of the capacitors C25, C26, C22, C5 and C20, and pins 4 and 6 of U5 are all connected to the output end of the first power supply unit (511) as the input end of the MCU unit (516) to access 3.3V direct current; the second end of the resistor R25 is connected to pin 14 of U1; the second end of the inductor L1 is connected to pins 21 and 22 of U1; the second ends of the capacitors C25, C26, C22, C5 and C20 are all connected to the GND end; Capacitor C31 is connected between pin 14 of U1 and the GND terminal, and button SW1 is connected across the two ends of capacitor C31; Capacitor C63 is connected between pin 12 of U1 and the GND terminal; Capacitor C62 is connected between pin 13 of U1 and the GND terminal; Passive crystal oscillator X3 and resistor R1 are connected across pins 13 and 12 of U1; The first ends of capacitors C59 and C6 are connected to pins 21 and 22 of U1, and the second ends of capacitors C59 and C6 are connected to the GND terminal; Resistor R24 ​​is connected between pin 94 of U1 and the GND terminal; The first ends of capacitors C64 and C65 are connected to pins 4 and 6 of U5, and the second ends of capacitors C64 and C65 are connected to the GND terminal; Pins 1, 2, and 3 of U5 are all connected to the GND terminal; Pin 5 of U5 is connected to the PB15 pin of U1, and Pin 7 of U5 is connected to the PB13 pin of U1; Pin 9 of U5 is connected to the PB12 pin of U1; Pin 11 of U5 is connected to the PC6 pin of U1; Pin 10 of U5 is connected to the PC7 pin of U1; Pin 12 of U5 is connected to the PB14 pin of U1; The PD15 pin of U1 is connected to the control end of the fourth power supply unit (514) as the first control end of the MCU unit (516); The PD12 pin of U1 serves as the second control terminal of the MCU unit (516) and is connected to the control terminal of the fifth power supply unit (515).

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