Industrial control computer

Abstract

The utility model is suitable for the technical field of computer heat dissipation, and provides an industrial control computer which comprises a box body, and the box body is provided with a containing cavity and an opening end; the main board is contained in the containing cavity, and a plurality of heating elements are arranged on the main board; the heat dissipation assembly covers the opening end, the heat dissipation assembly comprises an upper heat dissipation structure and a lower heat dissipation structure covering the upper heat dissipation structure, the lower heat dissipation structure is used for conducting heat with the heating element, and a fluid cavity is formed in the connecting position of the upper heat dissipation structure and the lower heat dissipation structure and used for allowing a cooling medium to flow. In the application, the fluid cavity is arranged at the joint of the upper heat dissipation structure and the lower heat dissipation structure, so that the cooling medium can take away the heat of the heating element when flowing through the heating element on the mainboard along the fluid cavity, thereby realizing the heat dissipation of the heating element, and realizing the heat dissipation of the heating element through the combination of air cooling and cooling medium cooling. The heat dissipation efficiency of the industrial control computer is improved, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of computer heat dissipation, and more specifically, to an industrial control computer. Background Art

[0002] Industrial computers are computers specifically used in the field of industrial automation control. Compared with personal computers, industrial computers have higher reliability, stability, durability and anti-interference ability, and can operate stably for a long time in harsh industrial environments. Industrial computers have a variety of processors inside, such as CPU processors, graphics processors, etc. Industrial computers generate a lot of heat when used. In order to ensure the normal use of industrial computers, it is usually necessary to dissipate heat from industrial computers.

[0003] In the related technology, industrial control computers mainly rely on external metal fin heat sinks to export the heat of multiple internal processors, thereby dissipating the heat into the air to achieve the purpose of heat dissipation. As the performance and power consumption of industrial control computers continue to improve, metal fin heat sinks are gradually unable to meet the heat dissipation needs of industrial control computers, and the heat dissipation efficiency is low and the heat dissipation effect is poor. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide an industrial control computer to solve the technical problems of low heat dissipation efficiency and poor heat dissipation effect existing in the prior art.

[0005] To achieve the above purpose, the technical solution adopted by this application is: to provide an industrial control computer, including:

[0006] A box body, the box body having a containing cavity and an open end;

[0007] A main board, which is accommodated in the accommodating cavity and has a plurality of heating elements arranged on the main board;

[0008] The heat dissipation component covers the open end. The heat dissipation component includes an upper heat dissipation structure and a lower heat dissipation structure covering the upper heat dissipation structure. The lower heat dissipation structure is used for heat conduction with the heating element. A fluid cavity is provided at the connection between the upper heat dissipation structure and the lower heat dissipation structure, and the fluid cavity is used for the flow of cooling medium.

[0009] The industrial computer provided in the embodiment of the present application can dissipate the heat of the mainboard into the air by covering the heat dissipation component on the open end of the box body, and at the same time, a fluid cavity is provided at the fitting connection between the upper heat dissipation structure and the lower heat dissipation structure, so that when the cooling medium flows through the heating element on the mainboard along the fluid cavity, it can take away the heat of the heating element, thereby achieving heat dissipation of the heating element. The combination of air cooling and cooling medium cooling helps to improve the heat dissipation efficiency of the industrial computer and improve the heat dissipation effect.

[0010] In some embodiments, a first fluid groove is provided at the bottom of the upper heat dissipation structure, and a second fluid groove matching the first fluid groove is provided at the top of the lower heat dissipation structure. The first fluid groove and the second fluid groove enclose a fluid cavity.

[0011] In this embodiment, a fluid cavity is formed by enclosing the first fluid groove and the second fluid groove, so that the cooling medium can flow evenly in the fluid cavity and cover the various heating elements on the mainboard, thereby achieving uniform heat dissipation. At the same time, the cooling medium can directly contact the upper heat dissipation structure and the lower heat dissipation structure, and can quickly absorb and take away the heat of the heating element, which helps to improve the heat dissipation efficiency and heat dissipation effect.

[0012] In some embodiments, the lower heat dissipation structure includes a heat dissipation plate and a heat dissipation pipe arranged on the side of the heat dissipation plate away from the heating element, the heat dissipation pipe has a fluid cavity, and the upper heat dissipation structure is arranged on the heat dissipation plate and the heat dissipation pipe.

[0013] In this embodiment, the heat sink can export the heat generated by the heating element, and the cooling medium in the heat pipe can further export the heat from the heat sink, thereby achieving heat dissipation of the mainboard. The heat pipe can be flexibly arranged according to the space inside the industrial computer, and can make more effective use of limited space resources. At the same time, the heat pipe, as an independent cooling medium transmission pipeline, can be relatively easy to maintain and replace, and is convenient to operate.

[0014] In some embodiments, a first receiving groove is provided on one side of the upper heat dissipation structure, and a second receiving groove adapted to the first receiving groove is provided on one side of the lower heat dissipation structure. The first receiving groove and the second receiving groove are adapted to the heat dissipation pipe, and the heat dissipation pipe is accommodated between the first receiving groove and the second receiving groove.

[0015] By adopting the above technical solution, the first accommodating groove and the second accommodating groove can limit the installation position of the heat dissipation pipe, and can firmly fix the heat dissipation pipe between the upper heat dissipation structure and the lower heat dissipation structure, which can prevent the heat dissipation pipe from loosening during vibration or transportation, and help to improve the stability and reliability of the connection between the heat dissipation pipe and the upper heat dissipation structure and the lower heat dissipation structure.

[0016] In some embodiments, the heat dissipation pipe includes a heat dissipation portion arranged in multiple sections and a transmission portion connected to the heat dissipation portion, and the heat dissipation portion corresponds to the heating element.

[0017] In this embodiment, the heat dissipation portion corresponds to the heating element, and the heat dissipation tube can be flexibly arranged according to the actual heat dissipation requirements of the heating element. Regardless of the position and shape of the heating element, the bending angle and number of the heat dissipation portion can be adjusted to adapt to different layout requirements. The heat dissipation portion adopts a multi-section bending setting, which can increase the length of the heat dissipation portion, thereby increasing the heat dissipation area of ​​the heat dissipation tube, helping to improve the heat dissipation efficiency and heat dissipation effect of the heat dissipation tube. At the same time, the heat dissipation portion can be folded in a relatively small space, which helps to improve the compactness of the heat dissipation assembly.

[0018] In some embodiments, the heat dissipation assembly further includes a heat dissipation pump, the heat dissipation pump is connected to the upper heat dissipation structure, and the transmission part is connected to the heat dissipation pump.

[0019] In this embodiment, the heat pump can increase the circulation capacity of the cooling medium, can actively absorb heat from the heating element and quickly conduct it away, and helps to improve the heat dissipation efficiency and heat dissipation effect.

[0020] In some embodiments, the upper heat dissipation structure includes a plurality of heat dissipation fins, and the heat dissipation fins are arranged around a heat dissipation pump.

[0021] In this embodiment, a plurality of heat dissipation fins can increase the contact area with the air, and can effectively conduct and dissipate heat. The heat dissipation fins are arranged around the heat dissipation pump, and can improve the compactness of the structure of the heat dissipation component.

[0022] In some embodiments, the heat dissipation assembly further includes a heat dissipation fan, and the heat dissipation fan and the heat dissipation pump are stacked.

[0023] By adopting the above technical solution, the cooling fan can enhance air flow, help increase the speed of heat conduction and dissipation, and increase the heat dissipation capacity of the cooling component. The stacking of the cooling fan and the cooling pump can improve the structural compactness of the cooling component.

[0024] In some embodiments, the heat dissipation assembly further includes a hood, which covers the heat dissipation fan.

[0025] By adopting the above technical solution, the hood can improve the safety of the heat dissipation component, preventing users from being injured by contact with a high-speed rotating fan when there is no protection from the hood, allowing users to use industrial computers more safely and reducing potential safety hazards. At the same time, the hood covers the cooling fan to protect the system from dust and pollution, preventing dust and pollutants from accumulating on the cooling fan, reducing heat dissipation efficiency, and even damaging the system, which helps to improve the reliability and stability of the system.

[0026] In some embodiments, the industrial computer further includes a heat conductor, which is disposed between the heating element and the lower heat dissipation structure.

[0027] In this embodiment, the heat conducting member can effectively conduct the heat generated by the heating element to the heat dissipation component, which can speed up the heat conduction speed and help improve the heat dissipation efficiency.

[0028] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is an exploded schematic diagram of an industrial control computer provided in one embodiment of the present application;

[0031] Figure 2 It is an assembly diagram of an industrial control computer provided by an embodiment of the present application;

[0032] Figure 3 is a partial cross-sectional schematic diagram of an industrial control computer provided by an embodiment of the present application;

[0033] Figure 4 is a partial cross-sectional schematic diagram of an industrial control computer provided by another embodiment of the present application;

[0034] Figure 5 is a partial schematic diagram of a heat dissipation assembly provided in one embodiment of the present application;

[0035] Figure 6 It is a partial cross-sectional schematic diagram of an industrial control computer provided in yet another embodiment of the present application.

[0036] Among them, the reference numerals in the figure are:

[0037] 100, industrial computer; 10, housing; 11, accommodating cavity; 12, opening end; 20, mainboard; 30, heat dissipation assembly; 31, upper heat dissipation structure; 311, first accommodating groove; 312, heat dissipation fins; 32, lower heat dissipation structure; 321, heat dissipation plate; 322, heat dissipation pipe; 3221, heat dissipation part; 3222, transmission part; 323, second accommodating groove; 33, heat dissipation pump; 34, heat dissipation fan; 35, machine cover; 36, heat dissipation hose; 37, heat dissipation joint; 40, heat conducting member; 50, pressing member. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0039] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] See also Figure 1 and Figure 2 The embodiment of the present application provides an industrial control computer 100 , including a housing 10 , a mainboard 20 and a heat dissipation assembly 30 .

[0043] The box body 10 has a receiving cavity 11 and an open end 12 .

[0044] The housing 10 may be a structure with a cavity such as a shell or a box. One end of the housing 10 is open, and the open end is an open end 12. The accommodating cavity 11 is used to accommodate the mainboard 20. The mainboard 20 can be placed in the accommodating cavity 11 from the open end 12, and the mainboard 20 can also be taken out of the accommodating cavity 11 from the open end 12.

[0045] The mainboard 20 is accommodated in the accommodating cavity 11 , and a plurality of heating elements are disposed on the mainboard 20 .

[0046] The mainboard 20 may be a circuit board on which a plurality of hardware components for connecting and supporting the computer are integrated. The heat generating element is a hardware component that generates heat among the plurality of hardware components, for example, an input / output control chip, a CPU processor, and the like.

[0047] The mainboard 20 is fixedly connected to the accommodating cavity 11 of the box body 10 , and the heating element on the mainboard 20 faces the opening end 12 .

[0048] The heat dissipation assembly 30 covers the open end 12, and the heat dissipation assembly 30 includes an upper heat dissipation structure 31 and a lower heat dissipation structure 32 covering the upper heat dissipation structure 31. The lower heat dissipation structure 32 is used for heat conduction with the heating element. A fluid cavity is provided at the connection between the upper heat dissipation structure 31 and the lower heat dissipation structure 32, and the fluid cavity is used for the flow of cooling medium.

[0049] The heat dissipation assembly 30 is used to dissipate heat from the heating element.

[0050] The lower heat dissipation structure 32 may be in a plate-like or sheet-like structure. The lower heat dissipation structure 32 has good thermal conductivity. The lower heat dissipation structure 32 is fixedly connected to the open end 12. The lower heat dissipation structure 32 may be directly connected to the heating element on the mainboard 20 to conduct the heat of the heating element. The lower heat dissipation structure 32 may also be connected to the heating element through a heat conduction structure connected to the heating element. The heat generated by the heating element is transferred to the lower heat dissipation structure 32 through the heat conduction structure, and then the heat is conducted out by the lower heat dissipation structure 32.

[0051] The upper heat dissipation structure 31 includes a substrate, on which a plurality of sheet-shaped or columnar heat dissipation structures are connected. The upper heat dissipation structure 31 can conduct the heat of the lower heat dissipation structure 32 to the air.

[0052] For example, a plurality of protrusions for heat dissipation are arranged at intervals on the substrate.

[0053] For example, a plurality of heat sinks for heat dissipation are arranged at intervals on the substrate.

[0054] The cooling medium is a medium used to reduce heat. The cooling medium can be a gaseous cooling medium, such as air, nitrogen, etc. The cooling medium can be a liquid cooling medium, such as water, coolant, cooling oil, etc. The cooling medium can also be a solid-liquid mixed cooling medium, such as a mixture of solid particles such as graphite, copper powder, silica gel, etc. and a liquid medium.

[0055] The upper heat dissipation structure 31 covers the lower heat dissipation structure 32 . A fluid cavity is provided at the connection between the upper heat dissipation structure 31 and the lower heat dissipation structure 32 . The fluid cavity is used for cooling medium to flow.

[0056] During the heat dissipation process, the heat generated by the heating element is transferred to the lower heat dissipation structure 32, the cooling medium in the fluid cavity transfers the heat to the upper heat dissipation structure 31, and the upper heat dissipation structure 31 transfers the heat to the air through the heat dissipation structure connected thereto.

[0057] The industrial computer 100 provided in the embodiment of the present application can dissipate the heat of the mainboard 20 into the air by covering the heat dissipation component 30 on the open end 12 of the box body 10. At the same time, a fluid cavity is provided at the fitting connection between the upper heat dissipation structure 31 and the lower heat dissipation structure 32, so that when the cooling medium flows along the fluid cavity through the heating element on the mainboard 20, it can take away the heat of the heating element, thereby achieving heat dissipation of the heating element. The combination of air cooling and cooling medium cooling helps to improve the heat dissipation efficiency of the industrial computer 100 and improve the heat dissipation effect.

[0058] In some embodiments, a first fluid groove is provided at the bottom of the upper heat dissipation structure 31, and a second fluid groove matching the first fluid groove is provided at the top of the lower heat dissipation structure 32. The first fluid groove and the second fluid groove enclose a fluid cavity.

[0059] The bottom of the upper heat dissipation structure 31 is a side of the upper heat dissipation structure 31 close to the lower heat dissipation structure 32 , and the top of the lower heat dissipation structure 32 is a side of the lower heat dissipation structure 32 close to the upper heat dissipation structure 31 .

[0060] The first fluid groove is a groove-shaped structure formed by the bottom of the upper heat dissipation structure 31 being recessed inward.

[0061] The second fluid groove is a groove-shaped structure formed by the bottom of the lower heat dissipation structure 32 being recessed inward.

[0062] The shape and size of the first fluid groove are adapted to the shape and size of the second fluid groove. When the upper heat dissipation structure 31 covers the lower heat dissipation structure 32, the first fluid groove is aligned with the second fluid groove. The first fluid groove and the second fluid groove are enclosed to form a fluid cavity, and the cooling medium flows in the enclosed fluid cavity.

[0063] The bottom of the upper heat dissipation structure 31 and the top of the lower heat dissipation structure 32 can be respectively provided with mutually matching recesses and protrusions to enhance the connection accuracy between the first fluid groove and the second fluid groove, avoid position deviation between the first fluid groove and the second fluid groove, improve the sealing between the upper heat dissipation structure 31 and the lower heat dissipation structure 32, and prevent leakage of the cooling medium.

[0064] In this embodiment, a fluid cavity is formed by enclosing the first fluid groove and the second fluid groove, so that the cooling medium can flow evenly in the fluid cavity and cover the various heating elements on the mainboard, thereby achieving uniform heat dissipation. At the same time, the cooling medium can directly contact the upper heat dissipation structure 31 and the lower heat dissipation structure 32, and can quickly absorb and take away the heat of the heating elements, which helps to improve the heat dissipation efficiency and heat dissipation effect.

[0065] like Figure 1 and Figure 3 As shown, in some embodiments, the lower heat dissipation structure 32 includes a heat dissipation plate 321 and a heat dissipation pipe 322 arranged on the side of the heat dissipation plate 321 away from the heating element, the heat dissipation pipe 322 has a fluid cavity, and the upper heat dissipation structure 31 is arranged on the heat dissipation plate 321 and the heat dissipation pipe 322.

[0066] The heat sink 321 is a plate-shaped, block-shaped or other structure. The heat sink 321 has good thermal conductivity and can absorb the heat emitted by the heating element. The heat sink 321 can be directly connected to the heating element to conduct the heat of the heating element. The heat sink 321 can also be connected to the heating element through a heat conduction structure connected to the heating element, and the heat generated by the heating element is transferred to the heat sink 321 through the heat conduction structure.

[0067] One side of the heat sink 321 is connected to the heating element, and the other end of the heat sink 321 is connected to the heat pipe 322 and the upper heat sink structure 31. The heat sink 321 absorbs the heat generated by the heating element and transfers the heat to the heat pipe 322 and the upper heat sink structure 31.

[0068] The heat dissipation pipe 322 is a tubular structure. The heat dissipation pipe 322 is distributed on the side of the heat dissipation plate 321 away from the heating element. The heat dissipation pipe 322 has a fluid cavity, and the cooling medium flows in the heat dissipation pipe 322. The heat dissipation pipe 322 absorbs the heat generated by the heating element through the cooling medium flowing inside it and takes the heat away.

[0069] The position of the heat pipe 322 on the heat sink 321 can be arranged according to the position of the heating element, and the number of the heat pipe 322 can be increased at the position corresponding to the heating element, thereby increasing the heat dissipation area of ​​the heat pipe 322 at this position, improving the heat dissipation effect of the heat pipe 322, and promptly and quickly dissipating the heat generated by the heating element, thereby ensuring the normal operation of each hardware component on the mainboard 20.

[0070] During the heat dissipation process, the heat generated by the heating element is transferred to the heat dissipation plate 321, and the heat dissipation plate 321 transfers the heat to the heat dissipation pipe 322 and the upper heat dissipation structure 31. The heat dissipation pipe 322 takes away the heat through the cooling medium flowing inside it, and the heat transferred to the upper heat dissipation structure 31 is dissipated into the air through the heat dissipation structure arranged thereon.

[0071] In this embodiment, the heat sink 321 can export the heat generated by the heating element, and the cooling medium in the heat sink 322 can further export the heat of the heat sink 321, thereby realizing the heat dissipation of the mainboard 20. The heat sink 322 can be flexibly arranged according to the space inside the industrial control computer 100, and can make more effective use of limited space resources. At the same time, the heat sink 322 serves as an independent cooling medium transmission pipeline, which can be relatively easy to maintain and replace, and is convenient to operate.

[0072] like Figure 1 , Figures 3 to 5 As shown, in some embodiments, a first receiving groove 311 is provided on one side of the upper heat dissipation structure 31, and a second receiving groove 323 adapted to the first receiving groove 311 is provided on one side of the lower heat dissipation structure 32. The first receiving groove 311 and the second receiving groove 323 are adapted to the heat dissipation pipe 322, and the heat dissipation pipe 322 is accommodated between the first receiving groove 311 and the second receiving groove 323.

[0073] The first accommodating groove 311 is a groove-shaped structure formed by the upper heat dissipation structure 31 being recessed inward.

[0074] The second accommodating groove 323 is a groove-shaped structure formed by the lower heat dissipation structure 32 being recessed inward.

[0075] When the upper heat dissipation structure 31 covers the lower heat dissipation structure 32, the first receiving groove 311 and the second receiving groove 323 are aligned, and the first receiving groove 311 and the second receiving groove 323 enclose a cavity structure for accommodating the heat dissipation pipe 322. The shape and size of the first receiving groove 311 and the shape and size of the second receiving groove 323 are respectively adapted to the shape and size of the heat dissipation pipe 322.

[0076] For example, the heat dissipation tube 322 is a circular tube, the first receiving groove 311 is a circular groove, and the diameter of the circular groove is the same as the outer diameter of the heat dissipation tube 322 , and the second receiving groove 323 is a square groove, and the groove width of the square groove is the same as the outer diameter of the heat dissipation tube 322 .

[0077] Optionally, the size of the first accommodating groove 311 and the size of the second accommodating groove 323 may be slightly larger than the outer diameter of the heat dissipation pipe 322 to facilitate installation and removal of the heat dissipation pipe 322 .

[0078] During installation, the lower heat dissipation structure 32 can be first covered on the open end 12, and then the heat dissipation tube 322 can be installed in the first receiving groove 311, so that the surface of the heat dissipation tube 322 is in contact with the groove wall of the first receiving groove 311, and then the upper heat dissipation structure 31 can be covered on the lower heat dissipation structure 32, and the second receiving groove 323 can be aligned with the first receiving groove 311, and the heat dissipation tube 322 can be accommodated in the cavity structure formed by the first receiving groove 311 and the second receiving groove 323.

[0079] During the heat dissipation process, the heat generated by the heating element can be transferred to the heat dissipation pipe 322 through the first receiving groove 311, and then transferred to the second receiving groove 323 through the heat dissipation pipe 322, and dissipated into the air through the heat dissipation structure of the upper heat dissipation structure 31, or directly taken away by the cooling medium flowing in the heat dissipation pipe 322.

[0080] By adopting the above technical solution, the first accommodating groove 311 and the second accommodating groove 323 can limit the installation position of the heat dissipation pipe 322, and can firmly fix the heat dissipation pipe 322 between the upper heat dissipation structure 31 and the lower heat dissipation structure 32, so as to prevent the heat dissipation pipe 322 from loosening during vibration or transportation, and help to improve the stability and reliability of the connection between the heat dissipation pipe 322 and the upper heat dissipation structure 31 and the lower heat dissipation structure 32.

[0081] like Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments, the heat dissipation pipe 322 includes a heat dissipation portion 3221 bent in multiple sections and a transmission portion 3222 connected to the heat dissipation portion 3221 , and the heat dissipation portion 3221 corresponds to the heating element.

[0082] The heat dissipation part 3221 is a part of the heat dissipation tube 322 that is bent in multiple sections. The heat dissipation part 3221 corresponds to the heating element, and the position and number of the heat dissipation part 3221 can be flexibly set according to the heat dissipation requirements of the heating element.

[0083] For example, the heat dissipation portion 3221 is located above the heating element. During the heat dissipation process, the heat generated by the heating element is transferred to the heat dissipation plate 321, and then the cooling medium in the heat dissipation portion 3221 above the heating element removes the heat from the heat dissipation plate 321, thereby achieving heat dissipation of the heating element.

[0084] For a heating element that generates a lot of heat and has a large heat dissipation requirement, the number of pipes of the heat dissipation part 3221 provided at the corresponding position can be increased accordingly to meet the heat dissipation requirement of the heating element. For a heating element that generates a little heat and has a small heat dissipation requirement, the number of pipes of the heat dissipation part 3221 provided at the corresponding position can be reduced accordingly to reduce the space resources occupied by the heat dissipation part 3221 and improve the utilization rate of the heat dissipation pipe 322.

[0085] The transmission part 3222 is a portion of the heat dissipation pipe 322 that is arranged in a straight line. The transmission part 3222 is used to transmit the cooling medium to the heat dissipation part 3221 to absorb heat, and to guide the cooling medium that has absorbed heat out of the heat dissipation part 3221.

[0086] In this embodiment, the heat dissipation portion 3221 corresponds to the heating element, and the heat dissipation tube 322 can be flexibly arranged according to the actual heat dissipation requirements of the heating element. Regardless of the position and shape of the heating element, the bending angle and number of the heat dissipation portion 3221 can be adjusted to adapt to different layout requirements. The heat dissipation portion 3221 adopts a multi-section bending setting, which can increase the length of the heat dissipation portion 3221, thereby increasing the heat dissipation area of ​​the heat dissipation tube 322, which helps to improve the heat dissipation efficiency and heat dissipation effect of the heat dissipation tube 322. At the same time, the heat dissipation portion 3221 can be folded in a relatively small space, which helps to improve the compactness of the heat dissipation assembly 30.

[0087] like Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments, the heat dissipation assembly 30 further includes a heat dissipation pump 33 , the heat dissipation pump 33 is connected to the upper heat dissipation structure 31 , and the transmission portion 3222 is connected to the heat dissipation pump 33 .

[0088] The heat dissipation pump 33 is a pump structure capable of conveying cooling medium and driving the cooling medium in the heat dissipation pipe 322 to circulate.

[0089] The heat pump 33 is fixedly connected to the upper heat dissipation structure 31, one end of the transmission part 3222 is connected to the heat pump 33, and the other end of the transmission part 3222 is connected to the heat dissipation part 3221. When the heat pump 33 is started, the cooling medium flows along the heat pipe 322 through the transmission part 3222 to the heat dissipation part 3221 under the action of the heat pump 33, then flows out from the heat dissipation part 3221 to the transmission part 3222, and finally flows back to the heat pump 33, and the cycle repeats.

[0090] During the heat dissipation process, the heat of the heating element is transferred to the heat sink 321, and the heat pump 33 pumps the cooling medium out to the transmission part 3222, flows into the heat dissipation part 3221 through the transmission part 3222, absorbs heat in the heat dissipation part 3221 and flows to the heat pump 33 through the transmission part 3222, so as to achieve the heat dissipation of the heating element.

[0091] Alternatively, if Figure 6 As shown, the transmission part 3222 is connected to the heat pump 33 through the heat dissipation hose 36 and the heat dissipation elbow 37. The cooling medium flows into the heat dissipation hose 36 from the outlet end of the heat pump 33, then enters the transmission part 3222 through the heat dissipation elbow 37, flows into the heat dissipation part 3221 through the transmission part 3222, and then flows into the transmission part 3222. Then, it flows through the heat dissipation elbow 37 and the heat dissipation hose 36 on the inlet side of the heat pump 33, and returns to the heat pump 33, thus circulating.

[0092] Optionally, the heat dissipation hose 36 is sealedly connected to the heat dissipation pump 33 via a sealed pagoda joint.

[0093] In this embodiment, the heat pump 33 can increase the circulation capacity of the cooling medium, actively absorb heat from the heating element and quickly conduct it away, which helps to improve the heat dissipation efficiency and heat dissipation effect of the heat dissipation component 30.

[0094] like Figures 1 to 4 As shown, in some embodiments, the upper heat dissipation structure 31 includes a plurality of heat dissipation fins 312 , and the heat dissipation fins 312 are disposed around the heat pump 33 .

[0095] The heat dissipation fins 312 may be a sheet-like structure and are used to transfer heat to the air.

[0096] During installation, a mounting position for the heat pump 33 can be reserved on the upper heat dissipation structure 31 , and no heat dissipation fins 312 are provided at the reserved mounting position. The heat pump 33 is fixedly connected to the reserved mounting position so that the heat dissipation fins 312 are arranged around the heat pump 33 .

[0097] When dissipating heat, the industrial computer 100 can transfer the heat generated by the heating element to the air through the heat dissipation fins 312 , and at the same time, the heat generated by the heating element can be taken away by the cooling medium transported by the heat pump 33 .

[0098] In this embodiment, the plurality of heat dissipation fins 312 can increase the contact area with the air, and can effectively conduct and dissipate heat. The heat dissipation fins 312 are arranged around the heat pump 33, and can improve the compactness of the structure of the heat dissipation component.

[0099] like Figure 4 As shown, in some embodiments, the heat dissipation assembly further includes a heat dissipation fan 34 , and the heat dissipation fan 34 and the heat dissipation pump 33 are stacked.

[0100] The cooling fan 34 is used to enhance the air flow at the location of the cooling pump 33 to cool the cooling pump 33 and the cooling medium in the cooling pump 33 .

[0101] The heat dissipation fan 34 is connected above the heat dissipation pump 33 . Specifically, the heat dissipation fan 34 is detachably connected to a side of the heat dissipation pump 33 that is away from the upper heat dissipation structure 31 .

[0102] During the heat dissipation process, the cooling medium absorbs the heat generated by the heating element at the heat dissipation part 3221, and flows back to the heat dissipation pump 33 through the transmission part 3222. The cooling fan 34 blows the cooling medium with a higher temperature to reduce the temperature of the cooling medium, so that the cooling medium that flows into the heat dissipation part 3221 again is a cooling medium with a lower temperature, thereby improving the heat absorption effect of the cooling medium and improving the heat dissipation effect of the heat dissipation component.

[0103] By adopting the above technical solution, the cooling fan 34 can enhance air flow, help increase the speed of heat conduction and dissipation, and increase the heat dissipation capacity of the cooling component 30. The cooling fan 34 and the cooling pump 33 are stacked to improve the structural compactness of the cooling component 30.

[0104] like Figure 1 and Figure 4 As shown, in some embodiments, the heat dissipation assembly further includes a hood 35 , and the hood 35 covers the heat dissipation fan 34 .

[0105] The cover 35 is a structure such as a shell, a box, etc. One end of the cover 35 is open, and a plurality of meshes are provided on its surface.

[0106] One end of the opening of the cover 35 is snapped on and covers the heat dissipation fan 34 , accommodating the heat dissipation fan 34 therein, and air enters the heat dissipation fan 34 or is exhausted from the heat dissipation fan 34 through the mesh holes on the cover 35 .

[0107] By adopting the above-mentioned technical solution, the hood 35 can improve the safety of the heat dissipation assembly 30, and prevent the user from being injured due to contact with the high-speed rotating heat dissipation fan 34 when there is no protection of the hood 35, so that the user can use the industrial control computer 100 more safely and reduce potential safety hazards. At the same time, the hood 35 covers the heat dissipation fan 34, which can protect the system from dust and pollution, and prevent dust and pollutants from accumulating on the heat dissipation fan 34, reducing the heat dissipation efficiency, and even damaging the system, which helps to improve the reliability and stability of the system.

[0108] like Figure 1 and Figure 4 As shown, in some embodiments, the industrial computer 100 further includes a heat conductor 40 , which is disposed between the heating element and the lower heat dissipation structure 32 .

[0109] The heat conducting member 40 may be made of a heat conducting material, such as copper, aluminum, ceramic, heat conducting glue, heat conducting silicone grease, etc.

[0110] The shape and size of the heat conducting member 40 are adapted to the heating element. For example, if the heating element is rectangular, the heat conducting member 40 can be a rectangular structure that can cover the heating element.

[0111] The number and position of the heat conducting members 40 can be flexibly set according to the number, position and heat dissipation duration of the heating elements.

[0112] The heat conducting member 40 is disposed between the heating element and the lower heat dissipation structure 32. One side of the heat conducting member 40 may be attached to the heating element, and the other side of the heat conducting member 40 may be attached to the lower heat dissipation structure 32.

[0113] Alternatively, if Figure 1As shown, in order to prevent a gap from appearing between the CPU processor and the lower heat dissipation structure 32 due to external forces such as vibration, thereby affecting the heat dissipation of the CPU processor, a clamping member 50 can be provided between the CPU processor and the lower heat dissipation structure 32. The clamping member 50 can be used to clamp the CPU processor so that the heating surface of the CPU processor fits tightly with the lower heat dissipation structure 32, thereby ensuring the heat dissipation of the CPU processor.

[0114] In this embodiment, the heat conducting member 40 can effectively conduct the heat generated by the heating element to the heat dissipation assembly 30, which can speed up the heat conduction speed and help improve the heat dissipation efficiency.

[0115] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An industrial control computer, characterized in that: include: A box body, the box body having a containing cavity and an open end; A mainboard, the mainboard is accommodated in the accommodating cavity, and a plurality of heating elements are arranged on the mainboard; A heat dissipation component, the heat dissipation component covers the open end, the heat dissipation component includes an upper heat dissipation structure and a lower heat dissipation structure covering the upper heat dissipation structure, the lower heat dissipation structure is used for heat conduction with the heating element, and a fluid cavity is provided at the connection between the upper heat dissipation structure and the lower heat dissipation structure, and the fluid cavity is used for the flow of cooling medium.

2. The industrial control computer according to claim 1, characterized in that: A first fluid groove is provided at the bottom of the upper heat dissipation structure, and a second fluid groove matched with the first fluid groove is provided at the top of the lower heat dissipation structure. The first fluid groove and the second fluid groove enclose the fluid cavity.

3. The industrial control computer according to claim 1, characterized in that: The lower heat dissipation structure comprises a heat dissipation plate and a heat dissipation pipe arranged on a side of the heat dissipation plate away from the heating element, the heat dissipation pipe has the fluid cavity, and the upper heat dissipation structure is arranged on the heat dissipation plate and the heat dissipation pipe.

4. The industrial control computer according to claim 3, characterized in that: A first accommodating groove is provided on one side of the upper heat dissipation structure, and a second accommodating groove matched with the first accommodating groove is provided on one side of the lower heat dissipation structure. The first accommodating groove and the second accommodating groove are matched with the heat dissipation pipe, and the heat dissipation pipe is accommodated between the first accommodating groove and the second accommodating groove.

5. The industrial control computer according to claim 4, characterized in that: The heat dissipation pipe comprises a heat dissipation portion arranged in multiple sections and a transmission portion connected to the heat dissipation portion, and the heat dissipation portion corresponds to the heating element.

6. The industrial control computer according to claim 5, characterized in that: The heat dissipation assembly further includes a heat dissipation pump, the heat dissipation pump is connected to the upper heat dissipation structure, and the transmission part is connected to the heat dissipation pump.

7. The industrial control computer according to claim 6, characterized in that: The upper heat dissipation structure includes a plurality of heat dissipation fins, and the heat dissipation fins are arranged around the heat dissipation pump.

8. The industrial control computer according to claim 7, characterized in that: The heat dissipation assembly further comprises a heat dissipation fan, and the heat dissipation fan and the heat dissipation pump are stacked.

9. The industrial control computer according to claim 8, characterized in that: The heat dissipation assembly also includes a hood, and the hood covers the heat dissipation fan.

10. The industrial control computer according to any one of claims 1 to 9, characterized in that: The industrial computer further comprises a heat conducting member, and the heat conducting member is arranged between the heating element and the lower heat dissipation structure.

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