Efficient heat dissipation structure of industrial control host

Abstract

The utility model relates to the technical field of heat dissipation of industrial control hosts, and discloses an efficient heat dissipation structure of an industrial control host. Comprising a shell, a first heat dissipation piece and heat dissipation fins. The shell is mounted on the mainboard; the first heat dissipation piece is arranged on the inner side of the shell and corresponds to the position of a main heat source on the mainboard, and the first heat dissipation piece makes contact with the main heat source on the mainboard; the heat dissipation fins are arranged on the outer side of the shell and make contact with outside air, and heat of the first heat dissipation piece can be transmitted into the heat dissipation fins. After the shell is installed on the main board, heat of the main board can be guided into the heat dissipation fins through the first heat dissipation piece and dissipated to outside air through the heat dissipation fins. After the shell is installed on the main board, heat of the main board can be guided into the heat dissipation fins through the first heat dissipation piece and dissipated to outside air through the heat dissipation fins. Through the arrangement, the heat dissipation effect of the mainboard can be improved, so that the normal operation temperature of the mainboard is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of an industrial control host, in particular to a high-efficiency heat dissipation structure of an industrial control host. Background Art

[0002] As the degree of industrial control automation increases, the popularity and usage of industrial control hosts are also increasing. However, in daily industrial environments, the heat dissipation of industrial control hosts has become a pain point. The commonly used heat dissipation method is passive heat dissipation, such as adding a fan to the industrial control host to assist its heat dissipation. However, the passive heat dissipation method of adding a fan to the industrial control host will cause the size of the whole machine to be too large, the power consumption of the whole machine to be too high, and the passive heat dissipation efficiency to be low. Utility Model Content

[0003] The embodiment of the utility model aims to provide an efficient heat dissipation structure of an industrial control host to solve the technical problems in the prior art that when using an injection pump for injection, if the infusion tube is long, the liquid in the middle part of the infusion tube is difficult to be pushed, and the middle part of the infusion tube is prone to shaking during infusion.

[0004] The utility model embodiment solves its technical problems by adopting the following technical solutions:

[0005] Provided is an efficient heat dissipation structure for an industrial control host, comprising:

[0006] A housing, wherein the housing is mounted on the mainboard;

[0007] A first heat sink is disposed on the inner side of the housing and corresponds to the position of a main heat source on the mainboard, and the first heat sink is in contact with the main heat source on the mainboard;

[0008] Heat dissipation fins, which are arranged on the outside of the housing and in contact with the outside air, and the heat of the first heat dissipation element can be transferred to the heat dissipation fins;

[0009] When the housing is mounted on the mainboard, the heat of the mainboard can be introduced into the heat dissipation fins through the first heat dissipation element and dissipated to the outside air through the heat dissipation fins.

[0010] In some embodiments, a groove is formed on the first heat dissipation element, the position of the groove corresponds to the position of the mainboard, and the mainboard can be embedded in the groove.

[0011] In some embodiments, the first heat sink is a copper heat conductive block.

[0012] In some embodiments, a second heat sink is also provided on the inner side of the outer shell, and the second heat sink is located on both sides of the first heat sink. The position of the second heat sink corresponds to the position of the auxiliary heat source of the mainboard, and the second heat sink is in contact with the auxiliary heat source of the mainboard.

[0013] In some embodiments, the second heat sink is connected to the heat sink fins, and the heat of the second heat sink can be transferred to the heat sink fins.

[0014] In some embodiments, the second heat sink is a copper heat conductive block.

[0015] In some embodiments, ventilation holes are provided on both sides of the shell, and the ventilation holes on both sides and the interior of the shell form an air duct.

[0016] In some embodiments, a plurality of ventilation holes are provided, and the plurality of ventilation holes are sequentially arranged on both sides of the shell.

[0017] Compared with the prior art, the efficient heat dissipation structure of the industrial control host provided in the embodiment of the utility model includes a shell, a first heat sink and heat sink fins. The shell is installed on the mainboard; the first heat sink is arranged on the inner side of the shell and corresponds to the position of the main heat source on the mainboard, and the first heat sink is in contact with the main heat source on the mainboard; the heat sink fins are arranged on the outer side of the shell and in contact with the outside air, and the heat of the first heat sink can be transferred to the heat sink fins; wherein, when the shell is installed on the mainboard, the heat of the mainboard can be introduced into the heat sink fins through the first heat sink and dissipated to the outside air through the heat sink fins. When the shell is installed on the mainboard, the heat of the mainboard can be introduced into the heat sink fins through the first heat sink and dissipated to the outside air through the heat sink fins. Through such a setting, the heat dissipation effect of the mainboard can be improved to ensure the normal operating temperature of the mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 It is a structural schematic diagram of a high-efficiency heat dissipation structure of an industrial control host provided by one embodiment of the utility model.

[0020] Reference numerals:

[0021] 100. High-efficiency heat dissipation structure of industrial control host; 10. Housing; 20. First heat dissipation element; 21. Groove; 30. Heat dissipation fins; 40. Second heat dissipation element; 50. Ventilation holes. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "connecting" another element, it can be directly on another element, or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "upper end", "lower end", "top" and "bottom" used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0023] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0024] In the embodiment of the utility model, the efficient heat dissipation structure of the industrial control host can be used to transport the medicine liquid.

[0025] Combine the following Figure 1 , the efficient heat dissipation structure of the industrial control host provided in the embodiment of the present application is described in detail through specific embodiments.

[0026] Please also read Figure 1 , Figure 1 It is a structural schematic diagram of the efficient heat dissipation structure of the industrial control host provided by one of the embodiments of the present invention. The efficient heat dissipation structure 100 of the industrial control host provided by one of the embodiments of the present invention is applied to the mainboard, and includes a shell 10, a first heat sink 20 and heat sink fins. The shell 10 is installed on the mainboard; the first heat sink 20 is arranged on the inner side of the shell 10 and corresponds to the position of the main heat source on the mainboard, and the first heat sink 20 is in contact with the main heat source on the mainboard; the heat sink fins 30 are arranged on the outer side of the shell 10 and in contact with the outside air, and the heat of the first heat sink 20 can be transferred to the heat sink fins 30; wherein, when the shell 10 is installed on the mainboard, the heat of the mainboard can be introduced into the heat sink fins 30 through the first heat sink 20 and dissipated to the outside air through the heat sink fins 30.

[0027] The housing 10 is mounted on the mainboard to ensure close contact. The first heat sink 20 is arranged on the inner side of the housing 10, corresponding to the position of the main heat source (such as a processor) on the mainboard, and is in contact with the main heat source. In this way, the first heat sink 20 can effectively conduct the heat generated by the main heat source. The heat sink fins 30 are arranged on the outer side of the housing 10 and are in contact with the outside air. When the main heat source on the mainboard transfers heat to the first heat sink 20, the heat in the first heat sink 20 can be dissipated by transferring to the heat sink fins 30. Specifically, when the housing 10 is mounted on the mainboard, the heat of the mainboard can be introduced into the heat sink fins 30 via the first heat sink 20, and dissipated to the outside air through the heat sink fins 30. Through such a setting, the heat dissipation effect of the mainboard can be improved to ensure the normal operating temperature of the mainboard.

[0028] The housing 10 can be mounted on the mainboard, so that the first heat sink 20 on the housing 10 can contact the mainboard, thereby transferring the heat generated by the operation of the mainboard to the first heat sink 20 .

[0029] In some embodiments, a groove 21 is formed on the first heat sink 20 . The position of the groove 21 corresponds to the position of the mainboard, and the mainboard can be embedded in the groove 21 .

[0030] Among them, a groove 21 is provided on the first heat sink 20, and the groove 21 corresponds to the position of the main heat source on the main board. When the housing 10 and the main board are connected to each other, the first heat sink 20 on the housing 10 is in contact with the main board. And because the groove 21 is provided on the first heat sink 20, the main heat source on the main board can be embedded in the groove 21. Thereby, the contact area of ​​the first heat sink 20 with the main heat source is not only the surface of the main heat source, but the side of the main heat source is in contact with the first heat sink 20. Through such a setting, the contact area between the first heat sink 20 and the main heat source of the main board can be increased, so that the heat can be transferred from the main heat source to the first heat sink 20 more quickly and effectively, and then dissipated to the outside air through the heat sink fins 30. The heat dissipation effect can be further improved, the temperature of the main board can be effectively reduced, and its normal operation can be ensured.

[0031] In some embodiments, the first heat sink 20 is a copper heat conductive block. Copper has a very high thermal conductivity of about 398W / m·K, which means that copper can conduct heat more effectively. The high thermal conductivity can quickly import the heat generated by the main heat source of the motherboard into the first heat sink 20, and then import it into the heat sink fins 30 through the first heat sink 20. In addition, copper has good plasticity and is easy to process into heat sinks of various shapes and sizes. Thus, a groove 21 can be provided on the first heat sink 20 made of copper for contact with the main heat source of the motherboard. At the same time, copper also has high corrosion resistance and can maintain stability under various environmental conditions. Moreover, copper is a very common and widely used metal material, which is relatively economical, so choosing a copper heat conductive block can control costs while ensuring the heat dissipation effect.

[0032] In some embodiments, a second heat sink 40 is also provided on the inner side of the outer shell 10. The second heat sink 40 is located on both sides of the first heat sink 20. The position of the second heat sink 40 corresponds to the position of the auxiliary heat source of the mainboard, and the second heat sink 40 is in contact with the auxiliary heat source of the mainboard.

[0033] The second heat sink 40 is located on both sides of the first heat sink 20, and its position corresponds to the auxiliary heat source of the mainboard to increase the heat dissipation effect of the auxiliary heat source part. By setting the second heat sink 40 in contact with the auxiliary heat source of the mainboard, the heat generated by the auxiliary heat source can be effectively transferred to the heat dissipation structure. The second heat sink 40 usually has similar materials and thermal conductivity as the first heat sink 20, such as a copper heat conductive block. In this way, the heat of the main heat source and the auxiliary heat source on the mainboard can be effectively transferred to the heat dissipation structure, thereby improving the overall heat dissipation effect. By comprehensively utilizing the first heat sink 20 and the second heat sink 40, the industrial control host can dissipate heat more effectively, ensure that the operating temperature of the mainboard and the auxiliary board is within the normal range, and improve the stability and reliability of the system.

[0034] In some embodiments, the second heat sink 40 is connected to the heat sink fins 30, and the heat of the second heat sink 40 can be transferred to the heat sink fins 30. By connecting the second heat sink 40 and the heat sink fins 30 together, the heat can be transferred from the second heat sink 40 to the heat sink fins 30 by conduction. The heat sink fins 30 are arranged on the outside of the housing 10 so as to be in contact with the outside air, and the heat in the second heat sink 40 can be dissipated to the outside air through the heat sink fins 30.

[0035] In some embodiments, the second heat sink 40 is a copper heat conductive block.

[0036] Copper has a very high thermal conductivity of about 398W / m·K, which means that copper can conduct heat more effectively. The high thermal conductivity can quickly import the heat generated by the auxiliary heat source of the mainboard into the second heat sink 40, and then import it into the heat sink fins 30 through the second heat sink 40. In addition, copper has good plasticity and is easy to process into heat sinks of various shapes and sizes. Therefore, a groove 21 can be provided on the second heat sink 40 made of copper for contact with the auxiliary heat source of the mainboard. At the same time, copper also has high corrosion resistance and can maintain stability under various environmental conditions. Moreover, copper is a very common and widely used metal material, which is relatively economical. Therefore, choosing a copper heat conductive block can control costs while ensuring the heat dissipation effect.

[0037] In some embodiments, ventilation holes 50 are provided on both sides of the housing 10, and air ducts are formed between the ventilation holes 50 on both sides and the interior of the housing 10. There are a plurality of ventilation holes 50, which are sequentially provided on both sides of the housing 10.

[0038] By opening ventilation holes 50 on both sides of the housing 10 and forming an air duct, the flow and circulation of air can be promoted. When the industrial control host is running, the ventilation holes 50 can allow outside air to enter the air duct and pass through the first heat sink 20 and the second heat sink 40, thereby effectively taking away heat. This arrangement helps to improve the heat dissipation effect and ensure the normal operating temperature of the motherboard and other internal components.

[0039] By sequentially arranging a plurality of ventilation holes 50, the ventilation area can be increased, more air circulation channels can be provided, and the heat dissipation effect can be further enhanced. This can effectively prevent heat accumulation and hot spot problems, and maintain the stable working state of the motherboard and other internal components.

[0040] It should be specially noted that the efficient heat dissipation structure 100 of the industrial control host provided in the embodiment of the utility model only shows the part related to the technical problem to be solved by the embodiment of the utility model. It can be understood that the efficient heat dissipation structure 100 of the industrial control host provided in the embodiment of the utility model also includes other structures for realizing the functions of the efficient heat dissipation structure 100 of the industrial control host, which will not be described one by one again.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Under the idea of ​​the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention is described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An efficient heat dissipation structure of an industrial control host, applied to a mainboard, characterized in that: include: A housing, wherein the housing is mounted on the mainboard; A first heat sink is disposed on the inner side of the housing and corresponds to the position of a main heat source on the mainboard, and the first heat sink is in contact with the main heat source on the mainboard; Heat dissipation fins, which are arranged on the outside of the housing and in contact with the outside air, and the heat of the first heat dissipation element can be transferred to the heat dissipation fins; When the housing is mounted on the mainboard, the heat of the mainboard can be introduced into the heat dissipation fins through the first heat dissipation element and dissipated to the outside air through the heat dissipation fins.

2. The efficient heat dissipation structure of the industrial control host according to claim 1 is characterized in that: The first heat sink is provided with a groove, the position of the groove corresponds to the position of the main board, and the main board can be embedded in the groove.

3. The efficient heat dissipation structure of the industrial control host according to claim 2 is characterized in that: The first heat sink is a copper heat conducting block.

4. The efficient heat dissipation structure of the industrial control host according to claim 1 is characterized in that: A second heat sink is also provided on the inner side of the shell. The second heat sink is located on both sides of the first heat sink. The position of the second heat sink corresponds to the position of the auxiliary heat source of the mainboard. The second heat sink is in contact with the auxiliary heat source of the mainboard.

5. The efficient heat dissipation structure of the industrial control host according to claim 4 is characterized in that: The second heat sink is connected to the heat sink fins, and the heat of the second heat sink can be transferred to the heat sink fins.

6. The efficient heat dissipation structure of the industrial control host according to claim 4, characterized in that: The second heat sink is a copper heat conducting block.

7. The efficient heat dissipation structure of the industrial control host according to claim 1, characterized in that: Ventilation holes are provided on both sides of the shell, and air ducts are formed between the ventilation holes on both sides and the interior of the shell.

8. The efficient heat dissipation structure of the industrial control host according to claim 7, characterized in that: A plurality of ventilation holes are provided, and the plurality of ventilation holes are sequentially arranged on both sides of the shell.

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