Heat dissipation device and workstation

Abstract

The utility model belongs to the technical field of work stations, and discloses a heat dissipation device and a work station, the heat dissipation device is used for conducting heat dissipation on a memory structure and a central processing unit power supply module, the heat dissipation device comprises a fixing support, an installation panel and a plurality of heat dissipation fans, and the fixing support can be installed on a case; the mounting panel is adjustably arranged on the fixed bracket along a first direction position; the mounting panel is provided with a plurality of mounting positions along a second direction, a preset angle is formed between the second direction and the first direction, at least one mounting position is provided with a cooling fan, and the cooling fan can directly face the memory structure and the central processing unit power supply module so as to accelerate heat dissipation of the memory structure and the central processing unit power supply module. The heat dissipation device can simultaneously dissipate heat of the memory structure and the central processing unit power supply unit, the heat dissipation effect is better, the compatibility is high, the heat dissipation effect of the workstation is improved, the reliability is high, and the change cost in the change process of the mainboard of the workstation is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of workstations, and in particular to a heat dissipation device and a workstation. Background Art

[0002] Currently, the heat dissipation of workstation memory and the heat dissipation of the central processing unit voltage regulator module (VRM) both use a natural heat exchange heat dissipation mode, and the heat dissipation structures of the two are different.

[0003] The heat dissipation of memory is mainly carried out by the host air duct. The memory is set in the air duct, and the airflow passes through the memory to take away the heat, ensuring that the memory works normally under the working temperature conditions. However, with the improvement of workstation performance requirements, the capacity of single-chip memory has also increased greatly, and the combined use of memory will make the total memory capacity even greater; when the host is working at full load, a large amount of heat will be generated in the local space. If the heat dissipation is not timely, it will affect the working stability and service life of the memory.

[0004] As for the heat dissipation of the power supply unit of the CPU, fin heat dissipation is currently commonly used. The fins are attached to the power supply unit and heat is dissipated by convection with the air. However, the power supply unit of the CPU is small in area, and the contact area between the fins and the air is limited. As the power consumption of the CPU increases, the power requirements are also getting higher and higher. The heat of the power supply unit itself must be removed in time to ensure the temperature of the best working performance.

[0005] In summary, the heat dissipation effect of the power supply unit of the memory and the CPU cannot meet the needs of workstations with larger capacity and requirements. In addition, the position and number of the power supply unit and the position and number of the memory are of various types according to different workstations, making the heat dissipation structure compatibility relatively poor. Once the structure of the power supply unit and the memory is changed, the heat dissipation structure needs to be changed accordingly, and the change cost is relatively high.

[0006] Therefore, there is an urgent need to provide a heat dissipation device and a workstation to solve the above technical problems. Utility Model Content

[0007] One purpose of the utility model is to provide a heat dissipation device, which can dissipate heat for a memory structure and a central processing unit power supply unit at the same time, and has better heat dissipation effect and high compatibility.

[0008] To achieve this purpose, the utility model adopts the following technical solutions:

[0009] A heat dissipation device is used to dissipate heat from the memory structure and the central processing unit power supply module, and the heat dissipation device includes:

[0010] A fixing bracket, wherein the fixing bracket can be installed on the chassis;

[0011] An installation panel is arranged on the fixing bracket in an adjustable manner along a first direction;

[0012] The above-mentioned installation panel is provided with a plurality of installation positions along the second direction, and the above-mentioned second direction is arranged at a preset angle with the above-mentioned first direction. A cooling fan is installed on at least one of the above-mentioned installation positions, and the above-mentioned cooling fan can be arranged directly opposite to the above-mentioned memory structure and the above-mentioned central processing unit power supply module to accelerate the heat dissipation of the above-mentioned memory structure and the above-mentioned central processing unit power supply module.

[0013] Optionally, each of the above-mentioned installation positions is provided with a plurality of heat dissipation holes so that the above-mentioned heat dissipation fan is connected to the space where the above-mentioned memory structure and the above-mentioned central processing unit power supply module are installed.

[0014] Optionally, the plurality of heat dissipation holes are spaced apart from the center of the mounting position outward.

[0015] Optionally, the installation position is provided with a plurality of fixing parts, the fixing parts are arranged on a side of the installation panel away from the fixing bracket, and the fixing parts are used for detachably connecting with the cooling fan.

[0016] Optionally, at least one group of two adjacent installation positions are partially overlapped.

[0017] Optionally, one of the mounting panel and the fixing bracket is provided with a plurality of slideways extending along the first direction, and the other is provided with a plurality of sliding members, and the slideways and the sliding members are slidably connected in a one-to-one correspondence.

[0018] Optionally, the fixed bracket includes a frame and a connection panel, the installation panel is adjustably arranged on the connection panel along a first direction, the frame can be installed on the chassis, and the installation panel and the cooling fan can pass through the frame along the first direction.

[0019] Optionally, the heat dissipation device further includes a whole-machine heat dissipation structure, the whole-machine heat dissipation structure is provided with an air duct, and the heat dissipation fan is arranged in the air duct.

[0020] Optionally, the whole machine heat dissipation structure further includes heat dissipation fins, and the heat dissipation fins can be arranged on the central processing unit power supply module and directly opposite to the heat dissipation fan.

[0021] Another object of the utility model is to provide a workstation, which can improve the heat dissipation effect of the workstation, has high reliability and high compatibility, and reduces the change cost during the change of the workstation motherboard.

[0022] To achieve this purpose, the utility model adopts the following technical solutions:

[0023] A workstation, characterized in that it includes a host and the heat dissipation device described in any of the above schemes, the host includes a chassis and a motherboard arranged in the chassis, the heat dissipation device is arranged in the chassis and is arranged opposite to the motherboard, the motherboard is provided with a plurality of chips, a plurality of central processing unit power supply modules and a plurality of memory structures, and the memory structures and the central processing unit power supply modules are respectively arranged on different sides of the chip.

[0024] Beneficial effects of the utility model:

[0025] The utility model provides a heat dissipation device and a workstation. By setting a heat dissipation fan, the memory structure and the central processing unit power supply module on the mainboard can accelerate the loss of heat through the heat dissipation fan, so as to quickly dissipate the heat of the memory structure and the central processing unit power supply module on the mainboard at the same time. The heat dissipation effect is better, and the service life of the memory structure and the central processing unit power supply module on the mainboard is extended. The situation that the performance of the workstation is poor due to the untimely heat dissipation of structures such as the memory structure and the central processing unit power supply module on the mainboard is avoided; the overall use efficiency and reliability of the workstation are improved. At the same time, the heat dissipation fan can also adjust the position along the first direction, and one, two or more heat dissipation fans can be selectively placed along the second direction to adapt to various types of mainboard structures, thereby improving the adaptability and compatibility of the heat dissipation device and reducing the change cost during the change of the workstation mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an exploded view of the heat dissipation device provided in a specific embodiment of the utility model;

[0027] Figure 2 This is a schematic diagram of the layout of a single-channel mainboard provided by the first optional embodiment of the first embodiment of the present utility model;

[0028] Figure 3 This is an axonometric diagram of a heat dissipation device provided by a specific embodiment of the utility model, in which only the heat dissipation fan is installed at the middle installation position;

[0029] Figure 4 It is a schematic diagram of the layout of a single-channel mainboard provided by the second optional embodiment in the first embodiment of the present utility model;

[0030] Figure 5 This is an axonometric view of the heat dissipation device provided by the specific embodiment of the utility model, in which only the heat dissipation fan is installed at the left installation position;

[0031] Figure 6 It is a schematic diagram of the layout of a single-channel mainboard provided by the third optional embodiment in the first embodiment of the utility model;

[0032] Figure 7This is an axonometric view of the heat dissipation device provided by the specific embodiment of the utility model, in which only the heat dissipation fan is installed at the right installation position;

[0033] Figure 8 This is a schematic diagram of the layout of a dual-way mainboard provided by an optional embodiment of the second embodiment of the present utility model;

[0034] Fig. 9 It is a schematic diagram of the layout of a dual-way mainboard provided by another optional embodiment in the second embodiment of the present utility model;

[0035] Fig.10 It is an axonometric diagram of cooling fans installed at two installation positions of the heat dissipation device provided in a specific embodiment of the utility model.

[0036] In the figure:

[0037] 10. Fixed bracket; 11. Frame; 12. Connection panel; 121. Slide;

[0038] 20. Installation panel; 21. Installation position; 22. Heat dissipation hole; 23. Fixing part; 24. Sliding hole;

[0039] 30. Cooling fan;

[0040] 200, main board; 210, memory structure; 220, central processing unit power supply module; 230, chip. DETAILED DESCRIPTION

[0041] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0042] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0045] Refer to the following Figures 1 to 10 The specific implementation manner is described in detail the heat dissipation device provided by the utility model.

[0046] It should be noted that the first direction is Figure 1 The Y direction in the figure is the vertical direction of the heat dissipation device, and the second direction is Figure 1 The X direction is the horizontal direction of the heat sink, and the X direction and the Y direction are arranged at a preset angle. In this embodiment, the X direction is perpendicular to the Y direction.

[0047] Please refer to Figure 1 , Figure 3 , Figure 5 , Figure 7 and Fig.10 Specifically, the heat dissipation device is used to dissipate heat for the memory structure 210 and the central processing unit power supply module 220, and includes a fixing bracket 10, an installation panel 20 and a plurality of heat dissipation fans 30, wherein the fixing bracket 10 can be installed on the chassis; the installation panel 20 is adjustably arranged on the fixing bracket 10 along a first direction; the installation panel 20 is provided with a plurality of installation positions 21 along a second direction, the second direction is arranged at a preset angle to the first direction, and a heat dissipation fan 30 is installed on at least one installation position 21, and the heat dissipation fan 30 can be arranged opposite to the memory structure 210 and the central processing unit power supply module 220 to accelerate the heat dissipation of the memory structure 210 and the central processing unit power supply module 220.

[0048] The heat dissipation device in this embodiment is provided with a heat dissipation fan 30, so that the memory structure 210 and the CPU power supply module 220 on the mainboard 200 can accelerate the loss of heat through the heat dissipation fan 30, so as to quickly dissipate the heat of the memory structure 210 and the CPU power supply module 220 on the mainboard 200 at the same time, and the heat dissipation effect is better. It avoids the situation where the performance of the workstation is poor due to the untimely heat dissipation of structures such as the memory structure 210 and the CPU power supply module 220 on the mainboard 200, and improves the reliability of the workstation. At the same time, the heat dissipation fan 30 can also adjust the position along the first direction, and can also selectively place one, two or more heat dissipation fans 30 along the second direction to adapt to various types of mainboard 200 structures, thereby improving the adaptability and compatibility of the heat dissipation device and reducing the change cost during the change of the workstation mainboard 200.

[0049] Please refer to Figure 1 and Figure 3 In this embodiment, the fixed bracket 10 includes a frame 11 and a connection panel 12, the installation panel 20 is adjustably arranged on the connection panel 12 along a first direction, the frame 11 can be installed on the chassis, and the installation panel 20 and the cooling fan 30 can be penetrated in the frame 11 along the first direction. This arrangement increases the structural strength of the fixed bracket 10, and at the same time allows the cooling fan 30 to be penetrated in the frame 11 as the installation panel 20 moves, avoiding positional interference during the penetration of the cooling fan 30.

[0050] Optionally, a through hole is provided on at least one side of the frame 11 along the first direction, so that the heat dissipation fan 30 can pass through the frame 11 along the first direction.

[0051] Optionally, at least one side of the frame 11 along the second direction is provided with a fixing hole for fixed connection with the chassis.

[0052] Furthermore, an avoidance hole is provided on the connection panel 12 so that the installation panel 20 can be exposed, thereby avoiding blocking the air flow channel of the heat dissipation fan 30 and ensuring the heat dissipation effect.

[0053] Furthermore, one of the mounting panel 20 and the fixing bracket 10 is provided with a plurality of slideways 121 extending along a first direction, and the other is provided with a plurality of sliding members. The slideways 121 and the sliding members are slidably connected one by one, so that the position between the mounting panel 20 and the fixing bracket 10 along the first direction can be adjusted.

[0054] Exemplarily, in this embodiment, a sliding member is provided on the mounting panel 20 , and a slideway 121 extending along the first direction is provided on the fixing bracket 10 , so that the two can be slidably connected along the first direction.

[0055] Specifically, a sliding hole 24 is provided on the mounting panel 20, and the bolt passes through the slideway 121 and the sliding hole 24 and is connected with the nut, so that the bolt can be used as a sliding part. After the position of the mounting panel 20 and the fixed bracket 10 along the first direction is determined, the bolt and the nut can be tightened to fix the position between the mounting panel 20 and the fixed bracket 10.

[0056] In order to improve the stability of the connection between the mounting panel 20 and the fixing bracket 10, optionally, four slideways 121 and four sliding members are evenly arranged to ensure the stability of the connection between the two.

[0057] Please continue to refer to Figure 1 In this embodiment, each mounting position 21 is provided with a plurality of heat dissipation holes 22 so that the heat dissipation fan 30 is connected to the space where the memory structure 210 and the CPU power supply module 220 are installed, so as to achieve the heat dissipation effect of the heat dissipation fan 30 on the memory structure 210 and the CPU power supply module 220.

[0058] Optionally, multiple heat dissipation holes 22 are spaced outward from the center of the installation position 21 so that the heat dissipation holes 22 expand outward in a ring shape, and the entire installation panel 20 corresponding to the heat dissipation fan 30 is evenly provided with ventilation holes, so that the air flow will not produce large resistance after the heat dissipation fan 30 rotates.

[0059] Furthermore, the installation position 21 is provided with a plurality of fixing parts 23 , and the fixing parts 23 are used to be detachably connected to the heat dissipation fan 30 , so that the installation position 21 and the heat dissipation fan 30 can be installed.

[0060] Preferably, the fixing portion 23 is disposed on a side of the mounting panel 20 away from the fixing bracket 10 to avoid interference when the mounting panel 20 moves along the first direction due to the fixing portion 23 being disposed between the mounting panel 20 and the fixing bracket 10 .

[0061] Optionally, at least one group of two adjacent mounting positions 21 are partially overlapped. Since the area of ​​the motherboard 200 in the workstation host will not change much, the heat dissipation device can set several more mounting positions 21 in a limited area for better heat dissipation, so as to correspond to the memory structure 210 and the central processing unit power supply module 220 in various positions. At this time, the cooling fans 30 will not be installed in several mounting positions 21 at the same time and the adjacent mounting positions 21 will partially overlap to meet the setting of multiple mounting positions 21 within a certain space.

[0062] Exemplarily, there are three mounting positions 21 in this embodiment, and the middle mounting position 21 partially overlaps with the two mounting positions 21 on both sides to meet the compatibility of the heat dissipation device with various types of motherboards 200.

[0063] In this embodiment, the heat dissipation device also includes a whole machine heat dissipation structure, which is provided with an air duct, and the heat dissipation fan 30 is arranged in the air duct, so as to realize convection between the air inside the chassis and the outside, and realize the heat dissipation of the whole chassis.

[0064] Furthermore, the heat dissipation structure of the whole machine also includes heat dissipation fins, which can be arranged on the CPU power supply module 220 and arranged directly opposite the heat dissipation fan 30, that is, the heat dissipation fins help to dissipate heat, and then through the acceleration effect of the heat dissipation fan 30, the heat dissipation effect of the heat dissipation device on the memory structure 210 and the CPU power supply module 220 is better improved.

[0065] This embodiment also provides a workstation, which includes a host and a heat dissipation device described in any of the above schemes, the host includes a chassis and a mainboard 200 arranged in the chassis, the heat dissipation device is arranged in the chassis and arranged directly opposite to the mainboard 200, and the mainboard 200 is provided with a plurality of chips 230, a plurality of central processing unit power supply modules 220 and a plurality of memory structures 210, and the memory structures 210 and the central processing unit power supply modules 220 are respectively arranged on different sides of the chip 230. By adopting the above heat dissipation device, the workstation can improve its own heat dissipation effect, ensure that its own heat does not affect the work, ensure that the workstation is always running in the best state, and improve the reliability of the workstation.

[0066] Different types of mainboards 200 and corresponding heat dissipation devices are described below.

[0067] Embodiment 1

[0068] Please refer to Figures 2 to 7 In this embodiment, the motherboard 200 of the workstation is a single-channel motherboard 200, and the heat dissipation device is arranged opposite to the upper area of ​​the single-channel motherboard 200 along the first direction, and the heat dissipation device has three installation positions 21. Specifically, the motherboard 200 includes a group of chips 230 and two memory structures 210 and a central processing unit power supply module 220 arranged outside the chip 230, and the heat dissipation device corresponding to the motherboard 200 only includes a heat dissipation fan 30.

[0069] Specifically, the position of the cooling fan 30 can be changed according to the positions of the memory structure 210 and the CPU power supply module 220, which is not specifically limited here.

[0070] Please refer to Figure 2 and Figure 3 In the first optional embodiment, the memory structure 210 and the CPU power supply module 220 on the motherboard 200 are located in the middle of the upper side of the motherboard 200, and the cooling fan 30 of the corresponding heat dissipation device is set at the middle installation position 21 to achieve better heat dissipation of the memory structure 210 and the CPU power supply module 220.

[0071] Please refer to Figures 4 to 7 In the second and third optional embodiments, the memory structure 210 and the CPU power supply module 220 on the motherboard 200 are located on the left or right side of the motherboard 200, and the cooling fan 30 of the corresponding heat dissipation device is set at the installation position 21 on the left side or the installation position 21 on the right side along the second direction to achieve better heat dissipation of the memory structure 210 and the CPU power supply module 220.

[0072] Optionally, if the memory structure 210 and the CPU power supply module 220 on the motherboard 200 are located at the lower position of the motherboard 200, the relative position of the installation panel 20 and the fixed bracket 10 can be slid along the first direction so that the cooling fan 30 can be arranged opposite to the memory structure 210 and the CPU power supply module 220 on the motherboard 200, thereby achieving better heat dissipation for the memory structure 210 and the CPU power supply module 220.

[0073] Embodiment 2

[0074] Please refer to Figure 3 , Figure 8 , Fig. 9 and Fig.10 In this embodiment, the motherboard 200 of the workstation is a dual-core motherboard 200, and the heat sink is arranged opposite to the upper area of ​​the dual-core motherboard 200 along the first direction, and the heat sink is provided with three installation positions 21. Specifically, the motherboard 200 includes a plurality of central processing unit power supply modules 220, two groups of chips 230 and four memory structures 210, and two memory structures 210 are arranged on the outer side of each chip 230 group.

[0075] Specifically, the position of the cooling fan 30 can be changed according to the positions of the memory structure 210 and the CPU power supply module 220, which is not specifically limited here.

[0076] Please refer to Figure 3 and Figure 8 In an optional embodiment, a CPU power supply module 220 is provided and arranged in the middle of the two groups of chips 230. The heat dissipation device corresponding to the motherboard 200 contains only one cooling fan 30 and is arranged in the middle mounting position 21 to achieve better heat dissipation of the memory structure 210 and the CPU power supply module 220.

[0077] Please refer to Fig. 9 and Fig.10In another optional embodiment, a central processing unit power supply unit is provided on one side of each group of chips 230 away from another group of chips 230, and a heat dissipation device corresponding to the mainboard 200 is provided with two cooling fans 30, and the two cooling fans 30 are respectively arranged at mounting positions 21 on both sides along the second direction to achieve better heat dissipation of the memory structure 210 and the central processing unit power supply module 220.

[0078] Optionally, if the memory structure 210 and the CPU power supply module 220 on the motherboard 200 are offset in the first direction on the motherboard 200, the cooling fan 30 can be arranged opposite to the memory structure 210 and the CPU power supply module 220 on the motherboard 200 by sliding the relative positions of the installation panel 20 and the fixed bracket 10 along the first direction, thereby achieving better heat dissipation for the memory structure 210 and the CPU power supply module 220.

[0079] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that: Used to dissipate heat from a memory structure (210) and a central processing unit power supply module (220), the heat dissipation device comprising: A fixing bracket (10), wherein the fixing bracket (10) can be installed on a chassis; A mounting panel (20) is arranged on the fixing bracket (10) in an adjustable manner along a first direction; The installation panel (20) is provided with a plurality of installation positions (21) along a second direction, the second direction being arranged at a preset angle with the first direction, a heat dissipation fan (30) being installed on at least one of the installation positions (21), and the heat dissipation fan (30) being arranged opposite to the memory structure (210) and the central processing unit power supply module (220) to accelerate the heat dissipation of the memory structure (210) and the central processing unit power supply module (220).

2. The heat dissipation device according to claim 1, characterized in that: Each of the installation positions (21) is provided with a plurality of heat dissipation holes (22) so that the heat dissipation fan (30) is connected to the space where the memory structure (210) and the central processing unit power supply module (220) are installed.

3. The heat dissipation device according to claim 2, characterized in that: The plurality of heat dissipation holes (22) are arranged at intervals outward from the center of the installation position (21).

4. The heat dissipation device according to claim 1, characterized in that: The installation position (21) is provided with a plurality of fixing parts (23), the fixing parts (23) being arranged on a side of the installation panel (20) away from the fixing bracket (10), and the fixing parts (23) being used for being detachably connected to the cooling fan (30).

5. The heat dissipation device according to claim 1, characterized in that: Parts of at least one group of two adjacent installation positions (21) are overlapped.

6. The heat dissipation device according to claim 1, characterized in that: One of the installation panel (20) and the fixing bracket (10) is provided with a plurality of slideways (121) extending along a first direction, and the other is provided with a plurality of sliding members, and the slideways (121) and the sliding members are slidably connected in a one-to-one correspondence.

7. The heat dissipation device according to claim 1, characterized in that: The fixing bracket (10) comprises a frame (11) and a connection panel (12); the mounting panel (20) is adjustably arranged on the connection panel (12) along a first direction; the frame (11) can be installed on the chassis; the mounting panel (20) and the cooling fan (30) can be passed through the frame (11) along the first direction.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The heat dissipation device also includes a whole-machine heat dissipation structure, the whole-machine heat dissipation structure is provided with an air duct, and the heat dissipation fan (30) is arranged in the air duct.

9. The heat dissipation device according to claim 8, characterized in that: The whole machine heat dissipation structure also includes heat dissipation fins, which can be arranged on the central processing unit power supply module (220) and are arranged opposite to the heat dissipation fan (30).

10. A workstation, characterized in that The invention comprises a host and a heat dissipation device as described in any one of claims 1 to 9, wherein the host comprises a chassis and a motherboard (200) arranged in the chassis, the heat dissipation device is arranged in the chassis and is arranged opposite to the motherboard (200), and the motherboard (200) is provided with a plurality of chips (230), a plurality of central processing unit power supply modules (220) and a plurality of memory structures (210), and the memory structures (210) and the central processing unit power supply modules (220) are respectively arranged on different sides of the chip (230).

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