BGA multi-SITE memory chip test socket

Abstract

The utility model relates to the technical field of chip test sockets, and specifically discloses a BGA multi-SITE memory chip test socket comprising a test circuit board, the upper end face of the test circuit board is provided with a plurality of socket main bodies, each socket main body comprises a base and an upper cover, a hinge assembly is connected between the rear ends of the base and the upper cover, and the base and the upper cover are connected through the hinge assembly. A clamping assembly is connected between the front ends of the base and the upper cover, a chip mounting groove is formed in the upper end face of the base, a mounting groove is formed in the upper end face of the upper cover, a cooling fin is arranged in the mounting groove in a sliding mode, adjusting assemblies are arranged on the two sides of the cooling fin, and a temperature control switch is fixedly embedded in the middle of the cooling fin. According to the utility model, the radiating fins are arranged, so that the chip can be prevented from being overheated during testing, and if the temperature is too high, the upper cover can be automatically opened to remind testers to stop testing, and the testers can conveniently and quickly take out the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip test sockets, in particular to a BGA multi-site storage chip test socket. Background Art

[0002] BGA multi-site memory chip is a memory chip that uses ball grid array packaging technology. It has multiple sites and can realize multiple storage functions on one chip. It is widely used in computers, communications, consumer electronics and other fields.

[0003] The BGA test socket is a tool specifically used to test BGA packaged chips. It allows the chip to be better connected to the test equipment and facilitates various performance tests. During the test, the chip is installed inside the socket and the lid is pressed on top to ensure stability. This structure is relatively closed and has poor heat dissipation. The BGA chip will generate heat during the test, and overheating will cause the chip performance to degrade, malfunction, or even damage the chip itself. If the overheating is serious, it will also have a certain impact on the test socket, such as affecting the contact performance of the socket. Therefore, those skilled in the art provide a BGA multi-site storage chip test socket to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a BGA multi-site memory chip test socket to solve the following technical problems:

[0005] How to improve the heat dissipation performance of the current BGA test socket and prevent the chip from overheating.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A BGA multi-site storage chip test socket, comprising a test circuit board, a plurality of socket bodies are arranged on the upper end surface of the test circuit board, the socket bodies comprise a base and an upper cover, a hinge assembly is connected between the rear ends of the base and the upper cover, a clamping assembly is connected between the front ends of the two, and a chip mounting groove is provided on the upper end surface of the base;

[0008] The upper end surface of the upper cover is provided with a mounting groove, a heat sink is slidably arranged inside the mounting groove, adjustment components are arranged on both sides of the heat sink, and a temperature control switch is fixedly embedded in the middle of the heat sink;

[0009] The snap-on assembly includes a first slot and a second slot respectively opened on the front end of the upper cover and the base, the interior of the first slot is fixedly connected with a rotating shaft, the outer side of the rotating shaft is rotatably connected with a card, the lower end of the card is snap-connected with the upper edge of the second slot, and the interior of the second slot is fixed with an electromagnet.

[0010] Furthermore, the hinge assembly includes a hinge shaft and two symmetrically arranged hinge heads, the hinge shaft is fixedly connected to the base, the lower end of the hinge head is rotatably sleeved with the hinge shaft, and the upper end is fixedly connected to the upper cover;

[0011] Furthermore, a second torsion spring is sleeved at the middle of the hinge shaft, and two ends of the second torsion spring are respectively fixedly connected to the two hinge joints;

[0012] Further, the adjustment assembly includes two adjustment slots with open inner sides, the adjustment slots are arranged on both sides of the mounting slot, a pressure plate is slidably connected inside the adjustment slot, one end of the pressure plate is fixedly connected to the heat sink, and the adjustment assembly also includes two hand-tightening studs, the two hand-tightening studs are respectively extended into the two adjustment slots and the lower ends are abutted against the pressure plate;

[0013] Furthermore, two springs are fixedly connected between the lower end surface of the pressing plate and the adjusting slot;

[0014] Furthermore, a top is fixedly connected to the lower end of the card, the top is aligned with the protruding end of the electromagnet, and the temperature control switch is electrically connected to the electromagnet;

[0015] Furthermore, the outer end of the rotating shaft is sleeved with a first torsion spring, and the upper and lower ends of the first torsion spring are fixedly connected to the card and the first notch respectively;

[0016] Furthermore, the lower end surface of the heat sink protrudes from the lower end surface of the upper cover, and the lower end surface of the temperature control switch is flush with the lower end surface of the heat sink;

[0017] Beneficial effects of the utility model:

[0018] The utility model is provided with a heat sink. When the BGA chip is tested, the heat sink contacts the chip, thereby reducing the temperature of the chip during the test and preventing the chip from overheating during the test. At the same time, a temperature control switch and a card connection component with an automatic pop-up function are also provided. During the test, if the chip temperature is too high and reaches the threshold of the temperature control switch, the electromagnet inside the card connection component is powered off and ejected, separating the card from the base and unlocking it, thereby automatically opening the upper cover, reminding the tester to terminate the test, and also facilitating the tester to quickly take out the chip, thereby preventing the chip from being damaged by overheating and the performance of the test socket from being affected by excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is the overall structure diagram of the utility model;

[0021] Figure 2 It is a structural diagram of the socket body of the utility model;

[0022] Figure 3 This is a structural diagram of the upper cover of the socket body of the utility model being opened;

[0023] Figure 4 It is a structural diagram of the adjustment component of the utility model;

[0024] Figure 5 It is a structural diagram of the clamping assembly of the utility model.

[0025] Reference numerals:

[0026] 1. Test circuit board; 2. Socket body; 21. Base; 22. Upper cover; 23. Heat sink; 24. Card assembly; 241. First notch; 242. Second notch; 243. Card; 244. Rotating shaft; 245. First torsion spring; 246. Top head; 247. Electromagnet; 25. Mounting slot; 26. Adjustment assembly; 261. Adjustment slot; 262. Press plate; 263. Spring; 264. Hand-tightened stud; 27. Articulated assembly; 271. Articulated shaft; 272. Articulated head; 273. Second torsion spring; 28. Chip mounting slot; 29. ​​Temperature control switch. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Please refer to the attached Figure 1-Figure 5 As shown, the BGA multi-site storage chip test socket in the embodiment of the utility model includes a test circuit board 1. The test circuit board 1 is configured to provide electrical connection to realize signal transmission between the chip and the test equipment, and at the same time provide fixation and support to ensure stable installation of the test socket.

[0029] A plurality of socket bodies 2 are provided on the upper end surface of the test circuit board 1. The socket bodies 2 include a base 21 and an upper cover 22. A hinge assembly 27 is connected between the rear ends of the base 21 and the upper cover 22. The hinge assembly 27 is used to rotatably connect the upper cover 22 with the base 21 so that the upper cover 22 can be opened and closed. A snap assembly 24 is connected between the front ends of the two. The snap assembly 24 is used to lock the upper cover 22 with the base 21. A chip mounting groove 28 is provided on the upper end surface of the base 21.

[0030] A mounting groove 25 is provided on the upper end surface of the upper cover 22, and a heat sink 23 is slidably arranged inside the mounting groove 25. Adjustment components 26 are arranged on both sides of the heat sink 23. A temperature control switch 29 is fixedly embedded in the middle of the heat sink 23. After the upper cover 22 is closed, the lower end surfaces of the heat sink 23 and the temperature control switch 29 are in contact with the chip installed in the chip mounting groove 28. The heat sink 23 is made of metal copper and has good thermal conductivity. A plurality of fins are arranged on the outer end, which has a large contact area with the air and a strong heat dissipation effect, and can efficiently conduct the heat generated during chip testing. The temperature control switch 29 is a normally closed switch, which is connected in series to the circuit of the electromagnet 247 and is in contact with the chip. If the chip temperature is too high, the temperature control switch 29 is disconnected, and the electromagnet 247 is powered off and extended.

[0031] The snap-on assembly 24 includes a first slot 241 and a second slot 242 respectively opened at the front end of the upper cover 22 and the base 21. The first slot 241 is fixedly connected to a rotating shaft 244 inside, and a card 243 is rotatably connected to the outer side of the rotating shaft 244. The lower end of the card 243 is snap-connected to the upper edge of the second slot 242, and an electromagnet 247 is fixed inside the second slot 242.

[0032] The electromagnet 247 retracts when energized, and after the upper cover 22 is closed, the hook structure at the lower end of the card 243 engages with the second slot 242, thereby locking the upper cover 22 and the base 21, ensuring that the chip can be stably pressed into the chip mounting slot 28. After the electromagnet 247 is powered off and extended, the electromagnet 247 pushes the lower end of the card 243, thereby separating the lower end of the card 243 from the upper edge of the second slot 242, unlocking the upper cover 22, reminding the tester to terminate the test, and also facilitating the tester to quickly remove the chip to prevent the chip from being damaged by overheating and the performance of the test socket from being affected by excessive temperature.

[0033] The hinge assembly 27 includes a hinge shaft 271 and two symmetrically arranged hinge heads 272, the hinge shaft 271 is fixedly connected to the base 21, the lower end of the hinge head 272 is rotatably sleeved with the hinge shaft 271, and the upper end is fixedly connected to the upper cover 22, a second torsion spring 273 is sleeved at the middle part of the hinge shaft 271, and the two ends of the second torsion spring 273 are respectively fixedly connected to the two hinge heads 272, and the upper cover 22 is rotatably connected to the hinge shaft 271 through the hinge heads 272. The arranged second torsion spring 273 can hinder the closing of the upper cover 22 and the base 21 through elastic force. After the clamping assembly 24 is unlocked, the upper cover 22 can be quickly separated from the base 21 through the elastic force of the second torsion spring 273, and it is more convenient to open the upper cover 22.

[0034] The adjusting assembly 26 includes two adjusting grooves 261 with open inner sides, the adjusting grooves 261 are arranged on both sides of the mounting groove 25, the adjusting grooves 261 are slidably connected with a pressing plate 262, one end of the pressing plate 262 is fixedly connected to the heat sink 23, the adjusting assembly 26 also includes two hand-tightening studs 264, the two hand-tightening studs 264 extend into the two adjusting grooves 261 respectively and the lower ends abut against the pressing plate 262, two springs 263 are fixedly connected between the lower end surface of the pressing plate 262 and the adjusting groove 261, and the adjusting assembly 26 is provided with an adjusting heat sink 23. The heat sink 23 protrudes from the upper cover 22 to such an extent that the heat sink 23 and the temperature control switch 29 arranged inside the heat sink 23 can be in close contact with the chip. When adjusting, the two hand-tightening studs 264 are rotated, and the hand-tightening studs 264 press down the pressure plate 262, thereby driving the heat sink 23 connected to the pressure plate 262 to be pressed down, so that the heat sink 23 can be closely attached to the chip surface, thereby ensuring the heat dissipation effect of the heat sink 23 and the use effect of the temperature control switch 29, and the spring 263 is provided to provide elastic force to enable the heat sink 23 to be reset.

[0035] The lower end of the card 243 is fixedly connected with a push head 246, which is aligned with the protruding end of the electromagnet 247. The temperature control switch 29 is electrically connected to the electromagnet 247. After the temperature control switch 29 is disconnected, the electromagnet 247 is powered off and extended. The protruding end of the electromagnet 247 pushes the push head 246 outward, thereby separating the lower end of the card 243 from the upper edge of the second slot 242, so that the upper cover 22 is unlocked.

[0036] The outer end of the rotating shaft 244 is sleeved with the first torsion spring 245 , and the upper and lower ends of the first torsion spring 245 are respectively fixedly connected to the card 243 and the first notch 241 . The first torsion spring 245 is provided to keep the card 243 in a locked state.

[0037] The lower end surface of the heat sink 23 protrudes from the lower end surface of the upper cover 22, and the lower end surface of the temperature control switch 29 is flush with the lower end surface of the heat sink 23. When the heat sink 23 contacts the chip surface, the temperature control switch 29 can also contact the chip.

[0038] Working principle: When in use, the chip is installed in the chip installation groove 28, and then the upper cover 22 is covered, and the lower end of the card 243 is engaged with the second notch 242, thereby locking the upper cover 22 and the base 21, and then the distance between the heat sink 23 and the chip is adjusted by rotating the hand-tightening stud 264 of the adjustment component 26, so that the heat sink 23 can fit tightly with the chip, and the heat sink 23 can efficiently conduct the heat generated during chip testing. The set temperature control switch 29 is a normally closed switch, which is connected in series to the circuit of the electromagnet 247 and contacts the chip. If the chip temperature is too high, the temperature control switch 29 is disconnected, and the electromagnet 247 is powered off and extended. After extending, the electromagnet 247 pushes the lower end of the card 243, so that the lower end of the card 243 is separated from the upper edge of the second notch 242, unlocking the upper cover 22, reminding the tester to terminate the test, and also facilitating the tester to quickly remove the chip to prevent the chip from being overheated and damaged.

[0039] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A BGA multi-site memory chip test socket, comprising a test circuit board (1), characterized in that: The upper end surface of the test circuit board (1) is provided with a plurality of socket bodies (2), the socket bodies (2) comprising a base (21) and an upper cover (22), a hinge assembly (27) being connected between the rear ends of the base (21) and the upper cover (22), a clamping assembly (24) being connected between the front ends of the two, and a chip mounting groove (28) being provided on the upper end surface of the base (21); The upper end surface of the upper cover (22) is provided with a mounting groove (25), a heat sink (23) is slidably arranged inside the mounting groove (25), adjustment components (26) are arranged on both sides of the heat sink (23), and a temperature control switch (29) is fixedly embedded in the middle of the heat sink (23); The clamping assembly (24) comprises a first notch (241) and a second notch (242) respectively provided at the front ends of the upper cover (22) and the base (21); a rotating shaft (244) is fixedly connected inside the first notch (241); a card (243) is rotatably connected outside the rotating shaft (244); the lower end of the card (243) is clamped with the upper edge of the second notch (242); and an electromagnet (247) is fixed inside the second notch (242).

2. The BGA multi-site memory chip test socket according to claim 1, characterized in that: The hinge assembly (27) comprises a hinge shaft (271) and two symmetrically arranged hinge joints (272); the hinge shaft (271) is fixedly connected to the base (21); the lower end of the hinge joint (272) is rotatably sleeved with the hinge shaft (271), and the upper end is fixedly connected to the upper cover (22).

3. The BGA multi-site memory chip test socket according to claim 2, characterized in that: A second torsion spring (273) is sleeved at the middle of the hinge shaft (271), and two ends of the second torsion spring (273) are respectively fixedly connected to the two hinge joints (272).

4. The BGA multi-site memory chip test socket according to claim 1, characterized in that: The adjustment assembly (26) comprises two adjustment grooves (261) with open inner sides, the adjustment grooves (261) are arranged on both sides of the mounting groove (25), a pressure plate (262) is slidably connected inside the adjustment groove (261), one end of the pressure plate (262) is fixedly connected to the heat sink (23), and the adjustment assembly (26) further comprises two hand-tightening studs (264), the two hand-tightening studs (264) respectively extend into the two adjustment grooves (261) and the lower ends thereof abut against the pressure plate (262).

5. The BGA multi-site memory chip test socket according to claim 4, characterized in that: Two springs (263) are fixedly connected between the lower end surface of the pressing plate (262) and the adjusting groove (261).

6. The BGA multi-site memory chip test socket according to claim 1, characterized in that: The lower end of the card (243) is fixedly connected with a top head (246), the top head (246) is aligned with the protruding end of the electromagnet (247), and the temperature control switch (29) is electrically connected to the electromagnet (247).

7. The BGA multi-site memory chip test socket according to claim 1, characterized in that: The outer end of the rotating shaft (244) is sleeved with a first torsion spring (245), and the upper and lower ends of the first torsion spring (245) are fixedly connected to the card (243) and the first notch (241) respectively.

8. The BGA multi-site memory chip test socket according to claim 1, characterized in that: The lower end surface of the heat sink (23) protrudes from the lower end surface of the upper cover (22), and the lower end surface of the temperature control switch (29) is flush with the lower end surface of the heat sink (23).

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