Semiconductor uniform heating device
By designing a combination device of rotary heat conduction cover and heating plate in semiconductor processing, the heating inhomogeneity problem is solved, uniform heating of silicon wafers is achieved, and processing quality and operation safety are improved.
Patent Information
- Application Number
- CN202421010206.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-11
AI Technical Summary
During semiconductor processing, due to the uneven position of the heating plate and the silicon wafer, the silicon wafer is heated unevenly, which affects the processing quality.
Design a semiconductor uniform heating device, including a workbench, heating box, heating plate, heat shield and semiconductor carrier. Through the rotation of the heat shield and the uniform heating of the heating plate, the radiation heating uniformity of the silicon wafer is ensured, and the rotating electric machine is used to drive it. The gear system realizes uniform heating of the heat conductor cover and provides a suitable heating environment through the gas introduction tube.
It improves the heating uniformity of the silicon wafer, avoids local overheating, and ensures the uniformity of semiconductor processing quality and operation safety.
Smart Images
Figure CN222260982U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor uniform heating device. Background Art
[0002] In the semiconductor processing process, heating mechanisms are often used to meet the needs of thermal processes. For example, processes such as oxidation, impurity diffusion and annealing of silicon wafers all require heating mechanisms to create a high-temperature environment that meets the process requirements.
[0003] In the heating mechanism, the silicon wafer can be heated by thermal radiation, but the silicon wafer and the heating plate are relatively fixed. The hot spots on the heating plate are at different distances from various parts of the silicon wafer, resulting in uneven heating of the silicon wafer. This is not conducive to ensuring the uniformity of the processing quality of the silicon wafer and needs to be improved. Utility Model Content
[0004] The utility model aims to provide a semiconductor uniform heating device to heat a silicon wafer and improve heating uniformity.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A semiconductor uniform heating device comprises: a workbench, a heating box, a heating plate, a heat-conducting cover and a semiconductor carrier, wherein the heating box is arranged on the workbench, a heat-insulating plate located in the heating box is arranged on the workbench, the heating plate is arranged on the heat-insulating plate, the heat-conducting cover is rotatably arranged above the heating plate, the semiconductor carrier is arranged above the heat-conducting cover, and a gas introduction pipe extending upward into the heat-conducting cover is arranged at the bottom of the workbench.
[0007] Wherein, a sealing cover is arranged on the top of the heating box.
[0008] Wherein, a pressure relief valve is arranged on the sealing cover.
[0009] Wherein, columns connected to the heat insulation board are arranged at intervals at the bottom edge of the semiconductor carrier.
[0010] Wherein, a circle of annular guide rails located outside the heating plate is arranged on the heat insulation plate, and sliders located on the annular guide rails are arranged at intervals at the bottom of the heat conductive cover.
[0011] Wherein, a gear ring is arranged on the outside of the heat-conducting cover, and a gear meshing with the gear ring is arranged in the heating box.
[0012] Wherein, a motor for driving the gear to rotate is arranged at the bottom of the workbench.
[0013] The beneficial effects of the utility model are as follows: a semiconductor uniform heating device first uses a heating plate to heat a heat-conducting cover, and through the rotation of the heat-conducting cover, ensures that the heat-conducting cover is evenly heated by the heating plate, and then radiates heat to the silicon wafer on the semiconductor carrier through the heat-conducting cover, further improving the heating uniformity of various parts on the silicon wafer, avoiding the problem of local overheating, and helping to ensure the uniformity of the processing quality of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the utility model;
[0015] Figure 2 yes Figure 1 A partial enlarged view of part A. DETAILED DESCRIPTION
[0016] Combine the following Figure 1~Figure 2 The technical solution of the utility model is further illustrated by specific embodiments.
[0017] like Figure 1 The semiconductor uniform heating device shown comprises: a workbench 1, a heating box 9, a heating plate 10, a heat-conducting cover 11 and a semiconductor carrier 6. The heating box 9 is arranged on the workbench 1. A sealing cover 7 is arranged on the top of the heating box 9. The sealing cover 7 can be quickly removed and installed, and the operation is simple. A pressure relief valve 8 is arranged on the sealing cover 7, and the air pressure in the heating box 9 can be automatically exhausted when it is high, thereby improving the safety of operation.
[0018] The workbench 1 is provided with a heat insulation board 2 in a heating box 9, and the heating board 10 is provided on the heat insulation board 2. The heat insulation board 2 is used to insulate the bottom of the heating board 10, thereby reducing the downward transfer of heat and achieving good energy saving. The heating board 10 can be an electric heating board, and the heating temperature can be controlled by a temperature control switch, which is easy to operate.
[0019] The heat-conducting cover 11 is rotatably arranged above the heating plate 10. Figure 2 As shown, the heat insulation board 2 is provided with a circle of annular guide rails 14 located outside the heating plate 10. In this embodiment, sliders 13 located on the annular guide rails 14 are spaced apart at the bottom of the heat conductive cover 11 to guide the rotation of the heat conductive cover 11 to avoid deviation.
[0020] A gear ring 4 is disposed outside the heat-conducting cover 11, and a gear 12 meshing with the gear ring 4 is disposed in the heating box 9 to drive the heat-conducting cover 11 to rotate. The heat-conducting cover 11 is first heated by the heating plate 10, and the heat-conducting cover 11 is rotated to ensure that the heat-conducting cover 11 is evenly heated by the heating plate 10. Figure 2As shown, a motor 15 for driving the gear 12 to rotate is provided at the bottom of the workbench 1. The motor 15 is located below the workbench 1 to avoid the problem of being heated. The rotating shaft of the motor 15 can be extended to the heating box 9 through an extension rod to install and rotate the gear 12.
[0021] The semiconductor carrier 6 is arranged above the heat-conducting cover 11. In this embodiment, the bottom edge of the semiconductor carrier 6 is provided with columns 5 connected to the heat insulation board 2 to ensure the stability of the semiconductor carrier 6. The silicon wafer is placed on the semiconductor carrier 6 for positioning and heating. Figure 1 As shown, the semiconductor carrier 6 is parallel to the top surface of the heat-conducting cover 11. The rotating heat-conducting cover 11 radiates and heats the silicon wafer on the semiconductor carrier 6, thereby further improving the heating uniformity of various parts on the silicon wafer, avoiding the problem of local overheating, and ensuring the uniformity of the processing quality of the silicon wafer.
[0022] like Figure 1 As shown, a gas introduction pipe 3 extending upward to the heat-conducting cover 11 is provided at the bottom of the workbench 1, and oxygen or inert gas can be introduced into the heat-conducting cover 11 to meet the needs of different heat treatment processes. The heat-conducting cover 11 is first used to heat the cold air flow to convert it into hot air flow, and the hot air flow escapes from the bottom of the heat-conducting cover 11 and then contacts the silicon wafer, thereby avoiding contact between the cold air flow and the silicon wafer.
[0023] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.
Claims
1. A semiconductor uniform heating device, characterized in that: include: A workbench, a heating box, a heating plate, a heat-conducting cover and a semiconductor carrier, wherein the heating box is arranged on the workbench, a heat-insulating plate located in the heating box is arranged on the workbench, the heating plate is arranged on the heat-insulating plate, the heat-conducting cover is rotatably arranged above the heating plate, the semiconductor carrier is arranged above the heat-conducting cover, and a gas introduction pipe extending upward into the heat-conducting cover is arranged at the bottom of the workbench.
2. The semiconductor uniform heating device according to claim 1, characterized in that: A sealing cover is arranged on the top of the heating box.
3. The semiconductor uniform heating device according to claim 2, characterized in that: The sealing cover is provided with a pressure relief valve.
4. The semiconductor uniform heating device according to claim 1, characterized in that: The bottom edge of the semiconductor carrier is provided with columns connected to the heat insulation board at intervals.
5. The semiconductor uniform heating device according to claim 1, characterized in that: The heat insulation plate is provided with a circle of annular guide rails located outside the heating plate, and the bottom of the heat conductive cover is provided with sliders located on the annular guide rails at intervals.
6. The semiconductor uniform heating device according to claim 1, characterized in that: A gear ring is arranged outside the heat-conducting cover, and a gear meshing with the gear ring is arranged in the heating box.
7. The semiconductor uniform heating device according to claim 6, characterized in that: A motor for driving the gear to rotate is arranged at the bottom of the workbench.