Correcting device of silicon wafer transmission device

Abstract

The utility model discloses a correction device of a silicon wafer transmission device, which comprises a plurality of transmission rollers and a plurality of correction units, the plurality of transmission rollers are arranged at intervals, each transmission roller is sleeved with the plurality of correction units, and each correction unit comprises a first correction ring and a second correction ring which are oppositely arranged. The first correction ring comprises a first inclined surface, and the second correction ring comprises a second inclined surface. The first inclined plane and the second inclined plane are obliquely arranged in opposite directions, after a silicon wafer in an inclined conveying state enters the correction device, one side of the silicon wafer is located at the high position in the inclined plane, the other side of the silicon wafer is located at the low position in the inclined plane, and the multiple conveying rollers push the silicon wafer to make contact with the multiple correction units in sequence. At the moment, the silicon wafer is driven by inertia of rotation of each transmission roller and under the inclined guiding action of the inclined planes, so that the silicon wafer is corrected from an inclined transmission state to a horizontal transmission state.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell chip manufacturing, in particular to a correction device for a silicon chip transmission device. Background Art

[0002] The preparation of crystalline silicon solar cells generally goes through processes such as texturing, diffusion, coating, screen printing, and sintering. In the process of processing solar silicon wafers, multiple steps of loading and unloading are involved, and these processes are usually implemented by a transmission device. In the prior art, when silicon wafers are placed in or removed from the transmission device, it is impossible to ensure that the position and transmission direction of each silicon wafer are consistent, or the position of the silicon wafer will shift during the transportation process in the transmission device. Both of these situations will eventually affect the collection and placement of the silicon wafers after the transmission is completed, and then affect the use in the next process, resulting in a decrease in overall production efficiency. Utility Model Content

[0003] In order to overcome the above shortcomings, the purpose of the utility model is to provide a correction device for a silicon wafer transmission device to solve the problem mentioned in the above background technology that the silicon wafer will be positionally offset during the transmission process of the transmission device, thereby affecting the use of the silicon wafer in the next process.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is a correction device for a silicon wafer transmission device, comprising a plurality of transmission rollers and a plurality of correction units, wherein the plurality of transmission rollers are arranged at intervals along a first direction, each of the transmission rollers extends along a second direction and can rotate in a circumferential direction. The plurality of correction units are sleeved on each of the transmission rollers at intervals along the second direction. Each of the correction units comprises a first correction ring and a second correction ring arranged opposite to each other along the second direction.

[0005] The first correction ring includes a first inclined surface, and the second correction ring includes a second inclined surface. The first inclined surface and the second inclined surface are inclined in opposite directions and form a first bearing space.

[0006] The correction device of the silicon wafer transmission device provided by the utility model comprises a plurality of transmission rollers and a plurality of correction units, each transmission roller is sleeved with a plurality of correction units, each correction unit comprises a first correction ring and a second correction ring arranged relatively along the second direction, the two correction rings are inclined along opposite directions and are provided with a first inclined surface and a second inclined surface, and the two inclined surfaces form a first bearing space. For a silicon wafer in a horizontal transmission state, after entering the correction device, the silicon wafer is transmitted in the transmission direction as the transmission roller rotates, and finally moves out of the correction device and enters the next process. For a silicon wafer in an inclined transmission state, after entering the correction device, the silicon wafer is driven by the inertia of the rotation of each transmission roller and the inclined guiding action of the plurality of inclined surfaces, so that the silicon wafer is corrected from the inclined transmission state to the horizontal transmission state.

[0007] In some embodiments, an end of the first inclined surface close to the second inclined surface is lower than an end away from the second inclined surface in the third direction. An end of the second inclined surface close to the first inclined surface is lower than an end away from the first inclined surface in the third direction.

[0008] By adopting the above technical solution, the first inclined surface and the second inclined surface are relatively arranged from high to low, so that when the silicon wafer is in a horizontal transmission state, there can be a certain gap between it and the transmission roller below, thereby preventing the silicon wafer from adhering to other impurities in the correction device.

[0009] In some embodiments, one end of the first correcting ring along the second direction includes a first vertical surface, the first vertical surface extends along the third direction, and is used to connect the first inclined surface and the transmission roller; one end of the second correcting ring along the second direction includes a second vertical surface, the second vertical surface extends along the third direction, and is used to connect the second inclined surface and the transmission roller.

[0010] With the above technical solution, the first vertical surface and the second vertical surface both extend along the third direction and are used to connect the first inclined surface and the transmission roller, and the second vertical surface is used to connect the second inclined surface and the transmission roller.

[0011] In some embodiments, the inclination angles of the first inclined surface, the second inclined surface and the second direction are all 45°.

[0012] By adopting the above technical solution, the inclination angle of the first inclined surface and the second inclined surface is 45°, and this inclination angle can realize stable sliding of the silicon wafer within the first inclined surface and the second inclined surface.

[0013] In some embodiments, the correction device of the silicon wafer transmission device further includes the correction unit including a plurality of clamping rings. The plurality of clamping rings are arranged at intervals along the second direction, and each of the clamping rings includes a third inclined surface and a fourth inclined surface at both ends along the second direction, and the third inclined surface and the fourth inclined surface are arranged obliquely in opposite directions. The third inclined surface and the fourth inclined surface of the adjacent clamping rings form a second bearing space for correcting the transmission of the silicon wafer.

[0014] With the above technical solution, the correction unit is composed of a plurality of clamping rings, and a third inclined surface and a fourth inclined surface are arranged at both ends of each clamping ring, and the third inclined surface and the fourth inclined surface are arranged in opposite directions. The third inclined surface and the fourth inclined surface of the adjacent clamping rings form a second bearing space for correcting the transmission silicon wafer.

[0015] In some embodiments, the third inclined surface of each of the clamping rings is away from one end of its fourth inclined surface and is lower than one end of its second inclined surface in the third direction. The fourth inclined surface of each of the clamping rings is away from one end of its third inclined surface and is lower than one end of its third inclined surface in the third direction.

[0016] By adopting the above technical solution, the third inclined surface and the fourth inclined surface on both sides of the clamping ring are symmetrically arranged, and both extend outward from high to low. Adjacent clamping rings support the silicon wafer through the inclined surfaces relative to each other.

[0017] In some embodiments, the inclination angles of the third inclined surface, the fourth inclined surface and the second direction are both 20° to 40°.

[0018] By adopting the above technical solution, the inclination angles of the third inclined surface and the fourth inclined surface are in the range of 20° to 40°, which can accelerate the sliding speed of the silicon wafer on the third inclined surface and the fourth inclined surface and accelerate the correction speed of the correction device.

[0019] In some embodiments, the correction unit further includes a plurality of rubber rings, which are convexly disposed between adjacent clamping rings or between the first correction ring and the second correction ring.

[0020] By adopting the above technical solution, a plurality of rubber rings are protruded between adjacent clamping rings, or between the first correction ring and the second correction ring, for elastically protecting the silicon wafer to prevent it from being at a large tilt angle and affecting the correction process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional diagram of an embodiment of a correction device for a silicon wafer transmission device of the utility model;

[0022] Figure 2It is a top view of an embodiment of a correction device for a silicon wafer transmission device of the utility model;

[0023] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0024] Figure 4 It is a structural schematic diagram of a first correction ring and a second correction ring of an embodiment of a correction device for a silicon wafer transmission device of the utility model;

[0025] Figure 5 It is a partial structural schematic diagram of an embodiment of a correction device for a silicon wafer transmission device of the utility model;

[0026] Figure 6 This is a structural schematic diagram of a clamping ring of an embodiment of a correction device for a silicon wafer transmission device of the utility model;

[0027] In the figure:

[0028] 1-correction device of silicon wafer transmission device; 2-transmission roller; 30-first correction ring; 300-first inclined surface; 301-first vertical surface; 31-second correction ring; 310-second inclined surface; 311-second vertical surface; 32-first bearing space; 33-clamping ring; 330-third inclined surface; 331-fourth inclined surface; 34-second bearing space; 4-rubber ring; 5-silicon wafer. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0030] refer to Figure 1 to Figure 3 , Figure 1 A three-dimensional diagram of a correction device 1 for a silicon wafer transfer device provided by an embodiment of the utility model is shown; Figure 2 A top view of a correction device 1 of a silicon wafer transmission device provided by an embodiment of the utility model is shown; Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0031] like Figure 1 to Figure 3 As shown, the technical solution adopted by the utility model is a correction device 1 for a silicon wafer transmission device, comprising a plurality of transmission rollers 2 and a plurality of correction units, wherein the plurality of transmission rollers 2 are arranged along a first direction ( Figure 2 The transmission rollers 2 are arranged in a spaced relationship along the second direction ( Figure 1 X direction) and can extend along the circumferential direction ( Figure 1The first direction is perpendicular to the second direction and circumferentially surrounds the second direction.

[0032] A plurality of correction units are sleeved on each transmission roller 2 at intervals along the second direction, and each correction unit includes a first correction ring 30 and a second correction ring 31 that are arranged opposite to each other along the first direction.

[0033] The first correction ring 30 includes a first inclined surface 300, and the second correction ring 31 includes a second inclined surface 310. The first inclined surface 300 and the second inclined surface 310 are arranged to be inclined in opposite directions, and form a first bearing space 32, which is used to change the silicon wafer 5 from an inclined transmission state to a horizontal transmission state. The inclined transmission state is that the extension direction of the silicon wafer 5 is inclined with the first direction. The horizontal transmission state is that the extension direction of the silicon wafer 5 is the same as the first direction.

[0034] The correction device 1 of the silicon wafer transmission device provided by the utility model is arranged at the front end and the end of the transmission device to correct the position of the silicon wafer 5 entering and leaving the transmission device. In this way, even if the silicon wafer 5 is shifted in position during the transmission process, it can be corrected by the correction device at the end, so that the silicon wafer 5 can be in the expected horizontal transmission state to enter the next process, thereby improving the overall production efficiency.

[0035] The correction device 1 of the silicon wafer transmission device comprises a plurality of transmission rollers 2 and a plurality of correction units, each transmission roller 2 is sleeved with a plurality of correction units, each correction unit comprises a first correction ring 30 and a second correction ring 31 arranged oppositely along the second direction, the two correction rings are inclined with a first inclined surface 300 and a second inclined surface 310 in opposite directions, and the two inclined surfaces form a first bearing space 32. For the silicon wafer 5 in the horizontal transmission state, after entering the correction device, the silicon wafer 5 is transmitted in the transmission direction as the transmission roller 2 rotates, and finally moves out of the correction device and enters the next process. For the silicon wafer 5 in the inclined transmission state, after entering the correction device, one side of the silicon wafer 5 will be at a high position in the inclined surface, and the other side will be at a low position in the inclined surface, and the plurality of transmission rollers 2 push the silicon wafer 5 to contact with the plurality of correction units in turn, at this time, the silicon wafer 5 is driven by the inertia of the rotation of each transmission roller 2 and the inclined guiding action of the plurality of inclined surfaces, so that the silicon wafer 5 is corrected from the inclined transmission state to the horizontal transmission state.

[0036] refer to Figure 4 , Figure 4 The schematic diagram of the structure of the first correction ring 30 and the second correction ring 31 in the correction device 1 of the silicon wafer transmission device provided by the utility model is shown.

[0037] In some embodiments, reference Figure 4 , one end of the first inclined surface 300 close to the second inclined surface 310 is in the third direction ( Figure 1The first direction is shown in the Z direction, and the second direction is lower than the end away from the second inclined surface 310. The second inclined surface 310 is close to the end of the first inclined surface 300, and is lower than the end away from the first inclined surface 300 in the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

[0038] Exemplarily, the first inclined surface 300 and the second inclined surface 310 are relatively arranged from high to low, so that when the silicon wafer 5 is in a horizontal transmission state, there can be a certain gap with the transmission roller 2 below, thereby preventing the silicon wafer 5 from adhering to other impurities in the correction device.

[0039] In some embodiments, reference Figure 4 One end of the first correcting ring 30 along the second direction includes a first vertical surface 301, which extends along the third direction and is used to connect the first inclined surface 300 and the transmission roller 2; one end of the second correcting ring 31 along the second direction includes a second vertical surface 311, which extends along the third direction and is used to connect the second inclined surface 310 and the transmission roller 2.

[0040] Exemplarily, the first vertical surface 301 and the second vertical surface 311 are sections extending along the third direction and are used to connect the first inclined surface 300 and the transmission roller 2 , and the second vertical surface 311 is used to connect the second inclined surface 310 and the transmission roller 2 .

[0041] In some embodiments, reference Figure 4 The inclination angles of the first inclined surface 300 and the second inclined surface 310 with respect to the second direction are both 45°.

[0042] Exemplarily, the inclination angle of the first inclined surface 300 and the second inclined surface 310 is 45°, and this inclination angle can achieve stable sliding of the silicon wafer 5 within the first inclined surface 300 and the second inclined surface 310 .

[0043] refer to Figure 5 and Figure 6 , Figure 5 A partial structural schematic diagram of a correction device 1 for a silicon wafer transmission device provided by the utility model is shown; Figure 5 A schematic structural diagram of a clamping ring 33 in a correction device 1 of a silicon wafer transmission device provided by the utility model is shown.

[0044] In some embodiments, reference Figure 5 and Figure 6The correction device 1 of the silicon wafer transmission device further includes a plurality of clamping rings 33. The plurality of clamping rings 33 are arranged at intervals along the second direction, and each clamping ring 33 includes a third inclined surface 330 and a fourth inclined surface 331 at both ends along the second direction, and the third inclined surface 330 and the fourth inclined surface 331 are arranged obliquely in opposite directions. The third inclined surface 330 and the fourth inclined surface 331 of adjacent clamping rings 33 form a second carrying space 34 for transmitting the silicon wafer 5.

[0045] For example, in this embodiment, the first correction ring 30 and the second correction ring 31 are replaced by a plurality of clamping rings 33, and the two ends of each clamping ring 33 are provided with a third inclined surface 330 and a fourth inclined surface 331, and the third inclined surface 330 and the fourth inclined surface 331 are inclined in opposite directions. The third inclined surface 330 and the fourth inclined surface 331 of the adjacent clamping rings 33 form a second bearing space 34 for the transmission of the silicon wafer 5. For the silicon wafer 5 in the inclined transmission state, the inertia of the rotation of the transmission roller 2 and the gravity of the silicon wafer 5 itself, as well as the inclined guidance of the inclined surface, the silicon wafer 5 is corrected to a horizontal transmission state.

[0046] In some embodiments, reference Figure 5 and Figure 6 The end of the third inclined surface 330 of each holding ring 33 away from its fourth inclined surface 331 is lower in the third direction than the end close to the second inclined surface 310. The end of the fourth inclined surface 331 of each holding ring 33 away from its third inclined surface 330 is lower in the third direction than the end close to the third inclined surface 330.

[0047] Exemplarily, the third inclined surface 330 and the fourth inclined surface 331 on both sides of the clamping ring 33 are symmetrically arranged, and both extend outward from high to low, and adjacent clamping rings 33 support the silicon wafer 5 through the inclined surfaces relative to each other.

[0048] In some embodiments, reference Figure 5 and Figure 6 The inclination angles of the third inclined surface 330 and the fourth inclined surface 331 with respect to the second direction are both 20° to 40°.

[0049] Exemplarily, the third inclined surface 330 and the fourth inclined surface 331 have an inclination angle of 20° to 40° compared to the first inclined surface 300 and the second inclined surface 310. The inclination angle within this range can increase the sliding speed of the silicon wafer 5 in the third inclined surface 330 and the fourth inclined surface 331, and increase the correction speed of the correction device. In the present application, the inclination angle of the third inclined surface 330 and the fourth inclined surface 331 is 22°.

[0050] In some embodiments, reference Figure 5 and Figure 6The correction unit further includes a plurality of rubber rings 4. The plurality of rubber rings 4 are convexly disposed between adjacent clamping rings 33, or between the first correction ring 30 and the second correction ring 31.

[0051] Exemplarily, the rubber ring 4 is protruding between adjacent clamping rings 33, that is, below the first bearing space 32, or between the first correction ring 30 and the second correction ring 31, that is, below the second bearing space 34, for elastically protecting the silicon wafer 5 to prevent it from being at a large tilt angle and affecting the correction process.

[0052] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A correction device for a silicon wafer transfer device, characterized in that: include: A plurality of transmission rollers, wherein the plurality of transmission rollers are arranged at intervals along a first direction, each of the transmission rollers extends along a second direction and is capable of rotating in a circumferential direction; A plurality of correction units, wherein the plurality of correction units are sleeved on each of the transmission rollers at intervals along the second direction; each of the correction units comprises a first correction ring and a second correction ring which are arranged opposite to each other along the second direction; The first correction ring includes a first inclined surface, and the second correction ring includes a second inclined surface; the first inclined surface and the second inclined surface are inclined in opposite directions to form a first bearing space.

2. The correction device for a silicon wafer transfer device according to claim 1, characterized in that: One end of the first inclined surface close to the second inclined surface is lower than one end away from the second inclined surface in the third direction; one end of the second inclined surface close to the first inclined surface is lower than one end away from the first inclined surface in the third direction.

3. The correction device for a silicon wafer transfer device according to claim 2, characterized in that: One end of the first correcting ring along the second direction includes a first vertical surface, which extends along the third direction and is used to connect the first inclined surface and the transmission roller; one end of the second correcting ring along the second direction includes a second vertical surface, which extends along the third direction and is used to connect the second inclined surface and the transmission roller.

4. The correction device for a silicon wafer transfer device according to claim 1, characterized in that: The inclination angles of the first inclined surface, the second inclined surface and the second direction are both 45°.

5. The correction device for a silicon wafer transfer device according to claim 1, characterized in that: It also includes a plurality of clamping rings; the plurality of clamping rings are arranged at intervals along the second direction, and each of the clamping rings includes a third inclined surface and a fourth inclined surface at both ends along the second direction, and the third inclined surface and the fourth inclined surface are arranged obliquely in opposite directions; the third inclined surface and the fourth inclined surface of adjacent clamping rings form a second bearing space for correcting the transmission silicon wafer.

6. The correction device for a silicon wafer transfer device according to claim 5, characterized in that: The third inclined surface of each clamping ring is away from one end of its fourth inclined surface and is lower than one end close to the second inclined surface in the third direction; the fourth inclined surface of each clamping ring is away from one end of its third inclined surface and is lower than one end close to the third inclined surface in the third direction.

7. The correction device for a silicon wafer transfer device according to claim 5, characterized in that: The inclination angles of the third inclined surface, the fourth inclined surface and the second direction are both 20° to 40°.

8. The correction device for a silicon wafer transfer device according to claim 5, characterized in that: The correction unit further includes a plurality of rubber rings; the plurality of rubber rings are convexly arranged between adjacent clamping rings, or between the first correction ring and the second correction ring.

Images