Wafer transferring and transporting device

Abstract

The utility model provides a wafer transferring and transporting device. The wafer transferring and transporting device comprises a transporting frame, a supporting frame and a driving device, the placing box is detachably mounted on the transportation frame; the plurality of wafer placing assemblies are accommodated in the placing box, each wafer placing assembly comprises a base component and a transfer component, the transfer component is provided with an accommodating cavity for placing a wafer along the vertical direction, an adsorption part for adsorbing the wafer is arranged in the accommodating cavity, and the transfer component is detachably mounted on the base component; and the wafer is packaged in the accommodating cavity by the base component. According to the wafer transferring and transporting device, the problem that the wafer is damaged in the transferring process can be solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer transfer and transportation device and method. Background Art

[0002] During the wafer processing, the wafer needs to be transferred and transported, and during the wafer transfer and transportation process, a wafer transfer and transportation device needs to be used for transfer. In the related art, the wafer transfer and transportation device has certain defects during use, and it is easy to cause wafer damage during the transfer process. Utility Model Content

[0003] The present application provides a wafer transfer and transportation device, which can improve the problem of wafer damage during the transfer process.

[0004] The technical solutions provided in this application are as follows:

[0005] The present disclosure provides a wafer transfer and transportation device, comprising:

[0006] Transport rack;

[0007] A placement box, the placement box being detachably mounted on the transport rack;

[0008] A plurality of wafer placement assemblies are accommodated in the placement box, the wafer placement assemblies include a base component and a transfer component, the transfer component is provided with a receiving cavity for placing wafers in a vertical direction, the receiving cavity is provided with an adsorption portion for adsorbing wafers, the transfer component can be detachably mounted on the base component, and the base component encapsulates the wafer in the receiving cavity.

[0009] Exemplarily, the adsorption portion includes a plurality of suction holes arranged in the accommodating cavity, a vacuum air path is provided inside the transfer component, the vacuum air path is communicated with the suction holes to provide adsorption negative pressure to the suction holes, and a vacuum air pump is also provided on the transfer component, the vacuum air pump is communicated with the vacuum air path.

[0010] Exemplarily, a soft pad is further provided in the accommodating cavity, and the soft pad is constructed to be provided with an opening corresponding to the position of the suction hole.

[0011] Exemplarily, the plurality of air intake holes are arranged in a plurality of concentric circles with the center of the bottom of the accommodating cavity as the center.

[0012] Exemplarily, the transfer component includes a placement plate that can be arranged in a vertical direction, the accommodating cavity is arranged on a side of the placement plate arranged in the vertical direction, and the base component includes a bottom plate portion extending laterally and a side plate portion extending in the vertical direction, and the side plate portion cooperates with the bottom plate portion to form an assembly groove; wherein, the placement plate is vertically installed to the assembly groove and is arranged opposite to the side plate portion, and the opening of the accommodating cavity is arranged toward the side plate portion, so that the side plate portion cooperates with the placement plate to encapsulate the wafer in the accommodating cavity.

[0013] Exemplarily, the bottom plate portion is also provided with a guide portion extending in a vertical direction, and the placement plate is provided with a guide adapter portion adapted to the guide portion, and the guide portion and the guide adapter portion cooperate with each other to guide the placement plate to be inserted into or pulled out of the assembly groove in a vertical direction relative to the base component.

[0014] Exemplarily, a first magnetic component is provided on the bottom plate portion, and a second magnetic component is provided on the placement plate, and the first magnetic component and the second magnetic component attract each other so that the placement plate can be detachably mounted on the base component.

[0015] Exemplarily, a plurality of mounting units are provided on the transport rack, and the placement box is detachably connected to the mounting units.

[0016] Exemplarily, the bottom of the placement box is provided with a sliding portion extending along the first direction;

[0017] The mounting unit comprises a track member, the track member is provided with a slide rail portion extending along the first direction, the sliding portion and the slide rail portion are slidably matched, the slide rail portion is provided with a first stopper and a second stopper at opposite ends along the first direction, the second stopper is configured to be switchable between a stop position and an avoidance position, wherein:

[0018] When the second stopper is at the stopping position, the sliding portion cooperates with the slide rail portion, and opposite ends of the sliding portion along the second direction are stopped by the first stopper and the second stopper respectively, so as to fix the placement box;

[0019] When the second stopper is at the avoidance position, the sliding part slides out of or into the slide rail part via the end where the second stopper is located, so as to assemble or disassemble the placement box.

[0020] Exemplarily, a first elastic member is sleeved on the slide rail portion, the first stop member is fixed to the end of the slide rail portion, and when the second stop member is in the stop position, the first elastic member abuts between the first stop member and the sliding portion.

[0021] Exemplarily, a sliding channel is provided inside the track member, the sliding channel is located on the circumferential side of the slide rail portion, and the sliding channel extends axially along a second direction perpendicular to the slide rail portion; an adjustment rod is slidably provided in the sliding channel, and one end of the adjustment rod axially close to the slide rail portion extends out of the sliding channel and is connected to the second stop member; wherein, when the adjustment rod slides axially relative to the sliding channel, the second stop member is driven to switch between a stop position and an avoidance position.

[0022] Exemplarily, the sliding channel is provided with an installation cavity on a side close to the sliding rail portion, and a second elastic member is provided in the installation cavity. The second elastic member is constructed to be in a compressed state when the second stop member is in the avoidance position, so as to provide a restoring elastic force to the second stop member to move to the stop position.

[0023] Exemplarily, the sliding portion includes a protrusion arranged at the bottom of the placement box, the protrusion extends along the first direction, and a slide groove is provided on the protrusion, and the slide groove can be sleeved on the slide rail portion to slide with the slide rail portion; the relative two side edges extending along the first direction in the track member are respectively provided with limiting convex edges, and the limiting convex edges are used to limit the slide groove in the vertical direction.

[0024] The beneficial effects brought about by this application are as follows:

[0025] The wafer transfer and transportation device provided in the present application includes a transport rack, a placement box and multiple wafer placement assemblies, the multiple wafer placement assemblies can be accommodated in the placement box, the placement box can be detachably installed on the transport rack, and the wafers can be placed in the wafer placement assemblies to realize wafer transfer and transportation; wherein, the wafer placement assembly is constructed to include a base component and a transfer component, the transfer component is provided with a accommodating cavity, and the accommodating cavity is provided with an adsorption portion for adsorbing the wafer, and when the transfer component is installed on the base component, the base component can seal the wafer in the accommodating cavity. In this way, the wafer can be accommodated in the accommodating cavity of the transfer component, and an adsorption portion is arranged inside the accommodating cavity to adsorb and fix the wafer. The base component also cooperates with the accommodating cavity to encapsulate the wafer in the accommodating cavity, so that the wafer can be effectively fixed, thereby improving the stability of the wafer during the transfer and transportation process, so as to reduce the probability of damage to the wafer during the transfer process; and the transfer component and the base component can be detachably installed to facilitate the removal and placement of the wafer; in addition, the accommodating cavity and the adsorption portion arranged on the transfer component can be used to place the wafer in the accommodating cavity of the transfer component, and then the transfer component can be installed on the base component to achieve the purpose of placing the wafer in the placement box. Compared with the method of manually holding the wafer and placing it in the placement box in the prior art, damage to the wafer due to manual operation can be avoided.

[0026] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become readily understood. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, wherein:

[0028] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0029] Figure 1 Shown is a schematic structural diagram of a wafer transfer and transportation device provided by an embodiment of the present disclosure;

[0030] Figure 2 Shown is a schematic diagram of the exploded structure of a wafer placement assembly in a wafer transfer and transportation device provided by an embodiment of the present disclosure;

[0031] Figure 3 Shown is a cross-sectional schematic diagram of a wafer placement assembly in a wafer transfer and transportation device provided by an embodiment of the present disclosure;

[0032] Figure 4 The figure is a schematic structural diagram of a placement box and a mounting unit in a wafer transfer and transportation device provided by an embodiment of the present disclosure;

[0033] Figure 5 Said Figure 1 Middle A is a partial enlarged view;

[0034] Figure 6 Shown Figure 4 Partial enlargement of B.

[0035] Description of the numbers in the figure:

[0036] A. Accommodation cavity;

[0037] 100. Transport rack;

[0038] 110. Wheel;

[0039] 200, place box;

[0040] 300, wafer placement assembly;

[0041] 310, base member;

[0042] 320, transfer member;

[0043] 321, adsorption unit;

[0044] 3211, air intake hole;

[0045] 322. Vacuum air circuit;

[0046] 323. Vacuum air pump;

[0047] 324, soft cushion;

[0048] 3241. Open your mouth;

[0049] A1, cavity bottom;

[0050] 320', placing panels;

[0051] 311, bottom plate part;

[0052] 312, side panel part;

[0053] S, assembly slot;

[0054] 3110, guide part;

[0055] 325, guide adapter;

[0056] 312', guide rod;

[0057] 313. A first magnetic attraction member;

[0058] 326. a second magnetic attraction member;

[0059] 120. Installation unit;

[0060] 210, sliding part;

[0061] 121. Track parts;

[0062] 122. Slide rail;

[0063] 123. A first stopper;

[0064] 124. A second stopper;

[0065] 125. a first elastic member;

[0066] 126. Sliding channel;

[0067] 127. Adjustment rod;

[0068] 128, installation cavity;

[0069] 129. a second elastic member;

[0070] 211, raised portion;

[0071] 212. Chute;

[0072] 130. Limiting convex edge. DETAILED DESCRIPTION

[0073] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0074] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0075] like Figure 1 As shown, the wafer transfer and transportation device provided by the embodiment of the present disclosure includes a transport frame 100, a placement box 200 and a plurality of wafer placement assemblies 300. The placement box 200 is detachably mounted on the transport frame 100, and the plurality of wafer placement assemblies 300 are accommodated in the placement box 200. In one embodiment, wheels 110 may be provided at the bottom of the transport frame 100 to facilitate the transfer and transportation of wafers.

[0076] In one embodiment, a plurality of mounting units 120 are provided on the transport rack 100, and the placement box 200 can be detachably connected to the mounting unit 120. By providing the mounting unit 120, the placement box 200 can be disassembled or assembled to the mounting unit 120 to transport the wafer through the transport rack 100.

[0077] like Figure 2 As shown, in one embodiment, the wafer placement assembly 300 includes a base component 310 and a transfer component 320. The transfer component 320 is provided with a receiving cavity A for placing the wafer in a vertical direction. The receiving cavity A is provided with an adsorption portion 321 for adsorbing the wafer. The transfer component 320 can be detachably mounted on the base component 310, and the base component 310 encapsulates the wafer in the receiving cavity A.

[0078] The wafer placement assembly 300 is constructed to include a base component 310 and a transfer component 320. The transfer component 320 is provided with a receiving cavity A, and the receiving cavity A is provided with an adsorption portion 321 for adsorbing the wafer. When the transfer component 320 is installed on the base component 310, the base component 310 can encapsulate the wafer in the receiving cavity A.

[0079] The accommodating cavity A of the transfer component 320 can accommodate the wafer, and an adsorption portion 321 is provided inside the accommodating cavity A to adsorb and fix the wafer. The base component 310 also cooperates with the accommodating cavity A to encapsulate the wafer in the accommodating cavity A, thereby effectively fixing the wafer and improving the stability of the wafer during the transfer and transportation process to reduce the probability of damage to the wafer during the transfer process; and the transfer component 320 and the base component 310 are detachably installed to facilitate the placement and removal of the wafer.

[0080] A accommodating cavity A and an adsorption portion 321 are provided on the transfer member 320. After placing the wafer in the accommodating cavity A of the transfer member 320, the transfer member 320 can be installed on the base member 310 to achieve the purpose of placing the wafer in the placement box 200. Compared with the method of manually holding the wafer and placing it in the placement box 200 in the prior art, damage to the wafer due to manual operation can be avoided.

[0081] In one embodiment, the adsorption portion 321 includes a plurality of suction holes 3211 arranged in the accommodating cavity A. A vacuum air path 322 is provided inside the transfer member 320 . The vacuum air path 322 communicates with the suction holes 3211 to provide adsorption negative pressure to the suction holes.

[0082] By designing a vacuum air path 322 inside the moving component, the wafer is adsorbed and fixed by vacuum adsorption, and the structure is simple. Compared with other adsorption methods, the vacuum adsorption method can reduce the contact with the wafer surface; and the vacuum adsorption method is more convenient to control the switching between the adsorption state and the release state.

[0083] In other embodiments, the adsorption portion 321 may also be constructed as a structure of other adsorption methods.

[0084] In one embodiment, if Figure 2 As shown, a soft pad 324 is further provided in the accommodating cavity A. The soft pad 324 is configured to have an opening 3241 corresponding to the position of the suction hole 3211. The opening 3241 is used to allow the negative pressure of the suction hole 3211 to act on the wafer. By providing the soft pad 324, the risk of scratching the wafer surface can be reduced, and the opening 3241 on the soft pad 324 can also form a negative pressure cavity between the suction hole 3211 and the wafer surface to improve the adsorption effect.

[0085] In one embodiment, the soft pad 324 can be made of any suitable material such as silicone. The soft pad 324 can be attached to the bottom of the accommodating cavity A.

[0086] In one embodiment, one opening 3241 may be configured to correspond to one air suction hole 3211 , or one opening 3241 may correspond to a plurality of air suction holes 3211 .

[0087] In one embodiment, the opening 3241 may also be configured as a structure that is conducive to forming a negative pressure chamber. For example, the opening 3241 may also be configured as a bell-mouth shape to form a suction cup-like structure.

[0088] In one embodiment, the soft pad 324 may be adapted to the shape and size of the accommodating cavity A. For example, if the accommodating cavity A is circular, the soft pad 324 may also be circular and can be embedded in the accommodating cavity A.

[0089] In one embodiment, the plurality of air intake holes 3211 are arranged in a plurality of concentric circles with the center of the cavity bottom A1 of the accommodating cavity A as the center. Accordingly, the soft pad 324 may include a plurality of concentrically arranged raised portions 3240 , and the air intake holes 3211 are located between two adjacent raised portions 3240 .

[0090] Such an arrangement can be beneficial for uniform adsorption of the wafer in the circumferential direction to prevent the wafer from being damaged by uneven force and can improve adsorption stability.

[0091] In other embodiments, the plurality of air suction holes 3211 may also be arranged in other ways, for example, the plurality of air suction holes 3211 may also be arranged in an array on the cavity bottom A1.

[0092] In one embodiment, the accommodating cavity A is constructed to have the same shape as the wafer, so that the wafer is limited circumferentially by the accommodating cavity A; and the diameter of the accommodating cavity A is slightly larger than the size of the wafer, so that the wafer can be easily taken out of or placed into the accommodating cavity A.

[0093] In one embodiment, the transfer member 320 includes a placement plate 320' that can be arranged in a vertical direction, and the accommodating cavity A is arranged on the side of the placement plate 320' arranged in the vertical direction. The base member 310 includes a bottom plate portion 311 extending laterally and a side plate portion 312 extending in the vertical direction. The side plate portion 312 cooperates with the bottom plate portion 311 to form an assembly groove S; wherein the placement plate 320' is vertically installed to the assembly groove S and is arranged opposite to the side plate portion 312, and the opening 3241 of the accommodating cavity A is arranged toward the side plate portion 312, so that the side plate portion 312 cooperates with the placement plate 320' to encapsulate the wafer in the accommodating cavity A.

[0094] In this way, the bottom plate portion 311 and the side plate portion 312 of the base member 310 can be arranged in an L shape, and the placement plate 320' can be installed on the base member 310 and opposite to the side plate portion 312, so that the wafer can be clamped between the placement plate 320' and the side plate portion 312, that is, the wafer is encapsulated in the accommodating cavity A to ensure the stability of the wafer during transfer and reduce the shaking of the wafer; and, by utilizing two vertical plates, namely the placement plate 320' and the side plate portion 312, which occupy a smaller space, a larger number of wafers can be placed in the limited space in the placement box 200.

[0095] In other embodiments not shown, the specific structures of the base member 310 and the placement member are not limited thereto.

[0096] In one embodiment, a guide portion 3110 extending in a vertical direction is further provided on the bottom plate portion 311, and a guide adapter portion 325 adapted to the guide portion 3110 is provided on the placement plate 320'. The guide portion 3110 and the guide adapter portion 325 cooperate with each other to guide the placement plate 320' to be vertically inserted into or pulled out of the assembly groove S relative to the base member 310.

[0097] By setting the guiding part 3110 and the guiding adapter part 325, when the placement plate 320' is installed on the base member 310, it can guide the placement plate 320' and also limit the placement plate 320' during the wafer transfer process to prevent the placement plate 320' from separating from the base member 310.

[0098] In one embodiment, the guide portion 3110 may be a guide rod 312', and the guide adapter portion 325 may be a guide hole 325'. When the placement plate 320' is installed on the base member 310, after the bottom guide hole 325' of the placement plate 320' is aligned with the corresponding guide rod 312', the placement plate 320' is pressed downward in the vertical direction to complete the assembly of the base member 310 and the placement plate 320'. The assembly is convenient and the structure is simple.

[0099] In other embodiments not shown, the structures of the guide portion 3110 and the guide adapter portion 325 may also have other structures. For example, the guide portion 3110 may use a guide protrusion, and the guide adapter portion 325 may use a guide groove, etc. The structures of the guide portion 3110 and the guide adapter portion 325 are not limited to this.

[0100] In one embodiment, a first magnetic member 313 is disposed on the bottom plate portion 311 , and a second magnetic member 326 is disposed on the placement plate 320 ′. The first magnetic member 313 and the second magnetic member 326 attract each other so that the placement plate 320 ′ can be detachably mounted on the base member 310 .

[0101] The mutual attraction between the first magnetic member 313 and the second magnetic member 326 can further improve the stability between the placement plate 320 ′ and the base member 310 to further prevent the wafer from shaking, and the placement plate 320 ′ and the base member 310 are easy to disassemble and assemble.

[0102] In one embodiment, the first magnetic member 313 and the second magnetic member 326 are magnets with opposite polarities.

[0103] Figure 3FIG. 3 is a schematic diagram showing the structure of the transfer member 320 when it is installed on the base member 310. Figure 3 As shown, the base component 310 can package the wafer in the accommodating cavity A.

[0104] In one embodiment, if Figure 3 As shown, the transfer member 320 is also provided with a vacuum air pump 323, and the vacuum air pump 323 is connected to the vacuum air path 322. The above scheme is to arrange the vacuum air pump 323 in the structure of the transfer member 320 itself, which is conducive to structural simplification. In other embodiments, the vacuum air path 322 can also be arranged only on the transfer member 320, and the vacuum air pump 323 providing negative pressure can be located outside the transfer member 320.

[0105] In one embodiment, see Figure 4 As shown, the bottom of the placement box 200 is provided with a sliding portion 210 extending along the first direction X. The sliding portion 210 is used to slide with the mounting unit 120 to detachably mount the placement box 200 on the mounting unit 120 .

[0106] In one embodiment, if Figure 5 and Figure 6 As shown, the mounting unit 120 includes a track member 121, the track member 121 is provided with a slide rail portion 122 extending along a first direction X, and the slide rail portion 122 is provided with a first stop member 123 and a second stop member 124 at opposite ends along the first direction X, respectively, and the second stop member 124 is configured to be switchable between a stop position and an avoidance position; wherein,

[0107] When the second stopper 124 is at the stopping position, the sliding portion 210 cooperates with the slide rail portion 122, and the two opposite ends of the sliding portion 210 along the second direction Y are stopped by the first stopper 123 and the second stopper 124 respectively, so as to fix the placement box 200;

[0108] When the second stopper 124 is at the avoidance position, the sliding portion 210 slides out of or into the slide rail portion 122 via the end where the second stopper 124 is located, so as to assemble or disassemble the placement box 200 .

[0109] With the above design, when installing the placement box 200, the second stopper 124 can be manually operated or triggered by the placement box 200 to switch to the avoidance position. At this time, the sliding part 210 at the bottom of the placement box 200 starts to slide into the slide rail part 122 from one end, and continues to slide with the slide rail part 122 on the track part 121 until the other end of the sliding part 210 also slides into the slide rail part 122 and stops. At this time, the second stopper 124 can be manually operated or triggered by the placement box 200 to switch to the stop position, so that the sliding part 210 of the placement box 200 is stopped between the first stopper 123 and the second stopper 124, and the assembly of the placement box 200 is completed;

[0110] When disassembling the placement box 200, the second stopper 124 can be manually operated or triggered by the placement box 200 to switch to the avoidance position. At this time, the sliding part 210 at the bottom of the placement box 200 starts to slide out of the slide rail part 122 from one end, and continues to slide and cooperate with the slide rail part 122 on the track part 121 until the other end of the sliding part 210 also slides out of the slide rail part 122 and stops. At this time, the second stopper 124 can be manually operated or triggered by the placement box 200 to switch to the stop position, completing the disassembly of the placement box 200.

[0111] In one embodiment, the first elastic member 125 is sleeved on the rail portion 122, the first stopper 123 is fixed to the end of the rail portion 122, and when the second stopper 124 is in the stop position, the first elastic member 125 abuts between the first stopper 123 and the sliding portion 210. In this way, the first elastic member 125 can apply an elastic force to the sliding portion 210, and the sliding portion 210 is firmly clamped between the first stopper 123 and the second stopper 124, and under the elastic buffering effect of the first elastic member 125, the impact caused by the shaking of the placement box 200 can be reduced, thereby reducing the damage to the wafers during transportation.

[0112] In one embodiment, the first elastic member 125 includes any suitable elastic element such as a spring.

[0113] In one embodiment, the slide rail portion 122 is a slide bar or any other suitable structure.

[0114] In one embodiment, a sliding channel 126 is provided inside the track member 121, and the sliding channel 126 is located on the peripheral side of the slide rail portion 122, and the sliding channel 126 extends axially along the second direction Y perpendicular to the slide rail portion 122; an adjustment rod 127 is slidably provided in the sliding channel 126, and one end of the adjustment rod 127 axially close to the slide rail portion 122 extends out of the sliding channel 126 and is connected to the second stop member 124; wherein, when the adjustment rod 127 slides axially relative to the sliding channel 126, the second stop member 124 moves synchronously with the adjustment rod 127 to switch between the stop position and the avoidance position.

[0115] In this way, by setting a sliding channel 126 inside the track member 121, setting an adjusting rod 127 in the sliding channel 126, the end of the adjusting rod 127 is connected to the second stop member 124, so that when the adjusting member reciprocates along the sliding channel 126, it can drive the second stop member 124 to move between the stop position and the avoidance position.

[0116] In one embodiment, the sliding channel 126 is provided with an installation cavity 128 on one side close to the sliding rail portion 122, and a second elastic member 129 is provided in the installation cavity 128. The second elastic member 129 is constructed to be in a compressed state by the second stop member 124 when the second stop member 124 is in the avoidance position, so as to provide a reset elastic force to the second stop member 124 to move to the stop position.

[0117] In this way, when the placement box 200 is installed on the transport vehicle, the adjustment rod 127 can be operated by manual operation or the force can be applied to the second stop member 124 through the placement box 200, so that the adjustment rod 127 moves along the sliding channel 126, and the second stop member 124 moves to the avoidance position until the placement box 200 slides to the target position. After the external force on the adjustment rod 127 and the second stop member 124 is removed, the second stop member 124 automatically returns to the stop position under the action of the restoring elastic force of the second elastic member 129.

[0118] In one embodiment, the second elastic member 129 can be any suitable elastic element such as a spring.

[0119] In one embodiment, the sliding part 210 includes a protruding part 211 protruding from the bottom of the placement box 200, the protruding part 211 extends along the first direction X, and a slide groove 212 is provided on the protruding part 211, and the slide groove 212 can be sleeved on the slide rail part 122 to slide with the slide rail part 122; the two opposite sides of the track member 121 extending along the first direction X are respectively provided with limiting convex edges 130, and the limiting convex edges 130 are used to limit the slide groove 212 in the vertical direction. Through the cooperation between the slide groove 212 and the limiting convex edges 130, the placement box 200 can be limited in the vertical direction to further improve the stability during the wafer transfer process.

[0120] In one embodiment, protrusions 211 are provided on two opposite sides of the bottom of the placement box 200, and the openings 3241 of the slide slots 212 on the two sides are arranged facing each other, and correspondingly, limiting convex edges 130 are respectively provided on the opposite sides of the track member 121. In this way, the opposite sides of the placement box 200 can be limited to further improve the stability of the wafer.

[0121] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer transfer and transportation device, characterized in that: include: Transport rack (100); A placement box (200), the placement box (200) being detachably mounted on the transport rack (100); A plurality of wafer placement assemblies (300) are accommodated in the placement box (200), the wafer placement assemblies (300) comprising a base component (310) and a transfer component (320), the transfer component (320) being provided with a receiving cavity (A) for wafers to be placed along a vertical direction (Z), the receiving cavity (A) being provided with an adsorption portion (321) for adsorbing wafers, the transfer component (320) being detachably mounted on the base component (310), and the base component (310) encapsulating the wafers in the receiving cavity (A).

2. The wafer transfer and transportation device according to claim 1, characterized in that: The adsorption portion (321) includes a plurality of suction holes (3211) arranged in the accommodating cavity (A); a vacuum air path (322) is provided inside the transfer component (320); the vacuum air path (322) is communicated with the suction holes (3211) to provide adsorption negative pressure to the suction holes (3211); a vacuum air pump (323) is also provided on the transfer component (320); the vacuum air pump (323) is communicated with the vacuum air path (322).

3. The wafer transfer and transportation device according to claim 2, characterized in that: A soft pad (324) is also provided in the accommodating cavity (A), and the soft pad (324) is constructed to be provided with an opening (3241) corresponding to the position of the air suction hole (3211).

4. The wafer transfer and transportation device according to claim 2, characterized in that: The plurality of air suction holes (3211) are arranged in a plurality of circles in a concentric circle shape with the center of the bottom of the accommodating cavity (A) as the center of the circle.

5. The wafer transfer and transportation device according to claim 1, characterized in that: The transfer member (320) includes a placement plate (320') that can be arranged in the vertical direction (Z), the accommodating cavity (A) is arranged on the side of the placement plate (320') arranged along the vertical direction (Z), and the base member (310) includes a bottom plate portion (311) extending laterally and a side plate portion (312) extending along the vertical direction (Z), and the side plate portion (312) cooperates with the bottom plate portion (311) to form an assembly groove (S); wherein the placement plate (320') is installed in the vertical direction (Z) at the assembly groove (S) and is arranged opposite to the side plate portion (312), and the opening of the accommodating cavity (A) is arranged toward the side plate portion (312), so that the side plate portion (312) cooperates with the placement plate (320') to encapsulate the wafer in the accommodating cavity (A).

6. The wafer transfer and transportation device according to claim 5, characterized in that: The bottom plate portion (311) is also provided with a guide portion (3110) extending in a vertical direction (Z), and the placement plate (320') is provided with a guide adapter portion (325) adapted to the guide portion (3110), and the guide portion (3110) and the guide adapter portion (325) are guided and matched to guide the placement plate (320') to be inserted into or pulled out of the assembly groove (S) in a vertical direction (Z) relative to the base member (310).

7. The wafer transfer and transportation device according to claim 5, characterized in that: A first magnetic component (313) is provided on the bottom plate portion (311), and a second magnetic component (326) is provided on the placement plate (320'). The first magnetic component (313) and the second magnetic component (326) attract each other so that the placement plate (320') can be detachably mounted on the base component (310).

8. The wafer transfer and transportation device according to claim 1, characterized in that: The transport rack (100) is provided with a plurality of installation units (120), and the placement box (200) is detachably connected to the installation units (120).

9. The wafer transfer and transportation device according to claim 8, characterized in that: The bottom of the placement box (200) is provided with a sliding portion (210) extending along a first direction (X); The mounting unit (120) comprises a track member (121), the track member (121) is provided with a slide rail portion (122) extending along the first direction (X), the sliding portion (210) and the slide rail portion (122) are slidably matched, the slide rail portion (122) is provided with a first stop member (123) and a second stop member (124) at two opposite ends along the first direction (X), respectively, the second stop member (124) is configured to be switchable between a stop position and an avoidance position, wherein: When the second stopper (124) is at the stopping position, the sliding portion (210) cooperates with the slide rail portion (122), and opposite ends of the sliding portion (210) along the second direction (Y) are respectively stopped by the first stopper (123) and the second stopper (124), so as to fix the placement box (200); When the second stopper (124) is in the avoidance position, the sliding portion (210) slides out of or into the slide rail portion (122) via the end where the second stopper (124) is located, so as to disassemble and assemble the placement box (200).

10. The wafer transfer and transportation device according to claim 9, characterized in that: The slide rail portion (122) is sleeved with a first elastic member (125), the first stop member (123) is fixed to the end of the slide rail portion (122), and when the second stop member (124) is in the stop position, the first elastic member (125) abuts between the first stop member (123) and the slide portion.

11. The wafer transfer and transportation device according to claim 9, characterized in that: A sliding channel (126) is provided inside the track member (121), and the sliding channel (126) is located on the peripheral side of the slide rail portion (122), and the sliding channel (126) extends axially along a second direction (Y) perpendicular to the slide rail portion (122); an adjustment rod (127) is slidably inserted into the sliding channel (126), and one end of the adjustment rod (127) axially close to the slide rail portion (122) extends out of the sliding channel (126) and is connected to the second stop member (124); wherein, when the adjustment rod (127) slides axially relative to the sliding channel (126), it drives the second stop member (124) to switch between a stop position and an avoidance position.

12. The wafer transfer and transportation device according to claim 11, characterized in that: The sliding channel (126) is provided with an installation cavity (128) on a side close to the sliding rail portion (122), and a second elastic member (129) is provided in the installation cavity (128). The second elastic member (129) is constructed to be in a compressed state when the second stop member (124) is in the avoidance position, so as to provide a restoring elastic force to the second stop member (124) to move to the stop position.

13. The wafer transfer and transportation device according to claim 9, characterized in that: The sliding portion (210) comprises a protruding portion (211) arranged at the bottom of the placement box (200), the protruding portion (211) extending along the first direction (X), and a slide groove (212) is arranged on the protruding portion (211), and the slide groove (212) can be sleeved on the slide rail portion (122) to slide with the slide rail portion (122); the two opposite side edges of the track member (121) extending along the first direction (X) are respectively provided with limiting convex edges (130), and the limiting convex edges (130) are used to limit the slide groove (212) in the vertical direction (Z).

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