Sucker device

Abstract

The utility model discloses a sucker device which comprises a sucker body and a connecting plate connected with the sucker body in a sleeved mode, and the sucker body is used for adsorbing a silicon wafer. A conductive structure is arranged on the side, close to the silicon wafer, of the connecting plate and used for eliminating static electricity on the surface of the silicon wafer, and the orthographic projection of the suction cup body and the orthographic projection of the conductive structure are not overlapped in the thickness direction of the connecting plate. One side, away from the silicon wafer, of the connecting plate is provided with a support member; at least one end of the conductive structure is connected with the support member; according to the utility model, the dismounting and maintenance time of the suction cup device can be shortened, the dismounting and maintenance difficulty of the suction cup device is reduced, the manufacturing and use cost of the suction cup device is reduced, the added conductive structure can eliminate static electricity of a silicon wafer, normal work of a machine table is prevented from being influenced, the failure rate of the machine table is reduced, and the production efficiency is improved. And the stability and the productivity of the machine are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, and more specifically, to a suction cup device. Background Art

[0002] Solar cells are devices that can convert solar energy into electrical energy. In the process of manufacturing solar cells, single crystal silicon rods need to be cut into raw silicon wafers. The raw silicon wafers are made into silicon wafers to be processed through processes such as polishing, cleaning, and sorting. The silicon wafers to be processed are made into solar cells through a series of process treatments.

[0003] In the sorting process, silicon wafers are usually sorted using an automatic silicon wafer sorting machine. The automatic silicon wafer sorting machine is provided with a suction cup device. The suction cup on the existing suction cup device is a Bernoulli suction cup. The Bernoulli suction cup has the problem of occasional static electricity during use, which will cause problems such as skewed suction and failure to put down the silicon wafer in time after sucking it, resulting in abnormal placement / removal of the wafer. At the same time, after a certain period of use, it is necessary to replace the buffer pad on the suction cup, or even replace the entire suction cup. When replacing the suction cup, it is necessary to use a hot air gun to remove the buffer pad on the suction cup, and at the same time, the entire suction cup device is dismantled. The disassembly and assembly process of the suction cup device in the prior art is very time-consuming, which affects the utilization rate of the machine. At the same time, the existing suction cup does not have a structure that can eliminate static electricity. The suction cup is prone to generate static electricity during the working process, which affects the normal operation of the machine, causing the machine failure rate and maintenance cost to increase, making it impossible to break through the machine production capacity. Therefore, it is a technical problem that needs to be solved in this field. Utility Model Content

[0004] In view of this, the utility model provides a suction cup device, which is used to shorten the time and difficulty of the suction cup device disassembly and assembly process and eliminate static electricity.

[0005] The present application provides a suction cup device, comprising a suction cup body and a connecting plate sleeved with the suction cup body, wherein the suction cup body is used to absorb a silicon wafer;

[0006] A conductive structure is provided on one side of the connecting plate close to the silicon wafer, and the conductive structure is used to eliminate static electricity on the surface of the silicon wafer. Along the thickness direction of the connecting plate, the orthographic projection of the suction cup body and the orthographic projection of the conductive structure do not overlap;

[0007] A support member is arranged on a side of the connection plate away from the silicon wafer, and at least one end of the conductive structure is connected to the support member.

[0008] Optionally, the conductive structure includes a first sub-conductive structure and a second sub-conductive structure, and an extension direction of the first sub-conductive structure intersects with an extension direction of the second sub-conductive structure.

[0009] Optionally, the first sub-conductive structure and the second sub-conductive structure form a tic-tac-toe structure.

[0010] Optionally, the support member includes at least two support pillars, and the first sub-conductive structure and / or the second sub-conductive structure is electrically connected to the at least two support pillars.

[0011] Optionally, a buffer structure is provided on a side of the connecting plate close to the silicon wafer;

[0012] Along the thickness direction of the connecting plate, the orthographic projection of the first sub-conductive structure and / or the orthographic projection of the second sub-conductive structure does not overlap with the orthographic projection of the buffer structure.

[0013] Optionally, a gasket is provided on one side of the suction cup body close to the silicon wafer, and along the thickness direction of the connecting plate, the upper surface of the gasket is flush with the upper surface of the buffer structure.

[0014] Optionally, along the thickness direction of the connecting plate, the cross-sectional shape of the gasket is triangular.

[0015] Optionally, a fixing plate is connected to a side of the support member away from the connecting plate, and along the thickness direction of the connecting plate, the orthographic projection of the fixing plate is located within the orthographic projection of the connecting plate.

[0016] Optionally, a reducer is arranged on a side of the fixing plate away from the suction cup body, and the reducer is connected to the fixing plate via a reducer connecting piece.

[0017] Optionally, the reducer includes a reducer connector, which is connected to the suction cup body through a reducer connector.

[0018] Compared with the prior art, the suction cup device provided by the utility model achieves at least the following beneficial effects:

[0019] The suction cup device provided by the utility model comprises a suction cup body and a connecting plate which is sleeved with the suction cup body, the suction cup body is used for adsorbing silicon wafers; a conductive structure is arranged on the side of the connecting plate close to the silicon wafer, the conductive structure is used for eliminating static electricity on the surface of the silicon wafer, and along the thickness direction of the connecting plate, the orthographic projection of the suction cup body and the orthographic projection of the conductive structure do not overlap; a supporting member is arranged on the side of the connecting plate away from the silicon wafer, at least one end of the conductive structure is connected to the supporting member; adopting the above scheme, the disassembly and maintenance time of the suction cup device can be shortened, the difficulty of disassembly and maintenance of the suction cup device can be reduced, and the manufacturing and use cost of the suction cup device can be reduced. At the same time, the added conductive structure can eliminate static electricity on the silicon wafer, avoid affecting the normal operation of the machine, reduce the failure rate of the machine, and improve the stability and production capacity of the machine.

[0020] Of course, any product implementing the present utility model does not necessarily need to achieve all of the above-mentioned technical effects at the same time.

[0021] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0023] Figure 1 It is a structural schematic diagram of a suction cup device provided by the utility model in one direction;

[0024] Figure 2 It is a structural schematic diagram of a suction cup body provided by the utility model in one direction;

[0025] Figure 3 yes Figure 2 A schematic diagram of the structure of the middle suction cup body in another direction;

[0026] Figure 4 This is an assembly diagram of a suction cup device and a silicon wafer provided by the utility model;

[0027] Figure 5 It is an exploded view of a part of the suction cup device provided by the utility model;

[0028] Figure 6 It is a top view of a suction cup body and a gasket provided by the utility model;

[0029] Figure 7 It is an exploded view of another partial suction cup device provided by the utility model;

[0030] Figure 8 It is a structural schematic diagram of a reducer connecting piece provided by the utility model;

[0031] Fig. 9 It is a structural schematic diagram of a part of the suction cup device provided by the utility model;

[0032] Fig.10 yes Figure 1 A schematic diagram of the structure of the middle suction cup device in another direction. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0035] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0036] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0037] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] Reference Figure 1-Figure 5 , Figure 1 It is a structural schematic diagram of a suction cup device provided by the utility model in one direction; Figure 2 It is a structural schematic diagram of a suction cup body provided by the utility model in one direction;

[0039] Figure 3 yes Figure 2 A schematic diagram of the structure of the middle suction cup body in another direction; Figure 4 This is an assembly diagram of a suction cup device and a silicon wafer provided by the utility model; Figure 5 It is an exploded view of a part of a suction cup device provided by the utility model. This embodiment provides a suction cup device, including a suction cup body 1 and a connecting plate 2 connected to the suction cup body 1, the suction cup body 1 is used to adsorb the silicon wafer 00; the connecting plate 2 is provided with a conductive structure 3 on the side close to the silicon wafer 00, the conductive structure 3 is used to eliminate static electricity on the surface of the silicon wafer 00, along the thickness direction X of the connecting plate 2, the orthographic projection of the suction cup body 1 and the orthographic projection of the conductive structure 3 do not overlap; the connecting plate 2 is provided with a support member 4 on the side away from the silicon wafer 00, and at least one end of the conductive structure 3 is connected to the support member 4.

[0040] Specifically, combined Figure 1-Figure 4As shown, the suction cup device provided in this embodiment includes a suction cup body 1 and a connecting plate 2 sleeved with the suction cup body 1, the suction cup body 1 includes a first area 11 and a second area 12 connected to the first area 11, the second area 12 is located on the side of the first area 11 away from the silicon wafer 00, along the thickness direction X of the connecting plate 2, the orthographic projection of the second area 12 is located within the orthographic projection of the first area 11, the shape of the first area 11 can be approximately cylindrical, the shape of the second area 12 can be cylindrical, the first area 11 is used to absorb the silicon wafer 00, the second area 12 is used to connect with the control device (not shown in the figure), and the second area 12 receives a signal from the control device to control the first area 11. The opening and closing of area 11, the adjustment of suction force, etc.; the working principle of the suction cup body 1 is as follows: the side of the suction cup body 1 away from the silicon wafer 00 is connected to the control device (not shown in the figure), and the side of the suction cup body 1 close to the silicon wafer 00 is in contact with the silicon wafer 00, and the control device draws air to form a negative air pressure inside the suction cup body 1, thereby firmly sucking the silicon wafer 00. When the suction cup body 1 drives the silicon wafer 00 to be transferred to the destination (such as a flower basket for storing the silicon wafer 00), the control device inflates the suction cup body 1, so that the negative air pressure inside the suction cup body 1 becomes zero air pressure or a smaller positive air pressure, and the silicon wafer 00 is detached from the suction cup body 1, thereby completing the adsorption and movement of the silicon wafer 00.

[0041] Combination Figure 1 , Figure 4-Figure 5As shown, an opening 21 is provided on the connecting plate 2, and the opening 21 penetrates the connecting plate 2 along the thickness direction X of the connecting plate 2. The opening 21 can be located in the middle of the connecting plate 2. When the suction cup body 1 and the connecting plate 2 are connected, the orthographic projection of the suction cup body 1 is located within the orthographic projection of the opening 21 along the thickness direction X of the connecting plate 2; when the suction cup body 1 absorbs the silicon wafer 00, along the thickness direction X of the connecting plate 2, the orthographic projection of the connecting plate 2 and the orthographic projection of the silicon wafer 00 at least partially overlap, along the thickness direction X of the connecting plate 2, the orthographic projection of the connecting plate 2 can be approximately square, and the orthographic projection of the silicon wafer 00 can be square, and the shapes of the two match each other. By setting the connecting plate 2, the contact area between the suction cup device and the silicon wafer 00 can be increased, ensuring that the suction force on the silicon wafer 00 is more uniform, avoiding problems such as falling off and breaking of the wafer; the suction cup body 1 can be a non-contact vacuum suction cup, and the model that can be selected is SNT-60. -S, the material of the connecting plate 2 can be glass, and the glass material can be acrylic. Acrylic (also known as PMMA or organic glass), with the chemical name of polymethyl methacrylate, is an important plastic polymer material developed earlier, and has the advantages of good transparency, high chemical stability and weather resistance, easy dyeing, easy processing, and beautiful appearance. The materials that can be selected for the connecting plate 2 include but are not limited to the above, and are not limited here; it should also be noted that the suction cup device in the prior art is a larger Bernoulli suction cup, and there is no connecting plate. The suction cup device provided in this embodiment includes a suction cup body 1 and a connecting plate 2 that is socketed with the suction cup body 1. The volume of the suction cup body 1 is much smaller than that of the Bernoulli suction cup. By socketing the suction cup body 1 and the connecting plate 2 with each other, the disassembly and maintenance time of the suction cup device can be shortened, the difficulty of disassembly and maintenance of the suction cup device is reduced, and the manufacturing and use costs of the suction cup device are reduced.

[0042] Combination Figure 1 , Figure 4As shown, a conductive structure 3 is provided on the side of the connecting plate 2 close to the silicon wafer 00. When the suction cup body 1 adsorbs the silicon wafer 00, the conductive structure 3 is used to eliminate static electricity on the surface of the silicon wafer 00. Along the thickness direction X of the connecting plate 2, the orthographic projection of the suction cup body 1 and the orthographic projection of the conductive structure 3 do not overlap. This arrangement can avoid the conductive structure 3 from interfering with the suction cup body 1 adsorbing the silicon wafer 00. A support member 4 is provided on the side of the connecting plate 2 away from the silicon wafer 00. The conductive structure 3 is made of a conductive material. The support member 4 is electrically connected to the conductive structure 3. The support member 4 can conduct away the static electricity on the conductive structure 3, thereby eliminating the static electricity on the silicon wafer 00. The conductive structure 3 can be conductive. Tape, conductive tape is a metal foil or conductive cloth with a highly conductive backing adhesive. Its conductive backing adhesive and conductive substrate form a complete conductor that can be bonded to multiple surfaces. The conductive tape provides a reliable grounding surface and provides electrical contact for surfaces that cannot be welded. Part of the conductive structure 3 is bonded to the connecting plate 2. The conductive tape has the advantages of low price and easy fixation. At least one end of the conductive structure 3 is connected to the support 4. The conductive structure 3 can be wrapped around and pasted on the support 4. Through the cooperation between the conductive structure 3 and the support 4, the static electricity generated by the silicon wafer 00 when being adsorbed by the suction cup device can be eliminated, thereby reducing the frequency of equipment failures.

[0043] The suction cup device provided in this embodiment can be applied to an automatic silicon wafer sorting machine (not shown in the figure). The automatic silicon wafer sorting machine is a machine that can automatically judge the quality of silicon wafers. Its work content includes grading silicon wafers. After each silicon wafer passes through the automatic silicon wafer sorting machine, silicon wafers of different grades are sorted into different flower baskets, thereby distinguishing silicon wafers of different grades. The automatic silicon wafer sorting machine is provided with a suction cup device, which is used to absorb silicon wafers and complete the transmission of silicon wafers. The suction cup on the existing suction cup device is a Bernoulli suction cup. Bernoulli The suction cup is an integrated structure and cannot be disassembled and changed. The Bernoulli suction cup is prone to deformation and cannot work properly. When sucking silicon wafers of different specifications (for example, the side length of the silicon wafer is 182mm, 183mm or 210mm), the Bernoulli suction cup needs to be replaced as a whole. At the same time, after the Bernoulli suction cup has been working for a period of time, the buffer pad on the side of the Bernoulli suction cup close to the silicon wafer will be severely worn, causing the silicon wafer to slip on the Bernoulli suction cup during the suction rotation process and cannot be normally transferred to the structure such as the flower basket. The material of the buffer pad is not wear-resistant enough, and the design requires it to be attached to the Bernoulli suction cup. The buffer pad is difficult to replace, and a lot of time will be frequently spent on disassembling the Bernoulli suction cup to replace the buffer pad on the suction cup and clean the glue on the buffer pad. In addition, since the overall structural design of the existing suction cup device is complex, and the suction cup device does not have the function of eliminating static electricity, the suction cup device of the prior art in this field is also prone to generate static electricity during the working process, affecting the normal operation of the machine, causing the machine failure rate and maintenance cost to increase, and making it impossible to break through the machine's production capacity. In order to achieve convenient suction cup replacement, it is necessary to select a more wear-resistant buffer pad and avoid static electricity and other problems. Therefore, the suction cup device needs to be redesigned. The suction cup device provided in this embodiment has a simple structure and can be disassembled and changed. When sucking silicon wafers of different specifications, the suction cup body 1 can be retained, and only the specifications of the connecting plate 2 can be changed. This embodiment improves the structure of the suction cup device, changes the material of the buffer pad, and adds a static electricity removal device. It can greatly reduce the use cost and replacement difficulty and reduce the failure rate of the machine.

[0044] Compared with the prior art, the suction cup device provided in this embodiment achieves at least the following beneficial effects:

[0045] The suction cup device provided in this embodiment includes a suction cup body and a connecting plate that is socketed with the suction cup body, the suction cup body is used to adsorb the silicon wafer; a conductive structure is provided on the side of the connecting plate close to the silicon wafer, the conductive structure is used to eliminate static electricity on the surface of the silicon wafer, and along the thickness direction of the connecting plate, the orthographic projection of the suction cup body and the orthographic projection of the conductive structure do not overlap; a support is provided on the side of the connecting plate away from the silicon wafer, and at least one end of the conductive structure is connected to the support; adopting the above scheme, the disassembly and maintenance time of the suction cup device can be shortened, the difficulty of disassembly and maintenance of the suction cup device can be reduced, and the manufacturing and use costs of the suction cup device can be reduced. At the same time, the added conductive structure can eliminate static electricity on the silicon wafer to avoid affecting the normal operation of the machine, reduce the failure rate of the machine, and improve the stability and production capacity of the machine.

[0046] In an optional embodiment, the conductive structure 3 includes a first sub-conductive structure 31 and a second sub-conductive structure 32 , and an extension direction of the first sub-conductive structure 31 intersects with an extension direction of the second sub-conductive structure 32 .

[0047] Specifically, refer to Figure 1 As shown, the conductive structure 3 may include a first sub-conductive structure 31 and a second sub-conductive structure 32. The first sub-conductive structure 31 and the second sub-conductive structure 32 both play a conductive role. The number of the first sub-conductive structure 31 and the second sub-conductive structure 32 may be multiple. In this embodiment, the number of the first conductive structure 31 may be two, the two first conductive structures 31 are parallel to each other, and the suction cup body 1 is located between the two first conductive structures 31. The number of the second conductive structure 32 may be two, the two second conductive structures 32 are parallel to each other, and the suction cup body 1 is located between the two second conductive structures 32. 1 intersects with the extension direction of the second sub-conductive structure 32. Optionally, the extension direction of the first sub-conductive structure 31 and the extension direction of the second sub-conductive structure 32 are perpendicular to each other. In this embodiment, the first sub-conductive structure 31 and the second sub-conductive structure 32 are arranged in the above manner, which can not only eliminate the static electricity on the surface of the silicon wafer from multiple angles, but also speed up the rate of eliminating the static electricity generated by the silicon wafer, and at the same time enhance the static electricity elimination ability of the suction cup device for the silicon wafer. The number, installation position, etc. of the first sub-conductive structure 31 and the second sub-conductive structure 32 can be adaptively adjusted according to actual conditions and are not limited here.

[0048] In an optional embodiment, the first sub-conductive structure 31 and the second sub-conductive structure 32 form a tic-tac-toe structure.

[0049] Specifically, refer to Figure 1As shown, along the thickness direction X of the connecting plate 2, the orthographic projection of the first sub-conductive structure 31 and the orthographic projection of the second sub-conductive structure 32 can both be rectangles, and a tic-tac-toe structure is formed between the first sub-conductive structure 31 and the second sub-conductive structure 32, and the suction cup body 1 is located in the middle of the tic-tac-toe structure. This arrangement ensures that static electricity on the surface of the silicon wafer can be eliminated from multiple angles, thereby increasing the static electricity elimination capability of the suction cup device.

[0050] In an optional embodiment, the support member 4 includes at least two support pillars 41 , and the first sub-conductive structure 31 and / or the second sub-conductive structure 32 are electrically connected to the at least two support pillars 41 .

[0051] Specifically, refer to Figure 4 As shown, the support member 4 includes at least two support columns 41, and the support columns 41 are located on the side of the connecting plate 2 away from the silicon wafer 00. The support columns 41 can extend along the thickness direction X of the connecting plate 2. Along the thickness direction X of the connecting plate 2, the orthographic projection of the support columns 41 is located within the orthographic projection of the connecting plate 2. The material of the support columns 4 can be metal. The support columns 41 can be used to support the connecting plate 2 to prevent the connecting plate 2 from falling. At the same time, since the support columns 41 are electrically connected to the conductive structure 3, the support columns 41 can conduct away the static electricity of the silicon wafer 00 adsorbed by the conductive structure 3 and release it in the air, thereby eliminating the static electricity on the surface of the silicon wafer 00; the number of support columns 41 can be four, and the four support columns 41 can be arranged in an array. The array is an arrangement of mathematical elements arranged in rows and columns. Every two adjacent support columns 41 can extend along the extension direction of the side length of the connecting plate 2. The four support columns 41 can be located at the four vertices of a square, and the plane where the square is located is perpendicular to the thickness direction X of the connecting plate 2.

[0052] Continue to combine Figure 5 As shown, a connecting hole 22 is provided on the connecting plate 2, and the connecting hole 22 penetrates the connecting plate 2 along the thickness direction X of the connecting plate 2. A supporting upper hole (not shown in the figure) is provided on the support column 41 close to the connecting plate 2. The supporting upper hole penetrates at least part of the supporting column 41 along the thickness direction X of the connecting plate 2. The upper screw 001 passes through the connecting hole 22 and the supporting upper hole in sequence, and the fixed connection between the connecting plate 2 and the support column 41 is completed through the cooperation between the upper screw 001, the connecting hole 22 and the supporting upper hole.

[0053] Continue to combine Figure 1 , Figure 4As shown, in this embodiment, the total number of the first sub-conductive structures 31 and the second sub-conductive structures 32 and the total number of the support pillars 41 can be four. Since at least one end of the conductive structure 3 is connected to the support member 4, each first sub-conductive structure 31 can correspond to a support pillar 41, and one end of a first sub-conductive structure 31 can be wrapped around the back side of the connecting plate 2 (the side away from the silicon wafer 00) and connected to a support pillar 41, and the other end of the same first sub-conductive structure 31 can be attached to the front side of the connecting plate 2 (the side close to the silicon wafer 00), and each second sub-conductive structure 32 can correspond to a support pillar 41, and one end of a second sub-conductive structure 32 can be wrapped around the back side of the connecting plate 2 (the side away from the silicon wafer 00). The conductive structure 3 absorbs the static electricity generated by the silicon wafer 00, and the support column 41 electrically connected to the conductive structure 3 can conduct the static electricity of the silicon wafer 00 adsorbed by the conductive structure 3, and finally release it into the air, thereby eliminating the static electricity on the surface of the silicon wafer 00. By setting a one-to-one correspondence between the conductive structure 3 and the support column 41, the effect of eliminating the static electricity on the surface of the silicon wafer 00 can be enhanced. In other embodiments, the number of the first sub-conductive structure 31, the second sub-conductive structure 32 and the support column 41 can be adaptively adjusted according to actual conditions, and is not limited here.

[0054] In an optional embodiment, a buffer structure 5 is provided on the side of the connecting plate 2 close to the silicon wafer 00; along the thickness direction X of the connecting plate 2, the orthographic projection of the first sub-conductive structure 31 and / or the orthographic projection of the second sub-conductive structure 32 does not overlap with the orthographic projection of the buffer structure 5.

[0055] Specifically, combined Figure 1 , Figure 4 As shown, a buffer structure 5 is provided on the side of the connecting plate 2 close to the silicon wafer 00. The material of the buffer structure 5 can be PVC adhesive cloth. PVC (polyvinyl chloride) is the third largest synthetic polymer plastic in the world (after polyethylene and polypropylene). PVC has the advantages of wear resistance, high pressure and high temperature resistance, long service life, easy installation, economical and practical, waterproof and moisture-proof, chemical corrosion resistance, aging resistance, easy welding and bonding. The PVC adhesive cloth can be fixed on the connecting plate 2 by glue. Compared with the Teflon spray rubber gasket in the prior art, the buffer structure 5 provided in this embodiment has the advantages of lower cost, higher wear resistance and more lasting use effect.

[0056] Reference Figure 1As shown, a buffer structure 5 can be located between two adjacent first sub-conductive structures 31, and a buffer structure 5 can also be located between two adjacent second sub-conductive structures 32. The shape of the buffer structure 5 can be a flat plate structure. Along the thickness direction X of the connecting plate 2, the orthographic projection of the first sub-conductive structure 31 can not overlap with the orthographic projection of the buffer structure 5, and the orthographic projection of the second sub-conductive structure 32 can not overlap with the orthographic projection of the buffer structure 5. This arrangement can ensure that the setting of the buffer structure 5 does not affect the effect of eliminating static electricity on the surface of the silicon wafer.

[0057] Optional, please continue to refer to Figure 1 In this embodiment, along the thickness direction X of the connecting plate 2, the thickness of the buffer structure 5 ranges from 1.5 mm to 2 mm.

[0058] This embodiment explains that the buffer structure 5 has a certain thickness along the thickness direction X of the connecting plate 2 to achieve the buffering effect on the silicon wafer when the suction cup device absorbs the silicon wafer. The thickness range of the buffer structure 5 can be 1.5mm-2mm. For example, along the thickness direction X of the connecting plate 2, the thickness of the buffer structure 5 can be 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2mm, etc., so as to avoid the waste of cost when the thickness of the buffer structure 5 is too thick, and also avoid the buffer structure 5 not having the effect of buffering the silicon wafer when the thickness is too thin. Therefore, this embodiment sets the thickness range of the buffer structure 5 along the thickness direction X of the connecting plate 2 to 1.5mm-2mm, which can avoid the waste of cost while ensuring the buffering effect of the suction cup device on the silicon wafer when the silicon wafer is absorbed.

[0059] In an optional embodiment, a gasket 6 is provided on one side of the suction cup body 1 close to the silicon wafer 00 , and along the thickness direction X of the connecting plate 2 , the upper surface of the gasket 6 is flush with the upper surface of the buffer structure 5 .

[0060] Specifically, combined Figure 1 , Figure 4As shown, a gasket 6 is arranged on one side of the suction cup body 1 close to the silicon wafer 00. The material of the gasket 6 can be plastic. The plastic material can be POM or PVC rubber cloth. POM (abbreviation: polyoxymethylene), also known as acetal resin, polyoxymethylene, polyacetal, is a thermoplastic crystalline polymer, known as "super steel" or "saigang". POM has the advantages of high mechanical strength and rigidity, strong resistance to repeated impact, good elasticity, good wear resistance, good electrical insulation, etc. PVC (polyvinyl chloride, Polyvinyl Chloride) is the third largest synthetic polymer plastic in the world (after polyethylene and polypropylene). PVC has the advantages of wear resistance, durability, resistance to high pressure and high temperature, long service life, easy installation, economical and practical, waterproof and moisture-proof, chemical corrosion resistance, anti-aging, easy welding and bonding. The PVC adhesive cloth can be fixed on the suction cup body 1 by glue. The plastic material that can be selected includes but is not limited to this, which is not limited here. In addition, the material of the gasket 6 can also be SMT docking station belt. The SMT docking station belt is a belt used to connect between docking stations. It can be composed of rubber, nylon and other materials. The SMT docking station belt has the advantages of wear resistance, tension resistance, good anti-static effect, etc.; the gasket 6 can be pasted on the connecting plate 2 with 3M adhesive. The 3M adhesive has the advantages of strong adhesiveness, stable adhesion, hidden fitting effect, etc.; the gasket 6 provided in this embodiment has the advantages of lower cost, higher wear resistance, more durable use effect, and longer service life of the suction cup body 1 compared with the Teflon spray rubber gasket in the prior art.

[0061] Combination Figure 1 , Figure 4 As shown, along the thickness direction X of the connecting plate 2, the upper surface of the gasket 6 is flush with the upper surface of the buffer structure 5. This arrangement ensures that when the suction cup device adsorbs the silicon wafer 00, the gasket 6 and the buffer structure 5 can contact the silicon wafer 00 at the same time, thereby enhancing the buffering effect on the silicon wafer 00. At the same time, the gasket 6 and the buffer structure 5 can support the silicon wafer 00 from multiple angles, thereby preventing the silicon wafer 00 from being damaged or even broken due to uneven force.

[0062] Optional, please continue to refer to Figure 1 In this embodiment, along the thickness direction X of the connecting plate 2, the thickness of the gasket 6 ranges from 1.5 mm to 2 mm.

[0063] This embodiment explains that the gasket 6 has a certain thickness along the thickness direction X of the connecting plate 2 to achieve the buffering effect on the silicon wafer when the suction cup device absorbs the silicon wafer. The thickness range of the gasket 6 can be 1.5mm-2mm. For example, along the thickness direction X of the connecting plate 2, the thickness of the gasket 6 can be 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2mm, etc., so as to avoid the waste of cost when the thickness of the gasket 6 is too thick, and also avoid the gasket 6 not having a buffering effect on the silicon wafer when the thickness is too thin. Therefore, this embodiment sets the thickness range of the gasket 6 along the thickness direction X of the connecting plate 2 to 1.5mm-2mm, which can avoid the waste of cost while ensuring the buffering effect of the suction cup device on the silicon wafer when the silicon wafer is absorbed.

[0064] Figure 6 It is a top view of a suction cup body and a gasket provided by the utility model. In an optional embodiment, along the thickness direction X of the connecting plate 2, the cross-sectional shape of the gasket 6 is a triangle.

[0065] Specifically, combined Figure 1 , Figure 4 As shown, along the thickness direction X of the connecting plate 2, the cross-sectional shape of the gasket 6 can be a triangle, the number of the gaskets 6 can be three, and the three gaskets 6 are arranged to form a structure similar to a fan blade. By providing multiple gaskets 6 and enclosing the gaskets 6 into a structure similar to a fan blade, the silicon wafer 00 can be supported from multiple angles, so that the supporting force on the silicon wafer 00 is more uniform, thereby enhancing the buffering effect of the gasket 6 on the silicon wafer 00.

[0066] Optional, combined Figure 4 and Figure 6 As shown, in this embodiment, the gasket 6 includes a first gasket 61 and a second gasket 62. Along the thickness direction X of the connecting plate 2, the cross-sectional shapes of the first gasket 61 and the second gasket 62 are both circular rings (also called hollow circles). The first gasket 61 and the second gasket 62 both include a large circle radius and a small circle radius. The large circle radius of the first gasket 61 is smaller than the small circle radius of the second gasket 62. Along the thickness direction X of the connecting plate 2, the orthographic projections of the first gasket 61 and the second gasket 62 on the suction cup body 1 are aligned with the air port of the suction cup body 1 (the air port is a structure for the air inlet and outlet of the suction cup body 1, through which the air inlet and outlet of the suction cup body 1 are formed). The air port realizes the taking and placing of the silicon wafer 00 by the suction cup body 1 (not shown in the structure diagram). The orthographic projections of the suction cup body 1 do not overlap. The first gasket 61 is located inside the second gasket 62, and the second gasket 62 surrounds the first gasket 61. By setting the first gasket 61 and the second gasket 62 to a circular ring shape, it ensures that the gasket 6 and the suction cup body 1 have a sufficiently large contact area without affecting the operation of the air port. At the same time, the silicon wafer 00 can be supported from multiple angles, so that the supporting force on the silicon wafer 00 is more uniform, thereby enhancing the buffering effect of the gasket 6 on the silicon wafer 00.

[0067] The above describes the cross-sectional shapes of the two types of gaskets 6 along the thickness direction X of the connecting plate 2 and the number of gaskets 6. In other embodiments, the cross-sectional shapes of the gaskets 6 along the thickness direction X of the connecting plate 2 and the number of gaskets 6 can be adaptively adjusted according to actual conditions and are not limited here.

[0068] In an optional embodiment, a fixing plate 7 is connected to a side of the support member 4 away from the connecting plate 2 , and along the thickness direction X of the connecting plate 2 , the orthographic projection of the fixing plate 7 is located within the orthographic projection of the connecting plate 2 .

[0069] Specifically, combined Figure 4-Figure 5 As shown, a fixing plate 7 is connected to the side of the support member 4 away from the connecting plate 2. The fixing plate 7 is used to connect to the support column 41 and support the connecting plate 2. The fixing plate 7 can be a flat plate structure. Along the thickness direction X of the connecting plate 2, the orthographic projection of the fixing plate 7 is located within the orthographic projection of the connecting plate 2. This arrangement can reduce costs while ensuring the supporting effect. The material of the fixing plate 7 can be metal, and the metal material can be aluminum. Aluminum has the advantages of strong corrosion resistance, wear resistance, weather resistance, high hardness, light weight, good plasticity, etc. The materials that can be used for the fixing plate 7 include but are not limited to these, and can be adaptively adjusted according to actual conditions, and are not limited here.

[0070] Combination Figure 4-Figure 5 As shown, the fixing plate 7 is provided with a first hole 71, a second hole 72, a third hole 73, a fourth hole 74 and a fifth hole 75, and the first hole 71, the second hole 72, the third hole 73, the fourth hole 74 and the fifth hole 75 all penetrate the fixing plate 7 along the thickness direction X of the connecting plate 2, and the first hole 71, the second hole 72, the third hole 73, the fourth hole 74 and the fifth hole 75 are not connected to each other, and the number of the first holes 71 can match the number of the supporting columns 41, and along the thickness direction X of the connecting plate 2, the orthographic projection of the first hole 71 on the fixing plate 7 and the orthographic projection of the supporting column 41 on the fixing plate 7 at least partially overlap, and the supporting column 41 is provided with a supporting lower hole 411 on the side close to the fixing plate 7, The lower support hole 411 passes through at least part of the support column 41 along the thickness direction X of the connecting plate 2. The lower support hole 411 may be connected or not connected to the upper support hole, which is not limited here. The lower screw 002 passes through the first hole 71 and the lower support hole 411 in sequence. The fixed connection between the fixed plate 7 and the support column 41 is completed through the cooperation between the lower screw 002, the first hole 71 and the lower support hole 411. The fixed plate 7 and the support column 4 cooperate with each other to support the connecting plate 2. It should also be noted that when connecting the fixed plate 7 and the support column 4, glue can be applied at the connection between the two. The glue can further strengthen the tightness of the installation between the fixed plate 7 and the support column 4.

[0071] Combination Figure 3-Figure 5As shown, the number of the second hole 72 can be one, and the second hole 72 is located in the middle of the fixing plate 7. Along the thickness direction X of the connecting plate 2, the orthographic projection of the second hole 71 on the fixing plate 7 is located within the orthographic projection of the first area 11 on the fixing plate 7. The second area 12 is arranged in the second hole 72, and the bottom surface of the first area 11 close to the second area 12 is abutted against the upper surface of the fixing plate 7 close to the first area 11. The second hole 72 has the function of accommodating the second area 12 and positioning the installation position of the first area 11.

[0072] Combination Figure 3-Figure 5 As shown, the number of the third holes 73 can be four, and the four third holes 73 are arranged in an array. The four third holes 73 can be located at the four vertices of a square, and the plane where the square is located is perpendicular to the thickness direction X of the connecting plate 2. A first zone connecting hole 111 that matches the third hole 73 is provided on the side of the first zone 11 close to the second zone 12. The first zone connecting hole 111 penetrates part of the first zone 11 along the thickness direction X of the connecting plate 2. The inner screw (not shown in the figure) passes through the third hole 73 and the first zone connecting hole 111 in sequence. The fixed connection between the suction cup body 1 and the fixing plate 7 is achieved through the mutual cooperation between the inner screw, the third hole 73 and the first zone connecting hole 111. The number of the third holes 73 is set to four, which can strengthen the fixed connection between the suction cup body 1 and the fixing plate 7 from multiple angles; it should also be noted that due to the fixed connection between the suction cup body 1 and the fixing plate 7, and the fixed connection between the connecting plate 2 and the fixing plate 7, the sleeve connection between the suction cup body 1 and the connecting plate 2 is achieved by setting the fixing plate 7, which ensures the fixation of the relative position between the suction cup body 1 and the connecting plate 2.

[0073] Combination Figure 4-Figure 5 As shown, the number of the fourth holes 73 can be four, and the four fourth holes 73 are arranged in an array. The four fourth holes 73 can be located at the four vertices of a square, and the plane where the square is located is perpendicular to the thickness direction X of the connecting plate 2. The fourth holes 73 are used to connect to the reducer connector 9.

[0074] Reference Figure 5 As shown, the number of the fifth holes 75 can be four, and each of the fifth holes 75 is located on the side of the third hole 73 away from the second hole 72. Along the thickness direction X of the connecting plate 2, the cross-sectional shape of the fifth hole 75 can be an irregular shape. The fifth hole 75 is used to reduce the weight of the fixing plate 7 and reduce the manufacturing cost. As long as the above-mentioned effects can be guaranteed, the shape, number, and position of the fifth hole 75 on the fixing plate 7 can be adaptively adjusted according to actual conditions, and are not limited here.

[0075] Figure 7 It is an exploded view of another partial suction cup device provided by the utility model; Figure 8 It is a structural schematic diagram of a reducer connecting piece provided by the utility model; Fig. 9 It is a structural schematic diagram of another partial suction cup device provided by the utility model. In an optional embodiment, a reducer 8 is arranged on the side of the fixing plate 7 away from the suction cup body 1 , and the reducer 8 is connected to the fixing plate 7 via a reducer connector 9 .

[0076] Specifically, combined Figure 4-Figure 5 , Figure 7 As shown, a reducer 8 is arranged on the side of the fixing plate 7 away from the suction cup body 1. The reducer 8 is an independent component composed of a gear transmission, a worm transmission, and a gear-worm transmission enclosed in a rigid shell. It is often used as a reduction transmission device between a prime mover and a working machine, and plays a role in matching the rotation speed and transmitting torque between the prime mover and the working machine or the actuator. When the suction cup device provided in this embodiment is applied to an automatic silicon wafer sorting machine, the reducer 8 can reduce the rotation speed of the suction cup body 1 and reduce the load inertia of the motor. The motor is a device for driving the suction cup body 1 to work, and the electric motor is a device for driving the suction cup body 1 to work. The motor load inertia refers to the load borne by the motor or the influence of the load on the motor rotational inertia during dynamic switching. Reducing the motor load inertia can improve the response speed of the motor, making the operation of the suction cup body 1 more flexible. The reducer 8 can select model DG060-5; the reducer 8 includes a reducer body 81 and a reducer connector 82. A through hole 811 is opened on the reducer body 81. The through hole 811 penetrates the reducer body 81 along the thickness direction X of the connecting plate 2. The reducer connector 82 extends along the thickness direction X of the connecting plate 2, and the reducer connector 82 is sleeved in the through hole 81.

[0077] Combination Figure 4-Figure 5 , Figure 7-Figure 8As shown, the reducer 8 is connected to the fixed plate 7 through a reducer connector 9, and the reducer connector 9 includes an upper area 91, a middle area 92 and a lower area 93 connected in sequence, the upper area 91 is located on the side of the middle area 92 close to the suction cup body 1, the upper area 91, the middle area 92 and the lower area 93 can all be cylinders, the axes of the three cylinders coincide, and the extension direction of the axis of the cylinder is the same as the thickness direction X of the connecting plate 2, the bottom radius of the upper area 91 is greater than the bottom radius of the lower area 93, and the bottom radius of the lower area 93 is greater than the bottom radius of the middle area 92, and at least one upper area connecting hole 911 is provided on the upper area 91, and the upper area connecting hole 911 passes through the upper area 91 along the thickness direction X of the connecting plate 2, and the upper area connecting hole 911 and the fourth hole 7 3 correspond to each other one by one and are interconnected, the third screw 003 passes through the upper area connecting hole 911 and the fourth hole 73 in sequence, and the third screw 003, the upper area connecting hole 911 and the fourth hole 73 cooperate with each other to achieve the fixed connection between the reducer connecting member 9 and the fixing plate 7, at least one lower area connecting hole 931 is provided on the lower area 93, and the lower area connecting hole 931 penetrates the lower area 93 along the thickness direction X of the connecting plate 2, and a reducer connecting hole (not shown in the figure) is provided on the side of the reducer body 81 close to the reducer connecting member 9, and the reducer connecting hole penetrates part of the reducer body 81 along the thickness direction X of the connecting plate 2, and the reducer connecting hole and the lower area connecting hole 931 correspond to each other one by one and are interconnected, and continue to combine Fig. 9 As shown, the fourth screw 004 passes through the lower area connecting hole 931 and the reducer connecting hole in sequence, and the fixed connection between the reducer connecting member 9 and the reducer body 81 is achieved through the mutual cooperation between the fourth screw 004, the lower area connecting hole 931 and the reducer connecting hole.

[0078] Combination Figure 7 , Fig. 9 As shown, a limiting plate 80 is arranged on the suction cup device provided in the present embodiment. The limiting plate 80 is a flat plate structure. The plane where the limiting plate 80 is located is perpendicular to the thickness direction X of the connecting plate 2. A limiting plate through hole 801 is provided on the limiting plate 80. The limiting plate through hole 801 penetrates the limiting plate 80 along the thickness direction X of the connecting plate 2. Part of the reducer body 81 is snapped into the limiting plate through hole 801. By setting the limiting plate 80, the position of the reducer body 81 can be limited, thereby limiting the position of the suction cup device.

[0079] Fig.10 yes Figure 1 A schematic structural diagram of the suction cup device in another direction. In an optional embodiment, the reducer 8 includes a reducer connector 82, and the reducer connector 82 passes through the reducer connector 9 and is connected to the suction cup body 1.

[0080] Specifically, combined Figure 7-Figure 8 , Fig.10As shown, the reducer connecting member 9 is provided with a connecting member through hole 90, which simultaneously penetrates the upper area 91, the middle area 92 and the lower area 93 along the thickness direction X of the connecting plate 2, and the connecting member through hole 90 is not connected with the upper area connecting hole 911 and the lower area connecting hole 931. Figure 3 As shown, the reducer joint 82 passes through the connecting piece through hole 90 and is connected to the second zone 12. The reducer joint 82 is used to connect the second zone 12 and the control device (not shown in the figure), so that the second zone 12 can receive the signal of the control device, control the opening and closing of the first zone 11, adjust the suction force of the suction cup body 1, etc. The reducer joint 82 can be a high-speed rotary joint, and the optional model is KSH4-01.

[0081] It can be seen from the above embodiments that the suction cup device provided by the utility model achieves at least the following beneficial effects:

[0082] The suction cup device provided by the utility model comprises a suction cup body and a connecting plate which is sleeved with the suction cup body, the suction cup body is used for adsorbing silicon wafers; a conductive structure is arranged on the side of the connecting plate close to the silicon wafer, the conductive structure is used for eliminating static electricity on the surface of the silicon wafer, and along the thickness direction of the connecting plate, the orthographic projection of the suction cup body and the orthographic projection of the conductive structure do not overlap; a supporting member is arranged on the side of the connecting plate away from the silicon wafer, at least one end of the conductive structure is connected to the supporting member; adopting the above scheme, the disassembly and maintenance time of the suction cup device can be shortened, the difficulty of disassembly and maintenance of the suction cup device can be reduced, and the manufacturing and use cost of the suction cup device can be reduced. At the same time, the added conductive structure can eliminate static electricity on the silicon wafer, avoid affecting the normal operation of the machine, reduce the failure rate of the machine, and improve the stability and production capacity of the machine.

[0083] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A suction cup device, characterized in that: It comprises a suction cup body and a connecting plate sleeved with the suction cup body, wherein the suction cup body is used to absorb the silicon wafer; A conductive structure is provided on one side of the connecting plate close to the silicon wafer, and the conductive structure is used to eliminate static electricity on the surface of the silicon wafer. Along the thickness direction of the connecting plate, the orthographic projection of the suction cup body and the orthographic projection of the conductive structure do not overlap; A support member is disposed on a side of the connection plate away from the silicon wafer, and at least one end of the conductive structure is connected to the support member.

2. The suction cup device according to claim 1, characterized in that: The conductive structure includes a first sub-conductive structure and a second sub-conductive structure, and an extension direction of the first sub-conductive structure intersects with an extension direction of the second sub-conductive structure.

3. The suction cup device according to claim 2, characterized in that: The first sub-conductive structure and the second sub-conductive structure form a tic-tac-toe structure.

4. The suction cup device according to claim 3, characterized in that: The support member includes at least two support pillars, and the first sub-conductive structure and / or the second sub-conductive structure are electrically connected to the at least two support pillars.

5. The suction cup device according to claim 3, characterized in that: A buffer structure is provided on one side of the connecting plate close to the silicon wafer; Along the thickness direction of the connecting plate, the orthographic projection of the first sub-conductive structure and / or the orthographic projection of the second sub-conductive structure does not overlap with the orthographic projection of the buffer structure.

6. The suction cup device according to claim 5, characterized in that: A gasket is arranged on one side of the suction cup body close to the silicon wafer, and along the thickness direction of the connecting plate, the upper surface of the gasket is flush with the upper surface of the buffer structure.

7. The suction cup device according to claim 6, characterized in that: Along the thickness direction of the connecting plate, the cross-sectional shape of the gasket is a triangle.

8. The suction cup device according to claim 1, characterized in that: A fixing plate is connected to a side of the support member away from the connecting plate, and along the thickness direction of the connecting plate, the orthographic projection of the fixing plate is located within the orthographic projection of the connecting plate.

9. The suction cup device according to claim 8, characterized in that: A reducer is arranged on one side of the fixing plate away from the suction cup body, and the reducer is connected to the fixing plate via a reducer connecting piece.

10. The suction cup device according to claim 9, characterized in that: The reducer comprises a reducer joint, and the reducer joint passes through the reducer connecting piece and is connected to the suction cup body.

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