Anti-interference silicon carbide diode packaging structure

Abstract

The utility model discloses an anti-interference silicon carbide diode packaging structure, which particularly relates to the technical field of diode packaging and comprises a lower packaging cover, an upper packaging cover is arranged at the top of the lower packaging cover, a hinge is mounted between the lower packaging cover and the upper packaging cover, and a dismounting mechanism is arranged between the lower packaging cover and the upper packaging cover. The disassembling and assembling mechanism comprises a diode, the diode is arranged between the lower packaging cover and the upper packaging cover, and the top surface of the lower packaging cover and the bottom surface of the upper packaging cover are each provided with a containing groove and a groove. According to the utility model, through the arrangement of the dismounting mechanism and the fixing mechanism, the packaging of the diode can be rapidly completed, the packaging stability of the diode is ensured, and the diode can be conveniently and rapidly dismounted; the problem that the diode is difficult to detach and replace after being packaged due to the fact that the packaging structure is packaged and fixed through sealing glue when the diode is packaged is solved, the diode can be detached and replaced conveniently, and meanwhile the detaching and replacing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode packaging, and more specifically, to an anti-interference silicon carbide diode packaging structure. Background Art

[0002] Silicon carbide diode is a high-performance semiconductor device. Due to its special physical properties, it exhibits excellent performance under high temperature and high frequency conditions. The main purpose of packaging silicon carbide diodes is to protect the device, improve its reliability, and facilitate its use in electronic circuits.

[0003] Publication No. CN213716872U discloses an anti-interference high-power silicon carbide diode packaging structure. The voltage resistance performance of the silicon carbide diode in the prior art is slightly insufficient. When it is used for welding on a PCB board, it is often necessary to connect a protection circuit in parallel at both ends to ensure the working performance of the silicon carbide diode and reduce the influence of harmonics on it. However, this design method needs to occupy the space of the PCB board, which is not conducive to the layout design of the PCB board. The structure of the PCB board needs to increase a certain area, which is not conducive to the current demand for miniaturized design of electronic products. A reliable circuit protection structure is integrated, which can effectively absorb the harmonics generated in the circuit, can form good anti-interference performance, and can effectively increase the bandgap width, and has excellent working performance; in addition, the inductor is arranged on the surface of the ceramic sheet by printing, which can not only effectively reduce the volume of the overall packaging structure, but also improve the heat dissipation performance of the overall structure and extend the service life; when applied, there is no need to set an additional protection circuit on the PCB board, and the application design is convenient.

[0004] During use, the packaging method of the silicon carbide diode packaging structure is the same as the traditional glue sealing method, using glue to connect the diode to the packaging structure, which makes it difficult to disassemble after packaging and is inconvenient to replace the diode inside the packaging structure, affecting the disassembly and replacement of the diode. Utility Model Content

[0005] In order to overcome the problems and defects in the prior art, the utility model provides an anti-interference silicon carbide diode packaging structure to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an anti-interference silicon carbide diode packaging structure, comprising a lower packaging cover, an upper packaging cover is arranged on the top of the lower packaging cover, a hinge is installed between the lower packaging cover and the upper packaging cover, and a disassembly mechanism is arranged between the lower packaging cover and the upper packaging cover;

[0007] The disassembly and assembly mechanism includes a diode, which is arranged between a lower packaging cover and an upper packaging cover. The top surface of the lower packaging cover and the bottom surface of the upper packaging cover are both provided with placement grooves and grooves, a fixing sleeve is arranged inside the groove, a lifting plate is fixedly connected to the bottom of the fixing sleeve, threaded holes are arranged on the bottom surface of the lower packaging cover and the top surface of the upper packaging cover, a threaded rod is threadedly connected inside the threaded hole, a bearing is installed between the threaded rod and the lifting plate, a knob is fixedly connected to the bottom of the threaded rod, and fixing mechanisms are arranged on the outer sides of the lower packaging cover and the upper packaging cover.

[0008] Preferably, a plurality of friction strips are fixedly connected to the inner wall of the fixed jacket, limiting grooves are provided on both side surfaces of the inner walls of the lower packaging cover and the upper packaging cover, limiting slide rods are fixedly connected on both sides of the lifting plate, and the limiting grooves are slidably connected to the limiting slide rods.

[0009] Preferably, the fixing mechanism comprises a fixing sleeve, the fixing sleeve is fixed to the front side of the lower packaging cover, the front side of the upper packaging cover is fixedly connected with a mounting sleeve, and a movable clamping plate is slidably connected inside the mounting sleeve.

[0010] Preferably, a moving rod is fixedly connected to the top of the moving card plate, the top of the moving rod passes through the mounting sleeve and extends to the top of the mounting sleeve, and the top of the moving rod is fixedly connected to a fixing plate.

[0011] Preferably, a connecting spring is sleeved on the outer side of the moving rod, the top of the connecting spring is fixedly connected to the top of the inner wall of the mounting sleeve, and the bottom of the connecting spring is fixedly connected to the top of the moving clamping plate.

[0012] Preferably, the bottom of the threaded rod passes through the lower packaging cover and extends to the bottom of the lower packaging cover, and the lifting plate is slidably connected to the inner wall of the groove.

[0013] Preferably, the diode is arranged inside the placement groove, the diode is slidably connected to the placement groove, and the number of the fixing sleeves is set to be multiple.

[0014] Technical effects and advantages of the utility model:

[0015] 1. By setting a disassembly and assembly mechanism and a fixing mechanism, the diode is inserted into the placement slot, and then the knob is rotated to clamp and fix the diode with two fixing sleeves, and the lower packaging cover and the upper packaging cover are closed at the same time, the packaging of the diode is completed, and the diode can be disassembled. Compared with the prior art, the packaging of the diode can be completed quickly, the packaging stability of the diode is ensured, and the diode can be quickly disassembled, which solves the problem that the diode is difficult to disassemble and replace after packaging because the packaging structure is packaged and fixed by sealing glue when packaging the diode, and the disassembly and replacement of the diode is convenient, while the disassembly and replacement efficiency is improved;

[0016] 2. By rotating the knob in the opposite direction, the knob drives the threaded rod to rotate, so that the two fixing sleeves are removed from the surface of the diode, and then the diode is pushed so that the diode is completely placed in the placement groove, which is convenient for storing the diode. During transportation, the diode is stored in the placement groove to prevent the diode from being bent and damaged during transportation, thereby improving the protection effect of the diode during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0018] Figure 2 It is a side sectional structural schematic diagram of the utility model.

[0019] Figure 3 It is a front cross-sectional structural schematic diagram of the lower packaging cover of the utility model.

[0020] Figure 4 For the utility model Figure 2 Enlarged structural diagram at A in the middle.

[0021] The accompanying drawings are marked as follows: 1. lower packaging cover; 2. upper packaging cover; 3. hinge; 4. placement groove; 5. diode; 6. groove; 7. fixed sleeve; 8. lifting plate; 9. threaded hole; 10. threaded rod; 11. bearing; 12. knob; 13. friction strip; 14. limit slide groove; 15. limit slide rod; 16. fixed sleeve; 17. installation sleeve; 18. movable clamping plate; 19. movable rod; 20. fixed plate; 21. connecting spring. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] As attached Figure 1-4 An anti-interference silicon carbide diode packaging structure shown includes a lower packaging cover 1, an upper packaging cover 2 is arranged on the top of the lower packaging cover 1, a hinge 3 is installed between the lower packaging cover 1 and the upper packaging cover 2, and a disassembly mechanism is arranged between the lower packaging cover 1 and the upper packaging cover 2;

[0024] The disassembly and assembly mechanism includes a diode 5, which is arranged between the lower packaging cover 1 and the upper packaging cover 2. The top surface of the lower packaging cover 1 and the bottom surface of the upper packaging cover 2 are both provided with a placement groove 4 and a groove 6, a fixing sleeve 7 is arranged inside the groove 6, and a lifting plate 8 is fixedly connected to the bottom of the fixing sleeve 7. Threaded holes 9 are arranged on the bottom surface of the lower packaging cover 1 and the top surface of the upper packaging cover 2, and a threaded rod 10 is threadedly connected inside the threaded hole 9. A bearing 11 is installed between the threaded rod 10 and the lifting plate 8, and a knob 12 is fixedly connected to the bottom of the threaded rod 10. A fixing mechanism is arranged on the outer side of the lower packaging cover 1 and the upper packaging cover 2.

[0025] As attached Figure 1 , 3 As shown, a plurality of friction strips 13 are fixedly connected to the inner wall of the fixed jacket 7 to increase the friction force between the diode 5 and the diode 5, thereby improving the fixing effect of the diode 5. Limiting grooves 14 are provided on both side surfaces of the inner walls of the lower packaging cover 1 and the upper packaging cover 2, and limiting slide bars 15 are fixedly connected on both sides of the lifting plate 8. The limiting grooves 14 and the limiting slide bars 15 are slidably connected to each other, which limit the lifting plate 8 and ensure the stability of the lifting and lowering of the lifting plate 8.

[0026] As attached Figure 1 , 2 As shown in , 4, the fixing mechanism includes a fixing sleeve 16, the fixing sleeve 16 is fixed on the front side of the lower packaging cover 1, and the front side of the upper packaging cover 2 is fixedly connected with a mounting sleeve 17, a movable card plate 18 is slidably connected inside the mounting sleeve 17, and a movable rod 19 is fixedly connected to the top of the movable card plate 18. The top of the movable rod 19 passes through the mounting sleeve 17 and extends to the top of the mounting sleeve 17, and a fixing plate 20 is fixedly connected to the top of the movable rod 19. A connecting spring 21 is provided on the outer sleeve of the movable rod 19, and the top of the connecting spring 21 is fixedly connected to the top of the inner wall of the mounting sleeve 17, and the bottom of the connecting spring 21 is fixedly connected to the top of the movable card plate 18, so as to facilitate the fixing of the lower packaging cover 1 and the upper packaging cover 2 and improve the packaging effect and fixing effect of the diode 5.

[0027] As attached Figure 1-3 As shown, the bottom of the threaded rod 10 passes through the lower packaging cover 1 and extends to the bottom of the lower packaging cover 1. The lifting plate 8 is slidably connected to the inner wall of the groove 6 to facilitate the lifting and lowering of the lifting plate 8. The diode 5 is arranged inside the placement groove 4. The diode 5 is slidably connected to the placement groove 4 to facilitate the diode 5 to slide into the placement groove 4. The number of the fixing sleeves 7 is set to multiple to facilitate clamping and fixing the diode 5.

[0028] Working principle of the utility model: During the use of the anti-interference silicon carbide diode packaging structure provided by the utility model, the diode 5 is first inserted into the placement groove 4 on the surface of the lower packaging cover 1 and the upper packaging cover 2, so that the diode 5 slides inside the placement groove 4, and then the knob 12 is rotated to drive the threaded rod 10 to rotate. At the same time, due to the threaded connection between the threaded rod 10 and the threaded hole 9, a bearing 11 is installed between the threaded rod 10 and the lifting plate 8, thereby driving the lifting plate 8 to move, so that the fixed jacket 7 moves, so that The fixing sleeve 7 inside the lower packaging cover 1 and the upper packaging cover 2 moves to clamp and fix the diode 5, and then the fixing plate 20 is pulled to move the moving rod 19 upward, thereby driving the moving card plate 18 at the bottom of the moving rod 19 to slide into the installation sleeve 17. At the same time, the connecting spring 21 is in a compressed state, and the lower packaging cover 1 and the upper packaging cover 2 are fitted together by rotating the upper packaging cover 2. Then the fixing plate 20 is released, and the moving card plate 18 rebounds and is clamped into the fixing sleeve 16 through the rebound force of the connecting spring 21, thereby completing the fixation of the lower packaging cover 1 and the upper packaging cover 2.

[0029] Finally: The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the relevant technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An anti-interference silicon carbide diode packaging structure, comprising a lower packaging cover (1), characterized in that: An upper packaging cover (2) is arranged on the top of the lower packaging cover (1), a hinge (3) is installed between the lower packaging cover (1) and the upper packaging cover (2), and a disassembly mechanism is arranged between the lower packaging cover (1) and the upper packaging cover (2); The disassembly and assembly mechanism comprises a diode (5), wherein the diode (5) is arranged between a lower packaging cover (1) and an upper packaging cover (2); a placement groove (4) and a groove (6) are provided on the top surface of the lower packaging cover (1) and the bottom surface of the upper packaging cover (2); a fixing sleeve (7) is provided inside the groove (6); a lifting plate (8) is fixedly connected to the bottom of the fixing sleeve (7); a threaded hole (9) is provided on the bottom surface of the lower packaging cover (1) and the top surface of the upper packaging cover (2); a threaded rod (10) is threadedly connected inside the threaded hole (9); a bearing (11) is installed between the threaded rod (10) and the lifting plate (8); a knob (12) is fixedly connected to the bottom of the threaded rod (10); and fixing mechanisms are provided on the outer sides of the lower packaging cover (1) and the upper packaging cover (2).

2. The anti-interference silicon carbide diode packaging structure according to claim 1, characterized in that: The inner wall of the fixed jacket (7) is fixedly connected to a plurality of friction strips (13), both sides of the inner wall surfaces of the lower packaging cover (1) and the upper packaging cover (2) are provided with limit slide grooves (14), both sides of the lifting plate (8) are fixedly connected to limit slide rods (15), and the limit slide grooves (14) are slidably connected to the limit slide rods (15).

3. The anti-interference silicon carbide diode packaging structure according to claim 1, characterized in that: The fixing mechanism comprises a fixing sleeve (16), the fixing sleeve (16) being fixed to the front side of the lower packaging cover (1), the front side of the upper packaging cover (2) being fixedly connected to a mounting sleeve (17), and a movable clamping plate (18) being slidably connected inside the mounting sleeve (17).

4. The anti-interference silicon carbide diode packaging structure according to claim 3, characterized in that: The top of the movable card plate (18) is fixedly connected to a movable rod (19), the top of the movable rod (19) passes through the mounting sleeve (17) and extends to the top of the mounting sleeve (17), and the top of the movable rod (19) is fixedly connected to a fixing plate (20).

5. The anti-interference silicon carbide diode packaging structure according to claim 4, characterized in that: The outer sleeve of the moving rod (19) is provided with a connecting spring (21), the top of the connecting spring (21) is fixedly connected to the top of the inner wall of the mounting sleeve (17), and the bottom of the connecting spring (21) is fixedly connected to the top of the moving clamping plate (18).

6. The anti-interference silicon carbide diode packaging structure according to claim 1, characterized in that: The bottom of the threaded rod (10) passes through the lower packaging cover (1) and extends to the bottom of the lower packaging cover (1), and the lifting plate (8) is slidably connected to the inner wall of the groove (6).

7. The anti-interference silicon carbide diode packaging structure according to claim 1, characterized in that: The diode (5) is arranged inside the placement groove (4), the diode (5) is slidably connected to the placement groove (4), and the number of the fixing jackets (7) is set to be multiple.

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