Fluorescent film structure and LED device
By designing a fluorescent film structure with dislocation distribution, the problem of low brightness caused by phosphor settlement in traditional LED packages is solved, and the excitation area of the phosphor layer under the same thickness and area is increased, thereby improving the luminous efficiency of LED devices.
Patent Information
- Application Number
- CN202323623896.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-28
AI Technical Summary
In traditional LED packaging processes, the phosphor settles on the bottom of the bracket, resulting in low LED brightness. It is difficult for existing fluorescent film preparation processes to prepare thinner phosphor layers to improve LED brightness.
A fluorescent film structure is designed, including a first encapsulating adhesive layer, a phosphor layer and a second encapsulating adhesive layer, the phosphor layer is arranged above the first encapsulating adhesive layer, and the second encapsulating adhesive layer is arranged above the phosphor layer, both The convex and concave parts are dislocated to form a curved surface structure and increase the excitation area of the phosphor layer.
With the same thickness and area, the excitation efficiency of the phosphor layer is improved, and the area where the phosphor layer is excited by the chip blue light is increased, thereby improving the luminous efficiency of the LED device.
Smart Images
Figure CN222261116U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED packaging, and in particular relates to a fluorescent film structure and an LED device. Background Art
[0002] The traditional LED packaging process mainly involves mixing phosphor and silica gel, filling the powder glue into the LED bracket bowl by a glue dispenser, and centrifuging the phosphor to settle on the chip surface. This method causes part of the phosphor to settle at the bottom of the bracket and cannot be well excited by the chip blue light, resulting in low LED brightness. Fluorescent film can solve this problem well. Fluorescent film is a thin film structure with a certain thickness made by mixing silica gel and phosphor. By directly fixing the fluorescent film on the chip surface, the problem of phosphor settling to the bottom of the bowl and affecting the LED brightness can be avoided, the efficiency of the chip blue light exciting the phosphor can be improved, and the LED brightness can be improved.
[0003] The main preparation process of existing fluorescent film is: mix fluorescent powder and silica gel, use a film scraper to scrape the powder-glue mixture, scrape out a thin sheet with a relatively fixed film thickness, and use a cutting machine to cut the thin sheet into small square sheets of appropriate length and width. The fluorescent powder is suspended and evenly distributed in the fluorescent film, but if the fluorescent film is too thick, the bottom blue light cannot pass through the bottom and middle layers of the fluorescent film to excite the fluorescent powder in the upper layer. Within a certain thickness range, the thicker the fluorescent film, the lower the excitation efficiency of the fluorescent film and the lower the brightness of the LED. Considering the mixing ratio of the fluorescent powder, it is difficult for the existing fluorescent film preparation process to compress the thickness of the fluorescent film and prepare a thinner phosphor layer, and it is difficult to further improve the brightness of the LED with fluorescent film.
[0004] In addition, when the cutting size of the existing fluorescent film is fixed, the bottom area of the fluorescent film powder layer is equal to the cutting area of the fluorescent film. Usually, the cutting size of the fluorescent film is increased to increase the area of the fluorescent powder excited by the blue light of the chip, so that the LED can achieve a brightening effect. However, due to the chip size and the packaged LED size, the improvement of the flat fluorescent powder layer is limited. It is necessary to ensure the thickness of the fluorescent film while making a fluorescent powder layer with a larger surface area within the limited fluorescent film size to further improve the brightness of the LED with fluorescent film. Utility Model Content
[0005] In order to overcome the above technical defects, the utility model provides a fluorescent film structure and an LED device to improve the luminous efficiency of the LED device.
[0006] In order to solve the above problems, in the first aspect, the utility model provides:
[0007] A fluorescent film structure includes a first encapsulation adhesive layer, a fluorescent powder layer, and a second encapsulation adhesive layer, wherein the fluorescent powder layer is arranged above the first encapsulation adhesive layer, and the second encapsulation adhesive layer is arranged above the fluorescent powder layer.
[0008] The first packaging glue layer includes a plurality of first convex portions arranged in an array, the second packaging glue layer includes a plurality of second convex portions arranged in an inverted array, and the first convex portions and the second convex portions are staggered.
[0009] The bottom surface where the phosphor layer is connected to the first packaging adhesive layer is provided with a plurality of first recesses which coincide with the first protrusions; the top surface where the phosphor layer is connected to the second packaging adhesive layer is provided with a plurality of second recesses which coincide with the second protrusions, and the first recesses and the second recesses are staggered.
[0010] Furthermore, the convex portion formed by the packaging adhesive is in a hemispherical shape, and the bottom diameter of the convex portion is 50-500 μm and the height is 20-100 μm.
[0011] Furthermore, the array spacing of each convex portion is 25-500 μm.
[0012] Furthermore, the concave portions on the phosphor layer are in a hemispherical shape, the bottom diameter of the concave portions is 50-500 μm, the depth is 20-100 μm, and the array spacing of the concave portions is 25-500 μm.
[0013] Furthermore, the thickness of the phosphor layer is 10-150 μm.
[0014] In a second aspect, the utility model provides an LED device, including a ceramic substrate, a light emitting diode chip, a fluorescent film, a light reflecting layer and a packaging lens.
[0015] The light emitting diode chip is arranged on the upper surface of the ceramic substrate;
[0016] The fluorescent film adopts the above fluorescent film structure and is laid on the upper surface of the light emitting diode chip;
[0017] The light reflecting layer is laid around the fluorescent film and covers the side surface of the fluorescent film and the side surface of the light emitting diode chip;
[0018] The packaging lens covers the upper surface of the fluorescent film and the inclined surface of the light reflecting layer.
[0019] Furthermore, the light reflecting layer is a slope structure.
[0020] Furthermore, the packaging lens is hemispherical.
[0021] Furthermore, the refractive index of the packaging lens is greater than the refractive index of the fluorescent film.
[0022] Compared with the prior art, the utility model has the following beneficial effects:
[0023] The utility model discloses a fluorescent film structure and an LED device. The fluorescent film structure comprises a first encapsulation adhesive layer, a fluorescent powder layer and a second encapsulation adhesive layer. The fluorescent powder layer is arranged above the first encapsulation adhesive layer, and the second encapsulation adhesive layer is arranged above the fluorescent powder layer. The first encapsulation adhesive layer comprises a plurality of first convex portions arranged in an array, and the second encapsulation adhesive layer comprises a plurality of second convex portions arranged in an inverted array, the first convex portions and the second convex portions are staggered, a plurality of first concave portions are arranged on the bottom surface where the fluorescent powder layer is connected to the first encapsulation adhesive layer, and the first concave portions are matched with the first convex portions; a plurality of second concave portions are arranged on the top surface where the fluorescent powder layer is connected to the second encapsulation adhesive layer, and the second concave portions are matched with the second convex portions, and the first concave portions and the second concave portions are staggered. The recessed portions staggered on the bottom and top surfaces of the phosphor layer form a curved surface structure of the phosphor layer, so that under the same phosphor film thickness, compared with the traditional phosphor film, the phosphor layer in the phosphor film provided by the utility model is thinner, which is more conducive to the upper layer (or surface layer) of the phosphor being excited by the blue light of the chip, thereby improving the luminous efficiency of the LED device; the recessed portions staggered on the bottom and top surfaces of the phosphor layer form a curved surface structure of the phosphor layer, so that under the same phosphor film bottom area, compared with the traditional phosphor film, the actual bottom area of the phosphor layer in the phosphor film provided by the utility model is larger, the area of the phosphor layer being excited is increased, which is more conducive to the phosphor layer being excited by the blue light of the chip, thereby improving the luminous efficiency of the LED device. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings, wherein:
[0025] Figure 1 is a structural schematic diagram of the fluorescent film structure described in Example 1;
[0026] Figure 2 A schematic diagram of a first encapsulation adhesive layer and a second encapsulation adhesive layer of the fluorescent film structure described in Example 1;
[0027] Figure 3 The finished product of the fluorescent film structure described in Example 1 is shown in FIG. Figure 1 ;
[0028] Figure 4 The finished product of the fluorescent film structure described in Example 1 is shown in FIG. Figure 2 ;
[0029] Figure 5 A schematic diagram of a first encapsulation adhesive layer and a second encapsulation adhesive layer of the fluorescent film structure described in Example 2;
[0030] Figure 6 This is a schematic diagram of the structure of the LED device described in Example 3;
[0031] Marking description: 100, phosphor layer; 200, first convex portion; 300, second convex portion;
[0032] 11. Ceramic substrate; 12. Light-emitting diode chip; 13. Fluorescent film; 14. Light reflecting layer; 15. Packaging lens. DETAILED DESCRIPTION
[0033] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0034] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0035] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it can be directly on the other element or indirectly set on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0036] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.
[0038] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.
[0039] Example 1
[0040] This embodiment provides a fluorescent film structure, such as Figure 1 , including a first encapsulation glue layer, a phosphor layer 100 and a second encapsulation glue layer, the phosphor layer 100 is arranged above the first encapsulation glue layer, and the second encapsulation glue layer is arranged above the phosphor layer 100, such as Figure 2 The first encapsulation glue layer includes a plurality of first protrusions 200 arranged in an array, and the second encapsulation glue layer includes a plurality of second protrusions 300 arranged in an inverted array. The first protrusions 200 and the second protrusions 300 are staggered. Optionally, the first protrusions 200 and the second protrusions 300 are both formed by dispensing transparent encapsulation glue.
[0041] A plurality of first recesses are provided on the bottom surface where the phosphor layer 100 is connected to the first packaging adhesive layer, which coincide with the first convex portion 200 ; a plurality of second recesses are provided on the top surface where the phosphor layer 100 is connected to the second packaging adhesive layer, which coincide with the second convex portion 300 . The first recesses and the second recesses are staggered, so that the cross section of the phosphor layer 100 is wavy.
[0042] In the above embodiment, the first convex portion 200 and the second convex portion 300 formed by the packaging adhesive are both in a hemispherical shape, and the bottom diameter of the convex portion is 50-500 μm and the height is 20-100 μm.
[0043] In the above embodiment, the array pitch of the first convex portion 200 and the second convex portion 300 are both 25-500 μm.
[0044] In the above embodiment, the first concave portion and the second concave portion on the phosphor layer 200 are both hemispherical in shape, with a bottom diameter of 50-500 μm and a depth of 20-100 μm. The array spacing of the first concave portion and the second concave portion is 25-500 μm.
[0045] In the above embodiment, the thickness of the phosphor layer 200 is 10-150 μm, and the phosphor layer contains yellow phosphor.
[0046] In the above embodiment, the thickness of the fluorescent film structure is 50-220 μm.
[0047] Schematic diagram of the fluorescent film structure Figure 3 and Figure 4 .
[0048] The staggered first concave portion and the second concave portion allow the phosphor layer to form a curved surface structure, so that under the same phosphor film thickness, compared with the traditional phosphor film, the phosphor layer in the phosphor film provided by the utility model is thinner, which is more conducive to the phosphor in the upper layer (or surface layer) being excited by the blue light of the chip, thereby improving the luminous efficiency of the LED device; under the same phosphor film bottom area, compared with the traditional phosphor film, the actual bottom area of the phosphor layer in the phosphor film provided by the utility model is larger, which increases the area of the phosphor layer being excited, is more conducive to the phosphor layer being excited by the blue light of the chip, and improves the luminous efficiency of the LED device.
[0049] Example 2
[0050] This embodiment provides a fluorescent film structure, such as Figure 1 , including a first encapsulation glue layer, a phosphor layer 100 and a second encapsulation glue layer, the phosphor layer 100 is arranged above the first encapsulation glue layer, and the second encapsulation glue layer is arranged above the phosphor layer 100, such as Figure 5 The first encapsulation adhesive layer includes a plurality of first protrusions 200 arranged in concentric circles, and the second encapsulation adhesive layer includes a plurality of inverted second protrusions 300 arranged in concentric circles. The first protrusions 200 and the second protrusions 300 are staggered. Optionally, the first protrusions 200 and the second protrusions 300 are both formed by dispensing transparent encapsulation adhesive.
[0051] A plurality of first recesses are provided on the bottom surface where the phosphor layer 100 is connected to the first packaging adhesive layer, which coincide with the first convex portion 200 ; a plurality of second recesses are provided on the top surface where the phosphor layer 100 is connected to the second packaging adhesive layer, which coincide with the second convex portion 300 . The first recesses and the second recesses are staggered, so that the cross section of the phosphor layer 100 is wavy.
[0052] In the above embodiment, the first convex portion 200 and the second convex portion 300 formed by the packaging adhesive are both in a hemispherical shape, and the bottom diameter of the convex portion is 50-500 μm and the height is 20-100 μm.
[0053] In the above embodiment, the array pitch of the first convex portion 200 and the second convex portion 300 are both 25-500 μm.
[0054] In the above embodiment, the first concave portion and the second concave portion on the phosphor layer 200 are both hemispherical in shape, with a bottom diameter of 50-500 μm and a depth of 20-100 μm. The array spacing of the first concave portion and the second concave portion is 25-500 μm.
[0055] In the above embodiment, the thickness of the phosphor layer 200 is 10-150 μm, and the phosphor layer contains yellow phosphor.
[0056] In the above embodiment, the thickness of the fluorescent film structure is 50-220 μm.
[0057] The staggered first concave portion and the second concave portion allow the phosphor layer to form a curved surface structure, so that under the same phosphor film thickness, compared with the traditional phosphor film, the phosphor layer in the phosphor film provided by the utility model is thinner, which is more conducive to the phosphor in the upper layer (or surface layer) being excited by the blue light of the chip, thereby improving the luminous efficiency of the LED device; under the same phosphor film bottom area, compared with the traditional phosphor film, the actual bottom area of the phosphor layer in the phosphor film provided by the utility model is larger, which increases the area of the phosphor layer being excited, is more conducive to the phosphor layer being excited by the blue light of the chip, and improves the luminous efficiency of the LED device.
[0058] Example 3
[0059] This embodiment provides an LED device, including a ceramic substrate 11, a light emitting diode chip 12, a fluorescent film 13, a light reflecting layer 14 and a packaging lens 15, wherein:
[0060] The light-emitting diode chip 12 is arranged on the upper surface of the ceramic substrate 11; the fluorescent film 13 adopts the fluorescent film structure described in Example 1 or Example 2, and is laid on the upper surface of the light-emitting diode chip 12; the light-reflecting layer 14 is laid around the fluorescent film 13 and covers the side surfaces of the fluorescent film 13 and the side surfaces of the light-emitting diode chip 12; the packaging lens 15 covers the upper surface of the fluorescent film 13 and the inclined surface of the light-reflecting layer 14.
[0061] In the above embodiment, the light reflecting layer 14 is a slope structure.
[0062] In the above embodiment, the packaging lens 15 is a hemispherical type.
[0063] In the above embodiment, the refractive index of the packaging lens 15 is greater than the refractive index of the fluorescent film 13 .
[0064] Specifically, the material of the packaging lens 15 can be epoxy resin, modified epoxy resin, silicone material, methyl silicone rubber, phenyl silicone rubber, etc.
[0065] Specifically, the materials of the first encapsulation adhesive layer and the second encapsulation adhesive layer in the fluorescent film structure can be epoxy resin, modified epoxy resin, organic silicon material, methyl silicone rubber, phenyl silicone rubber, etc.
[0066] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Therefore, any modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A fluorescent film structure, characterized in that: The invention comprises a first encapsulation glue layer, a phosphor layer and a second encapsulation glue layer, wherein the phosphor layer is arranged above the first encapsulation glue layer, and the second encapsulation glue layer is arranged above the phosphor layer. The first packaging glue layer includes a plurality of first convex portions arranged in an array, the second packaging glue layer includes a plurality of second convex portions arranged in an inverted array, and the first convex portions and the second convex portions are staggered. The bottom surface where the phosphor layer is connected to the first packaging adhesive layer is provided with a plurality of first recesses, which coincide with the first protrusions; the top surface where the phosphor layer is connected to the second packaging adhesive layer is provided with a plurality of second recesses, which coincide with the second protrusions, and the first recesses and the second recesses are staggered.
2. The fluorescent film structure according to claim 1, characterized in that: The first convex part and the second convex part formed by the packaging glue are both in a hemispherical shape, with a bottom diameter of 50-500 μm and a height of 20-100 μm.
3. The fluorescent film structure according to claim 2, characterized in that: The array spacings of the first convex portions and the second convex portions are both 25-500 μm.
4. The fluorescent film structure according to claim 3, characterized in that: The first concave portion and the second concave portion on the phosphor layer are both hemispherical in shape, with a bottom diameter of 50-500 μm and a depth of 20-100 μm. The array spacing of the first concave portion and the second concave portion is both 25-500 μm.
5. The fluorescent film structure according to claim 1, characterized in that: The thickness of the phosphor layer is 10-150 μm.
6. An LED device, characterized in that: It includes a ceramic substrate, a light-emitting diode chip, a fluorescent film, a light-reflecting layer and a packaging lens. The light emitting diode chip is arranged on the upper surface of the ceramic substrate; The fluorescent film adopts the fluorescent film structure according to any one of claims 1 to 5, and is laid on the upper surface of the light-emitting diode chip; The light reflecting layer is laid around the fluorescent film and covers the side surface of the fluorescent film and the side surface of the light emitting diode chip; The packaging lens covers the upper surface of the fluorescent film and the inclined surface of the light reflecting layer.
7. The LED device according to claim 6, characterized in that: The light reflecting layer is a slope structure.
8. The LED device according to claim 6, characterized in that: The packaged lens is of a hemispherical type.
9. The LED device according to claim 6, characterized in that: The refractive index of the packaging lens is greater than the refractive index of the fluorescent film.