UV LED packaging device with high-density packaging structure

Abstract

The utility model discloses a UV LED packaging device with a high-density packaging structure, which comprises a packaging piece main body and module welding positions arranged on the packaging piece main body, a light source module is welded in each module welding position, each light source module comprises a chip and a lens, each module welding position comprises a first bonding pad and a third bonding pad which are arranged on two sides and used for pin welding, and the first bonding pad and the third bonding pad are welded on the packaging piece main body. The first bonding pad and the third bonding pad are used for placing a chip, the second bonding pad is located between the first bonding pad and the third bonding pad and used for placing the chip, the first bonding pad and the third bonding pad are both communicated with the circuit layer of the packaging part body, a communication groove used for reducing the distance is formed between every two adjacent module welding positions, and a lens is arranged above the chip. And the bottom edge of the lens is fixed in a mounting groove arranged above the outer part of each bonding pad. The ultraviolet device packaging structure solves the problems that an ultraviolet device packaging structure in the prior art is low in density, light spots on an irradiation surface are not uniform, and the ultraviolet device packaging structure is easy to damage.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and in particular to a UVLED packaging device with a high-density packaging structure. Background Art

[0002] The use scenarios of ultraviolet light-emitting diodes (UV LEDs) have gradually and rapidly developed from low power and dispersed and complex device structures to structurally integrated and lightweight portable ultraviolet devices that can be used under high power conditions. This has greatly broadened the use of UV LEDs, especially high-power ultraviolet packaged devices with multiple integrated chips. The requirements for the uniformity of the light spot on the irradiated surface of the light source and its heat dissipation have been improved. Existing high-power ultraviolet packaged devices usually use multiple lenses to focus ultraviolet rays to improve the uniformity of irradiation. However, the distance between the multiple individual lenses that are dispersed, separated and fixed is relatively far, so that there are still obvious sudden changes in the light spot on the irradiated surface, and the uniformity effect is reduced. Lenses that are dispersed and fixed at a certain distance also make the device structure space larger and are not conducive to installation and use. In addition, the lenses are all fixed by curing with adhesives. Long-term ultraviolet radiation accelerates the aging of the adhesive. In particular, a temperature-changing and humid working environment will lead to a decrease in bonding ability and rapid damage to the device structure, which will ultimately affect the reliability and stability of the ultraviolet device.

[0003] In view of this, the present technical solution proposes a UV LED packaging device with a high-density packaging structure. By opening the welding positions of the modules connected by connecting grooves on the main body of the package, the gaps between the light source modules are reduced, the number of modules in a unit space is increased, and the package can be integrated with more modules, thereby improving the uniformity of the light spot on the irradiated surface of the ultraviolet device and thus improving the uniformity of the ultraviolet irradiation value on the irradiated surface, as well as the reliability and stability of the device, thereby extending the working life of the device. Utility Model Content

[0004] The technical solution of the utility model aims to solve one of the technical problems in the related art to a certain extent at least. To this end, the main purpose of the utility model is to provide a UV LED packaging device with a high-density packaging structure, aiming to solve the problems of low density of ultraviolet device packaging structure, uneven light spot on the irradiated surface, and easy damage in the prior art.

[0005] To achieve the above object, the utility model provides a UV LED packaging device with a high-density packaging structure, including a packaging body, and each module welding position arranged on the packaging body, each of the module welding positions is welded with a light source module, and the light source module includes a chip and a lens.

[0006] The module welding position includes a first pad and a third pad for pin welding on both sides, and a second pad located between the first pad and the third pad and used to place the chip, and the first pad and the third pad are both connected to the circuit layer of the package body.

[0007] A connecting groove for reducing the spacing is provided between each adjacent module welding position.

[0008] A lens is arranged above the chip, and the bottom edge of the lens is fixed in a mounting groove arranged above the outside of each pad.

[0009] As a further solution of the present invention, the package body also includes a substrate arranged at the bottom of the circuit layer, and a cover plate arranged at the other side of the circuit layer.

[0010] As a further solution of the utility model, a heat-conducting insulating layer is provided between the substrate and the circuit layer.

[0011] As a further solution of the utility model, an external electrode area is provided on one side of the surface of the circuit layer.

[0012] As a further solution of the utility model, a fixing hole for fixed installation is provided on the packaging body.

[0013] As a further solution of the present invention, the cover plate and the base plate are both metal plate structures.

[0014] As a further solution of the utility model, the surface of the circuit layer is provided with a copper foil layer structure covered by a nickel-palladium-gold process.

[0015] The beneficial effects of the utility model are as follows:

[0016] The UV LED packaging device with a high-density packaging structure proposed by the utility model realizes a multi-lens high-power UV packaging device with a small spacing by setting a connecting groove between the welding positions of each adjacent module. Its integrated small-pitch multi-lens structure makes the device light and easy to carry, and improves the uniformity of the light spot on the irradiated surface of the UV device, thereby improving the uniformity of the ultraviolet irradiation value of the irradiated surface, as well as the reliability and stability of the device, thereby extending the working service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model technical solution or the utility model technical solution in the prior art, the drawings required for use in the embodiments or the prior art descriptions will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model technical solution. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 It is an enlarged schematic diagram of the main structure of the package and the module welding position in the utility model.

[0019] Figure 2 It is an enlarged schematic diagram of the light source module in the utility model.

[0020] Figure 3 It is a schematic diagram of the overall planar structure of the utility model product.

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of one side of the utility model product.

[0022] Figure 5 This is a schematic diagram of the cross-sectional structure of the other side of the utility model product.

[0023] [Main parts / assembly reference numerals]

[0024]

[0025] DETAILED DESCRIPTION

[0026] as follows:

[0027] Please see attached Figure 1-5 ,

[0028] The main structure includes a package body 1, and each module welding position 16 arranged on the package body 1, a light source module 2 is welded in each module welding position 16, the light source module 2 includes a chip 20 and a lens 21, the module welding position 16 includes a first solder pad 161 and a third solder pad 163 on both sides for pin welding, and a second solder pad 162 located between the first solder pad 161 and the third solder pad 163 and used to place the chip 20, the first solder pad 161 and the third solder pad 163 are both connected to the circuit layer 14 of the package body 1, and a connecting groove 164 for reducing the spacing is provided between each adjacent module welding position 16, a lens 21 is provided above the chip 20, and the bottom edge of the lens 21 is fixed in the mounting groove 160 provided above the outside of each solder pad.

[0029] Here’s how it works:

[0030] By forming multiple connecting grooves 164, the spacing between the module welding positions 16 is reduced, and the smaller lens 21 matrix makes the light output more uniform. A thicker adhesive layer is formed at the connecting grooves 164 to effectively improve the bonding strength and release more internal forces caused by volume deformation. A plurality of functional pads are then used to form a thermoelectric separation structure separating the heat dissipation module and the conductive module, thereby improving the integration of high-power ultraviolet devices with higher light uniformity on a small volume structure, and having high reliability and ultra-long service life.

[0031] Specifically, it is a thermoelectric separation type high-power package device, and the main structure of the device is formed by integrally die-casting multiple layers of different materials, such as a cover plate 12, a circuit layer 14, a thermally conductive insulating layer 11, and a substrate 10, from top to bottom. Among them, the thermally conductive insulating layer 11 is an electrical insulating layer with high thermal conductivity, which can electrically insulate and isolate the cover plate 12, the circuit layer 14, and the substrate 10 from each other, and evacuate heat outward, which is more conducive to heat dissipation.

[0032] Furthermore, the surface of the circuit layer 14 is covered with a copper foil layer and the surface processing technology is nickel-palladium-gold, and a plurality of functional pad unit matrices are formed, and a single functional pad unit is provided with a first pad 161, a second pad 162 and a third pad 163 separated by an insulating groove, wherein the first pad 161 and the third pad 163 are both electrical connection areas of the circuit layer 14, and the second pad 162 is a solid crystal area for placing multiple chips 20, and an ultraviolet UVA chip 20 is fixedly placed on the second pad 162, which is preferably a high-power ultraviolet UVA chip 20 with a single chip 20 power higher than 3W, and then the ultraviolet UVA chips 20 are respectively connected to the second pad 162 through bonding wires. The positive terminal of the VA chip 20 is welded to the first pad 161 to form positive conduction, and the negative terminal is welded to the third pad 163 to form negative conduction. The 9 functional pad units in the same row along the long axis direction of the device body are used as a series branch, and then at least one similar series branch on its side is connected in parallel to form a main circuit, and then connected to the external circuit in a mixed series circuit connection mode to achieve multiple high-power ultraviolet UVA chips 20 with a total power greater than 50W to emit light simultaneously. The circuit layer 14 is provided with external electrode areas 15 on both sides of the package body 1, which is conducive to the installation and use of the packaged device and flexible electrical connection and conduction with the external circuit.

[0033] The substrate 10 at the bottom of the device is a metal substrate 10, preferably a copper substrate 10 with high mechanical strength and high thermal conductivity as a copper heat sink for heat dissipation. Furthermore, the second pad 162 is connected to the substrate 10 to form a heat dissipation module, which can quickly and efficiently dissipate the heat generated by the chip 20 inside the device when it is working directly from the inside to the outside, and the first pad 161 and the third pad 163 are both connected to the circuit layer 14 to form a conductive module. The heat dissipation module and the conductive module are separated in a structural manner to realize a high-power packaged device with thermoelectric separation and improve reliability. Furthermore, the thermal conductivity of the copper substrate 10 is greater than 300W / (m·K) and is more closely matched with the thermal conductivity of the chip 20, thereby effectively avoiding the performance risk of the chip 20 fixed on the second pad 162 and the substrate 10 being separated due to the large difference in volume expansion caused by thermal mismatch when the temperature changes, thereby improving the stability of the device.

[0034] The packaging device also includes fixing holes 13, preferably four fixing holes 13 located at two groups of diagonal positions of the entire packaging device, to facilitate the installation, positioning and fixing of the device.

[0035] Furthermore, the cover plate 12 at the upper end of the device is a metal plate, preferably made of an aluminum profile with good ultraviolet light reflection performance, which effectively reduces the absorption of ultraviolet light to increase the light output of the device, and a plurality of mounting grooves 160 are provided in the cover plate 12 at a position corresponding to each circular functional pad unit for supporting and placing a fixed lens 21, and further preferably a curved lens 21 with a small light output angle, and the plurality of mounting grooves 160 can be connected to each other, and a connecting groove 164 with a certain space is formed at the connection point, so that the distance between the mounting grooves 160 is smaller and more compact than that of a single groove that is completely separated and independently fixed as a whole. , which can reduce the overall volume of the device. The matrix of multiple lenses 21 with small pitch makes the output light spot more compact and smooth, thereby improving the uniformity of the overall light output of the device. Adhesive is injected into the space formed between the wall surface of each fixing groove and the outer edge surface of the lens 21, and a bonding layer is formed after high-temperature baking to bond and fix the lens 21. Furthermore, a connecting groove 164 adhesive layer with a thicker colloid thickness than that at other positions is formed at the connecting groove 164. The thicker adhesive layer can increase the bonding surface to increase the bonding strength. The larger adhesive layer can further effectively release the stress caused by volume deformation, thereby greatly reducing the damage to the packaged device caused by the stress and extending the working life of the device.

[0036] In a preferred embodiment of the present invention, the package body 1 further comprises a substrate 10 disposed at the bottom of the circuit layer 14 , and a cover plate 12 disposed at the other side of the circuit layer 14 .

[0037] In a preferred embodiment of the present invention, a heat-conducting insulating layer 11 is provided between the substrate 10 and the circuit layer 14 .

[0038] A preferred embodiment of the present invention: an external electrode area 15 is provided on one side of the surface of the circuit layer 14 .

[0039] A preferred embodiment of the present invention: a fixing hole 13 for fixed installation is provided on the package body 1.

[0040] A preferred embodiment of the present invention: the cover plate 12 and the base plate 10 are both metal plate structures. A preferred embodiment of the present invention: the surface of the circuit layer 14 is provided with a copper foil layer structure covered by nickel-palladium-gold processing.

[0041] The above are only preferred embodiments of the technical solution of the utility model, and the patent scope of the technical solution of the utility model is not limited thereto. All equivalent structural changes made by using the contents of the technical solution description and drawings of the technical solution of the utility model under the conception of the technical solution of the utility model, or directly / indirectly used in other related technical fields are included in the patent protection scope of the technical solution of the utility model.

Claims

1. A UV LED packaging device with a high-density packaging structure, characterized in that: include A package body, and each module welding position arranged on the package body, each module welding position is welded with a light source module, and the light source module includes a chip and a lens, The module welding position includes a first pad and a third pad for pin welding on both sides, and a second pad located between the first pad and the third pad and used for placing the chip, and the first pad and the third pad are both connected to the circuit layer of the package body. A connecting groove for reducing the spacing is provided between each adjacent module welding position. A lens is arranged above the chip, and the bottom edge of the lens is fixed in a mounting groove arranged above the outside of each pad.

2. The UV LED packaging device with a high-density packaging structure according to claim 1, characterized in that: The package body also includes a substrate arranged at the bottom of the circuit layer, and a cover plate arranged at the other side of the circuit layer.

3. The UV LED packaging device with a high-density packaging structure according to claim 2, characterized in that: A heat-conducting insulating layer is provided between the substrate and the circuit layer.

4. The UV LED packaging device with a high-density packaging structure according to claim 1, characterized in that: An external electrode area is arranged on one side of the circuit layer surface.

5. The UV LED packaging device with a high-density packaging structure according to claim 1, characterized in that: The packaging body is provided with a fixing hole for fixed installation.

6. The UV LED packaging device with a high-density packaging structure according to claim 2, characterized in that: The cover plate and the base plate are both metal plate structures.

7. The UV LED packaging device with a high-density packaging structure according to claim 1, characterized in that: The surface of the circuit layer is provided with a copper foil layer structure covered by a nickel-palladium-gold process.

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