Integrated solid-state relay

By introducing optical isolation circuits, resistive capacity absorption protection circuits and radiators into the integrated solid-state relay, thermal management, overload capacity and isolation problems are solved, and efficient isolation and stable operation are achieved, suitable for industrial automation and high-power equipment.

CN222262696UActive Publication Date: 2024-12-27WENZHOU ZHONGXUAN ELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202420596431.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-26
Publication Date
2024-12-27
Estimated Expiration
2034-03-26

AI Technical Summary

Technical Problem

Existing integrated solid-state relays have thermal management problems, limited overload capacity and poor input and output isolation in high-power applications, increasing the risk and complexity of the application.

Method used

An integrated solid state relay including a base, circuit board, optical isolation circuit, light emitting diode, resistance-capacity absorption protection circuit and radiator was designed. The optical isolation circuit is used to achieve electrical isolation between input and output, and the resistance-capacity absorption protection circuit absorbs instantaneously. The state overvoltage is used, and the radiator reduces heat and ensures stable operation.

Benefits of technology

Effectively manage heat, enhance overload capacity, achieve efficient electrical isolation, reduce costs, improve the anti-interference ability and stability of the relay, and is suitable for industrial automation and high-power equipment control.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of relays, and relates to an integrated solid-state relay which comprises a base, a containing groove is formed in the base, a first limiting block and a second limiting block are fixedly connected to the left side wall and the right side wall of the containing groove respectively, a circuit board is arranged in the containing groove, and threaded grooves are formed in the left side, the right side and the four corners of the upper surface of the circuit board respectively. An integrated shell is arranged over the base, a first containing groove and a second containing groove are formed in the front side and the rear side of the upper surface of the integrated shell correspondingly, and clamping plates are fixedly connected to one side of the first containing groove and one side of the second containing groove correspondingly. The circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light emitting diode, a resistance-capacitance absorption protection circuit and a radiator which are electrically connected, and the input circuit is used for triggering the integrated solid-state relay to act. The problems that in the using process, when internal parts break down and need to be replaced, installation is difficult, the internal parts cannot be replaced and maintained, the whole device needs to be replaced, and the device cost is increased are solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of relays, and more specifically to an integrated solid-state relay. Background Art

[0002] The integrated solid-state relay (SOL IDSTATERELAYS, hereinafter referred to as "SSR") is a new type of contactless switching device composed entirely of solid-state electronic components. It uses the switching characteristics of electronic components (such as switching transistors, bidirectional thyristors and other semiconductor devices) to achieve the purpose of connecting and disconnecting circuits without contact and sparks, so it is also called a "contactless switch". The integrated solid-state relay is a four-terminal active device, two of which are input control terminals and the other two are output controlled terminals. It has both amplification and isolation functions, and is very suitable for driving high-power switch actuators. Compared with electromagnetic relays, it has higher reliability, no contacts, long life, fast speed, and little interference to the outside world. It has been widely used.

[0003] However, although the integrated solid-state relay performs well in many applications, it still has some defects that cannot be ignored in the existing technology:

[0004] Thermal management issues: The operation of integrated solid-state relays relies on the conduction and cutoff of semiconductor devices. These processes generate heat, which, if not effectively dissipated, will cause the device temperature to rise, thus affecting its performance and reliability. Although existing heat dissipation technologies and materials have alleviated this problem to a certain extent, it is still a challenge in high-power applications.

[0005] Limited overload capacity: Compared with electromagnetic relays, the overload capacity of integrated solid-state relays is relatively weak. When an overload or short circuit occurs in the circuit, the integrated solid-state relay may not be able to withstand excessive current and be damaged. This limits its application in certain occasions that require high overload capacity.

[0006] High cost: Since the integrated solid-state relay uses advanced semiconductor technology and complex manufacturing processes, its manufacturing cost is relatively high. This makes it difficult to promote in some cost-sensitive applications.

[0007] Input and output isolation issues: In some applications, an integrated solid-state relay is required to have electrical isolation between the input and output. However, it is often difficult to achieve efficient electrical isolation in the integrated solid-state relays of the prior art, which increases the risk and complexity of the application.

[0008] Although the integrated solid-state relay performs well in many aspects, there are still some problems in the existing technology that need to be solved. Utility Model Content

[0009] The technical problem to be solved by the utility model is that the integrated solid-state relay in the prior art is often difficult to achieve efficient electrical isolation, which increases the risk and complexity of application. In view of the above-mentioned defects of the prior art, an integrated solid-state relay is provided, comprising:

[0010] A base, wherein a storage groove is provided inside the base, and the left and right side walls of the storage groove are fixedly connected with a first limit block and a second limit block, a circuit board is provided in the storage groove, and threaded grooves are provided on the left and right sides and four corners of the upper surface of the circuit board, an integrated shell is provided directly above the base, and the front and rear sides of the upper surface of the integrated shell are provided with a first placement groove and a second placement groove, and one side of the first placement groove and the second placement groove is fixedly connected with a clamping plate, the circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light-emitting diode, a resistor-capacitor absorption protection circuit, and a heat sink that are electrically connected, the input circuit is used to trigger the action of the integrated solid-state relay, the output circuit is used to respond when the input circuit issues an action instruction, the optical isolation circuit is used to isolate the input circuit from the output circuit, and enhance the anti-interference ability and stability of the relay, the light-emitting diode is used to display the working status of the relay, the resistor-capacitor absorption protection circuit is used to absorb transient overvoltage and protect the relay from damage, and the heat sink is used to reduce the heat generated by the relay during operation to ensure its stable operation.

[0011] Preferably, the input circuit comprises a sensitive element and a driving circuit, the sensitive element is used to receive an external control signal, and the driving circuit is used to convert the external control signal received by the sensitive element into a level suitable for internal processing, thereby triggering the relay to operate.

[0012] Preferably, the output circuit includes a switch element and a load circuit. When the input circuit issues an action instruction, the switch element responds to realize on-off control of the circuit, thereby realizing control of the load.

[0013] Preferably, the optical isolation circuit comprises an optical coupler.

[0014] Preferably, the RC absorption protection circuit comprises a resistor and a capacitor connected in series and / or in parallel.

[0015] Preferably, the heat sink comprises a heat sink, a fan and a fastener, and the fastener is used to fix the heat sink and the heat source.

[0016] Preferably, the sensitive element includes a photoresistor and / or a thermistor.

[0017] Preferably, the switching element comprises a thyristor and / or a transistor.

[0018] Preferably, the base is a thyristor base.

[0019] Preferably, the one-piece housing is an epoxy resin encapsulated one-piece housing.

[0020] The implementation of the integrated solid-state relay of the utility model has the following beneficial effects: by setting a base, a storage groove is provided inside the base, the left and right side walls of the storage groove are fixedly connected with a first limit block and a second limit block, a circuit board is provided in the storage groove, and thread grooves are provided on the left and right sides and four corners of the upper surface of the circuit board, an integrated shell is provided directly above the base, and the first placement groove and the second placement groove are provided on the front and back sides of the upper surface of the integrated shell, and a clamping plate is fixedly connected to one side of the first placement groove and the second placement groove, and the circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light-emitting diode, a resistance-capacitance absorption protection circuit, and a heat sink that are electrically connected, the input circuit is used to trigger the action of the integrated solid-state relay, the output circuit is used to respond when the input circuit issues an action command, and the optical isolation circuit is used to isolate the input circuit from the output circuit, thereby increasing The anti-interference ability and stability of the strong relay are improved, the light-emitting diode is used to display the working status of the relay, the RC absorption protection circuit is used to absorb transient overvoltage and protect the relay from damage, and the radiator is used to reduce the heat generated by the relay during operation to ensure its stable operation; it solves the problem that if the internal parts fail and need to be replaced during use, the installation is difficult and the internal parts cannot be replaced and repaired, and the entire device needs to be replaced, which increases the cost of the device; it can effectively manage heat, has strong overload capacity, low cost, and can effectively isolate the input and output. It is stable and safe to use, and can be widely used in industrial automation, weak current and strong current isolation control and various high-power equipment, such as heating control, lighting control, motors, solenoid valves, electromagnetic vibrators, battery charging and discharging switches and other fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without creative work. The utility model will be further described below in combination with the drawings and embodiments. In the drawings:

[0022] Figure 1 It is a cross-sectional structural schematic diagram of the integrated solid-state relay of the utility model;

[0023] Figure 2 It is a circuit schematic diagram arranged on a circuit board in the integrated solid-state relay of the utility model;

[0024] Figure 3 This is the front view of the integrated solid-state relay of the utility model;

[0025] Figure 4 It is a top view of the integrated solid-state relay of the utility model;

[0026] Figure 5 It is a side view of the integrated solid-state relay of the utility model.

[0027] In the figure, 1-base, 2-storage slot, 3-first limit block, 4-second limit block, 5-integrated housing, 6-first placement slot, 7-second placement slot, 8-clamping plate. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0031] Figure 1 It is a cross-sectional structural schematic diagram of the integrated solid-state relay of the utility model; Figure 2 It is a circuit schematic diagram arranged on a circuit board in the integrated solid-state relay of the utility model; Figure 3 This is the front view of the integrated solid-state relay of the utility model; Figure 4 It is a top view of the integrated solid-state relay of the utility model; Figure 5This is a side view of the integrated solid-state relay of the utility model. Figure 1 to Figure 5 In the integrated solid-state relay provided in the first embodiment of the utility model, at least a base 1 is included, a storage groove 2 is provided inside the base 1, and the left and right side walls of the storage groove 2 are fixedly connected with a first limit block 3 and a second limit block 4, a circuit board is provided in the storage groove 2, and thread grooves (not shown in the figure) are provided on the left and right sides and four corners of the upper surface of the circuit board, an integrated housing 5 is provided directly above the base 1, and the front and rear sides of the upper surface of the integrated housing 5 are provided with a first placement groove 6 and a second placement groove 7, and a clamping plate 8 is fixedly connected to one side of the first placement groove 6 and the second placement groove 7, and the circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light-emitting diode, a resistance-capacitance absorption protection circuit, and a heat sink that are electrically connected, the input circuit is used to trigger the action of the integrated solid-state relay, the output circuit is used to respond when the input circuit issues an action instruction, the optical isolation circuit is used to isolate the input circuit from the output circuit, and enhance the anti-interference ability and stability of the relay, the light-emitting diode is used to display the working state of the relay, the resistance-capacitance absorption protection circuit is used to absorb transient overvoltage and protect the relay from damage, and the heat sink is used to reduce the heat generated by the relay during operation to ensure its stable operation.

[0032] The input circuit includes a sensitive element and a driving circuit, wherein the sensitive element is used to receive an external control signal, and the driving circuit is used to convert the external control signal received by the sensitive element into a level suitable for internal processing, thereby triggering the relay to operate. In specific implementation, the sensitive element includes but is not limited to a photoresistor and / or a thermistor.

[0033] The output circuit includes a switching element and a load circuit. When the input circuit issues an action instruction, the switching element responds to realize the on-off control of the circuit, thereby realizing the control of the load. In the specific implementation, the switching element includes but is not limited to thyristors and / or transistors. As a semiconductor device, the most notable feature of thyristors is their high controllability, which can achieve precise adjustment within a wide range of voltage and current. In addition, thyristors also have stability and reliability, and can work stably for a long time in harsh environments such as high temperature and high humidity. At the same time, it has a fast response speed and can respond quickly to control signals to achieve rapid adjustment of the circuit. Transistor output has the advantages of fast speed, low power consumption and strong driving capability. Through the switching characteristics of the transistor, fast and stable control of the load is achieved. Transistor output, small on-state voltage drop, fast switching speed.

[0034] The optical isolation circuit includes an optical coupler. The optical coupler includes a light-emitting diode and a phototransistor. The light-emitting diode is responsible for converting electrical signals into optical signals, while the phototransistor is responsible for converting optical signals back into electrical signals. When the electrical signal in the input circuit acts on the light-emitting diode, it emits light of a specific wavelength. These optical signals pass through the isolation layer, are received by the phototransistor and converted into electrical signals, and then drive the output circuit. The working principle of the optical isolation circuit is based on the photoelectric effect and the characteristics of the photosensitive device. The process of the light-emitting diode converting electrical signals into optical signals utilizes the luminous effect driven by current, while the phototransistor utilizes the photoelectric effect to convert optical signals into electrical signals. This photoelectric conversion process is unidirectional, that is, light can only be transmitted from the light-emitting diode to the phototransistor, but not in the reverse direction. This unidirectionality ensures the isolation effect between the input circuit and the output circuit. By transmitting information through optical signals, electrical isolation between the input circuit and the output circuit is achieved, ensuring safe and reliable signal transmission.

[0035] The RC absorption protection circuit includes resistors and capacitors in series and / or in parallel. Working principle of RC absorption protection circuit: When transient overvoltage occurs in the circuit, the RC absorption circuit absorbs and converts the overvoltage into heat energy through its impedance and capacitance characteristics, thereby protecting the safety of the relay. Resistors are an important component of RC absorption protection circuits. Its main function is to limit the magnitude of the current and prevent excessive current from damaging other components in the circuit. When transient overvoltage occurs in the circuit, the resistor can effectively absorb this energy, thereby protecting the stable operation of the circuit. Capacitors are another key component in RC absorption protection circuits. The main function of capacitors is to store charge and balance the voltage fluctuations in the circuit by absorbing and releasing charge. When the circuit is subjected to transient impact, the capacitor can quickly absorb the impact energy and prevent this energy from damaging sensitive components in the circuit. The combination of resistors and capacitors forms the core of the RC absorption protection circuit. When transient overvoltage or impact occurs in the circuit, resistors and capacitors work together to effectively protect the circuit from damage by limiting current and balancing voltage. In addition to resistors and capacitors, the RC absorption protection circuit can also include other components, such as inductors, diodes, etc. These components can provide additional protection functions under certain circumstances and enhance the stability and reliability of the circuit.

[0036] The heat sink includes a heat sink, a fan and a clip. The clip is used to fix the heat sink and the heat source. Through the large metal sheet of the heat sink, the heat inside the relay is quickly transferred to the outside world, keeping its internal temperature within a low range. The heat sink is the core part of the heat sink, usually made of metal materials with excellent thermal conductivity, such as copper or aluminum. Its main function is to quickly extract heat from the heat source (such as the CPU) through close contact with the heat source, and disperse the heat into the air through its large heat sink. The fan generates wind flow by rotating, taking away the heat on the heat sink and discharging it into the external environment. The speed and wind force of the fan directly affect the heat dissipation effect. Therefore, choosing a fan with stable performance and low noise is crucial to the overall performance of the heat sink. The role of the clip is to fix the heat sink and the heat source tightly together to ensure good contact between the two, so that the heat can be transferred more effectively. A well-designed clip can not only provide a good fixing effect, but also ensure the ease of installation and convenience of disassembly. Every component of the heat sink plays an indispensable role, and they work together to ensure the normal operation and stability of electronic equipment. Therefore, when choosing a radiator, you need to fully consider many factors such as its heat dissipation performance, noise level, installation convenience, etc. to ensure that you can purchase a radiator with excellent performance and reliable quality.

[0037] The light-emitting diode used to display the working status of the relay can intuitively display the working status of the integrated solid-state relay, which is convenient for users to monitor. According to the working status inside the relay, the light-emitting diode emits a corresponding light signal to prompt the user of the operation status of the relay. Light-emitting diodes are not only energy-saving and environmentally friendly, but also have a long life, high brightness and rich colors. There are many types of LEDs, each with its own characteristics. Common ones are classified by color, such as red, green, blue, white, etc., and different colors can be selected according to actual needs. In addition, there are also classifications by power, ranging from a few milliwatts to several watts, to meet different brightness requirements. In terms of structure, there are also many types of LEDs, such as ordinary LEDs, high-brightness LEDs, super-bright LEDs, etc., which can be selected according to actual needs.

[0038] In specific implementation, the heat sink is arranged at the bottom of the relay, and the operation control and heat dissipation are integrated. The integrated solid-state relay of this embodiment can be encapsulated in one piece by epoxy resin, which is anti-corrosion and anti-vibration, and works reliably.

[0039] During specific implementation, the housing of the integrated solid-state relay of the utility model can be provided with a flame-retardant housing, which can protect the integrated solid-state relay of the utility model and prolong its service life. The radiator can adopt a black oxidation radiator, which not only looks cool, but also has multiple advantages. First, the black oxidation treatment makes the surface of the radiator more wear-resistant and corrosion-resistant, effectively extending the service life. Secondly, the black color can effectively absorb sunlight, reduce the surface temperature of the radiator, and improve the heat dissipation efficiency. In addition, the black oxidation radiator also has excellent thermal conductivity, which can quickly transfer heat to the heat sink to ensure stable operation of the equipment. Choosing a black oxidation radiator not only ensures the heat dissipation effect, but also improves the aesthetics of the whole machine. The integrated solid-state relay of the utility model can also use a flip-cover design, which is convenient for wiring and improves user satisfaction.

[0040] The utility model has the following beneficial effects through the design of the above embodiments: a base is provided, a storage groove is provided inside the base, the left and right side walls of the storage groove are fixedly connected with a first limit block and a second limit block, a circuit board is provided in the storage groove, thread grooves are provided on the left and right sides and four corners of the upper surface of the circuit board, an integrated shell is provided directly above the base, the front and rear sides of the upper surface of the integrated shell are provided with a first placement groove and a second placement groove, one side of the first placement groove and the second placement groove are fixedly connected with a clamping plate, the circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light emitting diode, a resistor-capacitor absorption protection circuit, and a heat sink that are electrically connected, the input circuit is used to trigger the action of the integrated solid-state relay, the output circuit is used to respond when the input circuit issues an action command, the optical isolation circuit is used to isolate the input circuit from the output circuit, and enhance The anti-interference ability and stability of the relay, the light-emitting diode is used to display the working status of the relay, the RC absorption protection circuit is used to absorb transient overvoltage and protect the relay from damage, and the radiator is used to reduce the heat generated by the relay during operation to ensure its stable operation; it solves the problem that if the internal parts fail and need to be replaced during use, the installation is difficult and the internal parts cannot be replaced and repaired. The entire device needs to be replaced, which increases the cost of the device; it can perform effective thermal management, has strong overload capacity, low cost, and the input and output can be effectively isolated. It is stable and safe to use and can be widely used in industrial automation, weak current and strong current isolation control and various high-power equipment, such as heating control, lighting control, motors, solenoid valves, electromagnetic vibrators, battery charging and discharging switches and other fields.

[0041] The present invention is described according to specific embodiments, but those skilled in the art should understand that various changes and equivalent substitutions can be made without departing from the scope of the present invention. In addition, in order to adapt to specific occasions of the present invention technology, many modifications can be made to the present invention without departing from its protection scope. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all embodiments that fall within the scope of protection of the claims.

Claims

1. An integrated solid-state relay, characterized in that: include: A base, wherein a storage groove is provided inside the base, and the left and right side walls of the storage groove are fixedly connected with a first limit block and a second limit block, a circuit board is provided in the storage groove, and threaded grooves are provided on the left and right sides and four corners of the upper surface of the circuit board, an integrated shell is provided directly above the base, and the front and rear sides of the upper surface of the integrated shell are provided with a first placement groove and a second placement groove, and one side of the first placement groove and the second placement groove is fixedly connected with a clamping plate, the circuit board is provided with an input circuit, an output circuit, an optical isolation circuit, a light-emitting diode, a resistor-capacitor absorption protection circuit, and a heat sink that are electrically connected, the input circuit is used to trigger the action of the integrated solid-state relay, the output circuit is used to respond when the input circuit issues an action instruction, the optical isolation circuit is used to isolate the input circuit from the output circuit, and enhance the anti-interference ability and stability of the relay, the light-emitting diode is used to display the working status of the relay, the resistor-capacitor absorption protection circuit is used to absorb transient overvoltage and protect the relay from damage, and the heat sink is used to reduce the heat generated by the relay during operation to ensure its stable operation.

2. The integrated solid-state relay according to claim 1, characterized in that: The input circuit includes a sensitive element and a driving circuit. The sensitive element is used to receive an external control signal. The driving circuit is used to convert the external control signal received by the sensitive element into a level suitable for internal processing, thereby triggering the relay to operate.

3. The integrated solid-state relay according to claim 1, characterized in that: The output circuit includes a switch element and a load circuit. When the input circuit issues an action instruction, the switch element responds to realize on-off control of the circuit, thereby realizing control of the load.

4. The integrated solid-state relay according to claim 1, characterized in that: The optical isolation circuit includes an optical coupler.

5. The integrated solid-state relay according to claim 1, characterized in that: The RC absorption protection circuit includes a resistor and a capacitor connected in series and / or in parallel.

6. The integrated solid-state relay according to claim 1, characterized in that: The heat sink comprises a heat sink, a fan and a fastener, and the fastener is used to fix the heat sink and the heat source.

7. The integrated solid-state relay according to claim 2, characterized in that: The sensitive element includes a photoresistor and / or a thermistor.

8. The integrated solid-state relay according to claim 3, characterized in that: The switch element includes a thyristor and / or a transistor.

9. The integrated solid-state relay according to any one of claims 1 to 8, characterized in that: The base is a thyristor base.

10. The integrated solid-state relay according to any one of claims 1 to 8, characterized in that: The integrated housing is an epoxy resin encapsulated integrated housing.