Aluminum substrate power module

Abstract

The utility model relates to an aluminum substrate power module, which comprises a copper foil layer, an insulating layer and an aluminum substrate, a plurality of power devices are arranged at the upper end of the aluminum substrate, a plurality of capacitors are arranged outside the aluminum substrate, a first wiring copper column is arranged on the aluminum substrate, and the first wiring copper column is communicated with a power supply; the capacitor is characterized by further comprising two copper bars which are arranged up and down, one end of one copper bar is fixedly connected with the positive pin of the capacitor, the other end of the copper bar is fixedly connected with one side of the upper end of the aluminum substrate, one end of the other copper bar is fixedly connected with the negative pin of the capacitor, and the other end of the other copper bar is fixedly connected with the other side of the upper end of the aluminum substrate. According to the technical scheme, the copper bar connection mode enables the current flow direction between the capacitor and the aluminum substrate to be a linear type guided by the two copper bars instead of an original annular type, so that the current flow path is reduced, the resistance is reduced, and the working efficiency of the single-sided board PCB is improved. In addition, the capacitor and the aluminum substrate are connected through the copper bars, the integrality is better, and the aluminum substrate can be well supported.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an aluminum substrate power module. Background Art

[0002] The aluminum substrate is a single-sided PCB process, and the circuit board routing is greatly restricted. The existing technical solution introduces the DC side power supply from the wiring copper column to the PCB (such as Figure 1 As shown in the figure, the current loop path is long and the parasitic parameters are large, which results in poor capacitor filtering effect, affecting the controller EMI and electrical performance (such as peak capacity, power tube voltage stress, etc.). In addition, the overly long current loop path causes the aluminum substrate wiring to have a high current density and severe heat generation. Summary of the invention

[0003] In order to solve the above problems, the purpose of the utility model is to provide an aluminum substrate power module, optimize the routing layout of the copper busbar, reduce the current flow path, reduce the routing resistance / inductance, and improve the working efficiency of the single-sided PCB; in addition, optimize the copper busbar supporting capacitor function; and improve the heat dissipation effect of the single-sided PCB.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0005] An aluminum substrate power module comprises a copper foil layer, an insulating layer and an aluminum substrate, wherein a plurality of power devices are arranged on the upper end of the aluminum substrate, a plurality of capacitors are arranged outside the aluminum substrate, and a first connection copper column and a second connection copper column connected to a power supply are arranged on the aluminum substrate; the module is characterized in that it also comprises two copper bars arranged up and down, wherein one end of one copper bar is fixedly connected to the positive pin of the capacitor, and the other end is fixedly connected to one side of the upper end of the aluminum substrate, and one end of the other copper bar is fixedly connected to the negative pin of the capacitor, and the other end is fixedly connected to the other side of the upper end of the aluminum substrate.

[0006] In the above technical solution, two copper bars are arranged up and down, and the two copper bars connect the pins of the capacitor to the aluminum substrate respectively. This connection method makes the current flow between the capacitor and the aluminum substrate a straight line guided by the two copper bars, rather than the original ring, thereby reducing the current flow path, reducing resistance, and improving the working efficiency of the single-sided PCB. In addition, the copper bar connects the capacitor to the aluminum substrate, which has better integrity and can provide better support for the aluminum substrate. In addition, the connection between the copper bar and the aluminum substrate has a certain thermal conductivity effect, which can improve the heat dissipation effect of the single-sided PCB.

[0007] Preferably, the two copper bars include a first copper bar and a second copper bar, the first copper bar is located above the second copper bar, the upper end of the positive pin is higher than the upper end of the negative pin, one end of the first copper bar is fixedly connected to the positive pin of the capacitor, and the other end is fixedly connected to the side of the upper end of the aluminum substrate relative to the capacitor; one end of the first copper bar is fixedly connected to the negative pin of the capacitor, and the other end is fixedly connected to the side of the upper end of the aluminum substrate close to the capacitor. In this technical solution, the first copper bar is connected to the end of the positive pin of the capacitor that is relatively far from the aluminum substrate, and its area is designed to be large, which can quickly guide the current to flow to the aluminum substrate, thereby improving the working efficiency of the single-sided PCB. If it first flows to the aluminum substrate through the second copper bar with a smaller area, the resistance is relatively large, the current flows slowly, and the working efficiency is relatively low.

[0008] Preferably, the first copper bar is provided with a plurality of first connection holes, through which the positive pin of the capacitor passes to be welded to the first copper bar; the second copper bar is provided with a plurality of second connection holes, through which the negative pin of the capacitor passes to be welded to the second copper bar. In this technical solution, the two pins of the capacitor are respectively welded and fixed through the connection holes on the copper bar, which has high stability.

[0009] Preferably, a plurality of copper blocks are provided on both sides of the upper end of the aluminum substrate, and the other ends of the first copper bar and the second copper bar are fixedly abutted against the upper ends of the plurality of copper blocks on both sides. In this technical solution, the provision of the plurality of copper blocks can raise one side of the first copper bar and the second copper bar, making it easier to install the first copper bar and the second copper bar on the aluminum substrate, and at the same time can prevent one side of the first copper bar and the second copper bar from being completely pressed on the aluminum substrate, thus playing a certain avoidance role.

[0010] Preferably, the surface of the copper block is provided with an insulating sheath, and the first copper bar / the second copper bar, the copper block and the aluminum substrate are fixedly connected by bolts. In this technical solution, the surface of the copper block is provided with an insulating sheath to prevent electrical interference with the power device; in addition, the first copper bar / the second copper bar, the copper block and the aluminum substrate are fixedly connected by bolts, so that the three layers are connected and tightened by bolts, and the stability is higher.

[0011] Preferably, the first copper bar includes a copper sheet A located directly above the plurality of capacitors and a copper sheet B located directly above the aluminum substrate, and a first downward bending section is formed between the copper sheet A and the copper sheet B; the second copper bar includes a copper sheet C attached to the upper ends of the plurality of capacitors and a copper sheet D fixedly attached to the upper end of the copper block, and a second downward bending section is formed between the copper sheet C and the copper sheet D. In this technical solution, the formation of the first bending section and the second bending section can facilitate the connection of the first copper bar and the second copper bar with the aluminum substrate, and can reduce the assembly volume of the first copper bar and the second copper bar, and can improve the structural stability of the first copper bar and the second copper bar.

[0012] Preferably, the first copper bar further comprises a copper sheet E, which is fixedly attached to the upper end of the copper block, and a third downward bending section is formed between the copper sheet B and the copper sheet E. In this technical solution, the formation of the third bending section can further improve the structural stability of the first copper bar, and in addition, the height of the copper block can be reduced, further reducing the assembly volume of the first copper bar.

[0013] Preferably, a plurality of avoidance openings and avoidance holes are constructed on the copper sheet B. In this technical solution, the provision of the plurality of avoidance openings and avoidance holes can reduce the height of the copper sheet B, facilitate the assembly of the first copper bar and the aluminum substrate, and reduce the assembly volume of the first copper bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The figure is a schematic diagram of the layout of the copper busbars on the existing circuit board and its current circulation.

[0015] Figure 2 It is a schematic diagram of the three-dimensional structure of the aluminum substrate power module in this case.

[0016] Figure 3 This is a schematic diagram of the three-dimensional structure of the aluminum substrate power module from another perspective.

[0017] Figure 4 Schematic diagram of the three-dimensional structure of the first copper busbar.

[0018] Figure 5 Schematic diagram of the three-dimensional structure of the second copper busbar.

[0019] Figure 6 Schematic diagram of the current flow from the optimized capacitor through the first copper bus to the aluminum substrate in this case.

[0020] Figure 7 This is a schematic diagram of the current flow from the optimized aluminum substrate through the second copper busbar to the capacitor in this case. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "plurality" means two or more, unless otherwise clearly defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0026] like Figures 2 to 7An aluminum substrate power module shown includes a copper foil layer, an insulating layer, an aluminum substrate 1, and two copper bars arranged up and down, a plurality of power devices 2 are provided at the upper end of the aluminum substrate 1, a plurality of capacitors 3 are provided outside the aluminum substrate 1, and a first connecting copper column 100 and a second connecting copper column 200 connected to a power supply are provided on the aluminum substrate 1; one end of one of the copper bars is fixedly connected to the positive pin 4 of the capacitor 3, and the other end is fixedly connected to one side of the upper end of the aluminum substrate 1, and one end of the other copper bar is fixedly connected to the negative pin 5 of the capacitor 3, and the other end is fixedly connected to the other side of the upper end of the aluminum substrate 1.

[0027] In the above technical solution, two copper bars are arranged up and down, and the two copper bars connect the pins of the capacitor to the aluminum substrate respectively. This connection method makes the current flow between the capacitor and the aluminum substrate a straight line guided by the two copper bars, rather than the original ring, thereby reducing the current flow path, reducing resistance, and improving the working efficiency of the single-sided PCB. In addition, the copper bar connects the capacitor to the aluminum substrate, which has better integrity and can provide better support for the aluminum substrate. In addition, the connection between the copper bar and the aluminum substrate has a certain thermal conductivity effect, which can improve the heat dissipation effect of the single-sided PCB.

[0028] Further, the two copper bars include a first copper bar 6 and a second copper bar 7, the first copper bar 6 is located above the second copper bar 7, the upper end of the positive pin 4 is higher than the upper end of the negative pin 5, one end of the first copper bar 6 is fixedly connected to the positive pin 4 of the capacitor 3, and the other end is fixedly connected to the side of the upper end of the aluminum substrate 1 relative to the capacitor 3; one end of the first copper bar 6 is fixedly connected to the negative pin 5 of the capacitor 3, and the other end is fixedly connected to the side of the upper end of the aluminum substrate 1 close to the capacitor 3. In this technical solution, the first copper bar is connected to the end of the capacitor positive pin relatively far from the aluminum substrate, and its area is designed to be large, which can quickly guide the current to flow to the aluminum substrate, thereby improving the working efficiency of the single-sided PCB. If it first flows to the aluminum substrate through the second copper bar with a smaller area, the resistance is relatively large, the current flows slowly, and the working efficiency is relatively low.

[0029] Further, the first copper bar 6 is provided with a plurality of first connection holes, and the positive pin 4 of the capacitor 3 passes through the first connection holes and is welded to the first copper bar 6; the second copper bar 7 is provided with a plurality of second connection holes, and the negative pin 5 of the capacitor 3 passes through the second connection holes and is welded to the second copper bar 7. In this technical solution, the two pins of the capacitor are respectively welded and fixed through the connection holes on the copper bar, and the stability is high.

[0030] Furthermore, a plurality of copper blocks 8 are correspondingly arranged on both sides of the upper end of the aluminum substrate 1, and the other ends of the first copper bar 6 and the second copper bar 7 are respectively fixedly abutted against the upper ends of the plurality of copper blocks 8 on both sides. In this technical solution, the arrangement of the plurality of copper blocks can raise one side of the first copper bar and the second copper bar, making it easier to install the first copper bar and the second copper bar on the aluminum substrate, and at the same time preventing one side of the first copper bar and the second copper bar from being completely pressed onto the aluminum substrate, thus playing a certain avoidance role.

[0031] Furthermore, the surface of the copper block 8 is provided with an insulating sheath, and the first copper bar 6 / the second copper bar 7, the copper block 8 and the aluminum substrate 1 are fixedly connected by bolts 9. In this technical solution, the surface of the copper block is provided with an insulating sheath to prevent electrical interference with the power device; in addition, the first copper bar / the second copper bar, the copper block and the aluminum substrate are fixedly connected by bolts, so that the three layers are connected and tightened by bolts, and the stability is higher.

[0032] Furthermore, the first copper bar 6 includes a copper sheet A61 located directly above the plurality of capacitors 3 and a copper sheet B62 located directly above the aluminum substrate 1, and a downward first bending section 63 is formed between the copper sheet A61 and the copper sheet B62; the second copper bar 7 includes a copper sheet C71 attached to the upper ends of the plurality of capacitors 3 and a copper sheet D72 fixedly attached to the upper end of the copper block 8, and a downward second bending section 73 is formed between the copper sheet C71 and the copper sheet D72. In this technical solution, the formation of the first bending section and the second bending section can facilitate the connection of the first copper bar and the second copper bar with the aluminum substrate, and can reduce the assembly volume of the first copper bar and the second copper bar, and at the same time can improve the structural stability of the first copper bar and the second copper bar.

[0033] Furthermore, the first copper bar 6 also includes a copper sheet E64, which is fixedly attached to the upper end of the copper block 8, and a downward third bending section 65 is formed between the copper sheet B62 and the copper sheet E64. In this technical solution, the formation of the third bending section can further improve the structural stability of the first copper bar, and in addition, the height of the copper block can be reduced, further reducing the assembly volume of the first copper bar.

[0034] Furthermore, the copper sheet B62 is constructed with a plurality of avoidance openings 10 and avoidance holes 11. In this technical solution, the setting of a plurality of avoidance openings and avoidance holes can reduce the height of the copper sheet B, facilitate the assembly of the first copper bar and the aluminum substrate, and reduce the assembly volume of the first copper bar.

[0035] In this specific embodiment, in view of the long current circulation path and large parasitic parameters on the existing single-sided PCB, which leads to poor capacitor filtering effect, affects the EMI of the controller, electrical performance and heating of the aluminum substrate, the above scheme optimizes the wiring arrangement of the copper bar, so that the current flow between the capacitor and the aluminum substrate is a straight line guided by two copper bars, rather than the original ring, thereby reducing the current flow path, reducing resistance, and improving the working efficiency of the single-sided PCB. In addition, the copper bar (through the copper block) connects the capacitor to the aluminum substrate, which has better integrity and can provide better support for the aluminum substrate. In addition, the connection between the copper bar and the aluminum substrate (through the copper block) plays a certain heat conduction effect, which can improve the heat dissipation effect of the single-sided PCB.

[0036] It should be noted here that the first copper busbar is connected to the first copper connection column via the contact sheet 66 .

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention without departing from the principles and purpose of the present invention.

Claims

1. An aluminum substrate power module, comprising a copper foil layer, an insulating layer and an aluminum substrate (1), wherein a plurality of power devices (2) are arranged on the upper end of the aluminum substrate (1), a plurality of capacitors (3) are arranged outside the aluminum substrate (1), and a first copper connection post (100) and a second copper connection post (200) connected to a power source are arranged on the aluminum substrate (1); the characteristics are: It also includes two copper bars arranged up and down, one end of one of the copper bars being fixedly connected to the positive pin (4) of the capacitor (3), and the other end being fixedly connected to one side of the upper end of the aluminum substrate (1); and one end of the other copper bar being fixedly connected to the negative pin (5) of the capacitor (3), and the other end being fixedly connected to the other side of the upper end of the aluminum substrate (1).

2. The aluminum substrate power module according to claim 1, characterized in that: The two copper bars comprise a first copper bar (6) and a second copper bar (7), the first copper bar (6) being located above the second copper bar (7), the upper end of the positive pin (4) being higher than the upper end of the negative pin (5), one end of the first copper bar (6) being fixedly connected to the positive pin (4) of the capacitor (3), and the other end being fixedly connected to a side of the upper end of the aluminum substrate (1) opposite to the capacitor (3); one end of the first copper bar (6) being fixedly connected to the negative pin (5) of the capacitor (3), and the other end being fixedly connected to a side of the upper end of the aluminum substrate (1) close to the capacitor (3).

3. The aluminum substrate power module according to claim 2, characterized in that: The first copper bar (6) is provided with a plurality of first connection holes, and the positive pin (4) of the capacitor (3) passes through the first connection hole and is welded to the first copper bar (6); the second copper bar (7) is provided with a plurality of second connection holes, and the negative pin (5) of the capacitor (3) passes through the second connection hole and is welded to the second copper bar (7).

4. The aluminum substrate power module according to claim 3, characterized in that: A plurality of copper blocks (8) are correspondingly provided on both sides of the upper end of the aluminum substrate (1), and the other ends of the first copper bar (6) and the second copper bar (7) are respectively fixedly abutted against the upper ends of the plurality of copper blocks (8) on both sides.

5. The aluminum substrate power module according to claim 4, characterized in that: An insulating sheath is provided on the surface of the copper block (8), and the first copper bar (6) / the second copper bar (7), the copper block (8) and the aluminum substrate (1) are fixedly connected by bolts (9).

6. The aluminum substrate power module according to claim 2, characterized in that: The first copper busbar (6) comprises a copper sheet A (61) located directly above the plurality of capacitors (3) and a copper sheet B (62) located directly above the aluminum substrate (1), wherein a first downwardly bent section (63) is formed between the copper sheet A (61) and the copper sheet B (62); the second copper busbar (7) comprises a copper sheet C (71) attached to the upper ends of the plurality of capacitors (3) and a copper sheet D (72) fixedly attached to the upper end of the copper block (8), wherein a second downwardly bent section (73) is formed between the copper sheet C (71) and the copper sheet D (72).

7. The aluminum substrate power module according to claim 6, characterized in that: The first copper bar (6) further comprises a copper sheet E (64), which is fixedly attached to the upper end of the copper block (8), and a third downwardly bent section (65) is formed between the copper sheet B (62) and the copper sheet E (64).

8. The aluminum substrate power module according to claim 6, characterized in that: The copper sheet B (62) is constructed with a plurality of avoidance openings (10) and avoidance holes (11).

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