Power supply heat dissipation structure

Abstract

The utility model relates to the technical field of power supply heat dissipation, and discloses a power supply heat dissipation structure which comprises a mainboard, a chip and a heat dissipation plate, the chip is fixedly installed on one side of the heat dissipation plate, pins are fixedly installed at the bottom end of the chip, the pins are fixedly installed on the top side of the mainboard, tooth grooves are formed in the top end of the heat dissipation plate, and the tooth grooves are communicated with the chip. A tin coating is arranged on the surface of the heat dissipation plate; a plurality of tooth grooves and tin coatings are arranged on the heat dissipation plate, a good heat dissipation effect on the chip can be achieved through heat conduction of the heat dissipation plate, the heat conduction and heat dissipation efficiency of the heat dissipation plate can be further improved through the tooth grooves in the top end of the heat dissipation plate and the tin coatings on the surface of the heat dissipation plate, and the situation that a mainboard is damaged and cannot be used due to the fact that the temperature of the chip is too high is avoided. The service life of the mainboard is prolonged; the pins are soldered on the main board, so that a worker can conveniently install and fix the heat dissipation plate and the chip, and the installation process is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation structure. Background Art

[0002] The existing power supply has the functions of rectification and transformation, so the heat generated is quite large. If the heat continues to accumulate, the electronic components therein will be burned. In order to avoid this phenomenon, a heat dissipation structure is required.

[0003] When dissipating heat, existing power supplies often use heat sinks to dissipate heat for chips in the internal motherboard. The heat sink is often fixed to the motherboard with fastening screws during installation. Due to interference from other components during installation, the heat sink is relatively troublesome and laborious to install, and the overall installation efficiency is low. Therefore, we propose a power supply heat dissipation structure. Utility Model Content

[0004] The purpose of the utility model is to provide a power supply heat dissipation structure to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: including a mainboard, a chip and a heat sink, the chip is fixedly mounted on one side of the heat sink, a pin is fixedly mounted on the bottom of the chip, the pin is fixedly mounted on the top side of the mainboard, a tooth groove is opened on the top of the heat sink, and a tin-plated layer is arranged on the surface of the heat sink.

[0006] Preferably, the number of the teeth grooves and the number of the tin-plated layers on the heat dissipation plate are both several.

[0007] Preferably, the chip is fixed on the heat sink by bonding, and the portion of the heat sink in contact with the chip is made of copper, and the rest of the portion is made of aluminum.

[0008] Preferably, the number of pins on the chip is three, and the pins are soldered to the mainboard. By setting the pins, it is convenient for personnel to fix the chip to the mainboard through the pins.

[0009] Preferably, the mainboard is provided with mounting holes, and the number of the mounting holes is four. By providing the mounting holes, it is convenient for personnel to install the mainboard through the mounting holes.

[0010] The utility model provides a power supply heat dissipation structure, which has the following beneficial effects:

[0011] (1) The power supply heat dissipation structure can achieve good heat dissipation effect on the chip through the heat conduction of the heat sink, and the heat conduction and heat dissipation efficiency of the heat sink can be further improved through the teeth grooves on the top of the heat sink and the tin-plated layer on the surface, thereby preventing the chip temperature from being too high, causing the motherboard to be damaged and unusable, and prolonging the service life of the motherboard;

[0012] (2) The power supply heat dissipation structure can facilitate personnel to install and fix the heat sink and chip by soldering the pins on the mainboard, thereby optimizing the installation process and solving the problem that the existing heat sink is fixed by fastening screws, which makes the installation of the heat sink more complicated. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the heat sink of the utility model;

[0015] Figure 3 For this utility model Figure 1 A schematic diagram of the enlarged structure of the middle part A;

[0016] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure of part B in the middle.

[0017] In the figure: 1. Main board; 2. Heat sink; 3. Chip; 4. Mounting hole; 5. Tooth groove; 6. Tin plating layer; 7. Pin. DETAILED DESCRIPTION

[0018] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0019] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] like Figure 1-4 As shown, the utility model provides a technical solution: a power supply heat dissipation structure, including a mainboard 1, a chip 3 and a heat sink 2, the mainboard 1 is provided with a mounting hole 4, the number of the mounting holes 4 is four, by setting the mounting holes 4, it is convenient for personnel to install the mainboard 1 through the mounting holes 4, the mainboard 1 is connected with a heat sink 2, the number of the heat sink 2 is two, the number of tooth grooves 5 and the number of tin-plated layers 6 on the heat sink 2 are both several, by setting the tin-plated layer 6, the heat dissipation capacity of the surface of the heat sink 2 can be improved, so that the heat dissipation effect is better;

[0022] The chip 3 is fixedly mounted on one side of the heat sink 2, and a pin 7 is fixedly mounted on the bottom end of the chip 3. There are three pins 7 on the chip 3, and the pins 7 are soldered to the main board 1. By setting the pins 7, it is convenient for personnel to fix the chip 3 on the main board 1 through the pins 7. There are three chips 3 on the heat sink 2, and the chip 3 is fixed on the heat sink 2 in a fitting manner. The contact portion of the heat sink 2 with the chip 3 is made of copper, and the rest of the portion is made of aluminum. A tooth groove 5 is provided at the top of the heat sink 2, and a tin-plated layer 6 is provided on the surface of the heat sink 2. The heat conduction of the heat sink 2 can achieve a good heat dissipation effect on the chip 3, and the tooth groove 5 at the top of the heat sink 2 and the tin-plated layer 6 on the surface can further improve the heat conduction and heat dissipation efficiency of the heat sink 2, avoid excessive temperature of the chip 3, and cause the main board 1 to be damaged and unusable, thereby improving the service life of the main board 1;

[0023] By using a combination of copper and aluminum materials for the heat sink 2, and utilizing the characteristics of copper absorbing heat quickly and dissipating heat slowly and aluminum absorbing heat slowly and dissipating heat quickly, the heat dissipation efficiency of the heat sink itself can be improved, and the problem of high cost caused by the original heat sink 2 being made of copper can be solved.

[0024] When the power supply heat dissipation structure is in use, the chip 3 is attached to one side of the heat sink 2 by means of a bonding device, and the pins 7 of the chip 3 are fixedly mounted on the mainboard 1 by means of soldering. The heat conduction of the heat sink 2 can achieve a good heat dissipation effect on the chip 3, and the tooth grooves 5 at the top of the heat sink 2 and the tin-plated layer 6 on the surface can further improve the heat conduction and heat dissipation efficiency of the heat sink 2, thereby preventing the mainboard 1 from being damaged and unusable due to excessive temperature of the chip 3, and thereby increasing the service life of the mainboard 1. By soldering the pins 7 to the mainboard 1, it is convenient for personnel to install and fix the heat sink 2 and the chip 3, thereby optimizing the installation process and solving the problem that the existing heat sink 2 is fixed by fastening screws, resulting in cumbersome installation of the heat sink 2.

[0025] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A power supply heat dissipation structure, comprising a mainboard (1), a chip (3) and a heat dissipation plate (2), characterized in that: The chip (3) is fixedly mounted on one side of the heat sink (2); a pin (7) is fixedly mounted on the bottom end of the chip (3); the pin (7) is fixedly mounted on the top side of the mainboard (1); a tooth groove (5) is provided on the top end of the heat sink (2); and a tin-plated layer (6) is provided on the surface of the heat sink (2).

2. A power supply heat dissipation structure according to claim 1, characterized in that: The number of the tooth grooves (5) and the number of the tin-plated layers (6) on the heat dissipation plate (2) are both several.

3. A power supply heat dissipation structure according to claim 1, characterized in that: The chip (3) is fixed on the heat sink (2) by means of bonding, and the portion of the heat sink (2) in contact with the chip (3) is made of copper, while the remaining portion is made of aluminum.

4. A power supply heat dissipation structure according to claim 1, characterized in that: The number of pins (7) on the chip (3) is three, and the pins (7) are soldered to the mainboard (1) by tin soldering.

5. The power supply heat dissipation structure according to claim 1, characterized in that: The main board (1) is provided with mounting holes (4), and the number of the mounting holes (4) is four.

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