Multilayer circuit board capable of preventing processing dislocation

Abstract

The utility model relates to the technical field of circuit boards, and discloses a multi-layer circuit board capable of preventing processing dislocation, which comprises a water distribution box, a water pipe is fixedly connected inside the water distribution box, the inner wall of the water distribution box is fixedly connected with a partition plate I, and the outer wall of the partition plate I is fixedly connected with a partition plate II. A heat dissipation copper plate is fixedly connected to the outer wall of the second partition plate, a connecting plate is fixedly connected to the outer wall of the heat dissipation copper plate, a prepreg is arranged on the outer wall of the heat dissipation copper plate, a base plate is fixedly connected to the outer wall of the prepreg, and a copper coating layer is fixedly connected to the outer wall of the base plate. According to the utility model, cooling liquid is firstly fed into the water distribution box through the water pipe, then the interior of the water distribution box is separated through the partition plate I in the water distribution box, the cooling liquid is fed into the heat dissipation copper plate through the partition plate I and the partition plate II, and heat dissipation is carried out on the substrate through the prepreg and the copper-clad layer on the outer wall of the heat dissipation copper plate, so that the effect of rapidly cooling the substrate is achieved; and the working efficiency of the circuit board is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer circuit board capable of preventing processing dislocation. Background Art

[0002] Circuit board, also known as printed circuit board, is an indispensable core component in electronic equipment. It forms a fine circuit pattern by carefully laying conductive materials on insulating materials, thereby achieving a stable connection between various electronic components. The introduction of circuit boards makes the assembly process of electronic equipment more concise and efficient, significantly reduces the points and lines required for connection, and reduces the complexity of electronic equipment. However, during the processing of circuit boards, it is usually necessary to combine multiple layers of circuit boards together to achieve more efficient space utilization. Although this combination of multi-layer circuit boards saves space, it also brings a potential problem. During the processing process, multi-layer circuit boards may be misaligned, which will undoubtedly affect the manufacturing accuracy and quality of the circuit boards. Therefore, we need a multi-layer circuit board technology that can prevent processing misalignment to solve this problem.

[0003] A Chinese patent document with the search announcement number CN217936148U discloses a multi-layer circuit board that can prevent processing dislocation, including a circuit board body, a side wall stopper and two end stoppers, the circuit board body is provided with a top layer and a bottom layer, the top layer and the bottom layer are both protective layers, the two end stoppers are respectively arranged at the two ends of the circuit board body, the end stoppers are slidably matched with the circuit board body, the side wall stoppers are arranged on the side walls of the circuit board body, and the side wall stoppers are slidably matched with the circuit board body. The utility model limits the position of the limit frame and the side wall of the circuit board body by the end stoppers to prevent the position of the circuit board body from being offset during processing. However, there are still some problems with the above patents. For example, the patent only solves the problem that the side walls of the multi-layer circuit board cannot be limited during processing, resulting in the dislocation of the multi-layer circuit board during processing, which affects the processing of the multi-layer circuit board, but cannot solve the problem that the multi-layer circuit board generates a lot of heat during use, resulting in reduced working efficiency of the circuit board. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a multi-layer circuit board that can prevent processing dislocation, aiming to improve the problem in the prior art that the multi-layer circuit board generates a lot of heat when in use, resulting in reduced working efficiency of the circuit board.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a multi-layer circuit board that can prevent processing dislocation, comprising a water distribution box, the interior of the water distribution box is fixedly connected to a water pipe, the inner wall of the water distribution box is fixedly connected to a partition plate 1, the outer wall of the partition plate 1 is fixedly connected to a partition plate 2, the outer wall of the partition plate 2 is fixedly connected to a heat dissipation copper plate, the outer wall of the heat dissipation copper plate is fixedly connected to a connecting plate, the outer wall of the heat dissipation copper plate is provided with a semi-cured sheet, the outer wall of the semi-cured sheet is fixedly connected to a substrate, the outer wall of the substrate is fixedly connected to a copper clad layer, the outer wall of the copper clad layer is arranged on the outer wall of the heat dissipation copper plate, the outer wall of the substrate is arranged on the outer wall of the connecting plate, the outer wall of the copper clad layer is arranged on the outer wall of the connecting plate, the outer wall of the semi-cured sheet is arranged on the outer wall of the connecting plate, the outer wall of the connecting plate is fixedly connected to the outer wall of the partition plate 1, and the outer wall of the water distribution box is provided with a limiting component.

[0006] As a further description of the above technical solution:

[0007] The limiting assembly comprises a side plate, and the outer wall of the side plate is fixedly connected to the outer wall of the water distribution tank.

[0008] As a further description of the above technical solution:

[0009] The outer wall of the side plate is fixedly connected to the limiting plate, and the outer wall of the limiting plate is arranged on the outer wall of the prepreg.

[0010] As a further description of the above technical solution:

[0011] The outer wall of the limiting plate is arranged on the outer wall of the substrate, and the outer wall of the limiting plate is arranged on the outer wall of the copper cladding layer.

[0012] As a further description of the above technical solution:

[0013] The outer wall of the limiting plate is arranged on the outer wall of the heat dissipation copper plate, a limiting tube is arranged inside the heat dissipation copper plate, the outer wall of the limiting tube is arranged inside the prepreg, and the outer wall of the limiting tube is arranged on the outer wall of the substrate.

[0014] As a further description of the above technical solution:

[0015] The outer wall of the limiting tube is arranged on the outer wall of the copper cladding layer, the outer wall of the side plate is fixedly connected with a support plate, and the outer wall of the support plate is arranged on the outer wall of the copper cladding layer.

[0016] As a further description of the above technical solution:

[0017] A fixing column is slidably connected inside the side plate, an outer wall of the fixing column is arranged on the outer wall of the prepreg, and a spring is arranged inside the side plate.

[0018] As a further description of the above technical solution:

[0019] One end of the spring is fixedly connected to the inner wall of the side plate, the other end of the spring is fixedly connected to a fixing plate, the outer wall of the fixing plate is fixedly connected to the outer wall of the fixing column, and the fixing plate is slidably connected to the inner wall of the side plate.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, firstly, the coolant is sent into the interior of the water distribution tank through the water pipe, and then the interior of the water distribution tank is separated by the partition 1 inside the water distribution tank, and the coolant is sent into the heat dissipation copper plate through the partition 1 and the partition 2, and the substrate is cooled by the semi-cured sheet and the copper cladding layer on the outer wall of the heat dissipation copper plate, and then the coolant is sent back to the interior of the water distribution tank through the other side of the heat dissipation copper plate. At the same time, the water distribution tank is sealed by the connecting plate on one side of the substrate to prevent the coolant from damaging the substrate, so as to achieve the effect of quickly cooling the substrate, solve the problem that a large amount of heat is generated when the multi-layer circuit board is in use, resulting in a decrease in the working efficiency of the circuit board, and greatly improve the working efficiency of the circuit board.

[0022] 2. In the utility model, the copper clad layer and the prepreg of the substrate and the outer wall of the substrate are clamped on the outer wall of the limiting plate, and the substrate is limited by the side plate at the same time, and then the substrate is pushed into the middle of the two heat dissipation copper plates, and the substrate is limited by the heat dissipation copper plates, and then the limiting tube is inserted into the heat dissipation copper plates and the substrate, and the substrate is fixed again by the limiting tube, so as to prevent the substrate from shifting during processing, making the substrate reinforcement safer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a three-dimensional structural diagram of a multi-layer circuit board that can prevent processing dislocation, which is proposed by the utility model;

[0024] Figure 2 This is a schematic diagram of the internal structure of a water distribution tank for a multi-layer circuit board that can prevent processing dislocation, as proposed by the utility model;

[0025] Figure 3 This is a cross-sectional view of a side plate structure of a multi-layer circuit board that can prevent processing dislocation, as proposed by the utility model;

[0026] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0027] Legend:

[0028] 1. Water distribution tank; 2. Water pipe; 3. Partition one; 4. Connecting plate; 5. Heat dissipation copper plate; 6. Limiting tube; 7. Limiting plate; 8. Side plate; 9. Copper cladding; 10. Base plate; 11. Prepreg; 12. Fixed column; 13. Fixed plate; 14. Spring; 15. Support plate; 16. Partition two. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Reference Figure 1-3 , the utility model provides an embodiment: a multilayer circuit board that can prevent processing dislocation, including a water distribution box 1, the interior of the water distribution box 1 is fixedly connected with a water pipe 2, the inner wall of the water distribution box 1 is fixedly connected with a partition 1 3, the outer wall of the partition 1 3 is fixedly connected with a partition 2 16, the outer wall of the partition 2 16 is fixedly connected with a heat dissipation copper plate 5, the outer wall of the heat dissipation copper plate 5 is fixedly connected with a connecting plate 4, the outer wall of the heat dissipation copper plate 5 is provided with a prepreg 11, the outer wall of the prepreg 11 is fixedly connected with a substrate 10, the outer wall of the substrate 10 is fixedly connected with a copper clad layer 9, the outer wall of the copper clad layer 9 is arranged on the outer wall of the heat dissipation copper plate 5, the outer wall of the substrate 10 is arranged on the outer wall of the connecting plate 4, the outer wall of the copper clad layer 9 is arranged on the outer wall of the connecting plate 4, the outer wall of the prepreg 11 is arranged on the outer wall of the connecting plate 4, the outer wall of the connecting plate 4 is fixedly connected to the outer wall of the partition 1 3, and the outer wall of the water distribution box 1 is provided with a limiting component;

[0031] Specifically, the coolant is sent into the water distribution tank 1 through the water pipe 2, and then the water distribution tank 1 is divided into two parts by the partition 1 3 inside the water distribution tank 1. The coolant sent through the water pipe 2 enters the heat dissipation copper plate 5 through the channel separated by the partition 1 3 and the partition 2 16, and the semi-cured sheet 11 and the copper clad layer 9 are dissipated by the heat dissipation copper plate 5. Then, the coolant is sent back to the water distribution tank 1 through the partition 2 16 and the other side of the partition 1 3, and then the coolant is sent out through another water pipe 2, and the substrate 10 is wrapped by the copper clad layer 9 and the semi-cured sheet 11, and the substrate 10 is dissipated by the copper clad layer 9 and the semi-cured sheet 11, thereby preventing heat accumulation caused by the operation of the multi-layer circuit board, resulting in low working efficiency of the circuit board.

[0032] Reference Figure 3 and Figure 4The limiting assembly includes a side plate 8, the outer wall of the side plate 8 is fixedly connected to the outer wall of the water distribution box 1; the outer wall of the side plate 8 is fixedly connected to the limiting plate 7, and the outer wall of the limiting plate 7 is arranged on the outer wall of the prepreg 11; the outer wall of the limiting plate 7 is arranged on the outer wall of the substrate 10, and the outer wall of the limiting plate 7 is arranged on the outer wall of the copper clad layer 9; the outer wall of the limiting plate 7 is arranged on the outer wall of the heat dissipation copper plate 5, and the heat dissipation copper plate 5 is provided with a limiting tube 6 inside, the outer wall of the limiting tube 6 is arranged inside the prepreg 11, and the outer wall of the limiting tube 6 is arranged on the outer wall of the substrate 10; the outer wall of the limiting tube 6 is arranged on the outer wall of the copper clad layer 9, and the outer wall of the side plate 8 is fixedly connected with a supporting plate 15, and the outer wall of the supporting plate 15 is arranged on the outer wall of the copper clad layer 9;

[0033] Specifically, the side plate 8 provides support for the limiting plate 7, and the copper clad layer 9, the substrate 10 and the semi-cured sheet 11 are clamped on the limiting plate 7 by the limiting plate 7. The limiting plate 7 limits them to prevent the copper clad layer 9, the substrate 10 and the semi-cured sheet 11 from shifting during processing, and then the upper and lower positions of the copper clad layer 9, the substrate 10 and the semi-cured sheet 11 are limited by the heat dissipation copper plate 5 to prevent them from moving, and then the copper clad layer 9, the substrate 10 and the semi-cured sheet 11 are supported by the support plate 15 under the side plate 8 to prevent them from falling during processing.

[0034] Reference Figure 3 and Figure 4 The inner part of the side plate 8 is slidably connected with a fixing column 12, the outer wall of the fixing column 12 is arranged on the outer wall of the semi-cured sheet 11, and a spring 14 is arranged inside the side plate 8; one end of the spring 14 is fixedly connected to the inner wall of the side plate 8, and the other end of the spring 14 is fixedly connected to a fixing plate 13, the outer wall of the fixing plate 13 is fixedly connected to the outer wall of the fixing column 12, and the fixing plate 13 is slidably connected to the inner wall of the side plate 8;

[0035] Specifically, the fixing column 12 is limited by the side plate 8 so that the fixing column 12 can only slide inside the side plate 8, and then the spring 14 is limited by the side plate 8, and then the side plate 8 and the fixing plate 13 are connected together by the spring 14, and at the same time, the fixing column 12 is connected by the fixing plate 13 to prevent the fixing column 12 from detaching from the side plate 8, so that the semi-cured sheet 11 can be limited by the fixing column 12 to prevent the semi-cured sheet 11 from detaching from the side plate 8.

[0036] Working principle: When a multi-layer circuit board that can prevent processing dislocation is needed, the copper clad layer 9 and the prepreg 11 are installed on the lower surface and the upper surface of the substrate 10 respectively, and then the substrate 10 is pushed into the middle of the two heat dissipation copper plates 5, and then the support plate 15 on the side plate 8 is used to limit the bottom of the substrate 10 to prevent the substrate 10 from detaching from the bottom of the side plate 8, and then the substrate 10 and the support plate 15 are limited by the limit plate 7 on the side plate 8 to prevent the substrate 10 and the heat dissipation copper plate 5 from moving horizontally, and then the limit tube 6 is inserted into the inside of the substrate 10 and the heat dissipation copper plate 5 along the holes on the substrate 10 and the heat dissipation copper plate 5, so as to The positions of the substrate 10 and the heat dissipation copper plate 5 are reinforced to prevent the substrate 10 from being misplaced during processing, and then the water distribution tank 1 is installed on the heat dissipation copper plate 5, and the coolant is sent into the interior of the water distribution tank 1 through the water pipe 2, and the coolant is sent into the interior of the heat dissipation copper plate 5 through the partition 1 3 and the partition 2 16, and the substrate 10 is cooled by the copper clad layer 9 and the semi-cured sheet 11 on the outer wall of the heat dissipation copper plate 5, and then the coolant is sent back to the interior of the water distribution tank 1 through the heat dissipation copper plate 5, and then the coolant is discharged through another water pipe 2, thereby achieving the effect of cooling the multi-layer circuit board, so that the circuit board can achieve the designed work efficiency.

[0037] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-layer circuit board capable of preventing processing dislocation, comprising a water distribution tank (1), characterized in that: The water distribution box (1) is fixedly connected to a water pipe (2) inside, the inner wall of the water distribution box (1) is fixedly connected to a partition plate 1 (3), the outer wall of the partition plate 1 (3) is fixedly connected to a partition plate 2 (16), the outer wall of the partition plate 2 (16) is fixedly connected to a heat dissipation copper plate (5), the outer wall of the heat dissipation copper plate (5) is fixedly connected to a connecting plate (4), the outer wall of the heat dissipation copper plate (5) is provided with a prepreg (11), the outer wall of the prepreg (11) is fixedly connected to a base plate (10), and the base plate ( The outer wall of the substrate (10) is fixedly connected with a copper clad layer (9), the outer wall of the copper clad layer (9) is arranged on the outer wall of the heat dissipation copper plate (5), the outer wall of the substrate (10) is arranged on the outer wall of the connecting plate (4), the outer wall of the copper clad layer (9) is arranged on the outer wall of the connecting plate (4), the outer wall of the semi-cured sheet (11) is arranged on the outer wall of the connecting plate (4), the outer wall of the connecting plate (4) is fixedly connected to the outer wall of the partition plate (3), and the outer wall of the water distribution box (1) is provided with a limiting component.

2. A multilayer circuit board capable of preventing processing dislocation according to claim 1, characterized in that: The limiting assembly comprises a side plate (8), the outer wall of the side plate (8) being fixedly connected to the outer wall of the water distribution tank (1).

3. A multilayer circuit board capable of preventing processing dislocation according to claim 2, characterized in that: The outer wall of the side plate (8) is fixedly connected to the limiting plate (7), and the outer wall of the limiting plate (7) is arranged on the outer wall of the prepreg (11).

4. A multilayer circuit board capable of preventing processing dislocation according to claim 3, characterized in that: The outer wall of the limiting plate (7) is arranged on the outer wall of the base plate (10), and the outer wall of the limiting plate (7) is arranged on the outer wall of the copper cladding layer (9).

5. A multilayer circuit board capable of preventing processing dislocation according to claim 4, characterized in that: The outer wall of the limiting plate (7) is arranged on the outer wall of the heat dissipation copper plate (5), a limiting tube (6) is arranged inside the heat dissipation copper plate (5), the outer wall of the limiting tube (6) is arranged inside the prepreg (11), and the outer wall of the limiting tube (6) is arranged on the outer wall of the base plate (10).

6. A multilayer circuit board capable of preventing machining dislocation according to claim 5, characterized in that: The outer wall of the limiting tube (6) is arranged on the outer wall of the copper cladding layer (9), the outer wall of the side plate (8) is fixedly connected to a support plate (15), and the outer wall of the support plate (15) is arranged on the outer wall of the copper cladding layer (9).

7. A multi-layer circuit board capable of preventing machining dislocation according to claim 6, characterized in that: A fixing column (12) is slidably connected inside the side plate (8), an outer wall of the fixing column (12) is arranged on the outer wall of the prepreg (11), and a spring (14) is arranged inside the side plate (8).

8. A multi-layer circuit board capable of preventing machining dislocation according to claim 7, characterized in that: One end of the spring (14) is fixedly connected to the inner wall of the side plate (8), the other end of the spring (14) is fixedly connected to a fixing plate (13), the outer wall of the fixing plate (13) is fixedly connected to the outer wall of the fixing column (12), and the fixing plate (13) is slidably connected to the inner wall of the side plate (8).

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