Thermal management system of automatic driving domain controller and vehicle with thermal management system

Abstract

The utility model provides a thermal management system of an automatic driving domain controller and a vehicle with the thermal management system. The thermal management system comprises a liquid cooling device, the liquid cooling device at least comprises a liquid cooling flow channel and a liquid cooling controller, the liquid cooling flow channel is formed in a PCB of the automatic driving domain controller, the liquid cooling flow channel is provided with a water inlet and a water outlet, and the liquid cooling controller is at least used for controlling the cooling liquid flow of the liquid cooling flow channel; the number of the chip temperature acquisition modules is at least one, and the chip temperature acquisition modules are used for acquiring temperature information of at least one SOC chip of the automatic driving domain controller; and the MCU module is arranged on the PCB, and the MCU module is electrically connected with the chip temperature acquisition module and the liquid cooling controller. According to the technical scheme, the flow of the cooling liquid is flexibly adjusted according to the collected temperature of the SOC chip, redundant design can be reduced, and then the effect of reducing power consumption of the whole vehicle is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle thermal management, and in particular to a thermal management system of an autonomous driving domain controller and a vehicle having the same. Background Art

[0002] Since the HAD controller uses a high-computing chip, the power consumption of the whole machine is relatively large. Traditional passive cooling and air cooling cannot meet the cooling needs of the controller, and liquid cooling is required. The HAD controller has a water inlet and a water outlet, and a flow channel is designed inside to ensure that the heat generated by the controller can be taken out through the liquid cooling source.

[0003] The existing solution uses a liquid cooling source with a constant flow rate and flow, such as a water inlet temperature of 55°C and a flow rate of 5L / min. Although thermal simulation and thermal testing can ensure the normal operation of the controller, the redundant design is not conducive to reducing the power consumption of the entire vehicle.

[0004] Currently, no effective solution has been proposed to the problem of excessive power consumption of the entire vehicle caused by the redundant design of the liquid cooling system of the above-mentioned controller. Utility Model Content

[0005] The main purpose of the utility model is to provide a thermal management system of an autonomous driving domain controller and a vehicle having the same, so as to solve the problem of excessive power consumption of the whole vehicle caused by the redundant design of the controller liquid cooling system in the prior art.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a thermal management system of an autonomous driving domain controller is provided, including: a liquid cooling device, the liquid cooling device at least includes a liquid cooling channel and a liquid cooling controller, the liquid cooling channel is arranged on the PCB board of the autonomous driving domain controller, the liquid cooling channel has a water inlet and a water outlet, and the liquid cooling controller is at least used to control the coolant flow rate of the liquid cooling channel; a chip temperature acquisition module, there is at least one chip temperature acquisition module, and the chip temperature acquisition module is used to collect temperature information of at least one SOC chip of the autonomous driving domain controller; an MCU module, the MCU module is arranged on the PCB board, and the MCU module is electrically connected to the chip temperature acquisition module and the liquid cooling controller.

[0007] Furthermore, the thermal management system also includes: a water inlet temperature acquisition module, which is used to collect the temperature of the PCB board at the water inlet, and the water inlet temperature acquisition module is electrically connected to the MCU module.

[0008] Furthermore, the thermal management system also includes: a board temperature acquisition module, which is arranged on the PCB board and is used to acquire the board temperature of the PCB board. The board temperature acquisition module is electrically connected to the MCU module.

[0009] Furthermore, there are multiple chip temperature acquisition modules, and each chip temperature acquisition module is used to collect temperature information of a SOC chip.

[0010] Furthermore, the chip temperature acquisition module includes: a first temperature element, which is arranged inside the SOC chip and is used to collect first temperature information inside the SOC chip; the first temperature element and the MCU module transmit signals via Ethernet.

[0011] Furthermore, the chip temperature acquisition module includes: a second temperature element, the second temperature element is arranged on the PCB board, the second temperature element is arranged adjacent to the first temperature element, and the second temperature element is used to collect the DC-DC chip temperature; the second temperature element transmits a signal to the MCU module through an analog signal.

[0012] Furthermore, the chip temperature acquisition module includes: a third temperature element, the third temperature element is arranged on the PCB board, the third temperature element is arranged adjacent to the first temperature element, and the third temperature element is used to collect the DDR chip temperature; the third temperature element transmits a signal to the MCU module through an analog signal.

[0013] Furthermore, the board temperature collection module includes: a board temperature collection element, there is at least one board temperature collection element, wherein at least one board temperature collection element is arranged at the geometric center position of the PCB board.

[0014] Furthermore, at least one of the plate body temperature collection element and the water inlet temperature collection module is a thermistor.

[0015] Further, at least one of the first temperature element, the second temperature element, and the third temperature element is a thermistor.

[0016] According to another aspect of the utility model, a vehicle is provided, the vehicle having a thermal management system of an autonomous driving domain controller, and the thermal management system of the autonomous driving domain controller is the thermal management system of the autonomous driving domain controller mentioned above.

[0017] By applying the technical solution of the utility model, the chip temperature acquisition module can collect the temperature information of the SOC chip, so as to adjust the coolant flow of the liquid cooling channel according to the temperature information of the SOC chip, thereby making the thermal management of the autonomous driving domain controller more flexible and reasonable, keeping the temperature of the autonomous driving domain controller within a suitable range, and improving the performance of the autonomous driving domain controller. At the same time, the coolant flow can be flexibly adjusted according to the collected SOC chip temperature, which can reduce redundant design and thus play a role in reducing the power consumption of the entire vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 A schematic structural diagram of an embodiment of a thermal management system of an autonomous driving domain controller according to the present utility model is shown;

[0020] Figure 2 A flow matrix schematic diagram of a thermal management system of an autonomous driving domain controller according to the present utility model is shown. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0025] like Figure 1 As shown, according to a specific embodiment of the present application, a thermal management system for an autonomous driving domain controller is provided.

[0026] The thermal management system includes a liquid cooling device, a chip temperature acquisition module and an MCU module. The liquid cooling device includes at least a liquid cooling channel and a liquid cooling controller. The liquid cooling channel is opened on the PCB board of the autonomous driving domain controller. The liquid cooling channel has a water inlet and a water outlet. The liquid cooling controller is at least used to control the coolant flow rate of the liquid cooling channel; there is at least one chip temperature acquisition module, and the chip temperature acquisition module is used to collect temperature information of at least one SOC chip of the autonomous driving domain controller; the MCU module is arranged on the PCB board, and the MCU module is electrically connected to the chip temperature acquisition module and the liquid cooling controller.

[0027] By applying the technical solution of this embodiment, the chip temperature acquisition module can collect the temperature information of the SOC chip, so as to adjust the coolant flow of the liquid cooling channel according to the temperature information of the SOC chip, thereby making the thermal management of the autonomous driving domain controller more flexible and reasonable, keeping the temperature of the autonomous driving domain controller within a suitable range, and improving the performance of the autonomous driving domain controller. At the same time, by flexibly adjusting the coolant flow according to the collected SOC chip temperature, redundant design can be reduced, thereby reducing the power consumption of the entire vehicle.

[0028] It should be noted that in this embodiment, the autonomous driving domain controller is mainly a high-level autonomous driving domain controller (HAD). HAD is mainly composed of a high-performance SoC chip and surrounding circuits, which collects and processes camera data, lidar data, and millimeter-wave radar data to realize the relevant functions of vehicle intelligent driving.

[0029] Furthermore, the thermal management system also includes a water inlet temperature acquisition module, which is used to collect the PCB board temperature at the water inlet, and the water inlet temperature acquisition module is electrically connected to the MCU module.

[0030] In this embodiment, by collecting the temperature of the PCB board at the water inlet and combining the temperature information of the SOC chip mentioned above, the coolant flow is adjusted, which can make the controller temperature adjustment more reasonable and practical.

[0031] Furthermore, the thermal management system also includes a board temperature acquisition module, which is arranged on the PCB board and is used to collect the board temperature of the PCB board. The board temperature acquisition module is electrically connected to the MCU module.

[0032] In this embodiment, the board temperature of the PCB board collected by the board temperature collection module can be used for both coolant flow control and controller working state control. For example, when it is determined that the board temperature of the PCB board is abnormal, the controller can be judged to be abnormal, and the controller can be stopped and repaired and inspected in time.

[0033] Preferably, there are multiple chip temperature acquisition modules, each of which is used to acquire temperature information of a SOC chip, so that the temperature information of multiple SOC chips can be acquired simultaneously, making the coolant flow control more reasonable.

[0034] Furthermore, the chip temperature acquisition module includes a first temperature element, which is arranged inside the SOC chip and used to collect first temperature information inside the SOC chip; the first temperature element and the MCU module transmit signals via Ethernet. By setting the first temperature element, the internal temperature of the SOC chip can be collected, and based on the internal temperature of the SOC chip, it is comprehensively judged whether the current coolant flow is reasonable, and then the coolant flow is appropriately adjusted to make the controller temperature suitable.

[0035] Furthermore, the chip temperature acquisition module includes a second temperature element, which is arranged on the PCB board, and the second temperature element is arranged adjacent to the first temperature element, and the second temperature element is used to collect the temperature of the DC-DC chip; the second temperature element transmits a signal to the MCU module through an analog signal. By setting the second temperature element, the temperature at the position of the DC-DC chip can be collected, providing more references for the coolant flow control, so as to appropriately adjust the coolant flow so that the controller temperature is suitable.

[0036] Furthermore, the chip temperature acquisition module includes a third temperature element, which is arranged on the PCB board, and is arranged adjacent to the first temperature element, and is used to acquire the temperature of the DDR chip; the third temperature element transmits a signal to the MCU module through an analog signal. By setting the third temperature element, the DDR chip temperature can be acquired, providing more references for the coolant flow control, so as to appropriately adjust the coolant flow to make the controller temperature suitable.

[0037] Specifically, the board temperature acquisition module includes a board temperature acquisition element, and there is at least one board temperature acquisition element, wherein at least one board temperature acquisition element is arranged at the geometric center of the PCB board. By arranging the board temperature acquisition element at the geometric center of the PCB board, the temperature at the center of the PCB board can be collected, which is beneficial for subsequent adjustment of the coolant flow and judgment of the controller state.

[0038] According to actual needs, board temperature collection elements can also be arranged at multiple locations on the PCB board to obtain more accurate board temperature.

[0039] Optionally, at least one of the plate body temperature collection element, the water inlet temperature collection module, the first temperature element, the second temperature element, and the third temperature element is a thermistor.

[0040] Preferably, the plate body temperature collection element, the water inlet temperature collection module, the first temperature element, the second temperature element, and the third temperature element are all thermistors, which can reduce the manufacturing cost.

[0041] According to another specific embodiment of the present application, a vehicle is provided, wherein the vehicle has a thermal management system of an autonomous driving domain controller, and the thermal management system of the autonomous driving domain controller is the thermal management system of the autonomous driving domain controller in the above-mentioned embodiment.

[0042] The present application also provides a preferred embodiment of a thermal management system of a HAD controller and a control method thereof, wherein the HAD controller includes three SOC chips.

[0043] Specifically, in a preferred embodiment, the SOC chip and the MCU are arranged on the PCB board as follows: Figure 1 As shown: the solid line represents the analog signal, and the dotted line represents the Ethernet signal. There are three chip temperature acquisition modules, namely module 1, module 2 and module 3. The chip temperature acquisition modules include a first temperature element (such as SoC-1, SoC-2, SoC-3, a second temperature element (such as DC-DC-1, DC-DC-2, DC-DC-3), and a third temperature element (such as DDR-1, DDR-2, DDR-3) to collect three temperature information.

[0044] Specifically, module 1 includes SoC-1, DC-DC-1 and DDR-1, which collect 3 temperature information in total. DC-DC-1 and DDR-1 collect temperature information by placing thermistors near the chip, and SoC-1 collects temperature information through the temperature sensor built into the chip. DC-DC-1 transmits temperature information to MCU-1 through analog signals, DDR-1 transmits temperature information to MCU-1 through analog signals, and SoC-1 transmits temperature information to MCU-1 through Ethernet signals.

[0045] Module 2 includes SoC-2, DC-DC-2 and DDR-2, which collect 3 temperature information in total. DC-DC-2 and DDR-2 collect temperature information by placing thermistors near the chip, and SoC-2 collects temperature information through the temperature sensor built into the chip. DC-DC-2 transmits temperature information to MCU-1 through analog signals, DDR-2 transmits temperature information to MCU-1 through analog signals, and SoC-2 transmits temperature information to MCU-1 through Ethernet signals.

[0046] Module 3 includes SoC-3, DC-DC-3 and DDR-3, which collect 3 temperature information in total. DC-DC-3 and DDR-3 collect temperature information by placing thermistors near the chip, and SoC-3 collects temperature information through the temperature sensor built into the chip. DC-DC-3 transmits temperature information to MCU-1 through analog signals, DDR-3 transmits temperature information to MCU-1 through analog signals, and SoC-3 transmits temperature information to MCU-1 through Ethernet signals.

[0047] Two additional thermistors are arranged on the PCB board. One is arranged at the center of the PCB board, which is NT-1 (i.e. the aforementioned board temperature acquisition element), which is used to monitor the PCB temperature of the entire board and transmit the temperature information to MCU-1 through analog signals. The other is arranged at the water inlet position, which is NT-2 (i.e. the aforementioned water inlet temperature acquisition module), which is used to monitor the water temperature at the water inlet and transmit the temperature information to MCU-1 through analog signals.

[0048] The temperature monitoring of the external thermistor is collected by MCU-1, and MCU-1 requests flow control based on the current temperature. Internal temperature monitoring is completed by each SOC and reported to MCU-1. If there is a risk of over-temperature in the SOC, it is necessary to actively reduce power consumption; MCU-1 makes a comprehensive judgment based on the temperature reported by the SOC and actively requests flow control before the over-temperature limit is reached.

[0049] The hardware control strategy after the chip temperature is abnormal is as follows:

[0050] 1. If the chip temperature is detected to be high, the thermal management module will actively request to increase the flow.

[0051] 2. If the chip temperature is detected to be low, the thermal management module will actively request to reduce the flow.

[0052] 3. If the temperature is too high, the thermal management module will actively request to increase the flow, and the over-temperature SoC chip will actively reduce the load.

[0053] According to the thermal test results, it is deduced that Figure 2The flow matrix shown is applied to the actual vehicle. The highest temperature of the chip is the highest temperature information among all the collected temperature information. Take the water inlet temperature as 0°C as an example:

[0054] 1. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is less than -40°C, the flow rate of the water inlet is controlled at 5L / min.

[0055] 2. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is between -40°C and 55°C, the flow rate of the water inlet is controlled at 2L / min.

[0056] 3. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is between 55°C and 75°C, the flow rate of the water inlet is controlled at 2L / min.

[0057] 4. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is between 75°C and 95°C, the flow rate of the water inlet is controlled at 2L / min.

[0058] 5. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is between 95°C and 115°C, the flow rate of the water inlet is controlled at 2L / min.

[0059] 6. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 is between 115°C and 125°C, the flow rate of the water inlet is controlled at 4L / min.

[0060] 7. When the water inlet temperature is 0°C and the maximum chip temperature collected by MCU-1 exceeds 125°C, the flow rate of the water inlet is controlled at 4L / min.

[0061] By using the matrix flow control in this embodiment, the flow rate of the liquid cooling source is adjusted in real time, which can reduce the redundant design of thermal management.

[0062] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0063] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present utility model.

[0064] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0065] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A thermal management system for an autonomous driving domain controller, characterized in that: include: A liquid cooling device, the liquid cooling device at least comprising a liquid cooling channel and a liquid cooling controller, the liquid cooling channel being provided on a PCB board of the autonomous driving domain controller, the liquid cooling channel having a water inlet and a water outlet, and the liquid cooling controller being at least used for controlling a coolant flow rate of the liquid cooling channel; A chip temperature acquisition module, wherein there is at least one chip temperature acquisition module, and the chip temperature acquisition module is used to collect temperature information of at least one SOC chip of the autonomous driving domain controller; An MCU module is disposed on the PCB board and is electrically connected to the chip temperature acquisition module and the liquid cooling controller.

2. The thermal management system of the autonomous driving domain controller according to claim 1, characterized in that: The thermal management system further comprises: The water inlet temperature acquisition module is used to collect the temperature of the PCB board at the water inlet, and the water inlet temperature acquisition module is electrically connected to the MCU module.

3. The thermal management system of the autonomous driving domain controller according to claim 2, characterized in that: The thermal management system further comprises: A board temperature acquisition module is provided on the PCB board, and is used to acquire the board temperature of the PCB board. The board temperature acquisition module is electrically connected to the MCU module.

4. The thermal management system of the autonomous driving domain controller according to claim 1, characterized in that: There are multiple chip temperature acquisition modules, and each chip temperature acquisition module is used to acquire temperature information of one SOC chip.

5. The thermal management system of the autonomous driving domain controller according to claim 4, characterized in that: The chip temperature acquisition module comprises: A first temperature element, the first temperature element is arranged inside the SOC chip, and the first temperature element is used to collect first temperature information inside the SOC chip; The first temperature element and the MCU module transmit signals via Ethernet.

6. The thermal management system of the autonomous driving domain controller according to claim 5, characterized in that: The chip temperature acquisition module comprises: A second temperature element, the second temperature element is arranged on the PCB board, the second temperature element is arranged adjacent to the first temperature element, and the second temperature element is used to collect the temperature of the DC-DC chip; The second temperature element transmits a signal to the MCU module via an analog signal.

7. The thermal management system of the autonomous driving domain controller according to claim 6, characterized in that: The chip temperature acquisition module comprises: A third temperature element, the third temperature element is arranged on the PCB board, the third temperature element is arranged adjacent to the first temperature element, and the third temperature element is used to collect the temperature of the DDR chip; The third temperature element transmits a signal to the MCU module via an analog signal.

8. The thermal management system of the autonomous driving domain controller according to claim 3, characterized in that: The board temperature acquisition module includes: There is at least one board temperature collection element, wherein at least one board temperature collection element is arranged at the geometric center of the PCB board.

9. The thermal management system of the autonomous driving domain controller according to claim 8, characterized in that: At least one of the plate body temperature collection element and the water inlet temperature collection module is a thermistor.

10. The thermal management system of the autonomous driving domain controller according to claim 7, characterized in that: At least one of the first temperature element, the second temperature element, and the third temperature element is a thermistor.

11. A vehicle, characterized in that: The vehicle has a thermal management system of an autonomous driving domain controller, and the thermal management system of the autonomous driving domain controller is the thermal management system of the autonomous driving domain controller according to any one of claims 1-10.

Images