Cooling structure and electronic equipment

Abstract

The utility model discloses a cooling structure, which comprises a shell, a cooling device and a cooling device, the cooling medium channel is arranged in the inner cavity of the shell and defines an electronic device placing area; wherein the cooling medium channel and the shell wall of the shell are integrally formed, the cooling medium channel comprises a cooling medium inlet and a cooling medium outlet, and the cooling medium inlet and the cooling medium outlet are located in the shell wall of the shell. According to the utility model, the cooling liquid can be prevented from leaking to the electronic device placing area to cause short circuit or other faults of the electronic device, and the heat dissipation efficiency can be improved. The utility model also provides an electronic device.

Description

Technical Field

[0001] The utility model relates to the field of power electronics, in particular to a cooling structure and electronic equipment. Background Art

[0002] The cooling structure of existing electric vehicle inverters is mostly a planar structure, including a cooling chamber and a heat sink. The cooling medium is located in the cooling chamber. The heat sink covers the cooling chamber and is sealed to the cooling chamber through a sealing ring. Multiple electronic devices are attached to the end of the heat sink facing away from the cooling chamber. Multiple short and dense fins are set at the end of the heat sink facing the cooling chamber. The cooling medium flows through the fins and takes away the heat of the electronic devices, such as the commonly used Pin-fin structure.

[0003] Among them, the isolation of the coolant and the electronic device is completely dependent on the sealing ring, that is, with the sealing ring, the coolant will not overflow to make the coolant contact with the electronic device. If the sealing ring fails, the coolant will overflow, causing the electronic device at one end of the heat sink to contact the coolant, thereby causing the electronic device to short-circuit or other failures. At the same time, this Pin-fin structure does not fully utilize the advantages of liquid heat dissipation. Although the fins are dense, the fins are relatively short, and the coolant flowing in is small, resulting in low heat dissipation efficiency. For the cooling structure with single-sided heat dissipation, the fins can be set to a slender structure so that more coolant can flow in. However, at this time, the tail of the fin is far away from the electronic device, and the heat of the electronic device cannot be transferred to the tail of the fin, and cannot take away more heat, resulting in average heat dissipation effect.

[0004] Therefore, there is an urgent need to design a cooling structure that can prevent the coolant from leaking into the electronic device placement area, causing short circuits or other failures in the electronic devices, while improving the heat dissipation efficiency. Utility Model Content

[0005] The utility model aims to solve the problem that the cooling liquid leaks into the electronic device placement area, causing the electronic device to short-circuit or other faults and low heat dissipation efficiency. The utility model provides a cooling structure and electronic equipment, which can prevent the cooling liquid from leaking into the electronic device placement area, causing the electronic device to short-circuit or other faults, and can improve the heat dissipation efficiency.

[0006] In order to solve the above technical problems, the embodiment of the utility model discloses a cooling structure, comprising:

[0007] a housing including an inner cavity;

[0008] A cooling medium channel is provided in the inner cavity of the housing and defines an electronic device placement area; wherein,

[0009] The cooling medium channel is integrally formed with the shell wall of the shell, and the cooling medium channel comprises a cooling medium inlet and a cooling medium outlet, and the cooling medium inlet and the cooling medium outlet are located on the shell wall of the shell.

[0010] By adopting the above technical scheme, the cooling medium channel and the shell wall of the shell are integrally formed, so that when the cooling medium (for example, coolant, for the convenience of description, the following description is based on the cooling medium being coolant) is passed into the cooling medium channel, the coolant can flow in the cooling medium channel without leakage, thereby ensuring that the coolant will not leak when the cooling structure is used. At the same time, an electronic device placement area is defined in the inner cavity of the shell by the cooling medium channel, that is, the cooling medium channel isolates the coolant from the electronic device placement area, that is, the coolant and the electronic device are completely in contact, even if the coolant leaks, it will not cause a short circuit or other faults in the electronic device placement area, effectively preventing the coolant from leaking into the electronic device placement area and causing a short circuit or other faults in the electronic device.

[0011] At the same time, the cooling medium channel defines the electronic device placement area, that is, the electronic device placement area surrounds the cooling medium channel. When the coolant passes through the cooling medium channel, it can fully contact the electronic devices in the electronic device placement area, take away their heat, and improve the cooling efficiency.

[0012] According to another specific embodiment of the present utility model, an embodiment of the present utility model discloses a cooling structure, wherein the inner wall of the cooling medium channel is provided with a plurality of fins.

[0013] By adopting the above technical solution, by arranging multiple fins on the inner wall of the cooling medium channel, the heat exchange area can be expanded and the efficiency of heat transfer can be improved. That is to say, when coolant is passed into the cooling medium channel, the coolant can take away more heat from the electronic components placed in the electronic component placement area, thereby improving the cooling effect.

[0014] According to another specific embodiment of the present utility model, an embodiment of the present utility model discloses a cooling structure, wherein both ends of each of the plurality of fins are connected to the inner wall of the cooling medium channel.

[0015] According to another specific embodiment of the utility model, the embodiment of the utility model discloses a cooling structure, the shell wall includes a first shell wall and a second shell wall, the first shell wall and the second shell wall are arranged opposite to each other, the cooling medium inlet is arranged at the first shell wall, and the cooling medium outlet is arranged at the second shell wall.

[0016] According to another specific embodiment of the present utility model, an embodiment of the present utility model discloses a cooling structure, and the cross-section of the outer wall of the cooling medium channel is square.

[0017] With the above technical solution, the first shell wall and the second shell wall are arranged opposite to each other, that is, the cooling medium inlet and the cooling medium outlet are also arranged opposite to each other. At the same time, the cross-section of the outer wall of the cooling medium channel is square, that is, the cooling medium channel is a linear structure rather than a bent structure. Then, when the cooling liquid is passed into the cooling medium channel, the cooling liquid will not produce water flow loss and can absorb more heat. At the same time, it can have multiple cooling surfaces to increase the cooling range, cool multiple electronic devices at the same time, and improve the cooling efficiency.

[0018] According to another specific embodiment of the utility model, the embodiment of the utility model discloses a cooling structure, wherein the cooling medium inlet is provided with a first sealing side plate, the first sealing side plate is sealed and connected to the cooling medium inlet, the first sealing side plate is connected to a first pipe joint, and the cooling medium outlet is provided with a second sealing side plate, the second sealing side plate is sealed and connected to the cooling medium outlet, and the second sealing side plate is connected to a second pipe joint.

[0019] By adopting the above technical solution, the first sealing side plate is sealedly connected to the cooling medium inlet to ensure that the coolant will not leak when entering the cooling medium inlet from the first sealing side plate; the second sealing side plate is sealedly connected to the cooling medium outlet to ensure that the coolant will not leak when flowing into the second sealing side plate from the cooling medium outlet, resulting in waste of coolant and affecting other equipment around the cooling structure.

[0020] According to another specific embodiment of the utility model, the embodiment of the utility model discloses a cooling structure, wherein the first sealing side plate is spaced apart from the fin to form a first buffer zone, and the second sealing side plate is spaced apart from the fin to form a second buffer zone.

[0021] By adopting the above technical solution, a first buffer zone is set between the first sealing side plate and the fins, so that before the coolant enters the fins from the first sealing side plate for heat dissipation, it first passes through the first buffer zone, and the coolant is conveniently distributed in the first buffer zone, so that the distribution is controllable, thereby ensuring the uniformity of heat dissipation; by setting a second buffer zone between the second sealing side plate and the fins, before the coolant enters the second sealing side plate from the fins and flows out, it first passes through the second buffer zone, and the coolant can flow out of the cooling medium channel in a unified manner in the second buffer zone.

[0022] According to another specific embodiment of the utility model, the embodiment of the utility model discloses a cooling structure, which also includes an upper cover plate and a lower cover plate. Along a first direction, the upper cover plate and the lower cover plate cover both ends of the shell and are sealed with the inner cavity. The upper cover plate and the lower cover plate are spaced apart from the cooling medium channel.

[0023] By adopting the above technical solution, the cooling structure is isolated from the outside world by sealing the upper cover plate, the lower cover plate and the inner cavity, preventing the entry of outside air or other impurities, preventing condensation and ensuring the cleanliness of the cooling structure.

[0024] According to another specific embodiment of the present utility model, an embodiment of the present utility model discloses a cooling structure, wherein the shell is integrally formed.

[0025] By adopting the above technical solution, the shell is integrally formed, which makes processing more convenient, saves processing costs and processes, and at the same time improves the sealing of the coolant and strengthens the sealing protection of the cooling structure.

[0026] According to another specific embodiment of the present utility model, an embodiment of the present utility model discloses a cooling structure, wherein the shell wall of the shell is provided with a through hole for connecting an external device.

[0027] An embodiment of the utility model also discloses a cooling structure, including a cooling medium channel, having an integrally formed cylindrical outer wall and a cooling medium inlet and a cooling medium outlet formed at both ends of the outer wall; and a shell, arranged outside the cooling medium channel, wherein the shell includes a first shell wall and a second shell wall arranged opposite to each other, the cooling medium inlet is arranged on the first shell wall and the cooling medium inlet is closer to the outside than the inner surface of the first shell wall, and the cooling medium outlet is arranged on the second shell wall and the cooling medium outlet is closer to the outside than the inner surface of the second shell wall.

[0028] By adopting the above technical solution, the cylindrical outer wall of the cooling medium channel is integrally formed, and the cooling medium inlet and the cooling medium outlet located at both ends of the cylindrical outer wall are respectively arranged on the shell wall of the shell and are closer to the outside than the inner surface of the shell wall, so that the cooling medium can only leak to the outside of the cooling medium channel through the cooling medium inlet or the cooling medium outlet (unless the outer wall of the cooling medium channel is damaged); at the same time, the outside of the cooling medium channel leaked is also the outside of the shell, and will not enter the inside of the shell to affect the electronic devices, thereby strengthening the sealing protection of the electronic devices.

[0029] According to another specific embodiment of the utility model, an embodiment of the utility model discloses a cooling structure, wherein the outer wall is integrally formed with the first shell wall so that the opening on the first shell wall forms the cooling medium inlet, and / or the outer wall is integrally formed with the second shell wall so that the opening on the second shell wall forms the cooling medium outlet.

[0030] By adopting the above technical solution, the outer wall of the cooling medium channel is integrally formed with the shell wall of the shell, and the cooling medium inlet and the cooling medium outlet are formed by the openings on the shell wall, which further ensures that the cooling medium will not enter the interior of the shell.

[0031] According to another specific embodiment of the present invention, the embodiment of the present invention discloses a cooling structure, wherein the outer wall has at least one flat surface for arranging electronic devices thereon.

[0032] According to another specific embodiment of the utility model, an embodiment of the utility model discloses a cooling structure, the outer wall has a first flat surface and a second flat surface arranged opposite to each other, and the shell also includes a third shell wall and a fourth shell wall arranged opposite to each other, wherein the first shell wall, the third shell wall, the second shell wall and the fourth shell wall are connected end to end in sequence and define a quadrilateral inner cavity, the third shell wall is spaced apart from the first flat surface and the fourth shell wall is spaced apart from the second flat surface so that electronic devices can be arranged at the intervals.

[0033] By adopting the above technical solution, the electronic device can be arranged on the outer wall of the cooling medium channel, which is beneficial to the heat dissipation of the electronic device.

[0034] The embodiment of the utility model further discloses an electronic device, comprising an electronic device and the cooling structure described in any one of the above embodiments, wherein the electronic device comprises a heating device, and the electronic device is attached to the outer wall of the cooling medium channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A three-dimensional diagram showing the cooling structure provided by the embodiment of the utility model Figure 1 , wherein the upper cover plate, the lower cover plate, the first sealing side plate and the second sealing side plate are not shown;

[0036] Figure 2 A cross-sectional view showing a cooling structure provided by an embodiment of the utility model;

[0037] Figure 3 A three-dimensional diagram showing the cooling structure provided by the embodiment of the utility model Figure 2 , wherein the cross section of the cooling medium inlet is circular;

[0038] Figure 4 A three-dimensional diagram showing the cooling structure provided by the embodiment of the utility model Figure 3 , which shows the connection between the fins and the cooling medium channel;

[0039] Figure 5 A three-dimensional diagram showing the cooling structure provided by the embodiment of the utility model Figure 4 , in which the electronic devices are placed;

[0040] Figure 6 Show Figure 5 A perspective view of the cooling structure from the bottom, where the electronic components are placed;

[0041] Figure 7 A three-dimensional diagram showing the cooling structure provided by the embodiment of the utility model Figure 5 , wherein an upper cover plate, a lower cover plate, a first sealing side plate and a second sealing side plate are shown;

[0042] Figure 8 Show Figure 7 A perspective view of the cooling structure from the right side;

[0043] Fig. 9 Show Figure 7 A perspective view of the cooling structure from the left. DETAILED DESCRIPTION

[0044] The following is an explanation of the implementation of the present invention by specific specific embodiments. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that, in the absence of conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0045] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0046] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0047] The terms “first”, “second”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0048] In the description of this embodiment, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0049] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0050] refer to Figure 1 and Figure 2 The present application provides a cooling structure that can be applied to electric vehicle inverters, frequency converters, or any electronic device that requires heat dissipation. The present application embodiment is described by taking the application to electric vehicle inverters as an example. Figure 1 and Figure 2 As shown, the cooling structure of the embodiment of the present application includes: a shell 1 and a cooling medium channel 2.

[0051] For example, reference Figure 1 The shell 1 includes an inner cavity 10 and a shell wall 11. The shell 1 is a quadrilateral structure, that is, the shell 1 is formed by four shell walls connected end to end. The four shell walls include a first shell wall 110, a second shell wall 111, a third shell wall 112 and a fourth shell wall 113, wherein the first shell wall 110 and the second shell wall 111 are connected along the second direction (i.e. Figure 1 The third shell wall 112 and the fourth shell wall 113 are arranged relatively and spaced apart along the third direction (ie, Figure 1 The first shell wall 110 , the third shell wall 112 , the second shell wall 111 and the fourth shell wall 113 are arranged relatively and spaced apart in the Z direction as shown, and are connected end to end in sequence to define a quadrilateral inner cavity 10 .

[0052] Among them, the embodiments of the present application do not limit the specific structure, material and formation process of the shell 1. The shell 1 can be formed as one piece by metal die-casting or extrusion, which is convenient for processing. It can also be formed by welding or threading the first shell wall 110, the third shell wall 112, the second shell wall 111 and the fourth shell wall 113 in sequence, or the shell 1 can also be a pentagonal structure, a hexagonal structure or any irregular shape, or the shell 1 is made of plastic material with good thermal conductivity. The specific structure can be selected according to actual needs.

[0053] For example, reference Figure 1 and Figure 2The cooling medium channel 2 is arranged in the inner cavity 10 (in other words, the shell 1 is arranged outside the cooling medium channel 2), and defines the electronic device placement area 3, that is, the cooling medium channel 2 defines the electronic device placement area 3 in the inner cavity 10 of the shell 1, that is, when the cooling medium (for example, coolant, for the convenience of description, the following description is based on the coolant) is passed into the cooling medium channel 2, the cooling medium channel 2 separates the coolant from the electronic device placement area 3, that is, the coolant does not contact the electronic device placement area 3.

[0054] Exemplarily, the cooling medium channel 2 is integrally formed with the first shell wall 110 and the second shell wall 111, and the cooling medium channel 2 includes a cooling medium inlet 20 and a cooling medium outlet 21. The cooling medium inlet 20 is provided at the first shell wall 110, and the cooling medium outlet 21 is provided at the second shell wall 111. Figure 2 As shown, the cooling medium inlet 20 is located outside the inner surface of the first shell wall 110, and the cooling medium outlet 21 is located outside the inner surface of the second shell wall 111, so that the coolant flowing through the cooling medium inlet 20 and the cooling medium outlet 21 will not enter the inner cavity 10 of the shell 1 from the first shell wall 110 and the second shell wall 111. Exemplarily, the outer wall 22 of the cooling medium channel 2 is integrally formed with the first shell wall 110, so that the opening on the first shell wall 110 forms the cooling medium inlet 20, and the outer wall 22 is integrally formed with the second shell wall 111, so that the opening on the second shell wall 111 forms the cooling medium outlet 21. In this way, it can be better ensured that the coolant flowing through the cooling medium inlet 20 and the cooling medium outlet 2 will not enter the inner cavity 10 of the shell 1.

[0055] It should be noted that the embodiment of the present application does not limit the specific positions of the cooling medium inlet 20 and the cooling medium outlet 21. The cooling medium inlet 20 and the cooling medium outlet 21 may be both located on the first shell wall 110, in which case the cooling medium channel 2 is integrally formed with the first shell wall 110, or the cooling medium inlet 20 is located on the first shell wall 110, and the cooling medium outlet 21 is located on the third shell wall 112, in which case the cooling medium channel 2 is integrally formed with the first shell wall 110 and the third shell wall 112.

[0056] By integrally forming the cooling medium channel 2 with the shell wall 11 (for example, the first shell wall 110 and the second shell wall 111) of the shell 1, the sealing performance of the cooling medium channel is improved, and no longer relying on a sealing ring, it is ensured that the coolant can flow in the cooling medium channel 2 without leakage, thereby ensuring that the coolant will not leak when the cooling structure is used. At the same time, the electronic device placement area 3 is defined in the inner cavity 10 of the shell 1 by the cooling medium channel 2, that is, the cooling medium channel 2 isolates the coolant from the electronic device placement area 3, that is, the coolant is completely out of contact with the electronic device, even if the coolant leaks, it will not cause a short circuit or other faults in the electronic device in the electronic device placement area 3, effectively preventing the coolant from leaking into the electronic device placement area 3 and causing a short circuit or other faults in the electronic device.

[0057] For example, reference Figure 1 The third shell wall 112 is provided with four through holes 1120 for connecting external devices (such as a power cord, a ventilation valve, etc.). It should be noted that the embodiment of the present application does not limit the specific position, shape, size and number of the through holes 1120. It can be arranged on the third shell wall 112 as shown in the embodiment of the present application, and three circular holes and one elliptical hole are set, or it can be arranged on the fourth shell wall 113, and five circular holes or four square holes are set.

[0058] The cooling medium channel 2 has an integrally formed cylindrical outer wall 22, so that unless the outer wall 22 is damaged, the coolant flowing in the cooling medium channel 2 will not leak outward from the outer wall 22, that is, will not leak into the inner cavity 10 of the housing 1. Figure 1 The outer wall 22 is provided with a cooling medium inlet 20 and a cooling medium outlet 21 at both ends thereof. The cylindrical outer wall 22 has at least one flat surface (e.g., a primary cooling surface 220 and a secondary cooling surface 221) for arranging the electronic device 30 thereon. Exemplarily, the outer wall 22 has a first flat surface and a second flat surface arranged opposite to each other (e.g., two primary cooling surfaces 220 arranged at intervals along the third direction), the third shell wall 112 is arranged at intervals from the first flat surface, and the fourth shell wall 113 is arranged at intervals from the second flat surface, so that the electronic device 30 is arranged at the intervals. In this way, the electronic device 30 can be arranged on the outer wall 22 of the cooling medium channel 2, which is conducive to heat dissipation of the electronic device 30.

[0059] For example, reference Figures 1 to 4 , along the second direction (i.e. Figure 1 The cross section of the outer wall 22 of the cooling medium channel 2 is rectangular, and along the first direction (i.e. Figure 1 The cross section of the cooling medium inlet 20 is a square. Similarly, along the first direction (ie, Figure 2The cross-section of the cooling medium outlet 21 (in the Y direction shown) is a square. At this time, the cooling structure has four cooling surfaces, that is, three-dimensional cooling can be performed, which increases the cooling range and makes full use of the four surfaces of the cooling medium channel 2. Multiple electronic devices can be cooled at the same time, thereby improving the cooling efficiency.

[0060] It should be noted that the embodiment of the present application does not limit the shapes of the cross-section of the outer wall 22 of the cooling medium channel 2, the cross-section of the cooling medium inlet 20, and the cross-section of the cooling medium outlet 21. The cross-section of the outer wall 22 of the cooling medium channel 2 may be a square, other polygonal or irregular shape, and the cross-section of the cooling medium inlet 20 may be a rectangle, a circle (refer to Figure 3 ) or other irregular shapes, the cross section of the cooling medium outlet 21 is rectangular, circular or other irregular shapes.

[0061] For example, reference Figures 1 to 3 The inner wall of the cooling medium channel 2 is provided with eight fins 4, along the third direction (i.e. Figure 1 Both ends of each of the eight fins 4 are connected to the inner wall 24 of the cooling medium channel 2 .

[0062] For example, reference Figure 1 and Figure 2 , the eight fins 4 are all along the second direction (i.e. Figure 1 The eight fins 4 extend in the first direction (ie, the X direction shown in FIG. Figure 2 The fins 4 are arranged at intervals along the Y direction (as shown in the figure) to form nine cooling channels 40, and the nine cooling channels 40 form a through-channel coolant heat dissipation area. The fins 4 are placed in this way, and the four cooling surfaces can be divided into two main cooling surfaces 220 arranged at intervals along the third direction and two secondary cooling surfaces 221 arranged at intervals along the first direction. They can be selectively placed in the electronic device placement area according to the heat generated by the electronic device.

[0063] That is to say, electronic devices that generate a lot of heat (such as IGBT (Insulated Gate Bipolar Transistor), bus capacitors, driver PCB (Printed Circuit Board) boards, etc.) can be placed on the main cooling surface 220, and electronic devices that generate a little heat can be placed on the secondary cooling surface 221. In this way, the electronic devices can be fully cooled while saving coolant, thereby improving the cooling efficiency and cooling effect, so that the temperature of all electronic devices drops more evenly. However, the embodiments of the present application do not limit the specific placement position of the electronic devices, and can be adjusted according to layout requirements.

[0064] Exemplarily, eight fins 4 and a first sealing side plate 12 (such as Figure 8 ) are arranged in a spaced relationship along the second direction to form a first buffer zone 5, and are separated from the second sealing side plate 13 (as shown in FIG. Fig. 9 ) are arranged at intervals along the second direction to form a second buffer zone 6.

[0065] It should be noted that the embodiment of the present application does not limit the number and arrangement of the fins 4. For example, five fins 4 can be provided, and the five fins 4 extend along the first direction, and the two ends of the five fins 4 are connected to the inner wall 24 of the cooling medium channel 2. The five fins 4 are distributed at intervals along the third direction, and the distribution intervals can be the same or different. At the same time, the embodiment of the present application does not limit the connection method between the fins 4 and the cooling medium channel 2. The fins 4 can be integrally formed with the cooling medium channel 2, or they can be as follows. Figure 4 As shown, a corresponding groove 23 is provided on the inner wall of the cooling medium channel so that the fins can be plugged therein.

[0066] For example, continue to refer to Figure 1 and Figure 2 Eight fins 4 are arranged on the inner wall 24 of the cooling medium channel 2, which can expand the heat exchange area and improve the efficiency of heat transfer. That is to say, when coolant is passed into the cooling medium channel 2, the coolant can take away more heat from the electronic components placed in the electronic component placement area 3. At the same time, the distribution of electronic components can be arranged according to the setting method of the fins 4 to improve the heat dissipation efficiency.

[0067] For example, reference Figures 5 to 9 Combined with Figure 2 The cooling medium inlet 20 is provided with a first sealing side plate 12, and the first sealing side plate 12 is sealedly connected to the cooling medium inlet 20, for example, it can be sealed by a first sealing ring 120, the first sealing side plate 12 is sealedly connected to the first pipe joint 121, and the first pipe joint 121 can be connected to a driving device to drive the coolant to flow from the first pipe joint 121 into the cooling medium inlet 20, and the cooling medium outlet 21 is provided with a second sealing side plate 13, the second sealing side plate 13 is sealedly connected to the cooling medium outlet 21, for example, it can be sealed by a second sealing ring 130, the second sealing side plate 13 is sealedly connected to the second pipe joint 131, and the second pipe joint 131 can be connected to a driving device to drive the coolant to flow from the cooling medium outlet 21 into the second pipe joint 131, and then flow out of the cooling medium channel 2.

[0068] Exemplarily, the coolant enters the first buffer zone 5 through the first pipe joint 121, and is then distributed by the first buffer zone 5 to the nine cooling channels 40 formed by the eight fins 4, absorbing the heat of the electronic components placed in the electronic component placement area 3, and then enters the second buffer zone 6, and then flows out from the second pipe joint 131.

[0069] Exemplarily, the first sealing side plate 12 is sealed and connected to the cooling medium inlet 20 to ensure that the coolant does not leak when entering the cooling medium inlet 20 from the first sealing side plate 12; the second sealing side plate 13 is sealed and connected to the cooling medium outlet 21 to ensure that the coolant does not leak when flowing into the second sealing side plate 13 from the cooling medium outlet 21, resulting in waste of coolant and affecting other equipment around the cooling structure.

[0070] If the seal fails for various reasons, causing the coolant to leak, the coolant will only leak to the outside of the cooling medium channel 2 and the outside of the shell 1 through the cooling medium inlet 20 or the cooling medium outlet 21, and will not enter the electronic device placement area 3 located inside the shell 1 to affect the electronic devices (unless the outer wall 22 of the cooling medium channel 2 is damaged), thereby strengthening the sealing protection of the electronic devices.

[0071] For example, reference Figure 5 and Figure 6 Combined with Figure 2 Various electronic devices 30 can be placed in the electronic device placement area 3 and attached to the outer wall 22 of the cooling medium channel 2. When the cooling medium channel 2 is set as a rectangular parallelepiped as shown in the embodiment of the present application, it has four cooling surfaces, that is, the electronic devices 30 can be placed on the four cooling surfaces. Among them, the electronic devices 30 include heat-generating devices. When working, the heat-generating devices will generate heat. When coolant is passed into the cooling medium channel 2, the coolant will take away the heat generated by the heat-generating devices when flowing in the cooling medium channel 2, thereby achieving a heat dissipation effect.

[0072] For example, reference Figures 5 to 9 Combined with Figure 1 The cooling structure also includes an upper cover plate 7 and a lower cover plate 8, along the first direction (ie Figure 7 The upper cover plate 7 covers the upper end of the housing 1 and is sealed with the inner cavity 10, for example, by a third sealing ring 70. The upper cover plate 7 and the cooling medium channel are connected in the first direction (i.e. Figure 7 The lower cover plate 8 covers the lower end of the housing 1 and is sealed with the inner cavity 10, for example, by a fourth sealing ring 80. The lower cover plate 8 is spaced apart from the cooling medium channel along the first direction (i.e., Figure 7 The electronic components are arranged in a spaced apart manner (in the Y direction as shown) to form an electronic component placement area 3.

[0073] Exemplarily, the upper cover plate 7 is sealedly connected to the lower cover plate 8 and the inner cavity 10 to isolate the cooling structure from the outside, prevent the outside air or other impurities from entering, prevent condensation, and ensure the cleanliness of the cooling structure.

[0074] refer to Figures 5 to 9Combined with Figure 2 The embodiment of the present application also provides an electronic device, including an electronic device 30, a driving device and the cooling structure described in any of the above embodiments, the electronic device 30 includes a heat generating device, and the electronic device 30 is attached to the outer wall 22 of the cooling medium channel 2 to fully contact with the cooling medium. The embodiment of the present application does not limit the specific setting position of the driving device, and the cooling medium inlet 20 and the cooling medium outlet 21 can be connected, or the driving device is only connected to the cooling medium inlet 20 or the driving device is only connected to the cooling medium outlet 21, as long as the flow of the cooling medium can be driven.

[0075] Although the present invention has been illustrated and described with reference to certain preferred embodiments of the present invention, it should be understood by those skilled in the art that the above contents are further detailed descriptions of the present invention in combination with specific embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art may make various changes in form and details, including making several simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A cooling structure, characterized in that: include: a housing including an inner cavity; A cooling medium channel is provided in the inner cavity of the housing and defines an electronic device placement area; wherein, The cooling medium channel is integrally formed with the shell wall of the shell, and the cooling medium channel comprises a cooling medium inlet and a cooling medium outlet, and the cooling medium inlet and the cooling medium outlet are located on the shell wall of the shell.

2. The cooling structure according to claim 1, characterized in that: The inner wall of the cooling medium channel is provided with a plurality of fins.

3. The cooling structure according to claim 2, characterized in that: Both ends of each of the plurality of fins are connected to the inner wall of the cooling medium channel.

4. The cooling structure according to claim 1, characterized in that: The shell wall includes a first shell wall and a second shell wall, the first shell wall is arranged opposite to the second shell wall, the cooling medium inlet is arranged at the first shell wall, and the cooling medium outlet is arranged at the second shell wall.

5. The cooling structure according to any one of claims 1 to 4, characterized in that: The cross section of the outer wall of the cooling medium channel is square.

6. The cooling structure according to claim 2, characterized in that: The cooling medium inlet is provided with a first sealing side plate, the first sealing side plate is sealed and connected to the cooling medium inlet, the first sealing side plate is connected to a first pipe joint, the cooling medium outlet is provided with a second sealing side plate, the second sealing side plate is sealed and connected to the cooling medium outlet, and the second sealing side plate is connected to a second pipe joint.

7. The cooling structure according to claim 6, characterized in that: The first sealing side plate is spaced apart from the fin to form a first buffer zone, and the second sealing side plate is spaced apart from the fin to form a second buffer zone.

8. The cooling structure according to claim 1, characterized in that: It also includes an upper cover plate and a lower cover plate. Along a first direction, the upper cover plate and the lower cover plate cover both ends of the shell and are sealed with the inner cavity. The upper cover plate and the lower cover plate are spaced apart from the cooling medium channel.

9. The cooling structure according to claim 1, characterized in that: The shell is integrally formed.

10. The cooling structure according to claim 1, characterized in that: The shell wall of the shell is provided with a through hole for connecting external equipment.

11. A cooling structure, characterized in that: include: A cooling medium channel has an integrally formed cylindrical outer wall and a cooling medium inlet and a cooling medium outlet formed at both ends of the outer wall; and A housing is provided outside the cooling medium channel, wherein: The shell includes a first shell wall and a second shell wall arranged opposite to each other, the cooling medium inlet is arranged on the first shell wall and the cooling medium inlet is closer to the outside than the inner surface of the first shell wall, and the cooling medium outlet is arranged on the second shell wall and the cooling medium outlet is closer to the outside than the inner surface of the second shell wall.

12. The cooling structure according to claim 11, characterized in that: The outer wall is integrally formed with the first shell wall so that the opening on the first shell wall forms the cooling medium inlet, and / or the outer wall is integrally formed with the second shell wall so that the opening on the second shell wall forms the cooling medium outlet.

13. The cooling structure according to claim 11, characterized in that: The outer wall has at least one planar surface for arranging electronic devices thereon.

14. The cooling structure according to claim 11, characterized in that: The outer wall has a first flat surface and a second flat surface arranged opposite to each other, and the shell also includes a third shell wall and a fourth shell wall arranged opposite to each other, wherein the first shell wall, the third shell wall, the second shell wall and the fourth shell wall are connected end to end in sequence and define a quadrilateral inner cavity, the third shell wall is spaced apart from the first flat surface and the fourth shell wall is spaced apart from the second flat surface so that electronic devices can be arranged at the intervals.

15. An electronic device, characterized in that: The invention comprises an electronic device and a cooling structure according to any one of claims 1 to 14, wherein the electronic device comprises a heat generating device, and the electronic device is attached to an outer wall of the cooling medium channel.

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