Server cabinet water-cooling heat dissipation device

Abstract

The utility model relates to the technical field of server cabinet heat dissipation, in particular to a server cabinet water-cooling heat dissipation device which comprises a bottom plate, the top of the bottom plate is fixedly connected with a heat dissipation main shell, the heat dissipation main shell is internally provided with a hybrid cooling assembly, the hybrid cooling assembly comprises a heat dissipation box, and the heat dissipation box is provided with a heat dissipation cavity. And the heat dissipation box is fixedly connected to the interior of the heat dissipation main shell, and a submersible circulating pump is fixedly connected to the interior of the heat dissipation box. According to the server cabinet water-cooling heat dissipation device, by installing the hybrid cooling assembly, the water-cooling heat dissipation structure can conveniently use a submersible pump outputting water downwards to disrupt the track of water flow, cooling water can make full contact with a cooled heat conduction copper plate, and therefore heat conduction silicone grease can be cooled more efficiently; the heat-conducting silicone grease is added to the server cabinet, so that the server cabinet at the other end of the heat-conducting silicone grease is efficiently cooled, the temperature of cooling water can be lower than the outdoor temperature, the heat dissipation effect is better when the outdoor temperature is high, and the practicability of the heat dissipation device in use is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of a server cabinet, in particular to a water-cooling heat dissipation device for a server cabinet. Background Art

[0002] Servers are generally the core of IT industry operations. Due to the operation and closed nature of servers, they heat up rapidly. If the safe operating temperature is exceeded, it may cause system crashes or damage the service life. Therefore, a proper cooling system is crucial.

[0003] The water-cooled radiator inside the water-cooled heat dissipation device of the prior art usually dissipates heat by means of copper heat sink heat conduction and cooling fan blowing, but this method can not reduce the maximum temperature of the cooling water below the normal outdoor temperature. If the normal outdoor temperature is higher, it will greatly affect the heat dissipation effect of the water-cooled heat dissipation device. Utility Model Content

[0004] The purpose of the present utility model is to provide a water-cooled heat dissipation device for a server cabinet, so as to solve the problem of poor heat dissipation effect of the water-cooled radiator proposed in the above background technology. In order to achieve the above purpose, the present utility model provides the following technical solutions: a water-cooled heat dissipation device for a server cabinet, comprising a base plate, the top of the base plate is fixedly connected to a heat dissipation main shell, the interior of the heat dissipation main shell is provided with a hybrid cooling component, the hybrid cooling component comprises a heat dissipation box, the heat dissipation box is fixedly connected to the interior of the heat dissipation main shell, the interior of the heat dissipation box is fixedly connected to a submersible circulating pump, the water inlet end of the front side of the submersible circulating pump is fixedly connected to a water suction pipe, the water outlet end of the back side of the submersible circulating pump is fixedly connected to a water outlet pipe, the water outlet end of the water outlet pipe is located inside the heat dissipation box, the top of the heat dissipation box is fixedly connected to a heat dissipation circulation pipe, the heat dissipation box is fixedly connected to the heat dissipation circulation pipe, A heat-conducting copper plate is fixedly connected to the middle of the heat box, a semiconductor refrigeration sheet is fixedly connected to the front of the heat dissipation box, and the back of the semiconductor refrigeration sheet extends backward to the front of the heat-conducting copper plate. A water storage assembly is arranged on the right side of the heat dissipation box, so that the water-cooled heat dissipation structure can use a submersible pump for outputting water downward to disrupt the trajectory of the water flow, so that the cooling water can fully contact the cooled heat-conducting copper plate, thereby more efficiently cooling the thermal grease, and the server cabinet at the other end of the thermal grease can be efficiently cooled, which can make the temperature of the cooling water lower than the outdoor temperature. When the outdoor temperature is high, the heat dissipation effect is better, which greatly improves the practicality of the heat dissipation device when in use.

[0005] Further preferably, the water storage assembly includes a movable door, which is movably connected to the front side of the heat dissipation main shell, a water tank is fixedly connected to the inside of the heat dissipation main shell on a side away from the heat dissipation box, a water supply pipe is fixedly connected to the top of the water tank, a closing cover is movably connected to the top of the water supply pipe, the water inlet end on the right side of the pumping pipe extends rightward to the inside of the water tank, and a heat dissipation assembly is provided on the left side of the water tank, so that the water-cooled heat dissipation device can circulate and dissipate heat.

[0006] Further preferably, the heat dissipation assembly includes a heat dissipation frame, which is fixedly connected to the front side of the heat dissipation box, the semiconductor refrigeration sheet is located inside the heat dissipation frame, the front side of the semiconductor refrigeration sheet is fixedly connected to copper heat-conducting fins, an air inlet window is provided on the side of the front side of the heat dissipation main shell close to the heat dissipation box, an air guide window is provided on the right side of the heat dissipation frame, an exhaust hose is fixedly connected to the left side of the heat dissipation frame, a heat dissipation fan is fixedly connected to the left side of the air guide window, and a control assembly is provided above the heat dissipation fan to facilitate the heat dissipation of the semiconductor refrigeration sheet so that it can be used continuously.

[0007] Further preferably, the control component includes thermal grease, which is fixedly connected to the back of the heat dissipation main shell, and the front of the thermal grease extends forward and is fixedly connected to the heat dissipation circulation pipe, so as to facilitate the conduction of heat from the server cabinet.

[0008] Further preferably, a temperature sensor is fixedly connected to the front side of the thermal grease, and a controller is fixedly connected to the right side of the heat dissipation main shell, thereby improving the practicability of the heat dissipation device when in use.

[0009] Further preferably, the temperature sensor is electrically connected to a controller, and the controller is electrically connected to the submersible circulation pump, the semiconductor refrigeration sheet and the heat dissipation fan, making the use of the device more convenient and practical.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] In the utility model, by installing a hybrid cooling component, the water-cooled heat dissipation structure can use a submersible pump that outputs water downward to disrupt the trajectory of the water flow, so that the cooling water can fully contact the thermally conductive copper plate to be cooled, thereby more efficiently cooling the thermal grease, and allowing the server cabinet at the other end of the thermal grease to complete efficient cooling. The temperature of the cooling water can be lower than the outdoor temperature, and the heat dissipation effect is better when the outdoor temperature is high, greatly improving the practicality of the heat dissipation device when in use.

[0012] In the utility model, by installing a semiconductor refrigeration sheet, it is convenient to utilize its cold end to cool the heat-conducting copper plate, so that the heat dissipation cooling water can evenly complete heat exchange with the cooled heat-conducting copper plate, and the copper heat-conducting fins at the other end can continuously cool the heat-conducting copper plate, thereby improving the efficiency of the heat dissipation device when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the front cross-section structure of the utility model;

[0015] Figure 3 It is a schematic diagram of the side section structure of the utility model;

[0016] Figure 4 For this utility model Figure 2 Schematic diagram of the structure at A in the middle;

[0017] Figure 5 For this utility model Figure 3 Schematic diagram of the structure at point B in the middle.

[0018] In the figure: 1. bottom plate; 2. main heat dissipation shell; 3. water storage component; 4. hybrid cooling component; 5. heat dissipation component; 6. control component; 301. movable door; 302. water storage tank; 303. water supply pipe; 304. closing cover; 401. heat dissipation box; 402. submersible circulation pump; 403. water suction pipe; 404. water outlet pipe; 405. heat dissipation circulation pipe; 406. thermal conductive copper plate; 407. semiconductor refrigeration plate; 501. heat dissipation frame; 502. copper thermal conductive fins; 503. air intake window; 504. air guide window; 505. exhaust hose; 506. cooling fan; 601. thermal conductive silicone grease; 602. temperature sensor; 603. controller. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 5The utility model provides a technical solution: a water-cooled heat dissipation device for a server cabinet, comprising a base plate 1, a heat dissipation main shell 2 is fixedly connected to the top of the base plate 1, a hybrid cooling component 4 is arranged inside the heat dissipation main shell 2, the hybrid cooling component 4 comprises a heat dissipation box 401, the heat dissipation box 401 is fixedly connected to the inside of the heat dissipation main shell 2, a submersible circulating pump 402 is fixedly connected to the inside of the heat dissipation box 401, a water inlet end at the front of the submersible circulating pump 402 is fixedly connected to a water pumping pipe 403, a water outlet end at the back of the submersible circulating pump 402 is fixedly connected to a water outlet pipe 404, the water outlet end of the water outlet pipe 404 is located inside the heat dissipation box 401, a heat dissipation circulation pipe 405 is fixedly connected to the top of the heat dissipation box 401, a heat-conducting copper plate 406 is fixedly connected to the middle of the heat dissipation box 401, a semiconductor refrigeration sheet 407 is fixedly connected to the front of the heat dissipation box 401, the back of the semiconductor refrigeration sheet 407 extends backward to the front of the heat-conducting copper plate 406, and a water storage component 3 is arranged on the right side of the heat dissipation box 401.

[0021] In this embodiment, Figure 1 and Figure 2 As shown, the water storage component 3 includes a movable door 301, which is movably connected to the front of the heat dissipation main shell 2, and a water storage tank 302 is fixedly connected to the side of the heat dissipation main shell 2 away from the heat dissipation box 401. The top of the water storage tank 302 is fixedly connected to a water supply pipe 303, and the top of the water supply pipe 303 is movably connected to a closed cover 304. The water inlet end of the right side of the water pumping pipe 403 extends rightward to the inside of the water storage tank 302. The left side of the water storage tank 302 is provided with a heat dissipation component 5, and the heat dissipation component 5 includes a heat dissipation frame 501, which is fixedly connected to the front of the heat dissipation box 401. The semiconductor refrigeration plate 4 07 is located inside the heat dissipation frame 501, the front of the semiconductor cooling sheet 407 is fixedly connected with a copper heat conducting fin 502, the front of the heat dissipation main housing 2 is provided with an air intake window 503 on the side close to the heat dissipation box 401, the right side of the heat dissipation frame 501 is provided with an air guide window 504, the left side of the heat dissipation frame 501 is fixedly connected with an exhaust hose 505, the left side of the air guide window 504 is fixedly connected with a heat dissipation fan 506, and the control component 6 is provided above the heat dissipation fan 506. When in use, the end of the thermal conductive silicone grease 601 away from the heat dissipation main housing 2 is brought into contact with the heat source of the server cabinet, and then the heat dissipation main housing 2 is positioned.

[0022] In this embodiment, Figure 2 and Figure 3As shown, the control component 6 includes a thermal conductive silicone grease 601, which is fixedly connected to the back of the heat dissipation main shell 2, and the front of the thermal conductive silicone grease 601 extends forward and is fixedly connected to the heat dissipation circulation pipe 405. A temperature sensor 602 is fixedly connected to the front of the thermal conductive silicone grease 601, and a controller 603 is fixedly connected to the right side of the heat dissipation main shell 2. The temperature sensor 602 is electrically connected to the controller 603, and the controller 603 is electrically connected to the submersible circulation pump 402, the semiconductor cooling sheet 407 and the heat dissipation fan 506. When the heat of the server cabinet is high, the heat source transfers the heat to the heat dissipation circulation pipe 405 through the thermal conductive silicone grease 601. At the same time, the temperature sensor 602 detects that the temperature of the thermal conductive silicone grease 601 is higher than the set threshold, and the temperature sensor 602 sends a signal to the controller 603, and the controller 603 controls the start of the submersible circulation pump 402 and the semiconductor cooling sheet 407 and the heat dissipation fan 506. Fan 506, submersible circulation pump 402 draws water from the water tank 302 into the heat sink 401 through the pumping pipe 403. As the water level and water pressure in the heat sink 401 continue to rise, the water continuously contacts the heat-conducting copper plate 406. The continuously rising water level circulates through the heat dissipation circulation pipe 405 and contacts the thermal grease 601, and takes away the heat of the thermal grease 601 and re-transports it to the water tank 302. The cold end of the semiconductor refrigeration plate 407 continuously outputs to cool the heat-conducting copper plate 406, so that the heat-conducting copper plate 406 exchanges heat with the cooling water, completing the cooling and heat dissipation. The heat dissipation fan 506 that blows gas to the left side generates negative pressure inside the heat dissipation frame 501. Under the action of negative pressure, external air enters the air guide window 504 inside the heat dissipation main shell 2 through the air inlet window 503, and the air contacts the copper heat-conducting fins 502, and discharges the heat to the outside through the exhaust hose 505.

[0023] The use method and advantages of the utility model: When the server cabinet water cooling device is used, the working process is as follows:

[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, when in use, the end of the thermal grease 601 away from the heat dissipation main housing 2 is brought into contact with the heat source of the server cabinet, and then the heat dissipation main housing 2 is positioned. When the heat of the server cabinet is high, the heat source transfers the heat to the heat dissipation circulation pipe 405 through the thermal grease 601. At the same time, the temperature sensor 602 detects that the temperature of the thermal grease 601 is higher than the set threshold. The temperature sensor 602 sends a signal to the controller 603. The controller 603 controls the start of the submersible circulation pump 402, the semiconductor cooling sheet 407 and the heat dissipation fan 506. The submersible circulation pump 402 draws water from the water storage tank 302 into the heat dissipation box 401 through the pumping pipe 403. As the water level and water pressure in the heat dissipation box 401 continue to rise, The water is constantly in contact with the heat-conducting copper plate 406, and the continuously rising water level is circulated through the heat dissipation circulation pipe 405 to contact the thermal grease 601, and takes away the heat of the thermal grease 601 and re-transported to the water storage tank 302. The cold end of the semiconductor refrigeration plate 407 continuously outputs to cool the heat-conducting copper plate 406, so that the heat-conducting copper plate 406 exchanges heat with the cooling water, completing the cooling and heat dissipation of the cooling water. The cooling fan 506 that blows gas to the left side creates a negative pressure inside the heat dissipation frame 501. Under the action of the negative pressure, external air enters the air guide window 504 inside the heat dissipation main shell 2 through the air inlet window 503, the air contacts the copper thermal fins 502, and the heat is discharged to the outside through the exhaust hose 505.

[0025] The above shows and describes the basic principle, main features and advantages of the utility model. Technical staff in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A water cooling device for a server cabinet, comprising a bottom plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected to a heat dissipation main housing (2), a hybrid cooling component (4) is arranged inside the heat dissipation main housing (2), and the hybrid cooling component (4) comprises a heat dissipation box (401), the heat dissipation box (401) is fixedly connected to the inside of the heat dissipation main housing (2), a submersible circulation pump (402) is fixedly connected to the inside of the heat dissipation box (401), a water inlet end on the front side of the submersible circulation pump (402) is fixedly connected to a water pump (403), and a water outlet end on the back side of the submersible circulation pump (402) is fixedly connected to a water pump (403). A water outlet pipe (404) is provided, the water outlet end of the water outlet pipe (404) is located inside the heat dissipation box (401), the top of the heat dissipation box (401) is fixedly connected to a heat dissipation circulation pipe (405), the middle of the heat dissipation box (401) is fixedly connected to a heat-conducting copper plate (406), the front of the heat dissipation box (401) is fixedly connected to a semiconductor cooling plate (407), the back of the semiconductor cooling plate (407) extends backward to the front of the heat-conducting copper plate (406), and a water storage component (3) is provided on the right side of the heat dissipation box (401).

2. A server cabinet water cooling device according to claim 1, characterized in that: The water storage component (3) comprises a movable door (301), the movable door (301) being movably connected to the front side of the heat dissipation main housing (2), a water storage tank (302) being fixedly connected to a side of the heat dissipation main housing (2) away from the heat dissipation box (401), a water supply pipe (303) being fixedly connected to the top of the water storage tank (302), a closing cover (304) being movably connected to the top of the water supply pipe (303), a water inlet end on the right side of the water pumping pipe (403) extending rightwards to the inside of the water storage tank (302), and a heat dissipation component (5) being arranged on the left side of the water storage tank (302).

3. A server cabinet water cooling device according to claim 2, characterized in that: The heat dissipation component (5) comprises a heat dissipation frame (501), the heat dissipation frame (501) is fixedly connected to the front of a heat dissipation box (401), the semiconductor cooling sheet (407) is located inside the heat dissipation frame (501), the front of the semiconductor cooling sheet (407) is fixedly connected to a copper heat-conducting fin (502), an air inlet window (503) is arranged on the front side of the heat dissipation main housing (2) close to the heat dissipation box (401), an air guide window (504) is arranged on the right side of the heat dissipation frame (501), an exhaust hose (505) is fixedly connected to the left side of the heat dissipation frame (501), a heat dissipation fan (506) is fixedly connected to the left side of the air guide window (504), and a control component (6) is arranged above the heat dissipation fan (506).

4. A server cabinet water cooling device according to claim 3, characterized in that: The control component (6) comprises thermally conductive silicone grease (601), wherein the thermally conductive silicone grease (601) is fixedly connected to the back side of the heat dissipation main housing (2), and the front side of the thermally conductive silicone grease (601) extends forward and is fixedly connected to the heat dissipation circulation pipe (405).

5. A server cabinet water cooling device according to claim 4, characterized in that: A temperature sensor (602) is fixedly connected to the front side of the thermal conductive silicone grease (601), and a controller (603) is fixedly connected to the right side of the heat dissipation main housing (2).

6. A server cabinet water cooling device according to claim 5, characterized in that: The temperature sensor (602) is electrically connected to a controller (603), and the controller (603) is electrically connected to a submersible circulation pump (402), a semiconductor cooling sheet (407), and a heat dissipation fan (506).

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