Semiconductor chip heat dissipation device

Abstract

The utility model provides a semiconductor chip heat dissipation device, and relates to the technical field of semiconductor chips. The semiconductor chip heat dissipation device comprises a base used for installing the device, the upper surface of the base is provided with an installation mechanism used for conveniently installing or disassembling the device, a heat dissipation mechanism used for conducting heat dissipation on a semiconductor chip is arranged above the base, and the heat dissipation mechanism comprises a heat conduction plate and fins. And the heat conducting plate is placed on the upper surface of the base. According to the semiconductor chip heat dissipation device, the heat dissipation mechanism is arranged, so that the problems that if heat generated during working of a chip in the prior art cannot be timely and effectively dissipated, the temperature of the chip is increased, then aging of internal materials of the chip is accelerated, the service life is shortened, even faults are possibly caused, and use of the chip is affected are solved; the beneficial effect that the aging damage or performance reduction of the chip caused by the fact that the chip is in a high-temperature environment for a long time can be avoided is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chips, and in particular to a semiconductor chip heat dissipation device. Background Art

[0002] Semiconductor chips are semiconductor devices that can realize specific functions and are made on semiconductor sheets through etching, wiring and other processes. Its core principle is to use the characteristics of semiconductor materials to control the flow of electrons to realize information processing and storage.

[0003] When semiconductor chips perform calculations, storage or other functions, they consume electrical energy, part of which is converted into heat. As chip performance improves and integration increases, power consumption also increases, and the amount of heat generated also increases accordingly. If this heat cannot be dissipated in a timely and effective manner, the chip temperature will rise, which will accelerate the aging of the chip's internal materials, shorten its lifespan, and may even cause failures, which will affect the use of the chip. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present application provides a semiconductor chip heat dissipation device that solves the problems mentioned in the above background technology.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present application is implemented through the following technical solutions: a semiconductor chip heat dissipation device, comprising a base for installing the device, the upper surface of the base is provided with a mounting mechanism for conveniently installing or disassembling the device, a heat dissipation mechanism for dissipating heat from the semiconductor chip is provided above the base, the heat dissipation mechanism comprises a heat conducting plate and fins, and the heat conducting plate is placed on the upper surface of the base.

[0008] By adopting the above technical solution, the heat dissipation mechanism can be removed from the device through the installation mechanism. After the device is used for a long time, dust is easily accumulated inside the installation plate and the fan. Removing them can more conveniently clean the dust to avoid excessive dust accumulation that affects the heat dissipation efficiency of the device. The heat dissipation mechanism can dissipate the heat of the chip to prevent the chip from being in a high temperature environment for a long time, causing chip aging, damage or performance degradation.

[0009] Preferably, a positioning block is fixedly mounted on the upper surface of the base, and a connecting block is slidably connected to the surface of the positioning block.

[0010] By adopting the above technical solution, the heat dissipation mechanism can be installed more conveniently through the positioning block and the connecting block.

[0011] Preferably, one end of the positioning block is rotatably connected to a rotating shaft, and the rotating shaft passes through one end of the positioning block.

[0012] By adopting the above technical solution, the hemisphere can be driven to rotate by the rotating shaft to limit the connection block and then the heat dissipation mechanism.

[0013] Preferably, a telescopic rod is fixedly mounted on the surface of the rotating shaft, a hemisphere is fixedly mounted on one end of the telescopic rod, a spring is fixedly mounted on one end of the hemisphere, and the other end of the spring is fixedly connected to the surface of the rotating shaft.

[0014] By adopting the above technical solution, the connection block can be limited by sliding the hemisphere on the inner wall surface of the connection block.

[0015] Preferably, a mounting plate is fixedly mounted on one side of the connecting block, and a heat pipe is fixedly mounted on the upper surface of the heat conducting plate.

[0016] By adopting the above technical solution, the heat generated by the chip can be conducted out through the heat conducting plate and the heat pipe to dissipate the heat of the chip.

[0017] Preferably, fins are fixedly mounted on the surface of the heat pipe, the fins are fixedly mounted on both sides of the inner wall of the mounting plate, and fans are fixedly mounted on both sides of the mounting plate.

[0018] By adopting the above technical solution, the heat conducted by the heat pipe can be absorbed by the fins, and the fan can dissipate heat from the fins.

[0019] (III) Beneficial effects

[0020] The present application provides a semiconductor chip heat dissipation device. The beneficial effects are as follows:

[0021] 1. The semiconductor chip heat dissipation device is provided with a heat dissipation mechanism to solve the problem that if the heat generated by the chip during operation cannot be dissipated promptly and effectively, the chip temperature will increase, which will accelerate the aging of the internal materials of the chip, shorten the lifespan, and may even cause failures, thereby affecting the use of the chip. It achieves the beneficial effect of preventing the chip from being in a high-temperature environment for a long time, causing chip aging, damage, or performance degradation.

[0022] 2. The semiconductor chip heat dissipation device is provided with a mounting mechanism, which enables the heat dissipation mechanism to be removed from the device. After the device is used for a long time, dust is easily accumulated inside the mounting plate and the fan. Disassembling them can more conveniently clean the dust and avoid excessive dust accumulation that affects the heat dissipation efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the implementation scheme of the utility model or the technical scheme in the prior art, the drawings required for use in the implementation scheme or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation schemes of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 This is a schematic diagram of the main appearance structure of this application;

[0025] Figure 2 This is a schematic diagram of the base and its connection structure of this application;

[0026] Figure 3 This is a schematic diagram of the installation mechanism structure of this application;

[0027] Figure 4 This is a schematic diagram of the heat pipe and its connection structure of the present application.

[0028] In the figure: 1. base; 2. mounting mechanism; 201. positioning block; 202. connecting block; 203. rotating shaft; 204. telescopic rod; 205. spring; 206. hemisphere; 3. heat dissipation mechanism; 301. mounting plate; 302. heat conducting plate; 303. heat pipe; 304. fin; 305. fan. DETAILED DESCRIPTION

[0029] It should be noted that in the description of the embodiments of the present application, the terms "front, rear", "left, right", "up, down", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present application. The terms "install", "connect", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0030] The present application is further described in detail below through drawings and examples.

[0031] Reference Figure 1 and Figure 2The embodiment of the present application provides a semiconductor chip heat dissipation device, including a base 1 for installing the device, an installation mechanism 2 for conveniently installing or removing the device is arranged on the upper surface of the base 1, and a heat dissipation mechanism 3 for dissipating heat from the semiconductor chip is arranged above the base 1, and the heat dissipation mechanism 3 includes a heat conducting plate 302 and a fin 304, and the heat conducting plate 302 is placed on the upper surface of the base 1. The installation mechanism 2 can be used to rotate the rotating shaft 203, and the rotating shaft 203 drives the telescopic rod 204 and the hemisphere 206 to rotate so that the hemisphere 206 slides on the inner wall surface of the connecting block 202 while squeezing the telescopic rod 204. 4 and the spring 205 are used to retract the heat sink 301 and then separate from the inner wall surface of the connecting block 202, and contact the inner wall surface of the positioning block 201. The mounting plate 301 can be lifted to remove the heat sink 3 and the connecting block 202 from the device for cleaning. The heat sink 3 can transfer the heat generated by the chip during use to the heat pipe 303 through the heat conduction plate 302, so that the coolant inside the heat pipe 303 evaporates to the upper condensation end, transfers the heat to the fins 304, and then recondenses into liquid and flows back to the bottom of the heat pipe 303. Starting the fan 305 can drive the air flow to blow away the heat on the fins 304 to complete the heat dissipation of the chip.

[0032] Reference Figure 2 and Figure 3 In one aspect of this embodiment, a positioning block 201 is fixedly mounted on the upper surface of the base 1 , and a connecting block 202 is slidably connected to the surface of the positioning block 201 .

[0033] One end of the positioning block 201 is rotatably connected to a rotating shaft 203 , and the rotating shaft 203 passes through one end of the positioning block 201 .

[0034] A telescopic rod 204 is fixedly installed on the surface of the rotating shaft 203, a hemispherical body 206 is fixedly installed on one end of the telescopic rod 204, a spring 205 is fixedly installed on one end of the hemispherical body 206, and the other end of the spring 205 is fixedly connected to the surface of the rotating shaft 203. The spring 205 is movably wound around the surface of the telescopic rod 204. By rotating the rotating shaft 203, the rotating shaft 203 drives the telescopic rod 204 and the hemispherical body 206 to rotate so that the hemispherical body 206 slides on the inner wall surface of the connecting block 202 and squeezes the telescopic rod 204 and the spring 205 to retract and then detach from the inner wall surface of the connecting block 202, and then contact the inner wall surface of the positioning block 201. The mounting plate 301 can be lifted to remove the heat dissipation mechanism 3 and the connecting block 202 from the device for cleaning.

[0035] Reference Figure 1 and Figure 4 In one aspect of this embodiment, a mounting plate 301 is fixedly mounted on one side of the connection block 202 , and a heat pipe 303 is fixedly mounted on the upper surface of the heat conducting plate 302 .

[0036] Fins 304 are fixedly installed on the surface of the heat pipe 303, and the fins 304 are fixedly installed on both sides of the inner wall of the mounting plate 301. Fans 305 are fixedly installed on both sides of the mounting plate 301. The heat generated by the chip when in use is conducted to the heat pipe 303 through the heat conducting plate 302, so that the coolant inside the heat pipe 303 evaporates to the upper condensation end, conducts the heat to the fins 304, and then re-condenses into liquid and flows back to the bottom of the heat pipe 303. Starting the fan 305 can drive the air flow to dissipate the heat on the fins 304 to complete the heat dissipation of the chip.

[0037] All electrical equipment in this solution are powered by an external power supply.

[0038] Working principle: When the device is used, the base 1 should first be installed at the designated position through the mounting hole opened on its surface so that the semiconductor chip passes through the notch opened on the surface of the base 1 and contacts the heat conducting plate 302. When the chip is in use, the heat generated is transferred to the heat pipe 303 through the heat conducting plate 302 so that the coolant inside the heat pipe 303 evaporates to the upper condensation end, and the heat is transferred to the fins 304 and then condenses into liquid again and flows back to the bottom of the heat pipe 303. Starting the fan 305 can drive the air flow to dissipate the heat on the fins 304 to complete the heat dissipation of the chip. After the device is used for a long time, the rotating shaft 203 is rotated, and the rotating shaft 203 drives the telescopic rod 204 and the hemisphere 206 to rotate so that the hemisphere 206 slides on the inner wall surface of the connecting block 202, and at the same time squeezes the telescopic rod 204 and the spring 205 to retract it and then detach from the inner wall surface of the connecting block 202, and then contact the inner wall surface of the positioning block 201. The mounting plate 301 can be lifted to remove the heat dissipation mechanism 3 and the connecting block 202 from the device for cleaning.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip heat dissipation device, comprising a base (1) for mounting the device, characterized in that: The upper surface of the base (1) is provided with a mounting mechanism (2) for conveniently mounting or dismounting the device, and a heat dissipation mechanism (3) for dissipating heat from a semiconductor chip is provided above the base (1), the heat dissipation mechanism (3) comprising a heat conducting plate (302) and fins (304), and the heat conducting plate (302) is placed on the upper surface of the base (1).

2. A semiconductor chip heat dissipation device according to claim 1, characterized in that: A positioning block (201) is fixedly mounted on the upper surface of the base (1), and a connecting block (202) is slidably connected to the surface of the positioning block (201).

3. A semiconductor chip heat dissipation device according to claim 2, characterized in that: One end of the positioning block (201) is rotatably connected to a rotating shaft (203), and the rotating shaft (203) passes through one end of the positioning block (201).

4. A semiconductor chip heat dissipation device according to claim 3, characterized in that: A telescopic rod (204) is fixedly mounted on the surface of the rotating shaft (203); a hemispherical body (206) is fixedly mounted on one end of the telescopic rod (204); a spring (205) is fixedly mounted on one end of the hemispherical body (206); and the other end of the spring (205) is fixedly connected to the surface of the rotating shaft (203).

5. A semiconductor chip heat dissipation device according to claim 2, characterized in that: A mounting plate (301) is fixedly mounted on one side of the connection block (202), and a heat pipe (303) is fixedly mounted on the upper surface of the heat conducting plate (302).

6. A semiconductor chip heat dissipation device according to claim 5, characterized in that: Fins (304) are fixedly mounted on the surface of the heat pipe (303), the fins (304) are fixedly mounted on both sides of the inner wall of the mounting plate (301), and fans (305) are fixedly mounted on both sides of the mounting plate (301).

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