Laser processing device

Abstract

The utility model provides a laser processing device which comprises a laser mechanism, a spectroscope, a processing module and an auxiliary module. The spectroscope is arranged on a light path of laser emitted by the laser mechanism. The auxiliary module comprises a first reflecting mirror unit and a second focusing mirror assembly, and the auxiliary module is used for conducting preheating or heat preservation on the to-be-machined area of the metal workpiece. The processing module comprises a first reflector unit and a first focus lens assembly. The processing module is used for forming an oxidation film. By arranging the spectroscope and the auxiliary module, the laser beam of the auxiliary module can move into the generation area of the oxidation film after the machining module completes machining so as to preserve heat of the oxidation film, and the probability that cracks or surface pits appear in the oxidation film due to sudden temperature drop caused by closing of the laser beam of the machining module is reduced.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] Anodizing generally refers to a surface treatment process that electrochemically oxidizes the surface of a metal workpiece. When the metal workpiece as the anode is electrolyzed in an electrolyte, the oxygen generated from the anode forms an oxide film with high adhesion on the surface of the metal workpiece, which is an anodizing method. However, this anodizing method is complex, some solutions in the process are harmful to the human body, and it is easy to cause environmental pollution.

[0003] Therefore, the technology of using laser pulses (also called laser) to generate oxide films on the surface of metal workpieces was born. The laser pulse (beam) is used to heat the processing area of ​​the metal workpiece, and the oxidation reaction is controlled by an auxiliary oxidant to generate an oxide film on the surface of the metal workpiece. However, the oxide film formed by laser is generated instantaneously at high temperature and cools down quickly, so cracks are easily generated inside the oxide film, affecting the performance of the film layer. Utility Model Content

[0004] In view of this, the present application proposes a laser processing device to reduce the probability of crack defects inside the oxide film.

[0005] The present application proposes a laser processing device for generating an oxide film on the surface of a to-be-processed area of ​​a metal workpiece. The laser processing device comprises a laser mechanism, a beam splitter, a processing module and an auxiliary module. The laser mechanism is used to emit laser light. The beam splitter is arranged opposite to the laser mechanism, and is arranged on the optical path of the laser. The beam splitter is used to split the laser light into a second laser beam and a second laser beam. The auxiliary module comprises a first reflector unit and a first focusing mirror assembly arranged in sequence. The first reflector unit is arranged in the optical path of the first laser beam, and is used to reflect the first laser beam to the first focusing mirror assembly, so that the first laser beam passes through the first focusing mirror assembly and irradiates the to-be-processed area of ​​the metal workpiece to preheat or keep the to-be-processed area warm. The processing module comprises a second reflector unit and a second focusing mirror assembly arranged in sequence. The second reflector unit is arranged in the optical path of the second laser beam, and is used to reflect the second laser beam to the second focusing mirror assembly so that the second laser beam passes through the second focusing mirror assembly and irradiates the to-be-processed area to form the oxide film.

[0006] In one embodiment, the first reflector unit includes a first driver, a second driver, a first reflector, and a second reflector. The first laser beam is reflected to the first focusing mirror assembly by the first reflector and the second reflector in sequence. The first reflector is connected to the first driver, and the first driver is used to drive the first reflector to rotate. The second reflector is connected to the second driver, and the second driver is used to drive the second reflector to rotate.

[0007] In one embodiment, the auxiliary module further includes a third reflector and a third driving member connected to the third reflector. The first focusing mirror assembly is disposed between the second reflector and the third reflector, and the third reflector is used to reflect the first laser beam passing through the first focusing mirror assembly to the area to be processed. The third driving member is used to drive the third reflector to rotate.

[0008] In one embodiment, the first focusing mirror assembly includes a first focusing mirror and a first light gate, the first focusing mirror is arranged between the second reflector and the third reflector, and the first light gate is arranged at an end of the first focusing mirror close to the second reflector.

[0009] In one embodiment, the auxiliary module further includes a first beam expander, and the first beam expander is disposed between the second reflector and the first focusing lens assembly, or the first beam expander is disposed between the first focusing lens assembly and the third reflector.

[0010] In one embodiment, the second reflector unit includes a fourth reflector, and the fourth reflector is disposed between the beam splitter and the second focusing mirror assembly. The second laser beam is reflected by the fourth reflector to the second focusing mirror assembly.

[0011] In one embodiment, the processing module further includes a fifth reflector. The second focusing mirror assembly is disposed between the fourth reflector and the fifth reflector, and the fifth reflector is used to reflect the second laser beam passing through the second focusing mirror assembly to the area to be processed.

[0012] In one embodiment, the second focusing mirror assembly includes a second focusing mirror and a second light gate. The second focusing mirror is disposed between the fourth reflector and the fifth reflector, and the second light gate is disposed at an end of the second focusing mirror close to the fourth reflector.

[0013] In one embodiment, the processing module further includes a second beam expander, and the second beam expander is arranged between the second focusing mirror assembly and the fifth reflector.

[0014] In one embodiment, the processing module further includes a second beam expander, and the second beam expander is disposed between the fourth reflector and the second focusing mirror assembly.

[0015] The present application sets a beam splitter and an auxiliary module so that the laser beam of the auxiliary module can move to the oxide film generation area after the processing module completes processing, so as to keep the oxide film warm, thereby reducing the probability of cracks or surface pits forming due to a sudden drop in temperature inside the oxide film caused by the shutdown of the laser beam of the processing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of a laser processing device according to one embodiment of the present application.

[0017] Figure 2 for Figure 1 The laser processing device shown is a schematic structural diagram of some components after the outer shell is removed.

[0018] Figure 3 for Figure 2 A is an enlarged schematic diagram from another perspective.

[0019] Figure 4 A scanning electron microscope (SEM) image of a titanium workpiece provided in accordance with an embodiment of the present application.

[0020] Figure 5 For Example 1 of this application Figure 4 The scanning electron microscope image of the oxide film prepared on the surface of the titanium workpiece is shown.

[0021] Figure 6 For comparative example 1 of this application Figure 4 The scanning electron microscope image of the oxide film prepared on the surface of the titanium workpiece is shown.

[0022] Figure 7 For comparative example 2 of this application Figure 4 The scanning electron microscope image of the oxide film prepared on the surface of the titanium workpiece is shown.

[0023] Main component symbols

[0024] Laser processing device 100

[0025] Laser mechanism 10

[0026] Beam splitter 20

[0027] Auxiliary module 30

[0028] Processing module 40

[0029] Housing 50

[0030] Mounting Block 60, 61, 62, 63, 64, 412

[0031] First optical path 11

[0032] Second optical path 12

[0033] First reflector unit 31

[0034] The first focusing lens assembly 32

[0035] The third reflecting mirror 33

[0036] The third driving member 34

[0037] First reflecting mirror 311

[0038] Second reflecting mirror 312

[0039] The first focusing mirror 321

[0040] First light gate 322

[0041] Second reflector unit 41

[0042] The second focusing lens assembly 42

[0043] Fourth reflecting mirror 411

[0044] Fifth reflecting mirror 43

[0045] Second focusing mirror 421

[0046] Second light shutter 422

[0047] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present application. The terms used herein are only for the purpose of describing specific implementation methods and are not intended to limit the present application embodiments.

[0049] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0050] It should be noted that when a component is referred to as being "fixed to" or "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. The term "and / or" as used herein includes all and any combinations of one or more of the relevant listed items.

[0051] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0052] See also Figure 1 and Figure 2 The present application provides a laser processing device 100, which can be used to form an oxide film on the surface of a to-be-processed area of ​​a metal workpiece (not shown). The metal workpiece 200 may be, but is not limited to, titanium (Ti), aluminum (Al), zinc (Zn), magnesium (Mg), niobium (Nb), tantalum (Ta) and other metals and their alloys. The laser processing device 100 of the present application heats the surface of the to-be-processed area of ​​the metal workpiece 200 instantaneously and at a high temperature by laser, so that a large amount of oxygen atoms in the air penetrate into the metal workpiece in a short time to oxidize the metal workpiece 200, thereby forming a stable oxide film on the surface of the processing area 202 of the metal workpiece 200 in a short time to protect the metal workpiece 200 from further oxidation.

[0053] like Figure 1 and Figure 2 As shown, the laser processing device 100 includes a laser mechanism 10, a spectroscope 20, an auxiliary module 30 and a processing module 40. The laser mechanism 10 is used to emit a laser, and the wavelength of the laser can be 350nm to 400nm. The spectroscope 20 is arranged opposite to the laser mechanism 10, and the laser mechanism 10 can be located above the spectroscope 20. The spectroscope 20 is arranged on the optical path of the laser emitted by the laser mechanism 10, and the laser emitted by the laser mechanism 10 first enters the spectroscope 20. The spectroscope 20 can be made of optical glass coating, and the spectroscope 20 is used to split the laser emitted by the laser mechanism 10 into a first laser beam and a second laser beam. The properties (wavelengths) of the first laser beam and the second laser beam are the same as those of the laser emitted by the laser mechanism 10, and the sum of the light intensities of the first laser beam and the second laser beam is approximately equal to the light intensity of the laser emitted by the laser mechanism 10. After being split by the spectroscope 20, the directions of the first laser beam and the second laser beam can be approximately perpendicular.

[0054] In this embodiment, Figure 2As shown in FIG. 1 , the transmission direction of the first laser beam emitted from the beam splitter 20 is approximately vertical, and the transmission direction of the second laser beam emitted from the beam splitter 20 is approximately horizontal. It can be understood that in order to show the transmission paths of the lasers (the first laser beam and the second laser beam) in the figure, the transmission paths of the first laser beam and the second laser beam are shown in FIG. Figure 1 and Figure 2 In the figure, they are represented by cylindrical shapes and are named as the first optical path 11 and the second optical path 12. The first laser beam is transmitted along the first optical path 11, and the second laser beam is transmitted along the second optical path 12. However, in the actual laser processing device 100, the actual cylindrical object representing the transmission path may not exist.

[0055] like Figure 2 As shown, the auxiliary module 30 includes a first reflector unit 31 and a first focusing mirror assembly 32 which are arranged in sequence. The first reflector unit 31 is arranged on the optical path of the first laser beam (the first optical path 11). The first reflector unit 31 is used to reflect the first laser beam emitted from the beam splitter 20 to change the transmission direction of the first laser beam, so that the first laser beam passes through the first focusing mirror assembly 32 and irradiates the metal workpiece 200 to preheat or keep the area to be processed. The first focusing mirror assembly 32 is used to focus the first laser beam to concentrate the energy of the first laser beam, thereby improving the preheating or keeping warm effect.

[0056] like Figure 2 As shown, the processing module 40 includes a second reflector unit 41 and a second focusing mirror assembly 42 which are arranged in sequence. The second reflector unit 41 is arranged on the optical path of the second laser beam (the second optical path 12). The second reflector unit 41 is used to reflect the second laser beam to change the direction of the second laser beam, so that the second laser beam passes through the second focusing mirror assembly 42 and irradiates the area to be processed of the metal workpiece 200 to form an oxide film. The second focusing mirror assembly 42 is used to focus the second laser beam to concentrate the energy of the second laser beam, thereby improving the processing speed and efficiency.

[0057] like Figure 2 and Figure 3As shown, in some embodiments, the first reflector unit 31 includes a first driver (not shown), a second driver (not shown), a first reflector 311 and a second reflector 312. The first reflector 311 is disposed between the beam splitter 20 and the second reflector 312, and the first laser beam is sequentially reflected to the first focusing mirror assembly 32 through the first reflector 311 and the second reflector 312. The first reflector 311 is connected to the first driver, and the first driver is used to drive the first reflector 311 to rotate. The second reflector 312 is connected to the second driver, and the second driver is used to drive the second reflector 312 to rotate. The first driver can accurately control the rotation angle of the first reflector, and the second driver can accurately control the rotation angle of the second reflector. Through the cooperation of the two, the first laser beam can be moved in multiple angles and directions on the area to be processed of the metal workpiece 200, thereby completing the preheating or heat preservation operation.

[0058] In some embodiments, the first reflector unit 31 is also called a galvanometer. The first driving element and the second driving element may be, but are not limited to, motors.

[0059] like Figure 1 and Figure 2 As shown, in some embodiments, the auxiliary module 30 further includes a third reflector 33 and a third driving member 34 connected to the third reflector 33. The first focusing mirror assembly 32 is disposed between the second reflector 312 and the third reflector 33, and the third reflector 33 is used to reflect the first laser beam passing through the first focusing mirror assembly 32 to the area to be processed. The third driving member 34 is used to drive the third reflector 33 to rotate to adjust the direction of the first laser beam so that the first laser beam can be irradiated on the area to be processed of the metal workpiece 200. The third driving member 34 cooperates with the first driving member and the second driving member to enable the first laser beam to move in multiple angles and directions on the area to be processed.

[0060] like Figure 2 and Figure 3 As shown, in some embodiments, the first focusing mirror assembly 32 includes a first focusing mirror 321 and a first light gate 322. The first focusing mirror 321 is disposed between the second reflector 312 and the third reflector 33, and the first light gate 322 is disposed at one end of the first focusing mirror 321 close to the second reflector 312. The first focusing mirror 321 may be composed of a plurality of lenses. The transmission path of the first laser beam may be: the beam splitter 20, the first reflector 311, the second reflector 312, the first light gate 322, the first focusing mirror 321, and the third reflector 33. The first laser beam reflected by the third reflector 33 acts on the area to be processed of the metal workpiece to preheat or keep the area to be processed warm.

[0061] Furthermore, the first shutter 322 has an open state and a closed state. When the first shutter 322 is in the open state, the first laser beam can pass through the first shutter 322 and be transmitted to the first focusing mirror 321 and the third reflecting mirror 33 in sequence, and finally irradiate the area to be processed of the metal workpiece. When the first shutter 322 is in the closed state, the first laser beam cannot pass through the first shutter 322, and the transmission of the first laser beam is blocked.

[0062] In some embodiments, the auxiliary module 30 further includes a first beam expander (not shown). The first beam expander can be disposed between the second reflector 312 and the first focusing lens assembly 32, or between the first focusing lens assembly 32 and the third reflector 33. The first beam expander is used to increase the diameter of the first laser beam. In some embodiments, the first beam expander can also be omitted.

[0063] like Figure 1 and Figure 2 As shown, in some embodiments, the laser processing device 100 further includes a housing 50 and mounting seats 60, 61, 62, and 63. The laser mechanism 10 can be mounted on the housing 50 through the mounting seat 60. The beam splitter 20 can be mounted on the housing 50 through a mounting seat (not shown). The first reflector 311 can be mounted on the housing 50 through the mounting seat 61 and can rotate relative to the housing 50. The second reflector 312 can be mounted on the housing 50 through the mounting seat 62 and can rotate relative to the housing 50. The third driving member 34 and the third reflector 33 can be mounted on the housing 50 through the mounting seat 63, and the third reflector 313 can rotate relative to the housing 50.

[0064] like Figure 2 As shown, in some embodiments, the second reflector unit 41 includes a fourth reflector 411 and a mounting base 412 connected to the fourth reflector 411. The fourth reflector 411 can be mounted on the housing 50 through the mounting base 412. The fourth reflector 411 is disposed between the beam splitter 20 and the second focusing lens assembly 42. The fourth reflector 411 is used to reflect the second laser beam emitted from the beam splitter 20 and change the direction of the second laser beam so that the second laser beam is incident on the second focusing lens assembly 42. In this embodiment, as shown in the second optical path 12, the transmission direction of the second laser beam emitted from the beam splitter 20 is approximately horizontal. After being reflected by the fourth reflector 411, the transmission direction of the second laser beam becomes vertical, and then is incident on the second focusing lens assembly 42.

[0065] like Figure 2 As shown, further, the processing module 40 also includes a fifth reflector 43. The second focusing mirror assembly 42 is disposed between the fourth reflector 411 and the fifth reflector 43, and the fifth reflector 43 is used to reflect the second laser beam emitted from the second focusing mirror assembly 42 to the area to be processed of the metal workpiece, thereby forming an oxide film.

[0066] like Figure 2 As shown, in some embodiments, the second focusing mirror assembly 42 includes a second focusing mirror 421 and a second light gate 422. The second focusing mirror 421 is disposed between the fourth reflector 411 and the fifth reflector 43, and the second light gate 422 is disposed at one end of the second focusing mirror 421 close to the fourth reflector 411. The second focusing mirror 421 may be composed of a plurality of lenses. The transmission path of the second laser beam may be: the beam splitter 20, the fourth reflector 411, the second light gate 422, the second focusing mirror 421, and the fifth reflector 43. The second laser beam reflected by the fifth reflector 43 acts on the area to be processed of the metal workpiece to form an oxide film.

[0067] Furthermore, the second shutter 422 has an open state and a closed state. When the second shutter 422 is in the open state, the second laser beam can pass through the second shutter 422 and be transmitted to the second focusing mirror 421 and the fifth reflecting mirror 43 in sequence, and finally irradiate the area to be processed of the metal workpiece. When the second shutter 422 is in the closed state, the second laser beam cannot pass through the second shutter 422, the transmission of the second laser beam is blocked, and the subsequent oxidation operation of the metal workpiece cannot be completed.

[0068] In some embodiments, the processing module 40 may further include a second beam expander (not shown). The second beam expander may be disposed between the fourth reflector 411 and the second focusing mirror assembly 42, or between the second focusing mirror assembly 42 and the fifth reflector 43. The second beam expander is used to increase the diameter of the second laser beam. In some embodiments, the second beam expander may also be omitted.

[0069] like Figure 2 As shown, in some embodiments, the second focusing lens assembly 42 can be mounted on the housing 50 via a mounting seat (not shown). The fifth reflecting mirror 43 can be mounted on the housing 50 via a mounting seat 64.

[0070] When in use, the laser mechanism 10 is started (the wavelength of the laser emitted can be 350nm to 400nm), the first shutter 322 of the auxiliary module 30 is opened, and the second shutter 422 of the processing module 40 is closed, so that the first laser beam emitted by the beam splitter 20 can be transmitted along the first optical path 11 (the first reflector 311, the second reflector 312, the first shutter 322, the first focusing mirror 321, and the third reflector 33) while the second laser beam cannot be transmitted, so that the laser processing device 100 is in the preheating mode. The frequency of the first laser beam can be 30kHz to 50kHz, the power can be 8w to 10w, the spot diameter of the first laser beam irradiated on the area to be processed of the metal workpiece can be 60μm to 100μm, and the first laser beam (spot) can move in the area to be processed in a "bow" shape, and the moving speed can be 500mm / s to 1000mm / s. In this way, while the temperature of the area to be processed is increased (can be increased to 300°C), impurities on the surface of the area to be processed can also be removed. Move the first laser beam outside the area to be processed (the first light gate 322 can still remain in the open state) to complete the preheating. Then, open the second light gate 422 of the processing module 40, so that the second laser beam is transmitted along the second optical path 12 (the fourth reflector 411, the second light gate 422, the second focusing mirror 421, and the fifth reflector 43), and irradiates the area to be processed to generate an oxide film. The frequency of the second laser beam can be 30kHz to 50kHz, the power can be 4w to 6w, the spot diameter of the second laser beam irradiated on the area to be processed can be 30μm to 50μm, and the second laser beam can move in the area to be processed, and the moving speed can be 100mm / s to 200mm / s. Under the above parameters, an oxide layer can be generated on the surface of the area to be processed. When the processing is finished, the second shutter 422 of the processing module 40 is closed. At this time, the first shutter 322 of the auxiliary module 30 is still in the open state, and the moving power can be changed to move the first laser beam (spot) to the oxide film generation area to keep the oxide film warm and reduce the probability of cracks or surface pits caused by the sudden drop in temperature inside the oxide film due to the closing of the second laser beam. After the second shutter 422 is closed, the first shutter 322 can be closed after a delay of 10ms to 100ms.

[0071] The present application will be further described below in conjunction with specific embodiments and comparative examples.

[0072] The following examples and comparative examples are used to perform surface treatment on titanium metal workpieces. Before treatment, the scanning electron microscope image of the titanium metal workpiece is as follows: Figure 4 As shown, the hardness of the titanium metal workpiece (HV10, that is, the Vickers hardness value measured under the effect of 10 kgf force for 10s to 15s) is 309.

[0073] Example 1

[0074] The laser processing device 100 described in this application is used to Figure 4Surface treatment of titanium metal workpieces.

[0075] Preheating: Start the laser mechanism 10, open the first light gate 322 of the auxiliary module 30, and close the second light gate 422 of the processing module 40, so that the first laser beam can be transmitted along the first optical path 11 to preheat the area to be processed of the titanium workpiece. The wavelength of the first laser beam is 355nm, the frequency is 30kHz, the power is 8w, and the diameter of the spot irradiated on the area to be processed is 60μm. The spot moves in the area to be processed in a "bow" shape at a moving speed of 500mm / s. In the area to be processed, the energy per unit area reaches 9.4J / cm 2 , the temperature of the area to be processed is increased, and the first laser beam is moved outside the area to be processed to complete the preheating operation.

[0076] Processing: Open the second shutter 422 of the processing module 40 (the first shutter 322 remains open), so that the second laser beam is transmitted along the second optical path 12 and irradiated to the area to be processed of the titanium workpiece to generate an oxide film. The frequency of the second laser beam is 30kHz, the power is 4w, the diameter of the spot irradiated on the area to be processed is 30μm, the spot moves in the processing area of ​​the titanium workpiece, and the axis movement speed is 150mm / s. The parameters used are single pulse energy of 133μJ and energy per unit area of ​​18.8J / cm 2 .

[0077] Heat preservation: close the second shutter 422 of the processing module 40, move the first laser beam to the area to be processed to keep the oxide film warm, and close the first shutter 322 after the second shutter 422 is closed for 100ms.

[0078] Finally, the laser mechanism 10 is turned off to complete the surface treatment of the titanium metal workpiece.

[0079] The SEM image of the titanium metal workpiece after surface treatment in Example 1 is as follows: Figure 5 As shown. Figure 5 It can be seen that a dense oxide film is formed on the surface of the titanium workpiece, and its thickness can reach 15.74μm. The hardness of the titanium workpiece was tested, and its hardness (HV10) was 450. Compared with the hardness before treatment, the hardness of the titanium workpiece processed by the laser processing device 100 of the present application increased by 45.6%.

[0080] Comparative Example 1

[0081] Using existing laser processing equipment Figure 4 The titanium metal workpiece is surface treated, which is different from Example 1 mainly in that the existing laser processing device does not have an auxiliary module and does not have a heat preservation step after the processing step is completed.

[0082] The SEM image of the titanium metal workpiece after surface treatment in Comparative Example 1 is as follows: Figure 6 As shown. Figure 6 It can be seen that the thickness of the oxide film formed on the surface of the titanium metal workpiece is about 10 μm, but due to the excessively fast cooling rate, a large number of microcracks exist in the film layer. The hardness of the titanium metal workpiece was tested, and its hardness (HV10) was 400, which is lower than the hardness of the titanium metal workpiece after surface treatment in Example 1.

[0083] Comparative Example 2

[0084] Comparative Example 2: Electrochemical method Figure 4 The titanium workpiece shown is subjected to surface treatment.

[0085] Will Figure 4 The titanium metal workpiece sheet shown is used as the anode, the graphite plate is used as the cathode, the surface area ratio of the cathode to the anode is 3:1, the distance between the two poles is 3 cm, and anodization is carried out in an electrolyte at a constant voltage of 30 V DC for 30 minutes. The anodization temperature is 25° C., and the electrolyte is 0.5% (volume percentage) HF.

[0086] The SEM image of the titanium metal workpiece after surface treatment in Comparative Example 2 is as follows: Figure 7 As shown. Figure 7 It can be seen that the thickness of the oxide film formed on the surface of the titanium metal workpiece is about 100 nm. The hardness of the titanium metal workpiece was tested and its hardness (HV10) was 340, which is lower than the hardness of the titanium metal workpiece after surface treatment in Example 1.

[0087] It can be seen from Example 1 and Comparative Examples 1 to 2 that, compared with the oxide film induced by the laser method (without the insulation step), the oxide film induced by the laser processing device 100 of the present application has fewer internal microcracks, higher hardness, and stronger adhesion; compared with the oxide film generated by the electrochemical method, the oxide film induced by the laser processing device 100 of the present application has a larger thickness and higher hardness.

[0088] The present application sets a beam splitter 20 and an auxiliary module 30 so that the laser beam of the auxiliary module 30 can move to the oxide film generation area after the processing module 40 completes processing, so as to keep the oxide film warm, thereby reducing the probability of cracks or surface pits occurring in the oxide film due to a sudden drop in temperature caused by the laser beam of the processing module being turned off.

[0089] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A laser processing device for forming an oxide film on the surface of a metal workpiece in a processing area, characterized in that: The laser processing device comprises: A laser mechanism, wherein the laser mechanism is used to emit laser light; A beam splitter, the beam splitter is arranged opposite to the laser mechanism, the beam splitter is arranged on the optical path of the laser, and the beam splitter is used to split the laser into a first laser beam and a second laser beam; an auxiliary module, comprising a first reflector unit and a first focusing mirror assembly which are arranged in sequence, wherein the first reflector unit is arranged in the optical path of the first laser beam and is used to reflect the first laser beam to the first focusing mirror assembly, so that the first laser beam irradiates the to-be-processed area of ​​the metal workpiece after passing through the first focusing mirror assembly, so as to preheat or keep the to-be-processed area warm; and The processing module includes a second reflector unit and a second focusing mirror assembly which are arranged in sequence. The second reflector unit is arranged in the optical path of the second laser beam and is used to reflect the second laser beam to the second focusing mirror assembly so that the second laser beam passes through the second focusing mirror assembly and then irradiates the area to be processed to form the oxide film.

2. The laser processing device according to claim 1, characterized in that: The first reflector unit includes a first driving member, a second driving member, a first reflector, and a second reflector. The first laser beam is reflected to the first focusing mirror assembly by the first reflector and the second reflector in sequence. The first reflector is connected to the first driving member, and the first driving member is used to drive the first reflector to rotate; The second reflector is connected to the second driving member, and the second driving member is used to drive the second reflector to rotate.

3. The laser processing device according to claim 2, characterized in that: The auxiliary module also includes a third reflector and a third driving member connected to the third reflector. The first focusing mirror assembly is arranged between the second reflector and the third reflector. The third reflector is used to reflect the first laser beam passing through the first focusing mirror assembly to the area to be processed, and the third driving member is used to drive the third reflector to rotate.

4. The laser processing device according to claim 3, characterized in that: The first focusing mirror assembly includes a first focusing mirror and a first light gate. The first focusing mirror is arranged between the second reflecting mirror and the third reflecting mirror. The first light gate is arranged at one end of the first focusing mirror close to the second reflecting mirror.

5. The laser processing device according to claim 3, characterized in that: The auxiliary module also includes a first beam expander, which is arranged between the second reflector and the first focusing lens assembly, or the first beam expander is arranged between the first focusing lens assembly and the third reflector.

6. The laser processing device according to claim 1, characterized in that The second reflector unit includes a fourth reflector, and the fourth reflector is arranged between the beam splitter and the second focusing mirror assembly. The second laser beam is reflected by the fourth reflector to the second focusing mirror assembly.

7. The laser processing device according to claim 6, characterized in that: The processing module also includes a fifth reflector. The second focusing mirror assembly is disposed between the fourth reflector and the fifth reflector. The fifth reflector is used to reflect the second laser beam passing through the second focusing mirror assembly to the area to be processed.

8. The laser processing device according to claim 7, characterized in that: The second focusing mirror assembly includes a second focusing mirror and a second light shutter, the second focusing mirror is arranged between the fourth reflecting mirror and the fifth reflecting mirror, and the second light shutter is arranged at an end of the second focusing mirror close to the fourth reflecting mirror.

9. The laser processing device according to claim 7, characterized in that: The processing module also includes a second beam expander, which is arranged between the second focusing mirror assembly and the fifth reflecting mirror.

10. The laser processing device according to claim 6, characterized in that: The processing module also includes a second beam expander, which is arranged between the fourth reflector and the second focusing mirror assembly.

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