Electroplating clamp

Abstract

The utility model discloses an electroplating clamp and belongs to the technical field of electroplating. The electroplating clamp provided by the utility model comprises a bottom plate and a plurality of electroplating tanks arranged on the bottom plate at intervals, wherein each electroplating tank is used for accommodating a product; the electroplating bath comprises a first through hole and a second through hole which are sequentially formed in the upper surface and the lower surface of the bottom plate in the thickness direction of the bottom plate; the axes of the first through hole and the second through hole are the same; the first through hole and the second through hole are communicated with each other; the first through hole and the second through hole are matched with a product in shape and size, and the size of the first through hole is larger than that of the second through hole; an L-shaped step surface is formed between the first through hole and the second through hole, and the to-be-electroplated surface of the product is placed into the electroplating bath from the first through hole downwards. The electroplating clamp provided by the scheme does not stick away a protective film on a product due to no sticky bottom film, and is simultaneously suitable for products with and without the protective film, and the through hole structure of the electroplating bath can save consumables of the bottom plate, so that the electroplating clamp is high in applicability and economical efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to an electroplating fixture. Background Art

[0002] In the prior art, when electroplating small flat products, in order to improve the efficiency of electroplating, an electroplating fixture is usually used to carry multiple products for batch electroplating. The electroplating fixture is usually composed of a base plate, on which an adhesive base film is attached, and then the product is attached to the adhesive base film, and the non-attached surface of the product is electroplated. This type of electroplating fixture is flexible and convenient to operate, can adapt to products of various sizes and shapes, and is widely used.

[0003] However, since the product is fixed with an adhesive base film, when processing products with a protective film on the non-electroplated surface, the adhesive base film will stick to the product protective film, causing the product to need to be re-applied with the protective film, which increases costs and may also result in product defects. Utility Model Content

[0004] The utility model aims at the above-mentioned problems in the background technology and provides a plating fixture without an adhesive bottom film to solve the problem that the plating fixture with an adhesive bottom film sticks away the protective film on the non-plating surface of the product.

[0005] The electroplating fixture provided by the utility model comprises a bottom plate and a plurality of electroplating tanks arranged at intervals on the bottom plate; each of the electroplating tanks is used to accommodate a product;

[0006] The electroplating tank includes a first through hole and a second through hole which are sequentially arranged on the upper surface and the lower surface of the bottom plate along the thickness direction of the bottom plate; the axial center lines of the first through hole and the second through hole are the same; the thickness of the first through hole is greater than the thickness of the product, and the sum of the thicknesses of the first through hole and the second through hole is equal to the thickness of the bottom plate; the shapes of the first through hole and the second through hole are adapted to the shapes of the edges of the product, the size of the first through hole is greater than the size of the product, and the size of the second through hole is smaller than the size of the product; an L-shaped step surface is formed between the first through hole and the second through hole.

[0007] Preferably, the width of the L-shaped step surface is smaller than the width of the waste area at the corresponding edge of the product.

[0008] Preferably, the thickness of the first through hole is greater than the thickness of the second through hole.

[0009] Preferably, a positioning block is provided on the edge of the first through hole.

[0010] Preferably, the first through hole is provided with a chamfer along the edge.

[0011] Preferably, the chamfer is a 45-degree chamfer.

[0012] The electroplating fixture provided by the utility model includes a base plate and a plurality of electroplating tanks for accommodating products arranged at intervals on the base plate, each electroplating tank accommodating one product; the electroplating tank includes a first through hole and a second through hole arranged in sequence along the thickness direction of the base plate on the upper surface and the lower surface of the base plate; the axial center lines of the first through hole and the second through hole are the same; the thickness of the first through hole is greater than the thickness of the product, and the first through hole and the second through hole are interconnected; the shape and size of the first through hole and the second through hole are adapted to the product, and the size of the first through hole is greater than the second through hole; an L-shaped step surface is formed between the first through hole and the second through hole, and the product to be electroplated is placed into the electroplating tank from the first through hole with the surface facing downward, and is supported by the L-shaped step surface, so that it is not easy to fall off. The electroplating fixture provided by this solution does not have a sticky bottom film, so the protective film on the product will not be stuck away, and is suitable for products with and without protective films, and the through-hole structure of the electroplating tank can save base plate consumables, so this solution has strong applicability and economy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the electroplating fixture structure provided in an embodiment of the utility model.

[0014] Figure 2 A side sectional view of an electroplating fixture provided in an embodiment of the utility model.

[0015] Figure 3 A top view of an electroplating tank provided in an embodiment of the utility model.

[0016] In the attached picture:

[0017] 10. Bottom plate; 11. Upper surface of bottom plate; 12. Lower surface of bottom plate.

[0018] 20. Electroplating tank; 21. First through hole; 22. Second through hole; 23. L-shaped step surface; 24. Positioning block; 25. Chamfer. DETAILED DESCRIPTION

[0019] In order to have a clearer understanding of the technical features, purposes and effects of the present utility model, the specific implementation methods of the present utility model are now described in detail with reference to the accompanying drawings.

[0020] The utility model is suitable for electroplating of small flat sheet products, which include glass, sapphire and metal.

[0021] With the increasing popularity of sapphire and glass materials, PVD coating technology is increasingly used for product surface treatment to improve performance and aesthetics. Different product designs and process conditions have increasingly complex and more refined requirements for the processing of electroplated film layers. Therefore, customized processing solutions for each specific project become particularly important. In some products, it is necessary to perform PVD electroplating on two surfaces at the same time. After one side is electroplated, a protective film is attached to the electroplated surface to prevent discoloration and scratches, and then the other surface is electroplated. If the electroplating fixture with a sticky bottom film mentioned in the background technology is used to electroplate the second surface, the sticky bottom film will stick away the product protective film, causing the product to need to re-apply the protective film, which increases the cost and may also result in product defects.

[0022] like Figure 1-3 As shown, an embodiment of the utility model provides an electroplating fixture, which includes a base plate 10 and a plurality of electroplating tanks 20 spaced apart on the base plate 10 , each of the electroplating tanks 20 being used to accommodate a product.

[0023] The utility model has no particular restrictions on the specific shape and size of the bottom plate 10. In practical applications, the shape and size of the bottom plate 10 are designed according to the specific electroplating machine. Figure 1 As shown, in some embodiments of the present invention, the bottom plate 10 is designed to be a fan-shaped structure. The bottom plate 10 can also be designed to be a square, round, oval or other structure as required.

[0024] The electroplating tanks 20 are arranged at intervals on the bottom plate 10. In the embodiment of the utility model, the electroplating tanks 20 are arranged regularly on the bottom plate 10 to accommodate as many electroplating tanks 20 as possible in a limited space. At the same time, the spacing between adjacent electroplating tanks 20 should not be too small to facilitate loading and unloading. Figure 1 As shown, in the embodiment of the utility model, the electroplating tanks 20 are neatly arranged along one radial side of the sector, and then expand to the other radial side in rows, so that the layout is neat and compact.

[0025] The present invention has no particular limitation on the material of the bottom plate 10 , and the same high temperature resistant material as in the prior art can be used.

[0026] The electroplating tank 20 includes a first through hole 21 and a second through hole 22 which are sequentially arranged on the upper surface 11 and the lower surface 12 of the bottom plate along the thickness direction of the bottom plate 10; the axial center lines of the first through hole 21 and the second through hole 22 are the same; the thickness of the first through hole 21 is greater than the thickness of the product, and the sum of the thicknesses of the first through hole 21 and the second through hole 22 is equal to the thickness of the bottom plate 10; the shapes of the first through hole 21 and the second through hole 22 are adapted to the shape of the edge of the product, the size of the first through hole 21 is greater than the size of the product, and the size of the second through hole 22 is smaller than the size of the product; an L-shaped step surface 23 is formed between the first through hole 21 and the second through hole 22.

[0027] The first through hole 21 and the second through hole 22 are both arranged along the thickness direction of the bottom plate, that is, they are arranged vertically relative to the surface of the bottom plate. The first through hole 21 and the second through hole 22 have the same axis. The size of the first through hole 21 is larger than the product size, and the size of the second through hole 22 is smaller than the product size. The sum of the thickness of the two through holes is equal to the thickness of the bottom plate, so that the two through holes are connected together to form an L-shaped step surface between the two through holes. Therefore, the product can be easily loaded and unloaded from the first through hole 21, and at the same time, it can be supported and fixed by the L-shaped step surface 23 and is not easy to fall. The thickness of the first through hole is greater than the thickness of the product, which also makes loading and unloading more convenient, and the product is more firmly fixed in the electroplating tank. Figure 1-Figure 3 In the illustrated embodiment, the product edge is rectangular, the first through hole 21 and the second through hole 22 are both rectangular, and taking the product size of 60mmx55mm as an example, the corresponding sizes of the first through hole 21 and the second through hole 22 are 60.6mmx55.6mm and 59.6mmx54.6mm respectively.

[0028] It should be noted that the present invention has no particular restrictions on the shape of the product. Figure 1-3 The embodiment of the present invention is a schematic diagram of a rectangular product. If the product is circular, oval, etc., the shapes of the first through hole 21 and the second through hole 22 can be changed according to the shape of the product. Therefore, the solution of the utility model is applicable to products with different shapes.

[0029] Before electroplating, place the upper surface 11 of the bottom plate 10 upward, place the product to be electroplated face downward into the electroplating tank 20 through the first through hole 21, and the product falls onto the L-shaped step surface 23. After placing the product, place the electroplating fixture into the electroplating machine, and then turn on the electroplating machine for electroplating. The electroplating machine electroplates the product through the second through hole. Because there is no adhesive bottom film attached to the bottom plate, the problem that the protective film on the non-electroplated surface of the product is easily stuck to the electroplating fixture with an adhesive bottom film is solved. In addition, the electroplating fixture provided in the embodiment of the utility model has multiple electroplating tanks 20 on the bottom plate 10, and the electroplating tanks 20 are arranged through the bottom plate 10. Compared with the electroplating fixture with an adhesive bottom film, the bottom plate uses less material and has lower cost.

[0030] The L-shaped step surface 23 is used to support the product, but at the same time the L-shaped step surface 23 will block part of the edge of the product. Usually, a waste area is set at the edge of the product. Therefore, in order to ensure the electroplating effect of the non-waste area, in the embodiment of the utility model, the width of the L-shaped step surface 23 is smaller than the width of the waste area at the corresponding edge of the product. Figure 2 In the structure shown, the width of the L-shaped step surface 23 is 0.5 mm, and the width of the waste area at the edge of the product is generally greater than 1 mm. Figure 2 The structure shown can ensure that the non-waste area of ​​the product is not blocked.

[0031] The first through hole 21 is the product discharge position, and the product position exposed by the second through hole 22 is the product electroplating area. In order to achieve a better electroplating effect, in the embodiment of the utility model, the thickness of the first through hole 21 is greater than the thickness of the second through hole 22, so that the electroplating surface of the product is closer to the electroplating machine and the electroplating effect is better. Figure 2 In the structure shown, the thickness of the bottom plate 10 is 6 mm, the thickness of the first through hole is 5 mm, and the thickness of the second through hole is 1 mm.

[0032] In order to facilitate loading and unloading, the size of the first through hole 21 is larger than the product size. In order to align the electroplating area of ​​the product with the electroplating machine, in some embodiments of the utility model, a positioning block 24 is provided at the edge of the first through hole 21 to position the edge of the product. Figure 3 The figure shows a top view of the electroplating tank of the electroplating fixture provided by the embodiment of the utility model, and two positioning blocks 24 are respectively arranged on the four sides of the electroplating tank. The utility model has no limitation on the specific structure of the positioning blocks 24. Figure 3 The positioning block 24 is a protrusion on the inner side of the first through hole 21 facing the edge of the second through hole 22, and the width of the protrusion is 0.225mm. Therefore, the effective width of the part with the protrusion on the L-shaped step surface 23 that carries the product becomes 0.5-0.225mm=0.275mm.

[0033] The utility model has no particular limitation on the number of positioning blocks 24. If the product is circular in shape, a plurality of positioning blocks can be evenly arranged inside the first through hole 21 as required.

[0034] In order to facilitate loading and unloading, the first through hole 21 is provided with a chamfer 25 along the edge. Figure 2 As shown, in some embodiments of the present invention, the chamfer 25 is a 45-degree chamfer, and the length of the right angle side of the chamfer is 1 mm. The chamfer 25 can also be designed to be other suitable angles, and the length of the right angle side of the chamfer can also be adjusted as needed, and the present invention does not limit this.

[0035] The electroplating fixture provided by the utility model includes a base plate and a plurality of electroplating tanks for accommodating products arranged at intervals on the base plate, each electroplating tank accommodating one product; the electroplating tank includes a first through hole and a second through hole arranged in sequence along the thickness direction of the base plate on the upper surface and the lower surface of the base plate; the axial center lines of the first through hole and the second through hole are the same; the thickness of the first through hole is greater than the thickness of the product, and the first through hole and the second through hole are interconnected; the shape and size of the first through hole and the second through hole are adapted to the product, and the size of the first through hole is greater than the second through hole; an L-shaped step surface is formed between the first through hole and the second through hole, and the product to be electroplated is placed into the electroplating tank from the first through hole with the surface facing downward, and is supported by the L-shaped step surface, so that it is not easy to fall off. The electroplating fixture provided by this solution does not have a sticky bottom film, so the protective film on the product will not be stuck away, and is suitable for products with and without protective films, and the through-hole structure of the electroplating tank can save base plate consumables, so this solution has strong applicability and economy. In addition, the size of the first through hole is larger than the product size, and the edge is chamfered to facilitate loading and unloading. A positioning block is set on the edge of the first through hole so that the electroplating area of ​​the product is aligned with the electroplating machine; the width of the L-shaped step surface is smaller than the width of the waste area at the edge of the product, ensuring the electroplating effect of the non-waste area of ​​the product.

[0036] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms of deformation without departing from the scope of protection of the utility model and the claims, which all fall within the protection of the utility model.

Claims

1. An electroplating fixture, characterized in that: The electroplating fixture comprises a bottom plate (10) and a plurality of electroplating tanks (20) arranged at intervals on the bottom plate (10); each of the electroplating tanks (20) is used to accommodate a product; The electroplating tank (20) comprises a first through hole (21) and a second through hole (22) which are sequentially arranged on the upper surface (11) and the lower surface (12) of the bottom plate along the thickness direction of the bottom plate (10); the axis center lines of the first through hole (21) and the second through hole (22) are the same; the thickness of the first through hole (21) is greater than the thickness of the product, and the sum of the thicknesses of the first through hole (21) and the second through hole (22) is equal to the thickness of the bottom plate (10); the shapes of the first through hole (21) and the second through hole (22) are adapted to the shape of the edge of the product, the size of the first through hole (21) is greater than the size of the product, and the size of the second through hole (22) is smaller than the size of the product; an L-shaped step surface (23) is formed between the first through hole (21) and the second through hole (22).

2. The electroplating fixture according to claim 1, characterized in that: The width of the L-shaped step surface (23) is smaller than the width of the waste area at the corresponding edge of the product.

3. The electroplating fixture according to claim 1, characterized in that: The thickness of the first through hole (21) is greater than the thickness of the second through hole (22).

4. The electroplating fixture according to claim 1, characterized in that: A positioning block (24) is provided at the edge of the first through hole (21).

5. The electroplating fixture according to claim 1, characterized in that: The first through hole (21) is provided with a chamfer (25) along the edge thereof.

6. The electroplating fixture according to claim 5, characterized in that: The chamfer (25) is a 45-degree chamfer.

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