Environment-friendly and damp-proof glue-free pure solid wood floor heating floor
By using PES hot melt film on solid wood floor heating floor for glue-free coating, the problem of poor VOC release and moisture-proof performance in glue-proof coating is solved, and higher environmental protection performance and moisture-proof effect are achieved, and the back film is improved. Adhesion firmness and silent performance.
Patent Information
- Application Number
- CN202420612165.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-03-27
AI Technical Summary
The adhesive coating of existing solid wood floor heating floors uses acrylic water-based pressure-sensitive adhesives to cause problems such as VOC release, odor, poor moisture resistance and poor weather resistance of the back film, which cannot meet the market's upgrade needs for environmental protection performance and moisture resistance.
PES hot melt film is used as the glue-free back film, and it is semi-melted and solidified on the back of the solid wood floor through hot pressing to form a solid coating, avoiding the use of glue.
It improves environmental protection performance, moisture-proof effect and firmness of the back membrane adhesion, reduces formaldehyde emission, enhances silent performance, and avoids odor problems and back membrane shedding.
Smart Images

Figure CN222276045U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a solid wood floor heating floor, in particular to an environmentally friendly, moisture-proof, glue-free pure solid wood floor heating floor. Background Art
[0002] Solid wood floor heating floors are usually covered with a backing film on the back for reasons such as moisture-proof, quiet, and beautiful. There are generally two types of backing films used on the market: PP film and PE film, which are adhered with glue (usually acrylic water-based pressure-sensitive adhesive). However, this method (hereinafter referred to as adhesive lamination) has the following problems: 1. Although the acrylic water-based pressure-sensitive adhesive used in adhesive lamination is more environmentally friendly than other glues, it still releases a certain amount of VOC, which poses a health hazard in floor heating (high temperature) environments; 2. Acrylic water-based pressure-sensitive adhesive has a slight odor. If the floor is paved over a large area, it may cause discomfort to people who are sensitive to odors; 3. With adhesive lamination, water vapor can easily enter the floor through the gaps in the glue, affecting moisture-proof performance; 4. Acrylic water-based pressure-sensitive adhesive has poor water resistance. If the floor is in a humid environment for a long time, the backing film is likely to fall off.
[0003] Therefore, the existing technology has the problems that the environmental protection performance does not meet the market consumption upgrade demand, the moisture-proof effect is poor, and the back film has poor weather resistance and is easy to fall off. Utility Model Content
[0004] The purpose of the utility model is to provide an environmentally friendly and moisture-proof glue-free pure solid wood floor heating floor. The utility model has the characteristics of being able to effectively improve environmental protection performance, enhance moisture-proof effect and enhance the adhesion firmness of the back film.
[0005] The technical solution of the utility model is: an environmentally friendly, moisture-proof glue-free pure solid wood floor heating floor, comprising a solid wood floor, a PES hot-melt film is arranged on the back of the solid wood floor; the thickness of the PES hot-melt film is 0.08-0.2mm.
[0006] In the aforementioned environmentally friendly, moisture-proof glue-free pure solid wood floor heating floor, the thickness of the PES hot-melt film is 0.1 mm.
[0007] In the aforementioned environmentally friendly and moisture-proof glue-free pure solid wood floor heating floor, the back side of the solid wood floor is a flat structure.
[0008] Compared with the prior art, the utility model applies PES hot-melt film as a backing film to solid wood floor heating floors, thereby realizing glue-free lamination. Compared with traditional PP film and PE film, it has the following advantages:
[0009] 1) Improved environmental performance. According to tests, the formaldehyde emission of PES hot-melt film laminated floor is 31% of that of PE film glue laminated floor.
[0010] 2) No glue is added during the PES hot melt film lamination process, and the PES film itself is odorless, so no odor is generated;
[0011] 3) Improved moisture resistance;
[0012] 4) The adhesion strength of the backing film is also enhanced, which can effectively prevent the backing film from falling off;
[0013] 5) Strictly limiting the thickness of the PES hot-melt film can also effectively improve the quietness performance.
[0014] In summary, the utility model has the characteristics of being able to effectively improve environmental protection performance, enhance moisture-proof effect and enhance the adhesion firmness of the back film. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of the utility model.
[0016] The markings in the attached drawings are: 1- solid wood floor, 2- PES hot melt film. DETAILED DESCRIPTION
[0017] The present invention is further described below in conjunction with the accompanying drawings and embodiments, but they are not intended to limit the present invention.
[0018] Embodiment. A glue-free pure solid wood floor heating floor that is both environmentally friendly and moisture-proof, comprising: Figure 1 As shown, it includes a solid wood floor 1, and a PES hot-melt film 2 is provided on the back of the solid wood floor 1; the thickness of the PES hot-melt film 2 is 0.08-0.2mm.
[0019] Preferably, the thickness of the PES hot-melt film 2 is 0.1 mm.
[0020] The back side of the solid wood floor 1 is a flat structure.
[0021] A glue-free laminating process for a pure solid wood floor heating floor that is both environmentally friendly and moisture-proof, comprising the following steps:
[0022] S1. Select a hot melt film with a release paper on the back;
[0023] S2, placing the hot melt film on the back of the floor, with the hot melt film side in contact with the floor, and the release paper side in contact with the hot press platen;
[0024] S3, controlling the temperature of the hot press plate to maintain at 125-135°C, and hot pressing the hot melt film for 20-30s, so that the hot melt film is in a semi-molten state;
[0025] Preferably, in step S3, the temperature of the hot press plate is 130°C and the hot pressing time is 25 seconds. Note: The melting point of PES hot melt film is 120°C, and the hot press temperature is set at 130°C to ensure that the hot melt film can melt. After 25 seconds of hot pressing, the hot melt film just enters a semi-molten state.
[0026] S4. Cool for 8-12 minutes (preferably 10 minutes) to allow the semi-molten hot melt film to cool and solidify and adhere to the back of the floor; and on the side in contact with the pressing plate, there is a layer of release paper to ensure that the hot melt film will not adhere to the hot pressing plate.
[0027] S5. Tear off the release paper and cut off the excess backing film to obtain the finished laminated solid wood floor heating floor.
[0028] After tearing off the release paper, use the automatic film cutting equipment to cut off the excess backing film.
[0029] Conduct the following experiment
[0030] 1) Environmental protection: The formaldehyde emission of the finished product coated with PES hot melt film is 31% of that of the finished product adhered with PE film glue.
[0031] Experiment: Take 15 pieces each of mangosteen, red oak, and oak (specifications: 900*150*18, moisture content: 12-13), of which 5 pieces are coated with PES hot melt film lamination process (specific process of Example 1), 5 pieces are coated with TPU hot melt film lamination process (specific process of Example 1), and 5 pieces are coated with PE adhesive. The formaldehyde emission is detected by the dryer method (GB / T 17657-2022 Test methods for physical and chemical properties of artificial boards and veneer artificial boards), and the following results are obtained.
[0032] Schedule 1
[0033]
[0034] Conclusion: The average formaldehyde emission of PES hot melt film coating is 0.010mg / L, the average formaldehyde emission of TPU hot melt film coating is 0.012mg / L, and the average formaldehyde emission of PE film adhesive adhesion is 0.032mg / L. The formaldehyde emission of PES hot melt film coating products is 31% of that of PE adhesive coating products.
[0035] 2. Moisture-proof performance is improved (moisture-proof performance PES hot melt film > TPU hot melt film coating > PE adhesive coating)
[0036] Take 15 pieces of red oak (specification: 900*150*22, moisture content: 10-11%, PES hot melt film coating 5 pieces (using the coating process of Example 1), TPU hot melt film coating (the coating process of Example 1, the difference lies in the film material) 5 pieces, PE film coating (the coating process of Example 1, the difference lies in the film material) 5 pieces), place them horizontally in a constant temperature and humidity environment (35°C, 70RH%) for 15 days, and compare the changes in the floor moisture expansion coefficient.
[0037] Schedule 2
[0038]
[0039] Moisture-proof performance: PES hot-melt film > TPU hot-melt film coating > PE adhesive coating.
[0040] 3. Enhanced back film firmness
[0041] Take 15 pieces of red oak (specification: 900*150*22, moisture content: 10-11, PES hot melt film coating (produced by the coating process of Example 1) 5 pieces, TPU hot melt film coating (produced by the coating process of Example 1, the difference is that the back film material is TPU hot melt film) 5 pieces, PE film coating (produced by the coating process of Example 1, the difference is that the back film material is PE film) 5 pieces), place them horizontally in a constant temperature and humidity environment (35°C, 70RH%) for 30 days, and compare the shedding of the back film.
[0042] Schedule 3
[0043]
[0044] Embodiment 2. Compared with Embodiment 1, the difference of this embodiment is that a group of evenly distributed concave holes are provided on the back of the solid wood floor, the depth of the concave holes is one fifth of the thickness of the PES hot melt film, and the diameter is 0.2-0.3 cm. When the PES hot melt film is melted, part of the material will be melted into the concave holes, and will be fixed inside the concave holes after cooling, thereby effectively improving the adhesion and preventing the back film from falling off.
Claims
1. An environmentally friendly, moisture-proof, glue-free pure solid wood floor heating floor, characterized by: The invention comprises a solid wood floor (1), wherein a PES hot-melt film (2) is provided on the back of the solid wood floor (1); the thickness of the PES hot-melt film (2) is 0.08-0.2 mm.
2. The environmentally friendly and moisture-proof glue-free pure solid wood floor heating floor according to claim 1, characterized in that: The thickness of the PES hot-melt film (2) is 0.1 mm.
3. The environmentally friendly and moisture-proof glue-free pure solid wood floor heating floor according to claim 1, characterized in that: The back side of the solid wood floor (1) is a flat structure.
