Temperature adjusting assembly and air conditioner

Abstract

The utility model provides a temperature adjusting assembly and an air conditioner, and the temperature adjusting assembly comprises a first semiconductor arranged on an air deflector of the air conditioner; the second semiconductor is arranged on a heating part of the air conditioner; the second semiconductor is electrically connected with the first semiconductor; the first electrode end of the power supply is electrically connected with the first semiconductor, and the second electrode end of the power supply is electrically connected with the second semiconductor; wherein the first semiconductor is an N-type semiconductor, the second semiconductor is a P-type semiconductor, the first electrode end is a negative electrode, and the second electrode end is a positive electrode; or the first semiconductor is a P-type semiconductor, the second semiconductor is an N-type semiconductor, the first pole end is a positive pole, and the second pole end is a negative pole. The air guide plate is prevented from condensation and the heating component is cooled under the condition that the refrigerating capacity is not sacrificed.

Description

Technical Field

[0001] The present application relates to the technical field of air conditioners, and in particular to a temperature control component and an air conditioner. Background Art

[0002] When the air conditioner is used for a long time to cool the room, condensation is easy to occur on the air guide plate, and the condensation drops fall, affecting the user experience. During the long-term cooling process of the air conditioner, the internal heat-generating components, such as the motor and the electric control box, heat up due to long-term operation, and therefore need to be cooled. In the prior art, preventing condensation on the air guide plate and cooling the heat-generating components are achieved by adjusting the throttling degree of the refrigerant throttle valve, which sacrifices the cooling capacity and reduces the cooling efficiency. Utility Model Content

[0003] The main purpose of the present application is to provide a temperature control assembly and an air conditioner, which are intended to prevent condensation on an air guide plate and cool down heat-generating components without sacrificing cooling capacity.

[0004] The present application embodiment provides a temperature control component, including:

[0005] a first semiconductor, wherein the first semiconductor is disposed on an air guide plate of the air conditioner;

[0006] A second semiconductor, the second semiconductor being disposed on a heat generating component of the air conditioner; the second semiconductor being electrically connected to the first semiconductor; and

[0007] A power supply, wherein a first terminal of the power supply is electrically connected to the first semiconductor, and a second terminal of the power supply is electrically connected to the second semiconductor;

[0008] The first semiconductor is an N-type semiconductor, the second semiconductor is a P-type semiconductor, the first extreme terminal is a negative pole, and the second extreme terminal is a positive pole; or the first semiconductor is a P-type semiconductor, the second semiconductor is an N-type semiconductor, the first extreme terminal is a positive pole, and the second extreme terminal is a negative pole.

[0009] Optionally, the power supply is a direct current power supply.

[0010] Optionally, the temperature control component also includes a first connecting wire, a second connecting wire and a third connecting wire, the first connecting wire connecting the first extreme terminal of the power supply and the first semiconductor, the second connecting wire connecting the first semiconductor and the second semiconductor, and the third connecting wire connecting the second semiconductor and the second extreme terminal of the power supply.

[0011] Optionally, at least two of the first connecting wire, the second connecting wire and the third connecting wire are made of different conductive materials.

[0012] Optionally, at least one of the first connection line, the second connection line and the third connection line is provided with a control switch;

[0013] When the control switch is turned on, the power source forms an electrical circuit with the first semiconductor and the second semiconductor.

[0014] In a second aspect, the present application further provides an air conditioner, comprising an air guide plate, a heating component and a temperature control assembly as described above;

[0015] The first semiconductor is disposed on the air guide plate, the second semiconductor is disposed on the heat generating component, and the power supply is disposed in the air conditioner.

[0016] Optionally, the air guide plate has a hollow cavity, and the first semiconductor is disposed in the hollow cavity.

[0017] Optionally, the air guide plate has a first axial hole and a second axial hole that are arranged opposite to each other;

[0018] A first connection line connecting the first semiconductor and the first terminal of the power source passes through the first axial hole, and a second connection line connecting the first semiconductor and the second semiconductor passes through the second axial hole.

[0019] Optionally, the heat-generating component includes at least one of a motor and an electric control box.

[0020] Optionally, the air conditioner further includes a control mainboard configured to control the power supply to form an electrical circuit with the first semiconductor and the second semiconductor.

[0021] In the technical solution of the embodiment of the present application, a first semiconductor is arranged in the air guide plate, and a second semiconductor is arranged on the heat generating component; during the cooling operation of the air conditioner, the air guide plate is the cold end, and the heat generating component is the hot end; at this time, the first semiconductor is located at the cold end, and the second semiconductor is located at the hot end, and at this time, there is a thermoelectric potential between the first semiconductor and the second semiconductor. An electrical circuit is formed between the first semiconductor, the second semiconductor, and the power supply; under the action of the thermoelectric potential, electron transfer and hole transfer are generated between the first semiconductor, the second semiconductor, and the power supply to achieve the temperature increase of the air guide plate and the temperature decrease of the heat generating component. The first semiconductor is an N-type semiconductor, and the second semiconductor is a P-type semiconductor. The first extreme is the negative pole, and the second extreme is the positive pole. Under the action of the thermoelectric potential, the P-type semiconductor absorbs heat, holes flow to the N-type semiconductor, the N-type semiconductor releases heat, and electrons flow to the P-type semiconductor, so that the air guide plate is heated up and the heat generating component is cooled down. The first semiconductor is a P-type semiconductor, the second semiconductor is an N-type semiconductor, the first extreme end is a positive pole, the second extreme end is a negative pole, the N-type semiconductor absorbs heat, electrons flow to the P-type semiconductor, the P-type semiconductor releases heat, and holes flow to the N-type semiconductor, so that the air guide plate is heated up and the heat-generating component is cooled down. In the technical solution of the present application, the heating of the air guide plate and the cooling of the heat-generating component do not involve adjusting the refrigerant, so there is no need to adjust the refrigerant throttling degree and there is no need to sacrifice the cooling capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of the structure of a temperature control component according to an embodiment of the present application;

[0024] Figure 2 Another structural schematic diagram of the temperature control component of the embodiment of the present application;

[0025] Figure 3 This is another structural schematic diagram of the temperature control component of the embodiment of the present application;

[0026] Figure 4 A schematic structural diagram of an air guide plate according to an embodiment of the present application.

[0027] Reference numerals list

[0028] 110 First Semiconductor 202 First axial end plate 120 The second semiconductor 203 First shaft hole 130 power supply 204 First line accommodation section 131 The first extreme 205 Air guide body 132 The second extreme L1 First connection line 200 Wind deflector L2 Second connection line 300 Heat generating components L3 The third connecting line 201 Hollow cavity DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0030] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0033] Combination Figure 1 , Figure 2 and Figure 3 As shown, the embodiment of the present application provides a temperature control component, including:

[0034] A first semiconductor 110, wherein the first semiconductor 110 is disposed on an air guide plate 200 of the air conditioner;

[0035] A second semiconductor 120, wherein the second semiconductor 120 is disposed on the heat generating component 300 of the air conditioner; the second semiconductor 120 is electrically connected to the first semiconductor 110; and

[0036] A power source 130, wherein a first terminal 131 of the power source 130 is electrically connected to the first semiconductor 110, and a second terminal 132 of the power source 130 is electrically connected to the second semiconductor 120;

[0037] Among them, the first semiconductor 110 is an N-type semiconductor, the second semiconductor 120 is a P-type semiconductor, the first pole 131 is a negative pole, and the second pole 132 is a positive pole; or the first semiconductor 110 is a P-type semiconductor, the second semiconductor 120 is an N-type semiconductor, the first pole 131 is a positive pole, and the second pole 132 is a negative pole.

[0038] In the technical solution of the embodiment of the present application, a first semiconductor 110 is arranged in the air guide plate 200, and a second semiconductor 120 is arranged on the heat generating component 300; during the cooling operation of the air conditioner, the air guide plate 200 is the cold end, and the heat generating component 300 is the hot end; at this time, the first semiconductor 110 is located at the cold end, and the second semiconductor 120 is located at the hot end, and at this time, there is a thermoelectric potential between the first semiconductor 110 and the second semiconductor 120. An electrical circuit is formed between the first semiconductor 110, the second semiconductor 120 and the power source 130; under the action of the thermoelectric potential, electron transfer and hole transfer are generated between the first semiconductor 110, the second semiconductor 120 and the power source 130, so as to achieve the temperature increase of the air guide plate 200 and the temperature decrease of the heat generating component 300. The first semiconductor 110 is an N-type semiconductor, the second semiconductor 120 is a P-type semiconductor, the first extreme terminal 131 is a negative electrode, and the second extreme terminal 132 is a positive electrode. Under the action of the thermoelectric potential, the P-type semiconductor absorbs heat, holes flow to the N-type semiconductor, the N-type semiconductor releases heat, and electrons flow to the P-type semiconductor, so that the air guide plate 200 is heated up and the heat-generating component 300 is cooled down. The first semiconductor 110 is a P-type semiconductor, the second semiconductor 120 is an N-type semiconductor, the first extreme terminal 131 is a positive electrode, and the second extreme terminal 132 is a negative electrode. The N-type semiconductor absorbs heat, electrons flow to the P-type semiconductor, the P-type semiconductor releases heat, and holes flow to the N-type semiconductor, so that the air guide plate 200 is heated up and the heat-generating component 300 is cooled down. In the technical solution of the present application, the heating of the air guide plate 200 and the cooling of the heat-generating component 300 do not involve the adjustment of the refrigerant throttling degree, and there is no need to sacrifice the cooling capacity.

[0039] As an optional mode of the above embodiment, the power supply 130 is a direct current power supply 130. The direct current power supply 130 specifies the current flow direction of the electric circuit formed by the first semiconductor 110, the second semiconductor 120 and the power supply 130, so that the current between the first semiconductor 110 and the second semiconductor 120 is unique after having a temperature difference electromotive force, so that the air guide plate 200 can be heated up reliably and the heat generating component 300 can be cooled down reliably.

[0040] As an optional implementation of the above embodiment, Figure 1 As shown, the temperature adjustment component further includes a first connection line L1, a second connection line L2 and a third connection line L3, the first connection line L1 connects the first extreme point 131 of the power source 130 and the first semiconductor 110, the second connection line L2 connects the first semiconductor 110 and the second semiconductor 120, and the third connection line L3 connects the second semiconductor 120 and the second extreme point 132 of the power source 130. In the technical solution of the embodiment, the first semiconductor 110, the second semiconductor 120 and the power source 130 are connected by connection lines to form an electrical circuit.

[0041] As an optional implementation of the above embodiment, the conductive materials of at least two of the first connection line L1, the second connection line L2 and the third connection line L3 are different. In the embodiment, by setting the conductive materials of at least two of the first connection line L1, the second connection line L2 and the third connection line L3 to be different, it is convenient to form a better thermoelectric potential, and the migration ability of electrons and holes can be improved. Generally, the conductive material of the second connection line L2 is different from the conductive material of the first connection line L1 and the third connection line L3, for example, the second connection line L2 is copper, and the first connection line L1 and the third connection line L3 are aluminum; for another example, the conductive materials of the second connection line L2, the first connection line L1 and the third connection line L3 are all different, for example, the second connection line L2 is copper, the first connection line L1 is aluminum, and the third connection line L3 is silver.

[0042] As an optional implementation of the above embodiment, at least one of the first connection line L1, the second connection line L2 and the third connection line L3 is provided with a control switch; when the control switch is turned on, the power supply 130 forms an electrical circuit with the first semiconductor 110 and the second semiconductor 120. In the embodiment, when the control switch is turned on, electrons and holes can migrate on the first connection line L1, the second connection line L2 and the third connection line L3 to form a current, at which time the air guide plate 200 is heated and the heat-generating component 300 is cooled. In the embodiment, the control switch can be an electromagnetic switch.

[0043] The embodiment of the present application also provides an air conditioner, including an air guide plate 200, a heating component 300 and a temperature control component. The temperature control component. The specific structure of the temperature control component refers to the above embodiment. Since the temperature control component adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0044] The air guide plate 200 is a component in the air conditioner for adjusting the air outlet angle, and it is rotatably installed at the air outlet of the air conditioner. The air guide plate 200 will gradually cool down during the cooling process of the air conditioner. The heat generating component 300 can be an electric control box of the air conditioner, or it can be a motor. The components of the air conditioner are installed inside the electric control box, and the components are used to control the air conditioner to adjust the operating parameters; the motor can be a motor for driving the air guide plate 200 to rotate, or it can be a motor for driving the impeller in the air conditioner to rotate. When the components and the motor are working, a lot of heat will be generated. The first semiconductor 110 is provided on the air guide plate 200, the second semiconductor 120 is provided on the heat generating component 300, and the power supply 130 is provided in the air conditioner.

[0045] In the technical solution of the embodiment of the present application, a first semiconductor 110 is arranged in the air guide plate 200, and a second semiconductor 120 is arranged on the heat generating component 300; during the cooling operation of the air conditioner, the air guide plate 200 is the cold end, and the heat generating component 300 is the hot end; at this time, the first semiconductor 110 is located at the cold end, and the second semiconductor 120 is located at the hot end, and at this time, there is a thermoelectric potential between the first semiconductor 110 and the second semiconductor 120. An electrical circuit is formed between the first semiconductor 110, the second semiconductor 120 and the power source 130; under the action of the thermoelectric potential, electron transfer and hole transfer are generated between the first semiconductor 110, the second semiconductor 120 and the power source 130, so as to achieve the temperature increase of the air guide plate 200 and the temperature decrease of the heat generating component 300. The first semiconductor 110 is an N-type semiconductor, the second semiconductor 120 is a P-type semiconductor, the first terminal 131 is a negative electrode, and the second terminal 132 is a positive electrode. Under the action of the thermoelectric potential, the P-type semiconductor absorbs heat, holes flow to the N-type semiconductor, the N-type semiconductor releases heat, and electrons flow to the P-type semiconductor, so that the air guide plate 200 is heated up and the heat-generating component 300 is cooled down. The first semiconductor 110 is a P-type semiconductor, the second semiconductor 120 is an N-type semiconductor, the first terminal 131 is a positive electrode, and the second terminal 132 is a negative electrode. The N-type semiconductor absorbs heat, electrons flow to the P-type semiconductor, the P-type semiconductor releases heat, and holes flow to the N-type semiconductor, so that the air guide plate 200 is heated up and the heat-generating component 300 is cooled down.

[0046] In some embodiments, the power supply 130 may be built into a non-duct cavity of the air conditioner, or may be built into an electric control box.

[0047] As an optional implementation of the above embodiment, Figure 4 As shown, the wind guide plate 200 has a hollow cavity 201, and the first semiconductor 110 is arranged in the hollow cavity 201. In the embodiment, the wind guide plate 200 has an axial direction, and the hollow cavity 201 is formed by extending along the axial direction, so that the first semiconductor 110 can heat all areas of the wind guide plate 200. In the embodiment, the wind guide plate 200 includes a first axial end plate 202, a second axial end plate, and a wind guide body 205 connecting the first axial end plate 202 and the second axial end plate; the wind guide body 205 is placed at the air outlet. The wind guide body 205 is a hollow cavity 201 structure, and the first semiconductor 110 is embedded in the hollow cavity 201.

[0048] In some embodiments, the second semiconductor 120 may be disposed on the surface of the heating element or inside the housing of the heating element.

[0049] As an optional implementation of the above embodiment, the air guide plate 200 has a first axial hole 203 and a second axial hole arranged opposite to each other (see Figure 4 The first connecting wire L1 connecting the first semiconductor 110 and the first terminal 131 of the power source 130 passes through the first axial hole 203, and the second connecting wire L2 connecting the first semiconductor 110 and the second semiconductor 120 passes through the second axial hole. By passing the first connecting wire L1 and the second connecting wire L2 through the first axial hole 203 and the second axial hole respectively, when the air guide plate 200 rotates, the first connecting wire L1 and the second connecting wire L2 do not have a large rotation angle, thereby reducing the failure rate of the first connecting wire L1 and the second connecting wire L2 and improving reliability.

[0050] In the embodiment, the first axial hole 203 and the second axial hole are used to install the first rotating shaft and the second rotating shaft respectively; the first rotating shaft and the second rotating shaft are respectively connected to the shell at the air outlet of the air conditioner. One of the first rotating shaft and the second rotating shaft is connected to the motor. In the embodiment, the first axial hole 203 is provided on the first axial end plate 202, and the second axial hole is provided on the second axial end plate. The first axial end plate 202 and the second axial end plate are respectively provided with a first wire accommodating portion 204 (groove-shaped or hole-shaped) and a second wire accommodating portion (groove-shaped or hole-shaped); the first wire accommodating portion 204 (groove-shaped or hole-shaped) connects the hollow cavity 201 and the first axial hole 203, and the second wire accommodating portion (groove-shaped or hole-shaped) connects the hollow cavity 201 and the second axial hole, which is convenient for the routing of the first connecting line L1 and the second connecting line L2.

[0051] As an optional implementation of the above embodiment, the air conditioner further includes a control mainboard, and the control mainboard is configured to control the power supply 130 to form an electrical circuit with the first semiconductor 110 and the second semiconductor 120. In an embodiment, the control mainboard is built into the electric control box. The control mainboard is configured to close or open the control switch. In some embodiments, a temperature sensor is provided at or near the air guide plate 200, and the temperature sensor transmits a temperature signal to the control switch; the control switch outputs an execution signal to the control switch according to the temperature signal to control the control switch to be closed or closed. In some embodiments, a temperature sensor is provided at or near the motor or the electric control box, and the temperature sensor transmits a temperature signal to the control switch; the control switch outputs an execution signal to the control switch according to the temperature signal to control the control switch to be closed or closed.

[0052] The above description is only an optional embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the application concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A temperature control component, characterized in that: include: a first semiconductor, wherein the first semiconductor is disposed on an air guide plate of the air conditioner; a second semiconductor, the second semiconductor being disposed on a heat generating component of the air conditioner; The second semiconductor is electrically connected to the first semiconductor; and A power supply, wherein a first terminal of the power supply is electrically connected to the first semiconductor, and a second terminal of the power supply is electrically connected to the second semiconductor; The first semiconductor is an N-type semiconductor, the second semiconductor is a P-type semiconductor, the first extreme terminal is a negative pole, and the second extreme terminal is a positive pole; or the first semiconductor is a P-type semiconductor, the second semiconductor is an N-type semiconductor, the first extreme terminal is a positive pole, and the second extreme terminal is a negative pole.

2. The temperature control assembly according to claim 1, characterized in that: The power supply is a direct current power supply.

3. The temperature control assembly according to claim 1, characterized in that: The temperature control component also includes a first connecting wire, a second connecting wire and a third connecting wire, the first connecting wire connects the first terminal of the power supply and the first semiconductor, the second connecting wire connects the first semiconductor and the second semiconductor, and the third connecting wire connects the second semiconductor and the second terminal of the power supply.

4. The temperature control assembly according to claim 3, characterized in that: At least two of the first connecting line, the second connecting line and the third connecting line have different conductive materials.

5. The temperature control assembly according to claim 3, characterized in that: At least one of the first connection line, the second connection line and the third connection line is provided with a control switch; When the control switch is turned on, the power source forms an electrical circuit with the first semiconductor and the second semiconductor.

6. An air conditioner, characterized in that: It comprises an air guide plate, a heat-generating component and a temperature regulating assembly as claimed in any one of claims 1 to 5; The first semiconductor is disposed on the air guide plate, the second semiconductor is disposed on the heat generating component, and the power supply is disposed in the air conditioner.

7. The air conditioner according to claim 6, characterized in that: The air guide plate has a hollow cavity, and the first semiconductor is arranged in the hollow cavity.

8. The air conditioner according to claim 7, characterized in that: The wind deflector has a first axial hole and a second axial hole which are arranged opposite to each other; A first connection line connecting the first semiconductor and the first terminal of the power source passes through the first axial hole, and a second connection line connecting the first semiconductor and the second semiconductor passes through the second axial hole.

9. The air conditioner according to claim 6, characterized in that: The heat generating component includes at least one of a motor and an electric control box.

10. The air conditioner according to claim 6, characterized in that: The air conditioner further includes a control mainboard configured to control the power source to form an electrical circuit with the first semiconductor and the second semiconductor.

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