Heat dissipation structure and notebook computer
By designing the heat dissipation module and the heat dissipation plate assembly, and using the combined structure of the retaining wall and fan, the high power consumption and electromagnetic wave leakage of the DDR memory are solved, and efficient heat dissipation and noise shielding are achieved, reducing costs.
Patent Information
- Application Number
- CN202420289304.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-06
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-02-06
AI Technical Summary
The high power consumption of DDR memory leads to heat dissipation problems, and the electromagnetic waves generated during operation affect the wireless wide area network, and the existing solutions are costly and affect the heat dissipation effect.
A heat dissipation structure is designed, including a heat dissipation module and a heat dissipation plate assembly. The storage elements are semi-covered through the retaining wall, combined with a fan and a heat pipe to achieve heat conduction and electromagnetic wave shielding, and the use of metal materials and heat pipes to improve heat dissipation efficiency.
Effectively reduce the temperature of storage components and electronic equipment housing, while shielding wireless wide area network noise, improving heat dissipation efficiency and reducing costs.
Smart Images
Figure CN222281175U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a heat dissipation structure and a notebook computer. Background Art
[0002] Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM) is commonly referred to as DDR. With the development of technology, the performance of DDR is getting higher and higher, and at the same time, the power consumption of DDR is also getting higher and higher. Usually, the power consumption of DDR has reached 6W to 10W on the common PC side. Therefore, DDR is a large source of heat in the PC. However, the development of radiator matching has not kept up with the technical development of DDR, and there is no heat dissipation structure specifically for DDR. On the other hand, when DDR is working, a certain amount of electromagnetic wave leakage will be generated within the working frequency range of the wireless wide area network, and these electromagnetic waves will affect the operation of the wireless wide area network.
[0003] The existing solution to the problem of DDR overheating is generally to use a thick thermally conductive substrate to conduct the heat of the DDR to the back cover of the laptop to dissipate the heat of the DDR. The DDR is usually far away from the back cover of the laptop and needs to be attached with a very thick thermal conductive pad. However, the thermal conductive pad is a relatively expensive thermal conductive material, so this method is costly. As for the situation where electromagnetic waves affect the wireless wide area network when the DDR is working, the above problem is usually solved by attaching absorbing materials or other shielding structures. However, absorbing materials not only affect heat dissipation, but also have very high costs. Utility Model Content
[0004] The present disclosure provides a heat dissipation structure and a notebook computer to at least solve the above technical problems existing in the prior art.
[0005] According to a first aspect of the present disclosure, there is provided a heat dissipation structure, comprising:
[0006] A heat dissipation module, including a fan; and
[0007] A heat sink assembly, comprising a plurality of heat sinks, wherein the heat sinks are connected to a plurality of retaining walls, wherein the retaining walls enclose a receiving space, and the receiving space is used to semi-enclose the storage element;
[0008] The storage element is in contact with the heat sink to transfer the heat of the storage element to the heat sink. The storage element is located between the heat sink and the mainboard. The heat sink assembly is connected to the heat dissipation module.
[0009] In one possible implementation manner, the retaining wall and the heat dissipation plate meet a vertical condition.
[0010] In one possible implementation manner, there is a gap between an end of the blocking wall away from the heat dissipation plate and the main board.
[0011] In one possible implementation, the gap is 0.5 mm.
[0012] In one possible implementation manner, the heat sink is made of metal.
[0013] In one possible implementation manner, the heat dissipation module includes a connection block, and the plurality of heat dissipation plates are connected to the connection block.
[0014] In one possible implementation, the heat dissipation module further includes a heat pipe, one end of the heat pipe is connected to a side of the connection block away from the mainboard, and the other end of the heat pipe is connected to the fan.
[0015] In one possible implementation manner, the accommodating space has an opening, and the connecting block is connected to one end of the plurality of heat dissipating plates close to the opening.
[0016] In one possible implementation manner, the connection block is fixed to the housing via the fixing member.
[0017] According to a second aspect of the present disclosure, a laptop computer is provided, comprising a housing assembly, wherein a heat dissipation structure as described in any one of the above-mentioned embodiments is disposed in the housing assembly, and the heat dissipation structure is connected to the housing assembly.
[0018] In the present disclosure, since the heat dissipation structure includes a heat dissipation plate assembly, the retaining wall connected to the heat dissipation plate can semi-enclose the storage element therein, and since the heat dissipation plate assembly is connected to the heat dissipation module, it can not only dissipate heat for the storage element, but also achieve the noise shielding effect of the storage element on the operating frequency of the wireless wide area network, and on the one hand, it can effectively reduce the temperature of the storage element body, and on the other hand, it can effectively reduce the temperature of the surface of the electronic device casing.
[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:
[0021] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0022] Figure 1 The overall structure schematic diagram of a heat dissipation structure of an exemplary embodiment of the present disclosure is shown;
[0023] Figure 2 The overall structure diagram of the heat dissipation structure of an exemplary embodiment of the present disclosure is shown (with Figure 1 relative to the directions shown);
[0024] Figure 3 A schematic diagram showing the overall structure of a heat dissipation plate assembly of a heat dissipation structure of an exemplary embodiment of the present disclosure is shown;
[0025] Figure 4 A partial installation diagram of a heat dissipation structure according to an exemplary embodiment of the present disclosure is shown.
[0026] Explanation of the numbers in the figure: 1. fan; 2. heat sink assembly; 3. storage element; 4. main board; 5. connection block; 6. heat pipe; 7. fixing part; 21. heat sink; 22. retaining wall; 23. accommodation space; 231. opening. DETAILED DESCRIPTION
[0027] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0028] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0029] Reference Figure 1 and Figure 4 As shown, a heat dissipation structure of an exemplary embodiment of the present disclosure includes a heat dissipation module and a heat dissipation plate assembly 2, the heat dissipation module includes a fan 1, the heat dissipation plate assembly 2 includes a plurality of heat dissipation plates 21, the heat dissipation plates 21 are connected to a plurality of baffles 22, the baffles 22 enclose a receiving space 23, and the receiving space 23 is used to semi-enclose a storage element 3. The storage element 3 is in contact with the heat dissipation plate 21, and is used to conduct the heat of the storage element 3 to the heat dissipation plate 21, the storage element 3 is located between the heat dissipation plate 21 and the mainboard 4, and the heat dissipation plate assembly 2 is connected to the heat dissipation module.
[0030] In this embodiment, the retaining wall 22 and the heat sink 21 can be an integrally formed structure, and the retaining wall 22 is formed by bending the edge of the heat sink 21 toward the side where the motherboard 4 is located. The plurality of retaining walls 22 surround the storage element 3 to a certain extent, forming a shielding effect surrounding the storage element 3, wherein the storage element 3 is usually a DDR. Since the heat dissipation structure includes the heat sink assembly 2, the retaining wall 22 connected to the heat sink 21 can half-cover the storage element 3 therein, and since the heat sink assembly 2 is connected to the heat dissipation module, it can not only dissipate heat for the storage element 3, but also achieve the noise shielding effect of the storage element 3 on the operating frequency of the wireless wide area network, and on the one hand, it can effectively reduce the temperature of the storage element 3 body, and on the other hand, it can effectively reduce the temperature of the surface of the electronic device housing.
[0031] Reference Figure 3 As shown, in one possible implementation manner, the retaining wall 22 and the heat dissipation plate 21 meet the vertical condition.
[0032] In this embodiment, the retaining wall 22 and the heat sink 21 are arranged to meet the vertical condition so that the storage element 3 can be closely attached to the heat sink 21 and the retaining wall 22, thereby achieving a better shielding effect.
[0033] In one embodiment, there is a gap between the end of the blocking wall 22 away from the heat dissipation plate 21 and the main board 4 .
[0034] Specifically, in one embodiment, the gap is 0.5 mm.
[0035] In this embodiment, it is calculated through simulation experiments that when the heat sink 21 is bent toward the main board 4 to form a retaining wall 22, and the retaining wall 22 is 0.5 mm away from the surface of the main board 4 after bending (it can be understood that the 0.5 mm here is not an absolute 0.5 mm, and there can be a small deviation within the tolerance range), the heat sink assembly 2 has a good shielding effect for frequencies between 600 MHz and 800 MHz, and can effectively reduce noise by about 4 dB, wherein 600 MHz to 800 MHz is the operating frequency of the wireless wide area network.
[0036] In one embodiment, the heat dissipation plate 21 is made of metal.
[0037] In this embodiment, commonly used metal materials have a video shielding effect, and the heat sink 21 can be specifically made of, but not limited to, aluminum alloy, copper alloy or stainless steel.
[0038] In one possible implementation manner, the heat dissipation module includes a connection block 5 , and a plurality of heat dissipation plates 21 are connected to the connection block 5 .
[0039] In this embodiment, the connection block 5 is in contact with the central processing unit, and can simultaneously conduct heat from the central processing unit and the storage element 3 through the heat dissipation module.
[0040] Reference Figure 2 As shown, in one embodiment, the heat dissipation module further includes a heat pipe 6 , one end of the heat pipe 6 is connected to a side of the connection block 5 away from the mainboard 4 , and the other end of the heat pipe 6 is connected to the fan 1 .
[0041] In this embodiment, the heat pipe 6 is a heat transfer element, which fully utilizes the heat conduction principle and the rapid heat transfer property of the phase change medium. The heat of the heating object is quickly transferred to the outside of the heat source through the heat pipe 6, and its thermal conductivity exceeds that of any known metal.
[0042] In one possible implementation manner, the accommodating space 23 has an opening 231 , and the connecting block 5 is connected to ends of the plurality of heat dissipating plates 21 close to the opening 231 .
[0043] In one possible implementation manner, the heat dissipation structure further includes a fixing member 7 , and the connecting block 5 is fixed to the housing via the fixing member 7 .
[0044] The present disclosure further provides a laptop computer (not shown in the figure), including a housing assembly, in which a heat dissipation structure as in any one of the above-mentioned embodiments is arranged, and the heat dissipation structure is connected to the housing assembly.
[0045] In this embodiment, the heat of the storage element 3 is first conducted to the heat sink 21, and then the heat on the heat sink 21 is transferred to the connecting block 5, and finally the heat on the connecting block 5 is transferred to the fan 1 through the heat pipe 6, and finally dissipated into the air through the housing assembly.
[0046] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.
[0047] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.
[0048] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.
[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.
[0050] The present disclosure has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present disclosure to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present disclosure is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the attached claims and their equivalents.
Claims
1. A heat dissipation structure, characterized in that: include: A heat dissipation module, comprising a fan (1); as well as A heat sink assembly (2) comprising a plurality of heat sinks (21), wherein the heat sinks (21) are connected to a plurality of retaining walls (22), wherein the retaining walls (22) enclose a receiving space (23), and wherein the receiving space (23) is used to semi-enclose a storage element (3); The storage element (3) is in contact with the heat sink (21) for transferring the heat of the storage element (3) to the heat sink (21); the storage element (3) is located between the heat sink (21) and the mainboard (4); and the heat sink assembly (2) is connected to the heat dissipation module.
2. The heat dissipation structure according to claim 1, characterized in that: The retaining wall (22) and the heat dissipation plate (21) meet the vertical condition.
3. The heat dissipation structure according to claim 1, characterized in that: There is a gap between one end of the retaining wall (22) away from the heat dissipation plate (21) and the main board (4).
4. The heat dissipation structure according to claim 3, characterized in that: The gap is 0.5 mm.
5. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation plate (21) is made of metal material.
6. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation module comprises a connection block (5), and a plurality of heat dissipation plates (21) are connected to the connection block (5).
7. The heat dissipation structure according to claim 6, characterized in that: The heat dissipation module further comprises a heat pipe (6), one end of the heat pipe (6) being connected to a side of the connection block (5) away from the mainboard (4), and the other end of the heat pipe (6) being connected to the fan (1).
8. The heat dissipation structure according to claim 6, characterized in that: The accommodating space (23) has an opening portion (231), and the connecting block (5) is connected to one end of the plurality of heat dissipating plates (21) close to the opening portion (231).
9. The heat dissipation structure according to claim 6, characterized in that: It also comprises a fixing member (7), and the connecting block (5) is fixed to the shell via the fixing member (7).
10. A notebook computer, comprising a housing assembly, characterized in that: A heat dissipation structure as described in any one of claims 1 to 9 is arranged in the shell assembly, and the heat dissipation structure is connected to the shell assembly.