Heat dissipation module and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a heat dissipation module and electronic equipment. The heat dissipation module provided by the utility model comprises a heat dissipation substrate and a heat conduction assembly, the heat dissipation substrate is provided with a first avoiding hole, and the first avoiding hole forms an installation position of a first heating device. The heat conduction assembly comprises a first heat conduction piece and a cantilever assembly. Wherein the first heat conduction piece is arranged corresponding to the installation position, one end of the cantilever assembly is connected with the first heat conduction piece, and the other end of the cantilever assembly is connected with the heat dissipation substrate, so that the first heat conduction piece can abut against a first heating device arranged in the first receding hole. In the heat dissipation module provided by the invention, the first heat conduction piece is relatively independently fixed on the heat dissipation substrate and is not influenced by other heating devices, so that the first heat conduction piece can be in full contact with the first heating device, and the heat dissipation capability of the first heating device can be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a heat dissipation module and electronic equipment. Background Art

[0002] As the overall performance of computer technology improves, the operating frequency of each component is getting higher and higher, and the power consumption is increasing accordingly. In addition, with the rapid development of electronic technology, the size of electronic equipment is constantly decreasing, which makes the heat growth per unit volume more and more. However, the reliability of electronic components decreases with the increase of temperature. Therefore, how to achieve efficient cooling has become an urgent problem that needs to be solved.

[0003] In order to reduce the operating temperature of electronic components and maintain effective operation, it is usually necessary to design various heat dissipation modules. The traditional heat dissipation module is fixed by bolts passing through the heat conduction plate and locking it to the circuit board. Due to the different heights of various electronic components on the circuit board, the heat conduction plate and the main heat dissipation electronic component surface often cannot fit tightly, thereby reducing the heat dissipation efficiency of the heat dissipation device. Summary of the invention

[0004] The present disclosure provides a heat dissipation module and an electronic device to at least solve the above technical problems existing in the prior art.

[0005] A first aspect of the present disclosure provides a heat dissipation module, comprising: a heat dissipation substrate and a heat conduction component;

[0006] The heat dissipation substrate is provided with a first avoidance hole, and the first avoidance hole forms a mounting position of the first heating element;

[0007] The heat-conducting assembly comprises a first heat-conducting member and a cantilever assembly;

[0008] Among them, the first heat conductive member is arranged corresponding to the installation position, one end of the cantilever assembly is connected to the first heat conductive member, and the other end is connected to the heat dissipation substrate, so that the first heat conductive member can abut against the first heating device arranged in the first avoidance hole.

[0009] Further, the cantilever comprises a first cantilever and a second cantilever, wherein one end of the first cantilever is connected to the first heat conducting member and the other end is connected to the heat dissipation substrate, and one end of the second cantilever is connected to the first heat conducting member and the other end is connected to the heat dissipation substrate;

[0010] The heat dissipation substrate includes a mounting surface, the mounting surface is provided with a first groove and a second groove, the first groove and the second groove both extend to the first avoidance hole, at least part of the first cantilever is arranged in the first groove, and at least part of the second cantilever is arranged in the second groove.

[0011] Furthermore, the heat dissipation substrate is provided with a third groove, the third groove extends to the first avoidance hole, the first heat conducting member is provided with a first mounting boss, and the first mounting boss is arranged in the third groove;

[0012] And / or, the heat-conducting component includes a second heat-conducting member, and the second heat-conducting member is arranged to be connected to the first heat-conducting member.

[0013] Further, the first heat-conducting member includes a first connecting portion and a second connecting portion, and the first connecting portion and the second connecting portion are symmetrical about a central axis of the first heat-conducting member;

[0014] The first cantilever is connected to the first connection portion, and the second cantilever is connected to the second connection portion.

[0015] Furthermore, the first heat conducting member includes a third connecting portion and a fourth connecting portion, and the third connecting portion and the fourth connecting portion are symmetrical about the central axis of the first heat conducting member.

[0016] The cantilever assembly includes a third cantilever and a fourth cantilever, the third cantilever is connected to the third connecting portion, and the fourth cantilever is connected to the fourth connecting portion.

[0017] Furthermore, the first cantilever, the second cantilever, the third cantilever and the fourth cantilever are all elastic arms.

[0018] Furthermore, the heat dissipation substrate is provided with a second avoidance hole for accommodating a second heat generating device;

[0019] There are two heat-conducting components, and the two first heat-conducting components are respectively arranged corresponding to the first avoidance hole and the second avoidance hole, so that one of the first heat-conducting components can abut against the first heating device arranged in the first avoidance hole, and the other first heat-conducting component can abut against the second heating device arranged in the second avoidance hole.

[0020] Furthermore, the heat dissipation substrate is fixed to a circuit board, the circuit board is provided with the first heating device, and the first heating device is arranged in the first avoidance hole;

[0021] There is a gap between the first heating device and the first avoidance hole.

[0022] Furthermore, the circuit board is provided with a second heating device, and the second heating device is arranged in the second avoidance hole;

[0023] Furthermore, the circuit board is provided with a third heating device, the surface of the heat dissipation substrate facing the circuit board is opened in an avoidance groove, the third heating device is arranged in the avoidance groove, the second heating device is abutted against the heat dissipation substrate, or the second heating device and the heat dissipation are basically connected by thermal conductive adhesive.

[0024] A second aspect of the present disclosure provides an electronic device, comprising the heat dissipation module described in the first aspect.

[0025] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0026] The heat dissipation module provided by the embodiment of the present disclosure includes a heat dissipation substrate and a heat-conducting component; the heat dissipation substrate is provided with a first avoidance hole, and the first avoidance hole forms a mounting position for a first heating device; the heat-conducting component includes a first heat-conducting member and a cantilever component; wherein the first heat-conducting member is arranged corresponding to the mounting position, one end of the cantilever component is connected to the first heat-conducting member, and the other end is connected to the heat dissipation substrate, so that the first heat-conducting member can abut against the first heating device arranged in the first avoidance hole. When in use, by fixing the heat dissipation substrate to the circuit board, when fixing, the cantilever component moves toward the direction close to the circuit board, and the cantilever component drives the first heat-conducting member, so that the first heat-conducting member acts on the first heating device as a pressure component of the first heating device. The first heat-conducting member is relatively independently fixed to the heat dissipation substrate, and is not affected by other heating devices, so that the first heat-conducting member is in full contact with the first heating device, which can improve the heat dissipation capacity of the first heating device.

[0027] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0029] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0030] Figure 1 The structure of the heat dissipation module provided by the embodiment of the present disclosure is shown in FIG. Figure 1 ;

[0031] Figure 2 The structure of the heat dissipation module provided by the embodiment of the present disclosure is shown in FIG. Figure 2 ;

[0032] Figure 3The structure of the heat dissipation substrate in the heat dissipation module provided by the embodiment of the present disclosure is shown. Figure 1 ;

[0033] Figure 4 The structure of the heat dissipation substrate in the heat dissipation module provided by the embodiment of the present disclosure is shown. Figure 2 .

[0034] Explanation of the numbers in the figure: 1. heat dissipation substrate; 11. first avoidance hole; 12. second avoidance hole; 13. mounting surface; 14. first groove; 15. second groove; 16. third groove; 17. avoidance groove; 21. first cantilever; 22. second cantilever; 3. first heat conducting member; 31. first connecting portion; 32. second connecting portion; 33. third connecting portion; 34. fourth connecting portion; 4. second heat conducting member; 51. first heating device; 52. third heating device; 6. fan; 7. circuit board. DETAILED DESCRIPTION

[0035] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0036] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation module provided by the embodiment of the present disclosure includes a heat dissipation substrate 1 and a heat conduction component; the heat dissipation substrate 1 is provided with a first avoidance hole 11, and the first avoidance hole 11 forms the installation position of the first heating device 51; the heat conduction component includes a first heat conduction member 3 and a cantilever component; wherein the first heat conduction member 3 is arranged corresponding to the installation position, one end of the cantilever component is connected to the first heat conduction member 3, and the other end is connected to the heat dissipation substrate 1, so that the first heat conduction member 3 can abut against the first heating device 51 arranged in the first avoidance hole 11. When in use, by fixing the heat dissipation substrate 1 to the circuit board 7, when installing, the cantilever component moves toward the direction close to the circuit board 7, and the cantilever component drives the first heat conduction member 3, so that the first heat conduction member 3 acts on the first heating device 51 as a pressure component of the first heating device 51. The first heat conduction member 3 is relatively independently fixed to the heat dissipation substrate 1, and is not affected by other heating devices, so that the first heat conduction member 3 is fully in contact with the first heating device 51, which can improve the heat dissipation capacity of the first heating device 51.

[0037] In this embodiment, the cantilever assembly can fix the first heat conductor 3 at the position of the first avoidance hole 11, and the cantilever assembly provides a clamping force. When a first heating device 51 is provided in the first avoidance hole 11, the clamping force provided by the cantilever assembly causes the first heat conductor 3 to abut against the first heating device 51.

[0038] Optionally, the cantilever assembly includes a first cantilever 21 and a second cantilever 22, one end of the first cantilever 21 is connected to the first heat conductor 3, and the other end is connected to the heat dissipation substrate 1, and one end of the second cantilever 22 is connected to the first heat conductor 3, and the other end is connected to the heat dissipation substrate 1, so that the first heat conductor 3 can abut against the first heating device 51 arranged in the first avoidance hole 11. When in use, by fixing the heat dissipation substrate 1 to the circuit board 7, the first cantilever 21 and the second cantilever 22 move toward the direction close to the circuit board 7, and the first cantilever 21 and the second cantilever 22 drive the first heat conductor 3, so that the first heat conductor 3 acts on the first heating device 51 as a pressure component of the first heating device 51. The first heat conductor 3 is relatively independently fixed to the heat dissipation substrate 1, and is not affected by other heating devices, so that the first heat conductor 3 is fully in contact with the first heating device 51, which can improve the heat dissipation capacity of the first heating device 51.

[0039] The first cantilever 21 and the second cantilever 22 can fix the first heat conductor 3 at the position of the first avoidance hole 11. The first cantilever 21 and the second cantilever 22 can provide a clamping force. When the first heating device 51 is provided in the first avoidance hole 11, the clamping force provided by the first cantilever 21 and the second cantilever 22 causes the first heat conductor 3 to abut against the first heating device 51.

[0040] Optionally, the first cantilever 21 and the second cantilever 22 may be spring sheets, that is, the first cantilever 21 and the second cantilever 22 have elastic force, and the first heat conductor 3 and the first heating device 51 may be brought into contact with each other through the elastic force of the first cantilever 21 and the second cantilever 22 .

[0041] Optionally, the first heating device 51 may be a CPU, a chip, a graphics card, etc.

[0042] The heat dissipation substrate 1 can be a die-casting, which can not only dissipate heat, but also protect the circuit board 7. The first heat-conducting member 3 can be a metal plate with high thermal conductivity such as copper and aluminum, or a graphite plate, a heat channel, a heat sink, etc. Preferably, the first heat-conducting member 3 is a copper block, which can transfer heat from the first heating element 51 to the copper block by virtue of the high thermal conductivity of copper, and then dissipate the heat through the heat pipe and the fan 6.

[0043] In some specific embodiments, the heat dissipation substrate 1 includes a mounting surface 13, the mounting surface 13 is provided with a first groove 14 and a second groove 15, the first groove 14 and the second groove 15 both extend to the first avoidance hole 11, at least part of the first cantilever 21 is arranged in the first groove 14, and at least part of the second cantilever 22 is arranged in the second groove 15. During installation, by fixing the heat dissipation substrate 1 to the circuit board 7, while the first cantilever 21 and the second cantilever 22 move toward the direction close to the circuit board 7, the first cantilever 21 and the second cantilever 22 are deformed to generate pressure so that the first heat conductor 3 acts on the first heating device 51. The first heat conductor 3 is relatively independently fixed to the heat dissipation substrate 1 and is not affected by other heating devices, so that the first heat conductor 3 is in full contact with the first heating device 51, which can improve the heat dissipation capacity of the first heating device 51.

[0044] In some specific embodiments, the heat dissipation substrate 1 is provided with a third groove 16, which extends to the first avoidance hole 11, and the first heat conductor 3 is provided with a first mounting boss, which is arranged in the third groove 16, so that the first heat conductor 3 is closer to the circuit board 7 that fixes the first heating device 51. During installation, the first cantilever 21 and the second cantilever 22 move toward the direction close to the circuit board 7, and the first cantilever 21 and the second cantilever 22 are deformed to generate pressure so that the first heat conductor 3 acts on the first heating device 51, so that the first heat conductor 3 is in full contact with the first heating device 51, which can improve the heat dissipation capacity of the first heating device 51.

[0045] In some specific implementations, the heat-conducting assembly includes a second heat-conducting member 4 , and the second heat-conducting member 4 is arranged to be connected to the first heat-conducting member 3 , so as to improve the heat dissipation capacity.

[0046] Optionally, the second heat-conducting member 4 is a heat pipe, which is connected to the first heat-conducting member 3 by welding. The heat pipe can conduct heat to the first heat-conducting member 3, thereby improving the heat conduction efficiency. Wind is generated by the fan 6, thereby generating airflow to carry away heat.

[0047] In some specific embodiments, the first heat conductor 3 includes a first connection portion 31 and a second connection portion 32, and the first connection portion 31 and the second connection portion 32 are symmetrical about the central axis of the first heat conductor 3; the first cantilever 21 is connected to the first connection portion 31, and the second cantilever 22 is connected to the second connection portion 32, so that the first heat conductor 3 can be evenly pressed on the first heating device 51, which can improve the heat dissipation effect of the first heating device 51. Optionally, the first cantilever 21 is riveted to the first connection portion 31, and the second cantilever 22 is riveted to the second connection portion 32.

[0048] In some specific embodiments, the first heat conductor 3 includes a third connecting portion 33 and a fourth connecting portion 34, and the third connecting portion 33 and the fourth connecting portion 34 are symmetrical about the central axis of the first heat conductor 3. The cantilever assembly includes a third cantilever and a fourth cantilever, and the third cantilever is connected to the third connecting portion 33, and the fourth cantilever is connected to the fourth connecting portion 34. The stability of the first heat conductor 3 can be improved, so that the first heat conductor 3 can be evenly pressed on the first heating device 51, and the heat dissipation effect of the first heating device 51 can be improved.

[0049] In some specific embodiments, the first cantilever 21, the second cantilever 22, the third cantilever and the fourth cantilever are all elastic arms. The pressure generated by the deformation of the first cantilever 21, the second cantilever 22, the third cantilever and the fourth cantilever causes the first heat conducting member 3 to act on the first heating device 51, so that the first heat conducting member 3 is in full contact with the first heating device 51, thereby improving the heat dissipation capacity of the first heating device 51.

[0050] In some specific embodiments, the heat dissipation substrate 1 is provided with a second avoidance hole 12 for accommodating a second heating device; there are two heat-conducting components, and two first heat-conducting members 3 are respectively arranged corresponding to the first avoidance hole 11 and the second avoidance hole 12, so that one of the first heat-conducting members 3 can abut against the first heating device 51 arranged in the first avoidance hole 11, and the other first heat-conducting member 3 can abut against the second heating device arranged in the second avoidance hole 12. Each first heat-conducting member 3 is relatively independently fixed to the heat dissipation substrate 1 and is not affected by other heating devices, so that one first heat-conducting member 3 is in full contact with the first heating device 51, and the other heat-conducting member is in full contact with the second heating device, which can improve the heat dissipation capacity of the first heating device 51 and the second heating device.

[0051] In some specific embodiments, the heat dissipation substrate 1 is fixed to the circuit board 7, and optionally, the heat dissipation substrate 1 and the circuit board 7 are locked by screws. The circuit board is provided with a first heating device 51, and the first heating device 51 is arranged in the first avoidance hole 11; there is a gap between the first heating device 51 and the first avoidance hole 11. During installation, by fixing the heat dissipation substrate 1 to the circuit board 7, the first cantilever 21 and the second cantilever 22 move toward the direction close to the circuit board 7, and the first cantilever 21 and the second cantilever 22 drive the first heat conductor 3, so that the first heat conductor 3 acts on the first heating device 51 as a pressure component of the first heating device 51. The first heat conductor 3 is relatively independently fixed to the heat dissipation substrate 1, and is not affected by other heating devices, so that the first heat conductor 3 is in full contact with the first heating device 51, which can improve the heat dissipation capacity of the first heating device 51.

[0052] Optionally, the circuit board 7 may be a main board.

[0053] In some specific embodiments, the circuit board 7 is provided with a second heating device, and the second heating device is arranged in the second avoidance hole 12; the first heat conductor 3 can abut against the second heating device arranged in the second avoidance hole 12, which can improve the heat dissipation capacity of the second heating device.

[0054] In some specific embodiments, the circuit board 7 is provided with a third heating device 52, the surface of the heat dissipation substrate 1 facing the circuit board 7 is provided with an avoidance groove 17, the third heating device 52 is arranged in the avoidance groove 17, the second heating device is in contact with the heat dissipation substrate 1, or the second heating device is connected to the heat dissipation substrate 1 through a thermal conductive adhesive. The first heating device 51, the second heating device and the third heating device 52 are relatively independently fixed to the heat dissipation substrate 1, and the heat dissipation capacity of each heating device is improved.

[0055] The electronic device provided in the embodiment of the present disclosure includes the heat dissipation module provided in the embodiment of the present disclosure. The electronic device may be a notebook PC, a desktop PC, a tablet terminal or a smart phone, etc. The electronic device provided in the embodiment of the present disclosure has the same advantages as the heat dissipation module provided in the embodiment of the present disclosure, which will not be repeated here.

[0056] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A heat dissipation module, characterized in that: include: A heat dissipation substrate (1) and a heat conducting component; The heat dissipation substrate (1) is provided with a first avoidance hole (11), and the first avoidance hole (11) forms a mounting position for a first heating element (51); The heat-conducting component comprises a first heat-conducting member (3) and a cantilever component; The first heat-conducting member (3) is arranged corresponding to the mounting position, one end of the cantilever assembly is connected to the first heat-conducting member (3), and the other end is connected to the heat dissipation substrate (1), so that the first heat-conducting member (3) can abut against the first heating device (51) arranged in the first avoidance hole (11).

2. The heat dissipation module according to claim 1, characterized in that: The cantilever comprises a first cantilever (21) and a second cantilever (22); one end of the first cantilever (21) is connected to the first heat-conducting member (3), and the other end is connected to the heat-dissipating substrate (1); one end of the second cantilever (22) is connected to the first heat-conducting member (3), and the other end is connected to the heat-dissipating substrate (1); The heat dissipation substrate (1) comprises a mounting surface (13), the mounting surface (13) being provided with a first groove (14) and a second groove (15), the first groove (14) and the second groove (15) both extending to the first avoidance hole (11), at least a portion of the first cantilever (21) being arranged in the first groove (14), and at least a portion of the second cantilever (22) being arranged in the second groove (15).

3. The heat dissipation module according to claim 2, characterized in that: The heat dissipation substrate (1) is provided with a third groove (16), the third groove (16) extends to the first avoidance hole (11), the first heat conducting member (3) is provided with a first mounting boss, and the first mounting boss is arranged in the third groove (16); And / or, the heat-conducting component comprises a second heat-conducting member (4), and the second heat-conducting member (4) is arranged to be connected to the first heat-conducting member (3).

4. The heat dissipation module according to claim 3, characterized in that: The first heat-conducting member (3) comprises a first connecting portion (31) and a second connecting portion (32), wherein the first connecting portion (31) and the second connecting portion (32) are symmetrical about a central axis of the first heat-conducting member (3); The first cantilever (21) is connected to the first connecting portion (31), and the second cantilever (22) is connected to the second connecting portion (32).

5. The heat dissipation module according to claim 4, characterized in that: The first heat-conducting member (3) comprises a third connecting portion (33) and a fourth connecting portion (34), wherein the third connecting portion (33) and the fourth connecting portion (34) are symmetrical about the central axis of the first heat-conducting member (3), The cantilever assembly comprises a third cantilever and a fourth cantilever, the third cantilever is connected to the third connecting portion (33), and the fourth cantilever is connected to the fourth connecting portion (34).

6. The heat dissipation module according to claim 5, characterized in that: The first cantilever (21), the second cantilever (22), the third cantilever and the fourth cantilever are all elastic arms.

7. The heat dissipation module according to claim 1, characterized in that: The heat dissipation substrate (1) is provided with a second avoidance hole (12) for accommodating a second heat generating device; The number of the heat-conducting components is two, and the two first heat-conducting components (3) are respectively arranged corresponding to the first avoidance hole (11) and the second avoidance hole (12), so that one of the first heat-conducting components (3) can abut against the first heating device (51) arranged in the first avoidance hole (11), and the other first heat-conducting component (3) can abut against the second heating device arranged in the second avoidance hole (12).

8. The heat dissipation module according to any one of claims 1 to 7, characterized in that: The heat dissipation substrate (1) is fixed to a circuit board (7), the circuit board is provided with the first heating device (51), and the first heating device (51) is arranged in the first avoidance hole (11); There is a gap between the first heating device (51) and the first avoidance hole (11).

9. The heat dissipation module according to claim 8, characterized in that: The circuit board (7) is provided with a second heating device, and the second heating device is arranged in the second avoidance hole (12); And / or, the circuit board (7) is provided with a third heating device (52), a surface of the heat dissipation substrate (1) facing the circuit board (7) is provided with an avoidance groove (17), the third heating device (52) is arranged in the avoidance groove (17), the second heating device is in contact with the heat dissipation substrate (1), or the second heating device is connected to the heat dissipation substrate (1) by means of a thermally conductive adhesive.

10. An electronic device, characterized in that: A heat dissipation module comprising any one of claims 1 to 9.

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