Heat dissipation assembly and electronic equipment
Patent Information
- Application Number
- CN202420516877.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-03-15
Smart Images
Figure CN222283760U_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of mechanical technology, and in particular to a heat dissipation component and an electronic device. Background Art
[0002] With the development of electronic technology, electronic devices are becoming more and more dense, and the space that can be deployed inside is getting smaller and smaller. For processors, in order to reduce the space they occupy, they are often placed in electronic devices in the form of bare chips. When cooling the bare chips, it is still necessary to fix the heat sink to the motherboard or base plate with screws and other devices to closely fit the bare chips.
[0003] However, compared with general processors, bare chip processors are more sensitive to pressure due to the lack of outer shell support. When the heat sink is screwed or transported after installation, if the heat sink is impacted, the impact force will directly act on the bare chip, causing damage to the bare chip, reducing the reliability of the electronic device. Summary of the invention
[0004] In order to overcome the problems existing in the related art, this specification provides a heat dissipation component and an electronic device.
[0005] According to a first aspect of an embodiment of this specification, a heat dissipation assembly is provided, including:
[0006] heat sink;
[0007] At least two fixing mechanisms are provided through the heat sink to provide a snapping force for the heat sink toward the heat dissipation object;
[0008] At least two supporting mechanisms are fixed between the heat sink and the substrate carrying the heat sink object, providing a supporting force for the heat sink to be away from the heat sink object;
[0009] The supporting force provided by the supporting mechanism increases as the heat dissipation surface of the heat sink moves toward the heat dissipation object, and the heat dissipation surface is the surface where the heat sink and the heat dissipation object are in contact.
[0010] Optionally, the fixing mechanism includes:
[0011] A first screw rod is inserted into a first through hole of the heat sink, wherein the first through hole is formed with a limiting protrusion having a diameter smaller than that of a head of the first screw rod;
[0012] A first spring is respectively abutted between the head of the first screw and the limiting protrusion;
[0013] A retaining ring is sleeved on the annular groove of the first screw, wherein the retaining ring abuts against the lower surface of the limiting protrusion.
[0014] Optionally, the supporting mechanism comprises:
[0015] A first supporting portion, wherein a top end of the first supporting portion is provided with a screw hole for screwing with the first screw rod;
[0016] A fixing portion, passing through and fixing the substrate;
[0017] The second spring is sleeved on the first supporting portion and respectively abuts against the heat sink and the substrate.
[0018] Optionally, the first screw rod passes through and fixes the substrate;
[0019] The supporting mechanism comprises:
[0020] Fastening screws;
[0021] An expansion portion is provided through the second through hole of the heat sink, and the fastening screw is provided through a screw hole formed in the expansion portion;
[0022] A second supporting portion is disposed between the substrate and the heat dissipation surface of the heat sink;
[0023] Wherein, as the fastening screw moves toward one side of the substrate, the outer diameter of the expansion portion increases to abut against the hole wall of the second through hole.
[0024] Optionally, the expansion portion comprises:
[0025] at least two expansion arms, with a gap between adjacent expansion arms, the screw hole is formed between the at least two expansion arms, and the diameter of the screw hole increases from a side close to the substrate to a side away from the substrate;
[0026] The outer diameter of the fastening screw increases from a side close to the substrate to a side away from the substrate.
[0027] Optionally, the supporting mechanism further includes:
[0028] A positioning portion extends from the second supporting portion away from the expansion portion, wherein the positioning portion positions the supporting mechanism by penetrating the substrate.
[0029] Optionally, the supporting mechanism comprises:
[0030] A connecting portion extending outward from both sides of the radiator;
[0031] A limiting portion, rotatably connected to the connecting portion;
[0032] a third supporting portion, formed with a movable segment passing through the limiting portion and a supporting segment fixed to the base plate, wherein a diameter of the movable segment is smaller than a diameter of the supporting segment;
[0033] A limiting screw is screwed to the movable section from a side away from the supporting section, wherein the head diameter of the limiting screw is larger than the diameter of the movable section, and a movable gap is formed between the limiting portion and at least the supporting section or the limiting screw;
[0034] When the heat dissipation surface is subjected to pressure in a direction vertical to the heat dissipation surface, the limiting portion and the connecting portion rotate relative to each other, and a supporting force is provided to the heat sink through the abutment between the limiting portion and the supporting section.
[0035] Optionally, the third supporting portion is further formed with a positioning segment extending from the supporting segment in a direction away from the movable segment, and the positioning segment positions the supporting mechanism by penetrating into the base plate.
[0036] Optionally, the connecting portion and the heat sink are integrally formed.
[0037] According to a second aspect of the embodiments of this specification, an electronic device is provided, including:
[0038] substrate;
[0039] a heat dissipation object, carried on the substrate; and
[0040] A heat dissipation assembly as described in any of the above items.
[0041] Optionally, the heat dissipation object is a bare chip.
[0042] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:
[0043] In the embodiments of the present specification, in the heat dissipation assembly, a fixing mechanism is used to provide a snapping force to the heat dissipation object to the heat dissipation device, and a supporting force is provided to the heat dissipation device away from the heat dissipation object by a supporting mechanism. When the heat dissipation device is subjected to pressure, the supporting force of the supporting mechanism is increased, thereby preventing the heat dissipation object from being damaged due to excessive pressure during the installation of the heat dissipation assembly on the heat dissipation object or the transportation of the electronic device containing the heat dissipation assembly, thereby improving the reliability of the electronic device.
[0044] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0046] Figure 1 It is a structural schematic diagram of a heat dissipation component involved in this application;
[0047] Figure 2 is a cross-sectional schematic diagram of a heat dissipation assembly involved in an embodiment of the present application, wherein the fixing mechanism and the supporting mechanism are located at the same position in the vertical direction;
[0048] Figure 3 is a cross-sectional schematic diagram of a heat dissipation assembly involved in an embodiment of the present application, wherein: Figure 3 Corresponds to Figure 2 ;
[0049] Figure 4 is a cross-sectional schematic diagram and a cross-sectional enlarged diagram of a heat dissipation assembly involved in an embodiment of the present application, wherein the fixing mechanism and the supporting mechanism are located at different positions in the vertical direction;
[0050] Figure 5 is a cross-sectional schematic diagram of a heat dissipation assembly involved in an embodiment of the present application, wherein: Figure 5 Corresponds to Figure 4 ;
[0051] Figure 6 is a cross-sectional schematic diagram of a heat dissipation component involved in an embodiment of the present application;
[0052] Figure 7 is a cross-sectional schematic diagram of a heat dissipation assembly involved in an embodiment of the present application, wherein: Figure 7 Corresponds to Figure 6 . DETAILED DESCRIPTION
[0053] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0054] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0055] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0056] The present application provides a heat dissipation assembly 100, such as Figure 1 As shown, including:
[0057] Radiator 1;
[0058] At least two fixing mechanisms 2 are disposed through the heat sink 1 to provide a snapping force for the heat sink 1 toward the heat dissipation object 4 .
[0059] At least two supporting mechanisms 3 are fixed between the heat sink 1 and a base plate 5 carrying the heat sink object 4 , and provide a supporting force for the heat sink 1 to be away from the heat sink object 4 .
[0060] The supporting force provided by the supporting mechanism 3 increases as the heat dissipation surface 10 of the heat sink 1 moves toward the heat dissipation object 4 , and the heat dissipation surface 10 is the surface where the heat sink 1 and the heat dissipation object 4 are in contact.
[0061] by Figure 1 For example, in the vertical direction X, the heat sink 1, the heat sink object 4 and the substrate 5 are arranged in sequence from top to bottom, and the heat sink surface 10 of the heat sink 1 (i.e., the lower surface of the heat sink 1) is fitted. In order to improve the tightness of the fitting, a heat conductive layer 6 can be arranged between the heat sink surface 10 and the upper surface of the heat sink object 4, and the heat sink object 4 is connected to the substrate 5, wherein the substrate 5 can be a circuit board, the heat sink object 4 can be a chip, and the heat sink object 4 is fixed to the substrate 5 by welding or the like. In addition, the heat sink assembly 100, the heat sink object 4, the substrate 5 and the heat conductive layer 6 are arranged in the electronic device and fixed to the housing of the electronic device, specifically, it can be a bottom plate 7 arranged on the housing.
[0062] Among them, the snap-fitting force refers to the force that presses the heat sink 1 toward the heat dissipation object 4 from top to bottom in the vertical direction X. By applying the snap-fitting force, a tighter fit can be formed between the heat dissipation object 4 and the heat sink 1; the supporting force refers to the force that provides the heat sink 1 from bottom to top in the vertical direction X to keep it away from the heat dissipation object 4 to avoid excessive pressure on the heat dissipation object 4. In the vertical direction X, as the heat sink 1 moves downward to the P position, the supporting force is equal to the snap-fitting force to maintain the force balance in the vertical direction X. At this time, if there is a downward force other than the snap-fitting force (such as vibration or pressing), the supporting force will continue to increase to offset the influence of the force, avoiding the possible pressure loss of the heat dissipation object 4 caused by the continued downward movement of the heat sink 1; if there is an upward force other than the supporting force (such as vibration or lifting), the snap-fitting force will continue to increase to offset the influence of the force, avoiding the continued upward movement of the heat sink 1, causing the substrate 5 to be intact or the heat sink 1 to be separated from the heat dissipation object 4.
[0063] The fixing mechanism 2 and the supporting mechanism 3 can be evenly arranged on the heat sink 1, for example, respectively arranged around the heat dissipation object 4, so as to provide balanced supporting force and locking force around. The specific arrangement method can be different according to the number of the fixing mechanism 2 and the supporting mechanism 3. Figure 1 The fixing mechanism 2 and the supporting mechanism 3 shown are for illustration only and are not intended to be limiting.
[0064] The fixing mechanism 2 and the supporting mechanism 3 can have different structures or connection relationships, with the fixing mechanism 2 providing a snap-fitting force downward and the supporting mechanism 3 providing a supporting force upward. For example, the fixing mechanism 2 can be implemented by using a screw, a bolt, or a combination thereof with an elastic member, and the supporting mechanism 3 can be implemented by a rotation limiting member, an expansion limiting member, or a combination thereof with an elastic member. The relationship between the fixing mechanism 2 and the supporting mechanism 3 can also be a connected or separated setting, and there is no restriction on this.
[0065] In the heat dissipation assembly, a fixing mechanism is used to provide a snapping force to the heat sink toward the heat dissipation object, and a supporting force is provided to the heat sink away from the heat dissipation object through a supporting mechanism. When the heat sink is subjected to pressure, the supporting force of the supporting mechanism is increased, thereby preventing the heat dissipation object from being damaged due to greater pressure during the process of installing the heat dissipation assembly on the heat dissipation object or transporting the electronic equipment containing the heat dissipation assembly, thereby improving the reliability of the electronic equipment.
[0066] Optionally, the fixing mechanism 2, such as Figure 2 , 3 As shown, including:
[0067] A first screw rod 20 is passed through the first through hole 11 of the heat sink 1 , wherein the first through hole 11 is formed with a limiting protrusion 11A having a diameter smaller than that of the head 20A of the first screw rod 20 ;
[0068] The first spring 21 is respectively abutted between the head 20A of the first screw rod 20 and the limiting protrusion 11A;
[0069] The retaining ring 22 is sleeved in the annular groove 20B of the first screw rod 20 , wherein the retaining ring 22 abuts against the lower surface 11B of the limiting protrusion 11A.
[0070] When the first screw rod 20 is installed, the head 20A of the first screw rod 20 and the limiting protrusion 11A compress the first spring 21, so that the first spring 21 can provide an upward elastic force in the vertical direction X, and the elastic force increases as the first screw rod 20 is screwed downward in the vertical direction X, which can also avoid the pressure on the heat dissipation object 4 when the fixing mechanism 2 is installed. In addition, the retaining ring 22 and the annular groove 20B cooperate to fix the position of the retaining ring 22 relative to the first screw rod 20. Through the abutment between the retaining ring 22 and the limiting protrusion 11A, the first screw rod 20 can be restricted in the first through hole 11 of the heat sink 1, and the first screw rod 20 can be prevented from slipping out of the first through hole 11.
[0071] In addition, a washer 23 can be provided on the lower side of the first spring 21 and contact the upper side of the limiting protrusion 11A. One end of the first spring 21 abuts against the head 20A of the first screw 20, and the other end abuts against the washer 23. In this way, scratches on the radiator 1 can be avoided when the first spring is compressed.
[0072] Optionally, the support mechanism 3, such as Figure 2 , 3 As shown, including:
[0073] A first support portion 30, wherein a screw hole 30A for screwing with the first screw rod 20 is provided at a top end of the first support portion 30;
[0074] A fixing portion 31 passes through and fixes the substrate 5;
[0075] The second spring 32 is sleeved on the first supporting portion 30 and abuts against the heat sink 1 and the substrate 5 respectively.
[0076] The fixing portion 31 passes through the through hole on the base plate 5 and extends toward the bottom plate 7. A nut 70 matching with the fixing portion 31 is provided on the bottom plate 7. The nut 70 can be fixed to the bottom plate 7 by riveting or the like. After the base plate 5 is fixed to the bottom plate 7, the fixing portion 31 passes through the base plate 5 from above in the vertical direction X and screws the nut 70 into the base plate 5. The base plate 5 is fixed to the bottom plate 7 by the connection between the nut 70 and the fixing portion 31, and the second spring 32 is sleeved on the first supporting portion 30.
[0077] After that, the heat sink 1 with the fixing mechanism 2 is placed on the supporting mechanism 3, so that the fixing mechanism 2 and the supporting mechanism 3 are aligned. Specifically, the first screw 20 can be aligned with the screw hole 30A, and the second spring 32 can support the heat dissipation surface 10 of the heat sink 1. After that, the first screw 20 is screwed into the screw hole 30A, and the heat sink 1 is moved downward. The second spring 32 supports the heat sink 1 and provides an upward supporting force in the vertical direction X until the heat sink 1 can fit the heat dissipation object 4 tightly.
[0078] The first support portion 30 and the second spring 32 of the support mechanism 3 provide a supporting force to the radiator 1, and Figure 3 As shown, it can be seen from the top view that the supporting mechanism 3 and the fixing mechanism 2 can be arranged on the same straight line, thereby avoiding too many openings on the radiator 1, making the structure of the radiator 1 more stable.
[0079] Optional, such as Figure 4 , 5 As shown, the first screw rod 20 passes through and fixes the base plate 5 , that is, the fixing mechanism 2 itself and the base plate 5 are used to fix the heat sink 1 , the base plate 5 and the bottom plate 7 .
[0080] The support mechanism 3 comprises:
[0081] Fastening screw 33;
[0082] The expansion portion 34 is inserted into the second through hole 12 of the heat sink 1, and the fastening screw 33 is inserted into the screw hole 34A formed by the expansion portion 34, that is, the expansion portion 34 is first inserted into the second through hole 12, and then the fastening screw 33 is inserted into the screw hole 34A;
[0083] A second supporting portion 35 is disposed between the substrate 5 and the heat dissipation surface 10 of the heat sink 1;
[0084] As the fastening screw 33 moves toward the substrate 5 , the outer diameter of the expansion portion 34 increases to abut against the hole wall of the second through hole 12 .
[0085] During installation, the support mechanism 3 is first placed on the substrate 5, and then the heat sink 1 with the fixing mechanism 2 is moved toward the support mechanism 3, so that the expansion portion 34 penetrates the second through hole 12 and the heat dissipation surface 10 of the heat sink 1 is close to the second support portion 35. Thereafter, the fastening screw 33 is passed through the second through hole to the screw hole 34A, and the fastening screw 33 is screwed downward, and the fastening screw 33 pushes the expansion portion 34 to press the hole wall of the second through hole 12, thereby limiting the movement of the heat sink 1 in the vertical direction X, and then the first screw 20 in the first through hole 11 is screwed to fix the heat sink 1, the substrate 5 and the bottom plate 7.
[0086] When the radiator 1 is subjected to downward pressure, due to the large friction between the expansion portion 34 and the hole wall of the second through hole 12, it is difficult for the radiator 1 to continue to move downward or upward, thereby damaging the heat dissipation object 4 or causing the substrate 5 to deform, thereby avoiding damage to the heat dissipation object 4 and the substrate 5.
[0087] Furthermore, the expansion portion 34 includes:
[0088] at least two expansion arms 34B, a gap 34C is formed between adjacent expansion arms 34B, the screw hole 34A is formed between the at least two expansion arms 34B, and the diameter of the screw hole 34A increases from the side close to the substrate 5 to the side away from the substrate 5;
[0089] The outer diameter of the fastening screw 33 increases from a side close to the substrate 5 to a side away from the substrate 5 .
[0090] Since the outer diameter of the lower end of the fastening screw 33 is smaller and the hole diameter of the upper end of the screw hole 34A is larger, the fastening screw 33 can be inserted into the screw hole 34A more easily, and the fastening screw 33 can be screwed into the screw hole 34A more smoothly.
[0091] Optionally, the supporting mechanism 3 further includes:
[0092] The positioning portion 36 extends from the second supporting portion 35 away from the expansion portion 34 , wherein the positioning portion 36 positions the supporting mechanism 3 by penetrating into the substrate 5 .
[0093] A positioning hole 50 corresponding to the positioning portion 36 may be opened on the substrate 5. When the support mechanism 3 is set on the substrate 5, the positioning hole 50 and the positioning portion 36 cooperate to achieve a more stable placement between the substrate 5 and the support mechanism 3. A locking hole 36A may also be provided at the lower end of the positioning portion 36. The stability of the placement is further improved by screwing the locking screw 51 and the locking hole 36A.
[0094] Of course, in addition to the locking screw 51 and the locking hole 36A, stable placement can also be achieved through other forms, such as extending an elastic clip from the lower end of the positioning portion 36, and after passing through the positioning hole 50 of the substrate 5, the clip expands outward to clamp the edge of the substrate 5.
[0095] Optionally, the support mechanism 3, such as Figure 6 , 7 As shown, including:
[0096] The connecting portion 13 is formed by extending outward from both sides of the heat sink 1;
[0097] The limiting portion 37 is rotatably connected to the connecting portion 13;
[0098] The third supporting portion 38 is formed with a movable segment 38A passing through the limiting portion 37 and a supporting segment 38B fixed to the base plate 5, wherein the diameter of the movable segment 38A is smaller than the diameter of the supporting segment 38B;
[0099] A limiting screw 39 is screwed to the movable segment 38A from a side away from the supporting segment 38B, wherein a head 39A of the limiting screw 39 has a diameter greater than a diameter of the movable segment 38A, and a movable gap 8 is formed between the limiting portion 37 and at least the supporting segment 38B or the limiting screw 39;
[0100] When the heat dissipation surface 10 is subjected to pressure in the vertical direction X, the limiting portion 37 and the connecting portion 13 rotate relative to each other, and the contact between the limiting portion 37 and the supporting section 38B provides a supporting force for the heat sink 1 .
[0101] When the radiator 1 is subjected to external force, relative rotation occurs between the limiting portion 37 and the connecting portion 13, and the limiting portion 37 and the connecting portion 13 are V-shaped or ∧-shaped. In this way, the surface of the limiting portion 37 will abut against the hole of the limiting portion 37, and the radiator 1 will also tilt (that is, the radiator 1 on one side is lifted, and the radiator 1 on the other side is sunk). Moreover, as the angle between the limiting portion 37 and the connecting portion 13 tends to 90°, the force between the limiting portion 37 and the connecting portion 13 increases, so that the angle between the two is gradually locked, thereby preventing the radiator 1 from further tilting, which may cause pressure loss of the heat dissipation object 4 or warping of the substrate 5.
[0102] In addition, by leaving a certain movable gap 8 between the limiting portion 37 and the limiting screw 39 and / or the third supporting portion 38, it is prevented that the rotation of the limiting portion 37 directly acts on the limiting screw 39, causing the limiting screw 39 to be overstressed and fall off.
[0103] Optionally, the third supporting portion 38 is further formed with a positioning segment 38C extending from the supporting segment 38B in a direction away from the movable segment 38A, and the positioning segment 38C positions the supporting mechanism 3 by penetrating into the base plate 5 .
[0104] The cooperation between the positioning section 38C and the hole on the substrate 5 can make the support mechanism 3 placed on the substrate 5 more stable, and further stable cooperation between the support mechanism 3 and the substrate 5 can be achieved by screwing another screw into the positioning section 38C.
[0105] Optionally, the connection part 13 is integrally formed with the radiator 1, that is, the radiator 1 with the connection part 13 is directly formed by injection molding or the like, or the connection part 13 can be formed separately and fixed to the radiator 1 by screws or the like, and it can be set according to actual needs without limitation.
[0106] Correspondingly, the present application also provides an electronic device, such as Figure 1 As shown, including:
[0107] substrate 5;
[0108] a heat dissipation object 4, carried on the substrate 5; and
[0109] The heat dissipation assembly 100 as described in any one of the above items.
[0110] Optionally, the heat dissipation object 4 is a bare chip.
[0111] In the embodiments of the present specification, in the heat dissipation assembly, a fixing mechanism is used to provide a snapping force to the heat dissipation object to the heat dissipation device, and a supporting force is provided to the heat dissipation device away from the heat dissipation object by a supporting mechanism. When the heat dissipation device is subjected to pressure, the supporting force of the supporting mechanism is increased, thereby preventing the heat dissipation object from being damaged due to excessive pressure during the installation of the heat dissipation assembly on the heat dissipation object or the transportation of the electronic device containing the heat dissipation assembly, thereby improving the reliability of the electronic device.
[0112] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0113] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.
[0114] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.
[0115] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.
Claims
1. A heat dissipation component, characterized in that: include: heat sink; At least two fixing mechanisms are provided through the heat sink to provide a snapping force for the heat sink toward the heat dissipation object; At least two supporting mechanisms are fixed between the heat sink and the substrate carrying the heat sink object, providing a supporting force for the heat sink to be away from the heat sink object; The supporting force provided by the supporting mechanism increases as the heat dissipation surface of the heat sink moves toward the heat dissipation object, and the heat dissipation surface is the surface where the heat sink and the heat dissipation object are in contact.
2. The heat dissipation assembly according to claim 1, characterized in that: The fixing mechanism comprises: A first screw rod is inserted into a first through hole of the heat sink, wherein the first through hole is formed with a limiting protrusion having a diameter smaller than that of a head of the first screw rod; A first spring is respectively abutted between the head of the first screw and the limiting protrusion; A retaining ring is sleeved on the annular groove of the first screw, wherein the retaining ring abuts against the lower surface of the limiting protrusion.
3. The heat dissipation assembly according to claim 2, characterized in that: The supporting mechanism comprises: A first supporting portion, wherein a top end of the first supporting portion is provided with a screw hole for screwing with the first screw rod; A fixing portion, passing through and fixing the substrate; The second spring is sleeved on the first supporting portion and respectively abuts against the heat sink and the substrate.
4. The heat dissipation assembly according to claim 2, characterized in that: The first screw rod passes through and fixes the substrate; The supporting mechanism comprises: Fastening screws; An expansion portion is provided through the second through hole of the heat sink, and the fastening screw is provided through a screw hole formed in the expansion portion; A second supporting portion is disposed between the substrate and the heat dissipation surface of the heat sink; Wherein, as the fastening screw moves toward one side of the substrate, the outer diameter of the expansion portion increases to abut against the hole wall of the second through hole.
5. The heat dissipation assembly according to claim 4, characterized in that: The expansion portion comprises: at least two expansion arms, with a gap between adjacent expansion arms, the screw hole is formed between the at least two expansion arms, and the diameter of the screw hole increases from a side close to the substrate to a side away from the substrate; The outer diameter of the fastening screw increases from a side close to the substrate to a side away from the substrate.
6. The heat dissipation assembly according to claim 4, characterized in that: The supporting mechanism further comprises: A positioning portion extends from the second supporting portion away from the expansion portion, wherein the positioning portion positions the supporting mechanism by penetrating the substrate.
7. The heat dissipation assembly according to claim 1, characterized in that: The supporting mechanism comprises: A connecting portion extending outward from both sides of the radiator; A limiting portion, rotatably connected to the connecting portion; a third supporting portion, formed with a movable segment passing through the limiting portion and a supporting segment fixed to the base plate, wherein a diameter of the movable segment is smaller than a diameter of the supporting segment; A limiting screw is screwed to the movable section from a side away from the supporting section, wherein the head diameter of the limiting screw is larger than the diameter of the movable section, and a movable gap is formed between the limiting portion and at least the supporting section or the limiting screw; When the heat dissipation surface is subjected to pressure in a direction vertical to the heat dissipation surface, the limiting portion and the connecting portion rotate relative to each other, and a supporting force is provided to the heat sink through the abutment between the limiting portion and the supporting section.
8. The heat dissipation assembly according to claim 7, characterized in that: The third supporting portion is further formed with a positioning section extending from the supporting section in a direction away from the movable section, and the positioning section positions the supporting mechanism by penetrating into the base plate.
9. The heat dissipation assembly according to claim 7, characterized in that: The connecting portion is integrally formed with the heat sink.
10. An electronic device, characterized in that: include: substrate; a heat dissipation object, carried on the substrate; as well as, The heat dissipation assembly according to any one of claims 1 to 9.
11. The electronic device according to claim 10, characterized in that: The heat dissipation object is a bare chip.