Laser processing device and laser processing equipment

Abstract

The utility model discloses a laser processing device and equipment, the laser processing device comprises a first light path mechanism, a second light path mechanism, a processing head, a cambered surface reflector and a controller, the first light path mechanism comprises a first laser and a first reflection assembly, and the second light path mechanism comprises a second laser and a second reflection assembly; the first reflecting assembly is arranged on an emergent light path of the first laser, the second reflecting assembly is arranged on an emergent light path of the second laser, and the cambered surface reflecting mirror is arranged on reflecting light paths of the first reflecting assembly and the second reflecting assembly. And the light reflected by the first reflecting assembly and the second reflecting assembly can be reflected to the processing head through the cambered surface reflecting mirror. According to the device, the plate can be processed based on the laser emitted by the first laser or the laser emitted by the second laser according to needs, or the plate is processed based on the laser emitted by the first laser and the laser emitted by the second laser at the same time, and therefore the purpose that one machine is suitable for multiple application scenes is achieved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device and laser processing equipment. Background Art

[0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beam and matter to cut, weld, surface treat, punch and micro-process materials. At present, laser processing has been widely used in the field of PCB board processing.

[0003] However, the laser forming equipment currently on the market can only be used in a single application. Equipment that uses picosecond lasers to cut cover films cannot cut copper foil, and equipment that uses nanosecond lasers to cut copper foil cannot cut cover films, making it impossible to achieve multi-scenario application of one machine. Utility Model Content

[0004] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide a laser processing device that can be applied to multiple scenarios.

[0005] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0006] The present application provides a laser processing device, which includes a processing head, a curved reflector, a first optical path mechanism, a second optical path mechanism and a controller;

[0007] The first optical path mechanism includes a first laser and a first reflecting component, the first laser is used to emit a first laser, and the first reflecting component is arranged on the outgoing optical path of the first laser, and is used to reflect the first laser to the reflection point of the arc reflector;

[0008] The second optical path mechanism includes a second laser and a second reflecting component, the second laser is used to emit a second laser, and the second reflecting component is arranged on the outgoing optical path of the second laser, and is used to reflect the second laser to the reflection point of the arc reflector;

[0009] The arc reflector is arranged on the reflection light path of the first reflection component and the second reflection component, and is used to reflect the first laser or the second laser to the processing head, or to combine the first laser and the second laser and reflect them to the processing head;

[0010] The controller is electrically connected to the first laser, the second laser and the processing head respectively, and is used to control the operation of the first laser, the second laser and the processing head.

[0011] In some embodiments, a pulse width of a first laser emitted by the first laser is different from a pulse width of a second laser emitted by the second laser, so that the first laser and the second laser can cut workpieces of different materials to be processed, wherein the workpieces to be processed include a first material and a second material covering and attached to the first material, the first material includes copper foil, and the second material includes a covering film.

[0012] In some embodiments, the arc reflector is configured as a convex reflector, and the convex reflector is provided with an arc-shaped reflective surface convex outwardly, or

[0013] The arc reflector is configured as a concave reflector, and the concave reflector is provided with an inwardly concave arc reflective surface.

[0014] In some embodiments, the first reflective assembly includes a first reflector and a second reflector, and the first reflector and the second reflector are sequentially arranged on the outgoing optical path of the first laser, so that the laser light emitted by the first laser can be sequentially reflected to the processing head by the first reflector, the second reflector and the arc reflector;

[0015] The second reflection component includes a third reflection mirror and a fourth reflection mirror, and the third reflection mirror and the fourth reflection mirror are sequentially arranged on the output light path of the second laser, so that the laser emitted by the second laser can be reflected to the processing head via the third reflection mirror, the fourth reflection mirror and the curved reflection mirror in sequence.

[0016] In some embodiments, the incident angle of the laser emitted by the first laser on the first reflector is α, 30゜≤α≤60゜, the incident angle of the laser reflected by the first reflector on the second reflector is β, 0≤β≤45゜, the incident angle of the laser emitted by the second laser on the third reflector is δ, 30゜≤δ≤60゜, and the incident angle of the laser reflected by the third reflector on the fourth reflector is γ, 0≤γ≤45゜.

[0017] In some embodiments, there are multiple processing heads, and the laser processing device also includes a spectrometer component, which is arranged on the reflection light path of the arc reflector, and is used to divide the laser reflected by the arc reflector into multiple laser beams, so that each beam of the laser is respectively emitted into each processing head.

[0018] In some embodiments, the processing head includes a first processing head and a second processing head, the spectroscopic component includes a 1 / 2 wave plate, a spectroscopic lens and a fifth reflector, the 1 / 2 wave plate and the spectroscopic lens are sequentially arranged on the reflected light path of the curved reflector, the fifth reflector is arranged on the lens light path of the spectroscopic lens, the first processing head is arranged on the reflected light path of the spectroscopic lens, and the second processing head is arranged on the reflected light path of the fifth reflector.

[0019] In some embodiments, the processing head and the arc reflector are provided in plurality, and the laser processing device further comprises a first beam splitter component and a second beam splitter component, wherein the first beam splitter component is provided on the outgoing light path of the first laser, and is used to split the laser light emitted by the first laser into a plurality of first laser beams, so that the plurality of first laser beams are sequentially reflected by the first reflector component and each of the arc reflectors to each of the processing heads;

[0020] The second beam splitter component is arranged on the outgoing light path of the second laser, and is used to split the laser light emitted by the second laser into multiple second laser beams, so that the multiple second laser beams are reflected to each processing head through the second reflection component and each arc reflection mirror in sequence.

[0021] In some embodiments, the first beam splitter assembly includes a first 1 / 2 wave plate, a first beam splitter lens and a sixth reflector, and the first 1 / 2 wave plate, the first beam splitter lens and the sixth reflector are sequentially arranged on the outgoing light path of the first laser;

[0022] The second beam splitter assembly includes a second 1 / 2 wave plate, a second beam splitter lens and a seventh reflector. The second 1 / 2 wave plate, the second beam splitter lens and the seventh reflector are sequentially arranged on the outgoing light path of the second laser.

[0023] In some embodiments, the arc reflector is set as a convex reflector, the convex reflector includes a first convex reflector and a second convex reflector, the first reflective assembly includes a first reflector and a second reflector, the first reflector is arranged on the reflection light path of the first beam splitter, and is used to reflect the laser reflected by the first beam splitter to the first convex reflector, and the second reflector is arranged on the reflection light path of the sixth reflector, so as to reflect the laser transmitted by the first beam splitter to the second convex reflector through the sixth reflector and the second reflector;

[0024] The second reflecting assembly includes a third reflecting mirror and a fourth reflecting mirror. The third reflecting mirror is arranged on the reflecting light path of the second beam splitter lens, and is used to reflect the laser reflected by the second beam splitter lens to the first convex reflecting mirror. The fourth reflecting mirror is arranged on the reflecting light path of the seventh reflecting mirror, so as to reflect the laser transmitted by the second beam splitter lens to the second convex reflecting mirror through the seventh reflecting mirror and the fourth reflecting mirror.

[0025] In some embodiments, the processing head includes a first processing head and a second processing head, and the laser processing device also includes an eighth reflector and a ninth reflector. The eighth reflector is arranged on the reflection light path of the first convex reflector, and is used to reflect the laser reflected by the first convex reflector to the first processing head. The ninth reflector is arranged on the reflection light path of the second convex reflector, and is used to reflect the laser reflected by the second convex reflector to the second processing head.

[0026] In some embodiments, the first laser is configured as a picosecond laser, and the second laser is configured as a nanosecond laser.

[0027] Correspondingly, the present application also provides a laser processing equipment, which includes a workbench and a laser processing device as described in any of the above embodiments.

[0028] Compared with the prior art, the laser processing device of the present application includes a first optical path mechanism, a second optical path mechanism, a processing head, a curved reflector and a controller, the first optical path mechanism includes a first laser and a first reflection component, the second optical path mechanism includes a second laser and a second reflection component, the first laser is used to emit a first laser, the first reflection component is arranged on the exit optical path of the first laser, and is used to reflect the first laser to the reflection point of the curved reflector, the second laser is used to emit a second laser, the second reflection component is arranged on the exit optical path of the second laser, and is used to reflect the second laser to the reflection point of the curved reflector, and the curved reflector is arranged on the reflection optical path of the first reflection component and the second reflection component, and is used to reflect the first laser or the second laser to the processing head, or to combine the first laser and the second laser and reflect them to the processing head, so that the processing head can select the laser processing plate based on the laser emitted by the first laser, or the laser processing plate based on the laser emitted by the second laser, or the laser processing plate based on the laser emitted by the first laser and the second laser at the same time as needed. The present application combines multiple lasers with different pulse widths together to achieve the purpose of sharing a processing head and one machine being applicable to multiple application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a laser processing device provided in an embodiment of the present application.

[0031] Figure 2 A schematic structural diagram of a laser processing device provided in another embodiment of the present application.

[0032] Figure 3 A schematic structural diagram of a laser processing device provided in yet another embodiment of the present application.

[0033] Figure ID:

[0034] 1. The first laser; 2. The second laser; 3. The processing head; 31. The first processing head; 32. The second processing head; 4. The first reflection component; 41. The first reflector; 42. The second reflector; 5. The second reflection component; 51. The third reflector; 52. The fourth reflector; 6. The convex reflector; 61. The first convex reflector; 62. The second convex reflector; 7. The spectrometer component; 71. The 1 / 2 wave plate; 72. The spectrometer lens; 73. The fifth reflector; 8. The first spectrometer component; 81. The first 1 / 2 wave plate; 82. The first spectrometer lens; 83. The sixth reflector; 9. The second spectrometer component; 91. The second 1 / 2 wave plate; 92. The second spectrometer lens; 93. The seventh reflector; 10. The eighth reflector; 11. The ninth reflector. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0036] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more, and the term "multiple" refers to two or more; the terms "connected", "fixed", etc. should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0038] Reference Figure 1 As shown, an embodiment of the present application discloses a laser processing device, which includes a first optical path mechanism, a second optical path mechanism, a processing head 3, a curved reflector 6 and a controller (not shown in the figure), wherein the first optical path mechanism includes a first laser 1 and a first reflection component 4, and the second optical path mechanism includes a second laser 2 and a second reflection component 5. The first laser 1 is used to emit a first laser, and the second laser 2 is used to emit a second laser. The first laser and the second laser can be lasers with the same wavelength and different pulse widths, so that different materials can be cut by the first laser and the second laser. The first reflection component 4 is arranged on the outgoing optical path of the first laser 1, and is used to reflect the first laser emitted by the first laser 1 to the curved reflector 6. The second reflection component 5 is arranged on the outgoing optical path of the second laser 2, and is used to reflect the second laser emitted by the second laser 2 to the curved reflector 6. The arc reflector 6 is arranged on the reflection light path of the first reflection component 4 and the second reflection component 5, and the processing head 3 is arranged on the reflection light path of the arc reflector 6. The arc reflector 6 is used to reflect the first laser reflected by the first reflection component 4 and the second laser reflected by the second reflection component 5 to the processing head 3, so that the processing head 3 can process the PCB board based on the first laser and / or the second laser. The controller is electrically connected to the first laser 1, the second laser 2 and the processing head 3 respectively, and is used to control the operation of the first laser 1, the second laser 2 and the processing head 3. Among them, the dotted line in the figure represents the laser beam.

[0039] In this embodiment, the first laser 1 may be a picosecond laser, which is used to cut thinner materials, such as plastics, glass, etc. The second laser 2 may be a nanosecond laser, which is used to cut thicker materials, such as metal sheets, ceramics, etc. In this embodiment, two different lasers are provided to adapt to different processing materials. It can be understood that in other embodiments, the first laser 1 and the second laser 2 may also be other types of lasers. Exemplarily, the laser processing device can be used to cut workpieces of different materials to be processed, and the workpiece to be processed may be a flexible printed circuit board (full name in English: Flexible Printed Circuit, abbreviated as: FPC), or the workpiece to be processed may include a first material and a second material covered and attached to the first material, the first material includes copper foil, etc., and the second material includes a covering film, etc. Specifically, a workpiece to be processed may contain different materials, or different workpieces to be processed may have different materials.

[0040] Continue to refer to Figure 1 As shown, the first reflection assembly 4 includes a first reflection mirror 41 and a second reflection mirror 42, and the second reflection assembly 5 includes a third reflection mirror 51 and a fourth reflection mirror 52. During installation, the first reflection mirror 41 is arranged on the outgoing light path of the first laser 1, and the second reflection mirror 42 is arranged on the reflected light path of the first reflection mirror 41. The third reflection mirror 51 is arranged on the outgoing light path of the second laser 2, and the fourth reflection mirror 52 is arranged on the reflected light path of the third reflection mirror 51. The arc reflection mirror 6 is arranged on the reflected light path of the second reflection mirror 42 and the fourth reflection mirror 52. When the first laser 1 emits the first laser, the first laser can be reflected to the arc reflection mirror 6 by the first reflection mirror 41 and the second reflection mirror 42 in sequence, and then reflected to the processing head 3 by the arc reflection mirror 6. When the second laser 2 emits the second laser, the second laser can be reflected to the arc reflection mirror 6 by the third reflection mirror 51 and the fourth reflection mirror 52 in sequence, and then reflected to the processing head 3 by the arc reflection mirror 6.

[0041] In this embodiment, the arc reflector 6 is configured as a convex reflector having an outwardly convex arc reflective surface. In other embodiments, the arc reflector 6 may also be configured as a concave reflector having an inwardly concave arc reflective surface.

[0042] Specifically, the incident angle of the laser emitted by the first laser 1 on the first reflector 41 is α, 30°≤α≤60°, and the incident angle of the laser reflected by the first reflector 41 on the second reflector 42 is β, 0≤β≤45°. The incident angle of the laser emitted by the second laser 2 on the third reflector 51 is δ, 30°≤δ≤60°, and the incident angle of the laser reflected by the third reflector 51 on the fourth reflector 52 is γ, 0≤γ≤45°. In actual applications, the deflection angles of the first reflector 41, the second reflector 42, the third reflector 51 and the fourth reflector 52 can be adjusted so that the point and reflection angle reflected by the second reflector 42 to the convex reflector are the same as the point and reflection angle reflected by the fourth reflector 52 to the convex reflector. At the same time, observe whether the light entrance reflected to the processing head 3 is centered. The laser paths emitted by the first laser 1 and the second laser 2 can be adjusted to be consistent by fine-tuning the deflection angles of the first reflector 41, the second reflector 42, the third reflector 51 and the fourth reflector 52.

[0043] In this embodiment, the laser path between the first laser 1 and the first reflector 41, the laser path between the second laser 2 and the third reflector 51, and the laser path between the convex reflector and the processing head 3 are arranged in parallel. The curvature radius of the convex reflector can be infinitely large or infinitely small depending on the distance from the second reflector 42 and the fourth reflector 52.

[0044] When processing a PCB board, if the first laser 1 is used for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits a first laser, and the first laser is sequentially reflected to the processing head 3 through the first reflector 41, the second reflector 42 and the convex reflector, so that the processing head 3 can process the PCB board based on the first laser. If the second laser 2 is used for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits a second laser, and the second laser is sequentially reflected to the processing head 3 through the third reflector 51, the fourth reflector 52 and the convex reflector, so that the processing head 3 can process the PCB board based on the second laser. If the first laser 1 and the second laser 2 are required to be used for simultaneous processing, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits the first laser and the second laser 2 emits the second laser. At this time, the first laser is reflected to the convex reflector by the first reflector 41 and the second reflector 42 in sequence, and the second laser is reflected to the convex reflector by the third reflector 51 and the fourth reflector 52 in sequence. The convex reflector combines the first laser and the second laser and reflects them to the processing head 3, thereby achieving the purpose of using the first laser and the second laser to process the PCB board simultaneously.

[0045] This embodiment can realize a variety of processing methods. For example, if only one of the lasers is used for processing, it is only necessary to control the corresponding laser to emit laser for processing; if dual lasers are required for alternating processing, dual lasers are used for alternating processing on the same workpiece to be processed; if dual laser beam combination is required for joint processing, the two lasers are controlled to emit laser processing products at the same time, so that the laser processing device can be suitable for a variety of application scenarios and has strong practicality.

[0046] Based on the above embodiments, the present application also discloses another specific implementation method. Figure 2 As shown, the difference between this embodiment and the above-mentioned embodiment is that, in this embodiment, a plurality of processing heads are provided, and the laser processing device further comprises a beam splitter component 7, which is arranged on the reflecting light path of the arc reflector 6, and the beam splitter component 7 is used to split the laser reflected by the arc reflector 6 into a plurality of laser beams, and make each laser beam be respectively emitted into each processing head, so as to process the PCB board simultaneously through the plurality of processing heads.

[0047] Continue to refer to Figure 2 As shown, the processing head includes a first processing head 31 and a second processing head 32, and the beam splitter assembly 7 includes a 1 / 2 wave plate 71, a beam splitter lens 72 and a fifth reflector 73. The 1 / 2 wave plate 71 is arranged on the reflected light path of the arc reflector 6, the beam splitter lens 72 is arranged on the transmitted light path of the 1 / 2 wave plate 71, and the fifth reflector 73 is arranged on the transmitted light path of the beam splitter lens 72. The first processing head 31 is arranged on the reflected light path of the beam splitter lens 72, and the second processing head 32 is arranged on the reflected light path of the fifth reflector 73. Among them, the 1 / 2 wave plate is used to change the polarization direction of the laser beam, and the beam splitter lens is used to split the incident light into two different beams at a specified ratio.

[0048] In actual applications, the deflection angles of the first reflector 41, the second reflector 42, the third reflector 51 and the fourth reflector 52 can be adjusted so that the point and reflection angle reflected by the second reflector 42 to the arc reflector 6 are the same as the point and reflection angle reflected by the fourth reflector 52 to the arc reflector 6; the laser is then split into two lights with different polarization directions by a 1 / 2 wave plate, and then the light is split into a beam of transmitted light and a beam of reflected light by a beam splitter 72, and the beams of light split by the beam splitter 72 are respectively emitted into each processing head.

[0049] During processing, if the first laser 1 is required, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits a first laser, and the first laser is reflected to the arc reflector 6 by the first reflector 41 and the second reflector 42 in sequence, and is reflected to the 1 / 2 wave plate 71 by the arc reflector 6, and the polarization direction of the laser is changed by the 1 / 2 wave plate 71 and then enters the beam splitter 72, so as to be split by the beam splitter 72, wherein a part of the laser is reflected by the beam splitter 72 and then enters the first processing head 31, and the other part of the laser is transmitted through the beam splitter 72 and then enters the fifth reflector 73, and then is reflected by the fifth reflector 73 into the second processing head 32, so that the first processing head 31 and the second processing head 32 can simultaneously process the PCB board based on the laser emitted by the first laser 1. If the second laser 2 is required for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits a second laser. The second laser is reflected to the arc reflector 6 by the third reflector 51 and the fourth reflector 52 in sequence, and is reflected to the 1 / 2 wave plate 71 by the arc reflector 6. The polarization direction of the laser is changed by the 1 / 2 wave plate 71 and then enters the beam splitter 72, so as to be split by the beam splitter 72, wherein a part of the laser is reflected by the beam splitter 72 and then enters the first processing head 31, and the other part of the laser is transmitted through the beam splitter 72 and then enters the fifth reflector 73, and then is reflected by the fifth reflector 73 into the second processing head 32, so that the first processing head 31 and the second processing head 32 can simultaneously process the PCB board based on the laser emitted by the second laser 2. If the first laser 1 and the second laser 2 are used for processing at the same time, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits the first laser and the second laser 2 emits the second laser. At this time, the first laser is reflected to the arc reflector 6 by the first reflector 41 and the second reflector 42 in sequence, and the second laser is reflected to the arc reflector 6 by the third reflector 51 and the fourth reflector 52 in sequence, and then the first laser and the second laser are combined by the arc reflector 6. The beam is then reflected to the 1 / 2 wave plate 71, and the polarization direction of the laser is changed by the 1 / 2 wave plate 71 and then incident on the beam splitter 72, so as to be split by the beam splitter 72, wherein a part of the laser is reflected by the beam splitter 72 and then incident on the first processing head 31, and the other part of the laser is transmitted through the beam splitter 72 and then incident on the fifth reflector 73, and then reflected by the fifth reflector 73 into the second processing head 32, so that the first processing head 31 and the second processing head 32 can simultaneously process the PCB board based on the lasers emitted by the first laser 1 and the second laser 2.

[0050] This embodiment can realize a variety of processing methods. For example, if only one of the lasers is used for processing, it is only necessary to control the corresponding laser to emit laser for processing; if dual lasers are required for alternating processing, dual lasers are used for alternating processing on the same workpiece to be processed; if dual laser beam combination is required for joint processing, the two lasers are controlled to emit laser processing products at the same time, so that the laser processing device can be suitable for a variety of application scenarios and has strong practicality.

[0051] Based on the above embodiments, the present application also discloses another specific implementation method. Figure 3 As shown, the difference between this embodiment and the above-mentioned embodiment is that, in this embodiment, there are multiple processing heads and convex reflectors, respectively, and the laser processing device further includes a first beam splitter component 8 and a second beam splitter component 9. The first beam splitter component 8 is arranged on the outgoing optical path of the first laser 1, and is used to split the laser light emitted by the first laser 1 into multiple first laser beams, so that the multiple first laser beams are sequentially reflected to each processing head through the first reflection component 4 and each convex reflector. The second beam splitter component 9 is arranged on the outgoing optical path of the second laser 2, and is used to split the laser light emitted by the second laser 2 into multiple second laser beams, so that the multiple second laser beams are sequentially reflected to each processing head through the second reflection component 5 and each convex reflector.

[0052] Continue to refer to Figure 3As shown, the processing head includes a first processing head 31 and a second processing head 32, the arc reflector 6 includes a first convex reflector 61 and a second convex reflector 62, the first reflection component 4 includes a first reflector 41 and a second reflector 42, the second reflection component 5 includes a third reflector 51 and a fourth reflector 52, the first beam splitter component 8 includes a first 1 / 2 wave plate 81, a first beam splitter lens 82 and a sixth reflector 83, the second beam splitter component 9 includes a second 1 / 2 wave plate 91, a second beam splitter lens 92 and a seventh reflector 93, and the laser processing device also includes an eighth reflector 10 and a ninth reflector 11. During installation, the first 1 / 2 wave plate 81 is arranged on the outgoing light path of the first laser 1, the first beam splitter lens 82 is arranged on the transmission light path of the first 1 / 2 wave plate 81, the first reflector 41 is arranged on the reflection light path of the first beam splitter lens 82, the sixth reflector 83 is arranged on the transmission light path of the first beam splitter lens 82, and the second reflector 42 is arranged on the reflection light path of the sixth reflector 83. The second 1 / 2 wave plate 91 is arranged on the emission light path of the second laser 2, the second beam splitter 92 is arranged on the transmission light path of the second 1 / 2 wave plate 91, the third reflector 51 is arranged on the reflection light path of the second beam splitter 92, the seventh reflector 93 is arranged on the transmission light path of the second beam splitter 92, and the fourth reflector 52 is arranged on the reflection light path of the seventh reflector 93. The first convex reflector 61 is arranged on the reflection light path of the first reflector 41 and the third reflector 51, and the second convex reflector 62 is arranged on the reflection light path of the second reflector 42 and the fourth reflector 52. The eighth reflector 10 is arranged on the reflection light path of the first convex reflector 61, and the ninth reflector 11 is arranged on the reflection light path of the second convex reflector 62. The first processing head 31 is arranged on the reflection light path of the eighth reflector 10, and the second processing head 32 is arranged on the reflection light path of the ninth reflector 11.

[0053] In this embodiment, the laser light emitted by the first laser 1 can first be divided into two beams by the first 1 / 2 wave plate 81 and the first beam splitter 82, and the two beams are respectively reflected to the first processing head 31 and the second processing head 32 by the first reflector 41, the second reflector 42, the first convex reflector 61, and the second convex reflector 62; the laser light emitted by the second laser 2 can first be divided into two beams by the second 1 / 2 wave plate 91 and the second beam splitter 92, and the two beams are respectively reflected to the first processing head 31 and the second processing head 32 by the third reflector 51, the fourth reflector 52, the first convex reflector 61, and the second convex reflector 62.

[0054] During processing, if the first laser 1 is required to be used for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits a first laser. The first laser is transmitted into the first beam splitter 82 after the polarization direction is changed by the first 1 / 2 wave plate 81, so that a part of the first laser is reflected to the first reflector 41 by the first beam splitter 82, and then reflected to the first convex reflector 61 by the first reflector 41. The first convex reflector 61 reflects the first laser to the eighth reflector 10 and reflects to the first processing head 31 through the eighth reflector 10, and the other part of the first laser is transmitted to the sixth reflector 83 through the first beam splitter 82, and then reflected to the second convex reflector 62 through the sixth reflector 83 and the second reflector 42. The second convex reflector 62 reflects the first laser to the ninth reflector 11 and reflects to the second processing head 32 through the ninth reflector 11, so that the first processing head 31 and the second processing head 32 can process the plate based on the laser emitted by the first laser 1. If the second laser 2 is required for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits a second laser. The second laser is transmitted into the second beam splitter 92 after the polarization direction is changed by the second 1 / 2 wave plate 91, so that a part of the second laser is reflected to the third reflector 51 by the second beam splitter 92, and then reflected to the first convex reflector 61 by the third reflector 51. The first convex reflector 61 reflects the second laser to the eighth reflector 10 and reflects it to the first processing head 31 through the eighth reflector 10, and the other part of the second laser is transmitted to the seventh reflector 93 through the second beam splitter 92, and then reflected to the second convex reflector 62 through the seventh reflector 93 and the fourth reflector 52. The second convex reflector 62 reflects the second laser to the ninth reflector 11 and reflects it to the second processing head 32 through the ninth reflector 11, so that the first processing head 31 and the second processing head 32 can process the plate based on the laser emitted by the second laser 2.If the first laser 1 and the second laser 2 are to be used for processing at the same time, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits the first laser and the second laser 2 emits the second laser. The first laser is transmitted into the first beam splitter 82 after the polarization direction is changed by the first 1 / 2 wave plate 81, so that a part of the first laser is reflected to the first reflector 41 by the first beam splitter 82, and is reflected to the first convex reflector 61 by the first reflector 41, and another part of the first laser is transmitted to the sixth reflector 83 by the first beam splitter 82, and is reflected to the second convex reflector 62 by the sixth reflector 83 and the second reflector 42 in sequence; at the same time, the second laser is transmitted to the second 1 The / 2 wave plate 91 changes the polarization direction and then transmits into the second beam splitter 92, so that a part of the second laser is reflected by the second beam splitter 92 to the third reflector 51, and then reflected by the third reflector 51 to the first convex reflector 61, and another part of the second laser is transmitted to the seventh reflector 93 through the second beam splitter 92, and is reflected by the seventh reflector 93 and the fourth reflector 52 to the second convex reflector 62 in sequence; then, the first laser and the second laser are combined by the first convex reflector 61 and reflected to the eighth reflector 10, and then reflected to the first processing head 31 through the eighth reflector 10, and then the first laser and the second laser are combined by the second convex reflector 62 and reflected to the ninth reflector 11, and then reflected to the second processing head 32 through the ninth reflector 11.

[0055] This embodiment can realize a variety of processing methods. For example, if only one of the lasers is used for processing, it is only necessary to control the corresponding laser to emit laser for processing; if dual lasers are required for alternating processing, dual lasers are used for alternating processing on the same workpiece to be processed; if dual laser beam combination is required for joint processing, the two lasers are controlled to emit laser processing products at the same time, so that the laser processing device can be suitable for a variety of application scenarios and has strong practicality.

[0056] Correspondingly, an embodiment of the present application further discloses a laser processing equipment, which includes a workbench and a laser processing device.

[0057] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laser processing device, characterized in that: It includes a processing head, a curved reflector, a first optical path mechanism, a second optical path mechanism and a controller; The first optical path mechanism includes a first laser and a first reflecting component, the first laser is used to emit a first laser, and the first reflecting component is arranged on the outgoing optical path of the first laser, and is used to reflect the first laser to the reflection point of the arc reflector; The second optical path mechanism includes a second laser and a second reflecting component, the second laser is used to emit a second laser, and the second reflecting component is arranged on the outgoing optical path of the second laser, and is used to reflect the second laser to the reflection point of the arc reflector; The arc reflector is arranged on the reflection light path of the first reflection component and the second reflection component, and is used to reflect the first laser or the second laser to the processing head, or to combine the first laser and the second laser and reflect them to the processing head; The controller is electrically connected to the first laser, the second laser and the processing head respectively, and is used to control the operation of the first laser, the second laser and the processing head.

2. The laser processing device according to claim 1, characterized in that: The pulse width of the first laser emitted by the first laser is different from the pulse width of the second laser emitted by the second laser, so that the first laser and the second laser can cut workpieces of different materials to be processed, wherein the workpieces to be processed include a first material and a second material covering and attached to the first material, the first material includes copper foil, and the second material includes a covering film.

3. The laser processing device according to claim 1, characterized in that: The arc reflector is a convex reflector, and the convex reflector is provided with an arc-shaped reflective surface protruding outwards, or The arc reflector is configured as a concave reflector, and the concave reflector is provided with an inwardly concave arc reflective surface.

4. The laser processing device according to claim 3, characterized in that: The first reflection assembly includes a first reflection mirror and a second reflection mirror, and the first reflection mirror and the second reflection mirror are sequentially arranged on the outgoing light path of the first laser, so that the laser light emitted by the first laser can be sequentially reflected to the processing head by the first reflection mirror, the second reflection mirror and the arc reflection mirror; The second reflection component includes a third reflection mirror and a fourth reflection mirror, and the third reflection mirror and the fourth reflection mirror are sequentially arranged on the output light path of the second laser, so that the laser emitted by the second laser can be reflected to the processing head via the third reflection mirror, the fourth reflection mirror and the curved reflection mirror in sequence.

5. The laser processing device according to claim 4, characterized in that: The incident angle of the laser emitted by the first laser on the first reflector is α, 30゜≤α≤60゜, the incident angle of the laser reflected by the first reflector on the second reflector is β, 0≤β≤45゜, the incident angle of the laser emitted by the second laser on the third reflector is δ, 30゜≤δ≤60゜, and the incident angle of the laser reflected by the third reflector on the fourth reflector is γ, 0≤γ≤45゜.

6. The laser processing device according to claim 1, characterized in that: There are multiple processing heads, and the laser processing device also includes a spectrometer component, which is arranged on the reflection light path of the arc reflector and is used to split the laser reflected by the arc reflector into multiple laser beams, so that each beam of the laser is respectively emitted into each processing head.

7. The laser processing device according to claim 6, characterized in that: The processing head includes a first processing head and a second processing head, the spectroscopic component includes a 1 / 2 wave plate, a spectroscopic lens and a fifth reflector, the 1 / 2 wave plate and the spectroscopic lens are sequentially arranged on the reflected light path of the arc reflector, the fifth reflector is arranged on the lens light path of the spectroscopic lens, the first processing head is arranged on the reflected light path of the spectroscopic lens, and the second processing head is arranged on the reflected light path of the fifth reflector.

8. The laser processing device according to claim 1, characterized in that: The processing head and the arc reflector are respectively provided with a plurality of them, and the laser processing device further comprises a first beam splitter component and a second beam splitter component, wherein the first beam splitter component is arranged on the output light path of the first laser, and is used to split the laser light emitted by the first laser into a plurality of first laser beams, so that the plurality of first laser beams are sequentially reflected by the first reflector component and each of the arc reflectors to each of the processing heads; The second beam splitter component is arranged on the outgoing light path of the second laser, and is used to split the laser light emitted by the second laser into multiple second laser beams, so that the multiple second laser beams are reflected to each processing head through the second reflection component and each arc reflection mirror in sequence.

9. The laser processing device according to claim 8, characterized in that: The first beam splitter assembly includes a first 1 / 2 wave plate, a first beam splitter lens and a sixth reflector, and the first 1 / 2 wave plate, the first beam splitter lens and the sixth reflector are sequentially arranged on the outgoing light path of the first laser; The second beam splitter assembly includes a second 1 / 2 wave plate, a second beam splitter lens and a seventh reflector. The second 1 / 2 wave plate, the second beam splitter lens and the seventh reflector are sequentially arranged on the outgoing light path of the second laser.

10. The laser processing device according to claim 9, characterized in that: The arc reflector is set as a convex reflector, and the convex reflector includes a first convex reflector and a second convex reflector. The first reflecting assembly includes a first reflector and a second reflector. The first reflector is arranged on the reflecting light path of the first beam splitter, and is used to reflect the laser reflected by the first beam splitter to the first convex reflector. The second reflector is arranged on the reflecting light path of the sixth reflector, so as to reflect the laser transmitted by the first beam splitter to the second convex reflector through the sixth reflector and the second reflector. The second reflecting assembly includes a third reflecting mirror and a fourth reflecting mirror. The third reflecting mirror is arranged on the reflecting light path of the second beam splitter lens, and is used to reflect the laser reflected by the second beam splitter lens to the first convex reflecting mirror. The fourth reflecting mirror is arranged on the reflecting light path of the seventh reflecting mirror, so as to reflect the laser transmitted by the second beam splitter lens to the second convex reflecting mirror through the seventh reflecting mirror and the fourth reflecting mirror.

11. The laser processing device according to claim 10, characterized in that: The processing head includes a first processing head and a second processing head, and the laser processing device also includes an eighth reflector and a ninth reflector. The eighth reflector is arranged on the reflection light path of the first convex reflector, and is used to reflect the laser reflected by the first convex reflector to the first processing head. The ninth reflector is arranged on the reflection light path of the second convex reflector, and is used to reflect the laser reflected by the second convex reflector to the second processing head.

12. A laser processing device, characterized in that: The invention comprises a workbench and a laser processing device as described in any one of claims 1 to 11.

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