Wafer processing system and magazine turnover device

Abstract

The utility model provides a wafer processing system and a magazine turnover device, and relates to the field of semiconductor manufacturing. The wafer processing system comprises a feeding subsystem and a wafer processing machine table. The feeding subsystem comprises a wafer reversing mechanism and a material box turnover mechanism, and the wafer processing machine table comprises a feeding port. The material box turnover mechanism is arranged between the feeding port and the wafer reversing mechanism and comprises a motor, a transmission belt, a turnover shaft, a base and a material box positioning block. And the turnover shaft is mechanically connected with the motor through a transmission belt. The base is fixed to the overturning shaft and located on the periphery of the overturning shaft. The material box positioning block is fixed to the end, away from the overturning shaft, of the base. According to the utility model, the safety of the wafer material box during overturning can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, and in particular to a wafer processing system and a material box turning device. Background Art

[0002] The wet bath process is an important semiconductor manufacturing process, mainly used to produce high-quality semiconductor devices. Before the wet bath process, the wafer needs to be sent to the loading port of the wet bath machine, and then the wafer is grabbed by the clamp of the wet bath machine and sent to the machine for wafer processing.

[0003] In the prior art, when a wafer box is turned over during wafer transportation, the wafer box is generally grabbed by a clamp and turned over in the air. However, such a box turning method has the risk of the box falling during the turning process. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer processing system and a material box turning device, which can at least partially solve the above technical problems.

[0005] In a first aspect, the utility model provides a wafer processing system, the wafer processing system comprises a loading subsystem and a wafer processing machine; the loading subsystem comprises a film reversing mechanism and a material box flipping mechanism, the wafer processing machine comprises a loading port; the material box flipping mechanism is arranged between the loading port and the film reversing mechanism, and comprises a motor, a transmission belt, a flipping shaft, a base and a material box positioning block;

[0006] The flip shaft is mechanically connected to the motor via the transmission belt;

[0007] The base is fixed on the flip shaft and is located outside the flip shaft;

[0008] The material box positioning block is fixed to an end of the base away from the turning axis.

[0009] Optionally, the material box flipping mechanism includes two bases, a first base and a second base, and two material box positioning blocks, a first material box positioning block and a second material box positioning block; the first material box positioning block is fixed on the first base, and the second material box positioning block is fixed on the second base; the first base and the second base form an angle of 90° with the axis of the flip axis as the origin;

[0010] The first material box positioning block is located on a side of the first base close to the second base;

[0011] The second material box positioning block is located on a side of the second base close to the first base.

[0012] Optionally, the wafer processing system further includes a first material box and a second material box;

[0013] The first material box is used to hold the wafer before the wafer is processed to the material box turning mechanism;

[0014] The second material box is provided with a material box positioning hole recessed toward the inside of the second material box, the material box positioning hole corresponds to the material box positioning block, and the shape of the material box positioning hole is adapted to the shape of the material box positioning block.

[0015] Optionally, the material of the second material box is perfluoroalkoxyethylene.

[0016] Optionally, the feeding subsystem further comprises a scanning mechanism; the scanning mechanism comprises a mechanical arm and a light sensor;

[0017] The optical sensor is disposed on the mechanical arm;

[0018] When the robotic arm grabs the wafer in the first material box, the wafer can be scanned by the optical sensor.

[0019] Optionally, the feeding subsystem further comprises a conveying mechanism; the conveying mechanism comprises a first conveying device and a second conveying device;

[0020] The scanning mechanism is arranged at the end of the conveying direction of the first conveying device;

[0021] The second conveying device is arranged between the material box turning mechanism and the loading port.

[0022] Optionally, the film rewinding mechanism includes a fork hand and a laser alignment device;

[0023] The laser alignment device is arranged opposite to the fork hand, and when the fork hand clamps and takes out the wafer, the wafer can be scanned by the laser alignment device.

[0024] Optionally, the wafer processing machine further includes a material unloading port, and the wafer processing system further includes a material unloading subsystem; the material unloading subsystem includes a material unloading and flipping mechanism, a material unloading box flipping mechanism, a material unloading conveying mechanism, and a material unloading scanning mechanism;

[0025] The material unloading scanning mechanism is arranged between the material unloading port and the material unloading box flipping mechanism;

[0026] The material box flipping mechanism is arranged between the material scanning mechanism and the material reversing mechanism;

[0027] The material unloading conveying mechanism comprises a third conveying device and a fourth conveying device, and the third conveying device is located between the material unloading port and the material unloading scanning mechanism;

[0028] The unloading and reversing mechanism is arranged at the starting end of the conveying direction of the fourth conveying device.

[0029] Optionally, the wafer processing system further includes an overhead crane;

[0030] The overhead travelling crane is arranged between the scanning mechanism and the material unloading scanning mechanism.

[0031] In a second aspect, the utility model provides a material box turning device, which is applied to a wafer processing system; the material box turning device includes a motor, a transmission belt, a turning shaft, a base and a material box positioning block;

[0032] The flip shaft is mechanically connected to the motor via the transmission belt;

[0033] The base is fixed on the flip shaft and is located outside the flip shaft;

[0034] The material box positioning block is fixed to an end of the base away from the turning axis.

[0035] The beneficial effects of the wafer processing system and the material box turning device provided by the utility model are:

[0036] By setting a material box flipping mechanism including a motor, a transmission belt, a flip shaft, a base and a material box positioning block, when the material box needs to be flipped, the material box is fixed on the flip shaft based on the material box positioning block, and the motor drives the transmission belt to move so that the flip shaft flips. Since the material box positioning block is set, the material box will not be displaced during the flipping process, and the material box is fixed on the flip shaft, and the risk of falling is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 A schematic diagram of a wafer processing system provided by an embodiment of the utility model;

[0039] Figure 2 A schematic diagram of the structure of the material box turning mechanism provided in an embodiment of the utility model;

[0040] Figure 3 A schematic diagram of a material box flipping provided in an embodiment of the utility model;

[0041] Figure 4A schematic diagram of the position of a scanning mechanism provided in an embodiment of the utility model;

[0042] Figure 5 A schematic diagram of the structure of a scanning mechanism provided by an embodiment of the utility model;

[0043] Figure 6 A schematic diagram of the structure of a film rewinding mechanism provided in an embodiment of the utility model;

[0044] Figure 7 A schematic diagram of the position of a transmission mechanism provided in an embodiment of the utility model;

[0045] Figure 8 A schematic diagram of a material unloading subsystem provided in an embodiment of the utility model.

[0046] Icons: 01-wafer processing system; 10-loading subsystem; 101-film rewinding mechanism; 1011-fork arm; 1012-laser alignment device; 102-material box flipping mechanism; 1021-motor; 1022-transmission belt; 1023-flip axis; 1024-base; 1025-material box positioning block; 103-scanning mechanism; 1031-robot arm; 1032-light sensor; 104-transmission mechanism; 1041-first transmission device; 1042-second transmission device; 11-wafer processing machine; 111-loading port; 112-unloading port; 12-unloading subsystem; 121-unloading scanning mechanism; 122-unloading material box flipping mechanism; 123-unloading film rewinding mechanism; 124-unloading transmission mechanism; 1241-third transmission device; 1242-fourth transmission device. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0050] In the description of the present utility model, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model.

[0051] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0052] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In the prior art, before the wafer is subjected to wet tank processing, the wafer box is generally grabbed by a clamp and flipped in the air, so that the wafer is placed vertically instead of horizontally. The flipped wafer box is then grabbed in front of a scanning device to detect whether the structure of the wafer is damaged and whether the quantity is correct. After scanning, the wafer box is sent to the loading end of the wet tank machine for wet tank processing.

[0054] However, flipping the magazine in mid-air increases the risk of the magazine falling. In addition, the stability of the wafer in a vertical state is worse than that in a horizontal state, so scanning the wafer in a vertical state is more likely to cause scanning errors.

[0055] Based on the above situation, the embodiments of this specification provide a wafer processing system and a material box flipping device, which can effectively alleviate the above technical problems.

[0056] See also Figure 1 as well as Figure 2The present embodiment provides a wafer processing system 01, which includes a loading subsystem 10 and a wafer processing machine 11. The loading subsystem 10 includes a film reversing mechanism 101 and a material box flipping mechanism 102, and the wafer processing machine 11 includes a loading port 111. The material box flipping mechanism 102 is disposed between the loading port 111 and the film reversing mechanism 101, and includes a motor 1021, a transmission belt 1022, a flip shaft 1023, a base 1024, and a material box positioning block 1025.

[0057] The turning shaft 1023 is mechanically connected to the motor 1021 via a transmission belt 1022. The base 1024 is fixed on the turning shaft 1023 and is located outside the turning shaft 1023. The material box positioning block 1025 is fixed on the base 1024 at one end away from the turning shaft 1023.

[0058] like Figure 1 As shown, when processing the wafer, the wafer needs to be first transported to the film reversing mechanism 101 for reversing, that is, a certain number of wafers are taken out of the material box where they were originally placed and placed in another material box. Then the wafer and the material box are transported to the material box flipping mechanism 102, so that the wafers originally stacked horizontally are rotated 90° in the vertical direction in the material box to become an upright state. Finally, the flipped material box containing the wafers is transported to the loading port 111 of the wafer processing machine 11, the material box containing the wafers is removed, and the wafers are sent to the wafer processing machine 11 for wet tank processing.

[0059] like Figure 2 As shown, when the magazine is turned over, the magazine containing the wafers can be placed on the magazine positioning block 1025 of the magazine turning mechanism 102, so that the magazine is fixed on the base 1024, and the magazine positioning block 1025 limits the movement of the magazine on the base 1024. When the magazine starts to be turned over, the motor 1021 rotates to drive the transmission belt 1022 to move, thereby causing the turning shaft 1023 to rotate counterclockwise / clockwise, thereby driving the magazine to rotate in the vertical direction to complete the turning of the magazine.

[0060] Optionally, the magazine flipping mechanism 102 includes two bases 1024, a first base 1024 and a second base 1024, and two magazine positioning blocks 1025, a first magazine positioning block 1025 and a second magazine positioning block 1025. The first magazine positioning block 1025 is fixed on the first base 1024, and the second magazine positioning block 1025 is fixed on the second base 1024. The first base 1024 and the second base 1024 form a 90° angle with the axis of the flip axis 1023 as the origin. The first magazine positioning block 1025 is located on the first base 1024, close to the second base 1024. The second magazine positioning block 1025 is located on the second base 1024, close to the first base 1024.

[0061] Still Figure 2 For example, the first base 1024 may be Figure 2 Any one of the bases 1024, the second base 1024 is another base 1024 different from the first base 1024. The first material box positioning block 1025 is the material box positioning block 1025 on the first base 1024, and the second material box positioning block 1025 is the material box positioning block 1025 on the second base 1024.

[0062] by Figure 2 The base 1024 with the middle number is the first base 1024. Figure 2 Taking the first box positioning block 1025 as an example, the first base 1024 extends outward from the axis of the flip axis 1023 in a direction that forms a 90° angle with the second base 1024 extending outward from the axis of the flip axis 1023. When placing the box, the bottom and one side of the box can be fixed by the box positioning block 1025, so that the box can neither move horizontally nor be displaced vertically relative to the base 1024. Figure 3 As shown, when flipping, the first base 1024 and the second base 1024 are simultaneously rotated 90° counterclockwise, so that the material box A is Figure 3 The state shown in part a is flipped to Figure 3 The state shown in part b in the middle completes the flipping of the material box.

[0063] Optionally, the wafer processing system 01 further includes a first material box and a second material box. The first material box is used to hold wafers before the wafers are processed to the material box turning mechanism 102.

[0064] The second material box is provided with a material box positioning hole recessed toward the inside of the second material box, the material box positioning hole corresponds to the material box positioning block 1025 , and the shape of the material box positioning hole is adapted to the shape of the material box positioning block 1025 .

[0065] In the embodiment of the utility model, before turning over the material box containing the wafers, it is necessary to first perform a flipping operation on the wafers, that is, taking the wafers out of the first material box and placing them in the second material box. After the flipping is completed, the second material box is flipped by the material box flipping mechanism 102. Among them, since the first material box does not need to be flipped, it is not necessary to have a material box positioning hole, and the second material box needs to be provided with a material box positioning hole that is recessed into the inside of the second material box, and the material box positioning hole corresponds to the material box positioning block 1025 and the shape is adapted to the shape of the material box positioning block 1025.

[0066] Optionally, the material of the second cartridge is perfluoroalkoxyethylene.

[0067] Perfluoroalkoxyethylene has excellent heat resistance, chemical corrosion resistance and electrical insulation properties. In the manufacturing process of semiconductor devices, perfluoroalkoxyethylene materials can be made into various tools, such as a basket for cleaning wafers, a soaking bucket, and a beaker for etching and removing photoresist. Therefore, in the present invention, perfluoroalkoxyethylene can be used as the material of the second material box.

[0068] Alternatively, if Figure 4 as well as Figure 5 As shown, the loading subsystem 10 further includes a scanning mechanism 103 . The scanning mechanism 103 includes a mechanical arm 1031 and a light sensor 1032 .

[0069] The optical sensor 1032 is disposed on the robot arm 1031 . When the robot arm 1031 grabs the wafer in the first material box, the wafer can be scanned by the optical sensor 1032 .

[0070] like Figure 4 As shown in FIG. 1 , before the wafer reaches the wafer reversing mechanism 101, it will first be scanned by the scanning mechanism 103. The scanning mechanism 103 is as shown in FIG. Figure 5 As shown, on the wafer conveying path, the mechanical arm 1031 of the scanning mechanism 103 grabs the wafer and scans it through the light sensor 1032. When the wafer blocks the light, a signal is generated, and when it does not block the light, another signal is generated, thereby obtaining information on the thickness and quantity of the wafer.

[0071] Alternatively, if Figure 6 As shown, the film rewinding mechanism 101 includes a fork arm 1011 and a laser alignment device 1012 .

[0072] The laser alignment device 1012 is arranged opposite to the fork arm 1011 , and when the fork arm 1011 grabs and takes out the wafer, the wafer can be scanned by the laser alignment device 1012 .

[0073] After the wafer is scanned by the scanning mechanism 103, it arrives at the position of the film rewinding mechanism 101. The fork 1011 of the film rewinding mechanism 101 moves each wafer from Figure 6 The wafers are taken out from the first material box shown in the figure, and laser alignment is performed at the laser alignment device 1012 to check whether each wafer has a gap. After laser alignment, the fork 1011 places each wafer in the second material box in turn for the next process.

[0074] Alternatively, if Figure 7 As shown, the loading subsystem 10 further includes a conveying mechanism 104. The conveying mechanism 104 includes a first conveying device 1041 and a second conveying device 1042.

[0075] The scanning mechanism 103 is disposed at the end of the conveying direction of the first conveying device 1041. The second conveying device 1042 is disposed between the material box turning mechanism 102 and the loading port 111.

[0076] See also Figure 7 When performing wet tank processing, the wafer is first placed in the first material box, and the wafer is transferred to the scanning mechanism 103 by the first conveying device 1041 of the conveying mechanism 104. After the film reversing mechanism 101 moves the wafer from the first material box to the second material box, the material box flipping mechanism 102 flips the second material box, and after the flipping is completed, the second conveying device 1042 transfers the flipped second material box containing the wafer to the loading port 111, so as to send the wafer to the wafer processing machine 11 for processing.

[0077] Alternatively, if Figure 8 As shown, the wafer processing machine 11 further includes a material unloading port 112 , and the wafer processing system 01 further includes a material unloading subsystem 12 . The material unloading subsystem 12 includes a material unloading and flipping mechanism 123 , a material unloading box flipping mechanism 122 , a material unloading conveying mechanism 124 , and a material unloading scanning mechanism 121 .

[0078] The material unloading scanning mechanism 121 is disposed between the material unloading port 112 and the material unloading box flipping mechanism 122. The material unloading box flipping mechanism 122 is disposed between the material unloading scanning mechanism 121 and the material unloading film reversing mechanism 123.

[0079] The unloading conveying mechanism 124 includes a third conveying device 1241 and a fourth conveying device 1242. The third conveying device 1241 is located between the unloading port 112 and the unloading scanning mechanism 121. The unloading film rewinding mechanism 123 is disposed at the starting end of the conveying direction of the fourth conveying device 1242.

[0080] like Figure 8 As shown, after the wafer is processed in the wafer processing machine 11, it is sent out from the unloading port 112. It is transmitted to the unloading scanning mechanism 121 for scanning through the third conveying device 1241. After the scanning is completed, the unloading box flipping mechanism 122 flips the second box containing the wafers so that the wafers are changed from a vertical state to a horizontal stacking state. Then the unloading flipping mechanism 123 takes the wafer out of the second box and places it in the first box, and finally it is transmitted out by the fourth conveying device 1242.

[0081] It should be noted that the structures of the unloading film reversing mechanism 123, the unloading material box flipping mechanism 122, the unloading material conveying mechanism 124 and the unloading material scanning mechanism 121 in the embodiment of the utility model can be the same as the corresponding film reversing mechanism 101, the material box flipping mechanism 102, the conveying mechanism 104 and the scanning mechanism 103 in the loading subsystem, so the embodiments of the utility model specification will not repeat their structures.

[0082] Optionally, the wafer processing system 01 further includes an overhead crane, which is disposed between the scanning mechanism 103 and the material unloading scanning mechanism 121 .

[0083] In order to save the use of the first material box and the second material box, an overhead crane (not shown in the figure) can be set between the scanning mechanism 103 and the unloading scanning mechanism 121. After the wafer is transported from the loading subsystem 10 to the wafer processing machine 11, the first material box and / or the second material box can be transported to the specified position of the unloading subsystem 12 by the overhead crane, so that after the wafer is transferred out from the unloading port 112, it can continue to be contained in the previous first material box and the second material box.

[0084] Based on the same inventive concept, the utility model provides a material box flipping device, which is applied to a wafer processing system 01. The material box flipping device includes a motor, a transmission belt, a flip shaft, a base, and a material box positioning block. The flip shaft is mechanically connected to the motor through a transmission belt. The base is fixed on the flip shaft and is located outside the flip shaft. The material box positioning block is fixed to the side of the flip shaft away from the end of the base. The specific functions and structures of each part have been described in detail in the embodiment of the wafer processing system 01 provided in this specification, and will not be elaborated here.

[0085] By adopting the above solution in the embodiment of the utility model, it is possible to:

[0086] 1. By setting up a material box flipping mechanism including a motor, a transmission belt, a flip shaft, a base and a material box positioning block, when the material box needs to be flipped, the material box is fixed on the flip shaft based on the material box positioning block, and the motor drives the transmission belt to move so that the flip shaft flips. Due to the provision of the material box positioning block, the material box will not be displaced during the flipping process, and the material box is fixed on the flip shaft, so the risk of falling is small.

[0087] 2. Since the material box flipping mechanism is arranged after the scanning mechanism and the film reversing mechanism, the scanning mechanism does not need to scan the wafer in a vertical state, thereby improving the scanning accuracy.

[0088] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer processing system, characterized in that: The wafer processing system includes a loading subsystem and a wafer processing machine; the loading subsystem includes a film reversing mechanism and a material box flipping mechanism, and the wafer processing machine includes a loading port; the material box flipping mechanism is arranged between the loading port and the film reversing mechanism, and includes a motor, a transmission belt, a flip shaft, a base, and a material box positioning block; The flip shaft is mechanically connected to the motor via the transmission belt; The base is fixed on the flip shaft and is located outside the flip shaft; The material box positioning block is fixed to an end of the base away from the turning axis.

2. The wafer processing system according to claim 1, wherein: The material box turning mechanism includes two bases, a first base and a second base, and two material box positioning blocks, a first material box positioning block and a second material box positioning block; The first material box positioning block is fixed on the first base, and the second material box positioning block is fixed on the second base; The first base and the second base form an angle of 90° with the axis of the flip axis as the origin; The first material box positioning block is located on a side of the first base close to the second base; The second material box positioning block is located on a side of the second base close to the first base.

3. The wafer processing system according to claim 2, characterized in that: The wafer processing system also includes a first material box and a second material box; The first material box is used to hold the wafer before the wafer is processed to the material box turning mechanism; The second material box is provided with a material box positioning hole recessed toward the inside of the second material box, the material box positioning hole corresponds to the material box positioning block, and the shape of the material box positioning hole is adapted to the shape of the material box positioning block.

4. The wafer processing system according to claim 3, characterized in that: The material of the second material box is perfluoroalkoxyethylene.

5. The wafer processing system according to claim 3, characterized in that: The feeding subsystem further includes a scanning mechanism; the scanning mechanism includes a mechanical arm and a light sensor; The optical sensor is disposed on the mechanical arm; When the robotic arm grabs the wafer in the first material box, the wafer can be scanned by the optical sensor.

6. The wafer processing system according to claim 5, characterized in that: The feeding subsystem further includes a conveying mechanism; the conveying mechanism includes a first conveying device and a second conveying device; The scanning mechanism is arranged at the end of the conveying direction of the first conveying device; The second conveying device is arranged between the material box turning mechanism and the loading port.

7. The wafer processing system according to claim 1, wherein: The film rewinding mechanism includes a fork and a laser alignment device; The laser alignment device is arranged opposite to the fork hand, and when the fork hand clamps and takes out the wafer, the wafer can be scanned by the laser alignment device.

8. The wafer processing system according to claim 5, characterized in that: The wafer processing machine also includes a material unloading port, and the wafer processing system also includes a material unloading subsystem; the material unloading subsystem includes a material unloading and flipping mechanism, a material unloading box flipping mechanism, a material unloading conveying mechanism, and a material unloading scanning mechanism; The material unloading scanning mechanism is arranged between the material unloading port and the material unloading box flipping mechanism; The material box flipping mechanism is arranged between the material scanning mechanism and the material reversing mechanism; The material unloading conveying mechanism comprises a third conveying device and a fourth conveying device, and the third conveying device is located between the material unloading port and the material unloading scanning mechanism; The unloading and reversing mechanism is arranged at the starting end of the conveying direction of the fourth conveying device.

9. The wafer processing system according to claim 8, characterized in that: The wafer processing system also includes an overhead crane; The overhead travelling crane is arranged between the scanning mechanism and the material unloading scanning mechanism.

10. A material box turning device, characterized in that: Applicable to wafer processing system; the material box flipping device includes a motor, a transmission belt, a flipping shaft, a base and a material box positioning block; The flip shaft is mechanically connected to the motor via the transmission belt; The base is fixed on the flip shaft and is located outside the flip shaft; The material box positioning block is fixed to an end of the base away from the turning axis.

Images