Packaging structure of microphone assembly and microphone

Abstract

The embodiment of the utility model discloses a packaging structure of a microphone assembly and a microphone. The packaging structure of the microphone assembly comprises a substrate; the shell is arranged on one side of the substrate, and a cavity is defined by the shell and the substrate; a first acoustic component, a second acoustic component and a filter element, wherein the first acoustic component, the second acoustic component and the filter element are arranged on the substrate and are accommodated in the cavity; wherein the second acoustic component is internally provided with an impedance conversion module and a signal processing module, the impedance conversion module and the signal processing module are connected to form a signal path, the filter element is arranged on the signal path, and the filter element is used for filtering high-frequency signals and / or low-frequency signals in the electric signals output by the impedance conversion module. According to the utility model, the signal-to-noise ratio is improved, and the cut-off frequency and size of the filter can be adjusted according to different requirements.

Description

Technical Field

[0001] The utility model relates to the field of micro-electromechanical sensors, in particular to a packaging structure of a microphone component and a microphone. Background Art

[0002] MEMS silicon microphones have been increasingly used in electronic products such as headphones, mobile phones, tablets and computers. In particular, high-end mobile phones, ANC headphones and other electronic products have increasingly higher requirements for customizable frequency response. Among them, MEMS silicon microphones, as important devices for sound-to-electric conversion, are required to have high signal-to-noise ratio and good frequency response in specific application frequency bands.

[0003] In the prior art, in order to eliminate interference signals in the circuit, a capacitor or RC circuit is usually added between the output end of the MEMS microphone and GND for filtering. This method will increase the impedance of the ASIC output end and poor performance consistency. Utility Model Content

[0004] The embodiments of the utility model provide a packaging structure of a microphone assembly and a microphone, so as to improve the performance consistency and set the cut-off frequency and size of the filter according to the requirements.

[0005] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:

[0006] In one aspect, a packaging structure of a microphone assembly is provided, comprising:

[0007] substrate;

[0008] A shell is arranged on one side of the substrate, and the shell and the substrate are arranged to form a cavity;

[0009] A first acoustic component, a second acoustic component and a filter element, wherein the first acoustic component, the second acoustic component and the filter element are arranged on the substrate and accommodated in the cavity;

[0010] Among them, the second acoustic component is provided with an impedance conversion module and a signal processing module, the impedance conversion module and the signal processing module are connected to form a signal path, and a filter element is arranged on the signal path, and the filter element is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion module.

[0011] In addition to or as an alternative to one or more of the features disclosed above, one end of the filter element is electrically connected to the output end of the impedance conversion module, and the other end of the filter element is electrically connected to the input end of the signal processing module;

[0012] The output end of the impedance conversion module includes a first output end and a second output end, and the input end of the signal processing module includes a first input end and a second input end, the first output end and the first input end are connected to form a first signal path, and the second output end and the second input end are connected to form a second signal path; a first fulcrum is provided on the first signal path, and the first fulcrum is electrically connected to one end of the filter element, and a second fulcrum is provided on the second signal path, and the second fulcrum is electrically connected to the other end of the filter element.

[0013] In addition to one or more of the features disclosed above, or as an alternative, the second acoustic component includes a first solder pad and a second solder pad, the first solder pad is electrically connected to the first fulcrum, the second solder pad is electrically connected to the second fulcrum, and the two ends of the filter element are electrically connected to the first solder pad and the second solder pad respectively through wires.

[0014] In addition to or as an alternative to one or more of the features disclosed above, the filter element comprises at least one capacitor and / or at least one inductor and / or at least one resistor.

[0015] In addition to or as an alternative to one or more of the features disclosed above, the capacitance of the capacitor ranges from 1 nF to 330 nF.

[0016] In addition to or as an alternative to one or more features disclosed above, the first acoustic component is a MEMS chip, and the second acoustic component is an AS IC chip.

[0017] In addition to or as an alternative to one or more of the features disclosed above, the substrate is provided with a sound hole penetrating along the thickness direction thereof, and the first acoustic component covers the sound hole.

[0018] In addition to or as an alternative to one or more of the features disclosed above, the filtering element includes at least one of a first-order or multi-order RC filtering circuit, an LC filtering circuit, and an RLC filtering circuit.

[0019] On the other hand, another packaging structure of a microphone assembly is provided, comprising:

[0020] substrate;

[0021] A shell is arranged on one side of the substrate, and the shell and the substrate are arranged to form a cavity;

[0022] A first acoustic component, a second acoustic component, an impedance conversion chip and a filter element, wherein the first acoustic component, the second acoustic component, the impedance conversion chip and the filter element are arranged on the substrate and accommodated in the cavity;

[0023] Among them, a signal processing module is provided in the second acoustic component, the impedance conversion chip and the signal processing module are connected to form a signal path, and a filter element is arranged on the signal path, and the filter element is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion chip.

[0024] On the other hand, another packaging structure of a microphone assembly is provided, comprising:

[0025] substrate;

[0026] A shell is arranged on one side of the substrate, and the shell and the substrate are arranged to form a cavity;

[0027] A first acoustic component, a second acoustic component, and an integrated chip, wherein the first acoustic component, the second acoustic component, and the integrated chip are arranged on the substrate and accommodated in the cavity;

[0028] Among them, a signal processing module is provided in the second acoustic component, an impedance conversion module and a filtering module are provided in the integrated chip, the impedance conversion module and the signal processing module are connected to form a signal path, the filtering module is arranged on the signal path, and the filtering module is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion module.

[0029] On the other hand, a microphone is further disclosed. In addition to or as an alternative to one or more of the features disclosed above, the microphone includes a packaging structure of the microphone assembly as described in any one of the above items.

[0030] One of the above technical solutions has the following advantages or beneficial effects: The present application sets the filter element on the signal path between the impedance conversion module and the signal processing module, avoiding the problem in the prior art that the filter element is set between the first acoustic component and the second acoustic component, causing the capacitance change signal output by the first acoustic component to be attenuated and susceptible to interference. It also avoids the problem in the prior art that the filter element is set at the output end of the second acoustic component, causing the impedance of the output end of the second acoustic component to increase and the performance consistency to be poor. The present application sets the filter element on the signal path between the impedance conversion module and the signal processing module, significantly improving the performance consistency, and the filter element, as an external adjustable component, can adjust the cutoff frequency and size of the filter according to different needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0032] Figure 1It is a circuit diagram of a packaging structure of a microphone assembly provided according to the first embodiment of the present utility model.

[0033] Figure 2 It is a cross-sectional schematic diagram of a packaging structure of a microphone assembly provided according to the first embodiment of the present utility model.

[0034] Figure 3 It is a top view of a packaging structure of a microphone assembly provided according to the first embodiment of the present utility model.

[0035] Figure 4 It is a circuit diagram of a packaging structure of a microphone assembly provided according to the second embodiment of the present utility model.

[0036] Figure 5 It is a schematic diagram of a frequency response curve of a packaging structure of a microphone assembly provided according to the second embodiment of the present utility model.

[0037] Figure 6 It is a circuit diagram of a packaging structure of a microphone assembly provided according to the third embodiment of the present invention.

[0038] Figure 7 It is a cross-sectional schematic diagram of a packaging structure of a microphone assembly provided according to Embodiment 3 of the present utility model.

[0039] Figure 8 This is a circuit diagram of a packaging structure of a microphone assembly provided according to Embodiment 4 of the present utility model.

[0040] Fig. 9 It is a cross-sectional schematic diagram of a packaging structure of a microphone assembly provided according to a fourth embodiment of the present utility model.

[0041] Fig.10 This is a circuit diagram of a packaging structure of a microphone assembly provided according to Embodiment 5 of the present utility model.

[0042] Fig.11 It is a cross-sectional schematic diagram of a packaging structure of a microphone assembly provided according to Embodiment 5 of the present utility model.

[0043] In the figure: 1-substrate; 101-welding ring; 102-sound hole; 2-shell; 3-first acoustic component; 4-second acoustic component; 41-impedance conversion module; 42-signal processing module; 5-filtering element; 6-wire; 7-impedance conversion chip; 8-integrated chip; 81-impedance conversion module; 82-filtering module. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.

[0045] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0046] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0047] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] See also Figure 1 to Figure 3 , Figure 1 , Figure 2 and Figure 3 The circuit schematic diagram, cross-sectional schematic diagram and top view of the packaging structure of a microphone assembly provided according to the first embodiment of the utility model are respectively shown. In the first embodiment, the packaging structure of the microphone assembly includes: a substrate 1, a shell 2, a first acoustic component 3, a second acoustic component 4 and a filter element 5. A welding ring 101 adapted to the shell 2 is provided on one side surface of the substrate 1, and the shell 2 is welded and connected to the substrate 1 through the welding ring 101, so that the substrate 1 and the shell 2 are surrounded to form a cavity. A first acoustic component 3, a second acoustic component 4 and a filter element 5 are provided on one side surface of the substrate 1, and the first acoustic component 3, the second acoustic component 4 and the filter element 5 are all accommodated in the cavity. The first acoustic component 3 is used to receive an external input sound wave signal and convert the sound wave signal into a capacitance change signal. The first acoustic component 3 and the second acoustic component 4 are electrically connected, and the second acoustic component 4 converts the capacitance change signal input by the first acoustic component 3 into an electrical signal for output. Among them, an impedance conversion module 41 and a signal processing module 42 are provided in the second acoustic component 4, the impedance conversion module 41 is used to convert and amplify the capacitance change signal input by the first acoustic component 3, and the signal processing module 42 is used to convert the capacitance change signal converted and amplified by the impedance conversion module 41 into an electrical signal, and the impedance conversion module 41 and the signal processing module 42 are connected to form a signal path. The filter element 5 is arranged on the signal path, and the filter element 5 is used to filter out the high-frequency signal and / or low-frequency signal in the electrical signal output by the impedance conversion module 41.

[0049] The present application sets the filter element 5 on the signal path between the impedance conversion module 41 and the signal processing module 42, avoiding the problem in the prior art that the filter element 5 is set between the first acoustic component 3 and the second acoustic component 4, causing the capacitance change signal output by the first acoustic component 3 to be attenuated and susceptible to interference. It also avoids the problem in the prior art that the filter element 5 is set at the output end of the second acoustic component 4, causing the output end impedance of the second acoustic component 4 to increase and the performance consistency is poor. The present application sets the filter element 5 on the signal path between the impedance conversion module 41 and the signal processing module 42, significantly improving the performance consistency, and the filter element 5, as an external adjustable component, can adjust the cutoff frequency and size of the filter according to different needs, thereby improving the modularity of the product.

[0050] In the prior art, the filter is set in the second acoustic component. The area in the second acoustic component is limited, and the values ​​of the capacitor, inductor or resistor in the filter are small, so the filtering effect is limited. The filter element 5 is externally arranged outside the second acoustic component 4. The filter element 5 is an adjustable component. The filter element 5 with different performance can be replaced according to different cutoff frequency application requirements to achieve different filtering effects.

[0051] Specifically, the first acoustic component 3 is a MEMS chip, and the second acoustic component 4 is an ASIC chip.

[0052] Further, the filter element 5 includes at least one of a capacitor, an inductor or a resistor, and the number of the capacitor, the inductor or the resistor is not specifically limited. The filter element 5 includes at least one of a first-order or multi-order RC filter circuit, an LC filter circuit or an RLC filter circuit.

[0053] Furthermore, the filter element 5 includes at least one of a high-pass filter circuit, a low-pass filter circuit and a band-pass filter circuit.

[0054] Furthermore, the first acoustic component 3 has a first electrode and a second electrode, and the second acoustic component 4 has an electrical signal input terminal (Vin), a driving voltage terminal (VBias), a power supply terminal (VDD), a ground terminal (GND), and an electrical signal output terminal. The first electrode of the first acoustic component 3 is electrically connected to the driving voltage terminal of the second acoustic component 4, and the second electrode of the first acoustic component 3 is electrically connected to the electrical signal input terminal of the second acoustic component 4.

[0055] Combination Figure 2 , Figure 3 As shown, a sound hole 102 is provided on the substrate 1 and runs through the thickness thereof, and the first acoustic component 3 covers the through hole. The first acoustic component 3 has a back cavity therein, and the back cavity is connected to the through hole. The first electrode and the second electrode of the first acoustic component 3 are electrically connected to the driving voltage terminal and the electrical signal input terminal of the second acoustic component 4 through the wire 6, respectively. A first soldering pad and a second soldering pad are provided on the surface of the second acoustic component 4 facing away from the substrate 1. Inside the second acoustic component 4, the first soldering pad and the second soldering pad are electrically connected to the output terminal of the impedance conversion module 41 and the input terminal of the signal processing module 42, respectively; outside the second acoustic component 4, the first soldering pad and the second soldering pad are electrically connected to the input terminal and the output terminal of the filter element 5, respectively, through the wire 6.

[0056] In this embodiment, the signal path between the impedance conversion module 41 and the signal processing module 42 passes through the filter element 5 provided outside the second acoustic component 4. In other embodiments, the signal path between the impedance conversion module 41 and the signal processing module 42 is provided in the second acoustic component 4, at least one fulcrum is provided on the signal path, and pads corresponding to the number of fulcrums and electrically connected one by one are provided on the surface of the second acoustic component 4, and the impedance conversion element is electrically connected to the fulcrum through the pads. When there is no filtering requirement, the filter element 5 does not need to be provided, and there is no influence on the internal circuit structure of the second acoustic component 4, and this structure further improves the modularity of the present application.

[0057] Exemplarily, the signal path between the impedance conversion module 41 and the signal processing module 42 is arranged in the second acoustic component 4, a fulcrum is arranged on the signal path between the impedance conversion module 41 and the signal processing module 42, and a pad is arranged on the surface of the second acoustic component 4 and electrically connected to the fulcrum. The impedance element includes a filter, one end of which is electrically connected to the pad through a wire 6, and the other end is electrically connected to the ground terminal to form an RC filter circuit.

[0058] Reference Figure 4 As shown, Figure 4 A circuit diagram of a packaging structure of a microphone assembly provided according to Embodiment 2 of the present utility model is shown. Compared with Embodiment 1, the filter capacitance change signal shown by the first acoustic component 3 to the second acoustic component 4 in Embodiment 2 is a differential signal, and the impedance conversion module 41 converts and amplifies the differential signal and outputs the first signal and the second signal. The output end of the impedance conversion module 41 includes a first output end and a second output end, and the input end of the signal combing module includes a first input end and a second input end. The first output end of the impedance conversion module 41 is connected to the first input end of the signal processing module 42 to form a first signal path, and the second output end of the impedance conversion module 41 is connected to the second input end of the signal processing module 42 to form a second signal path. The first signal and the second signal are respectively input to the signal processing module 42 through the first signal path and the second signal path.

[0059] In this embodiment, a first fulcrum is provided on the first signal path, a second fulcrum is provided on the second signal path, the first fulcrum is electrically connected to a first pad on the surface of the second acoustic component 4, and the second fulcrum is electrically connected to a second pad on the surface of the second acoustic component 4. Both ends of the filter element 5 are electrically connected to the first pad and the second pad through a wire 6, respectively, so that the filter element 5 is connected in parallel between the first signal path and the second signal path, so as to achieve synchronous filtering of the electrical signals in the first signal path and the second signal path of the dual-channel by the filter element 5.

[0060] Combination Figure 5 As shown, Figure 5 A in the figure shows the high-frequency frequency response curve of the microphone used in the present application, and the filter element 5 is a single capacitor. Curve a represents the high-frequency frequency response curve of the microphone when the filter element 5 is connected, and curves b and c are the high-frequency frequency response curves of the microphone connected to capacitors of different capacitances. Among them, the capacitance of the capacitor corresponding to curve c is greater than the capacitance of the capacitor corresponding to curve b. It can be seen from A that within the appropriate capacitance range, the larger the capacitance, the stronger the effect of filtering out high-frequency interference signals, thereby making the high-frequency frequency response curve of the microphone smoother or even tending to be horizontal.

[0061] Furthermore, when the filter element 5 is a single capacitor, the capacitance of the capacitor is 1 nF to 330 nF. Figure 5 B in the figure shows the low-frequency response curve of the microphone used in the present application. The filter element 5 is a single capacitor. Curve a represents the low-frequency response curve of the microphone when the filter element 5 is connected. Curves b and c are the low-frequency response curves of the microphone when capacitors with different capacitances are connected. The capacitance of the capacitor corresponding to curve c is greater than the capacitance of the capacitor corresponding to curve b. From B, it can be seen that within the appropriate capacitance range, the larger the capacitance, the stronger the effect of filtering out low-frequency interference signals, thereby making the low-frequency response curve of the microphone smoother or even tending to be horizontal.

[0062] Combination Figure 6 , Figure 7 As shown, Figure 6 and Figure 7 The circuit diagram and cross-sectional diagram of the packaging structure of a microphone assembly provided according to the third embodiment of the utility model are respectively shown. Compared with the first embodiment, the second acoustic component 4 in the third embodiment is not provided with an impedance conversion module 41, and an impedance conversion chip 7 is provided outside the second acoustic component 4. The impedance conversion chip 7 is arranged on the substrate 1 and accommodated in the cavity. The input end of the impedance conversion chip 7 is electrically connected to the second electrode of the first acoustic component 3 to realize the conversion and amplification function of the capacitance change signal output by the first acoustic component 3. A signal path is formed between the impedance conversion chip 7 and the signal processing module 42 in the second acoustic component 4, and the filter element 5 is connected in series to the signal path to filter out the high-frequency signal and / or low-frequency signal in the electrical signal output by the impedance conversion chip 7.

[0063] Combination Figure 7 As shown, the second electrode of the first acoustic component 3 is electrically connected to the input end of the impedance conversion chip 7 through the wire 6, the output end of the impedance conversion chip 7 is electrically connected to the input end of the filter element 5 through the wire 6, and the output end of the filter element 5 is electrically connected to the electrical signal input end of the second acoustic component 4 through the wire 6.

[0064] Combination Figure 8 , Fig. 9 As shown, Figure 8 and Fig. 9The circuit diagram and cross-sectional diagram of the packaging structure of a microphone assembly provided according to the fourth embodiment of the utility model are respectively shown. Compared with the second embodiment, the second acoustic component 4 in the fourth embodiment is not provided with an impedance conversion module 41, and an impedance conversion chip 7 is provided outside the second acoustic component 4. The impedance conversion chip 7 is arranged on the substrate 1 and accommodated in the cavity. The input end of the impedance conversion chip 7 is electrically connected to the second electrode of the first acoustic component 3 to realize the conversion and amplification function of the capacitance change signal output by the first acoustic component 3. The filtered capacitance change signal shown by the first acoustic component 3 to the second acoustic component 4 is a differential signal, and the impedance conversion module 41 converts and amplifies the differential signal and outputs the first signal and the second signal. The output end of the impedance conversion module 41 includes a first output end and a second output end, and the input end of the signal processing module 42 includes a first input end and a second input end. The first output end of the impedance conversion module 41 is connected to the first input end of the signal processing module 42 to form a first signal path, and the second output end of the impedance conversion module 41 is connected to the second input end of the signal processing module 42 to form a second signal path. The first signal and the second signal are respectively input to the signal processing module 42 through the first signal path and the second signal path.

[0065] In this embodiment, a first fulcrum is provided on the first signal path, a second fulcrum is provided on the second signal path, the first fulcrum and the second fulcrum are both arranged in the second acoustic component 4, the first fulcrum is electrically connected to the first pad on the surface of the second acoustic component 4, and the second fulcrum is electrically connected to the second pad on the surface of the second acoustic component 4. The two ends of the filter element 5 are electrically connected to the first pad and the second pad through the wire 6, respectively, so that the filter element 5 is connected in parallel between the first signal path and the second signal path, so as to realize the filter element 5 to filter out the high-frequency signal and / or low-frequency signal synchronously in the electrical signal in the first signal path and the second signal path of the dual-channel.

[0066] Combination Fig.10 , Fig.11 As shown, Fig.10 and Fig.11The circuit diagram and cross-sectional diagram of the packaging structure of a microphone assembly provided according to the fifth embodiment of the utility model are respectively shown. Compared with the first embodiment, the second acoustic component 4 in the fifth embodiment is not provided with an impedance conversion module 41, and an integrated chip 8 is provided outside the second acoustic component 4, and the integrated chip 8 is arranged on the substrate 1 and accommodated in the cavity. An impedance conversion module 81 and a filter module 82 are provided in the integrated chip 8. The input end of the integrated chip 8 is electrically connected to the second electrode of the first acoustic component 3, and the output end of the integrated chip 8 is electrically connected to the electrical signal input end of the second acoustic component 4. The impedance conversion module 81 and the filter module 82 are arranged on the circuit between the input end and the output end of the integrated chip 8. Among them, the input end of the impedance conversion module 81 is electrically connected to the second electrode of the first acoustic component 3, and the output end of the impedance conversion module 81 forms a signal path with the signal processing module 42 inside the second acoustic component. The filter module 82 is arranged on the signal path to filter out the high-frequency signal and / or low-frequency signal in the electrical signal output by the impedance conversion module 81.

[0067] In this embodiment, the filter module 82 is connected in series to the signal path between the impedance conversion module 81 and the signal processing module 42. The input end of the filter module 82 is electrically connected to the output end of the impedance conversion module 81, and the output end of the filter module 82 is electrically connected to the input end of the signal processing module 42. Fig.11 As shown, the first acoustic component 3 is electrically connected to the input end of the integrated chip 8 through a wire, and the output end of the integrated chip 8 is electrically connected to the second acoustic component 4 through a wire.

[0068] In other embodiments, a fulcrum is provided in the signal path between the impedance conversion module 81 and the signal processing module 42 , one end of the filter module 82 is electrically connected to the fulcrum, and the other end is electrically connected to the ground.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A packaging structure of a microphone assembly, characterized in that: include: base(1); A shell (2) is arranged on one side of the substrate (1), and the shell (2) and the substrate (1) are arranged to form a cavity; A first acoustic component (3), a second acoustic component (4) and a filter element (5), wherein the first acoustic component (3), the second acoustic component (4) and the filter element (5) are arranged on the substrate (1) and accommodated in the cavity; The second acoustic component (4) is provided with an impedance conversion module (41) and a signal processing module (42), the impedance conversion module (41) and the signal processing module (42) are connected to form a signal path, a filter element (5) is provided on the signal path, and the filter element (5) is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion module (41).

2. The packaging structure of the microphone assembly according to claim 1, characterized in that: One end of the filter element (5) is electrically connected to the output end of the impedance conversion module (41), and the other end of the filter element (5) is electrically connected to the input end of the signal processing module (42); The output end of the impedance conversion module (41) includes a first output end and a second output end, and the input end of the signal processing module (42) includes a first input end and a second input end, the first output end and the first input end are connected to form a first signal path, and the second output end and the second input end are connected to form a second signal path; a first fulcrum is provided on the first signal path, and the first fulcrum is electrically connected to one end of the filter element (5); a second fulcrum is provided on the second signal path, and the second fulcrum is electrically connected to the other end of the filter element (5).

3. The packaging structure of the microphone assembly as claimed in claim 2, characterized in that: The second acoustic component (4) comprises a first solder pad and a second solder pad, the first solder pad is electrically connected to the first fulcrum, the second solder pad is electrically connected to the second fulcrum, and two ends of the filter element (5) are electrically connected to the first solder pad and the second solder pad respectively through wires (6).

4. The packaging structure of the microphone assembly according to claim 1, characterized in that: The filter element (5) comprises at least one capacitor and / or at least one inductor and / or at least one resistor.

5. The packaging structure of the microphone assembly as claimed in claim 4, characterized in that: When the filtering element (5) comprises a single capacitor, the capacitance of the capacitor ranges from 1 nF to 330 nF.

6. The packaging structure of the microphone assembly according to claim 1, characterized in that: The first acoustic component (3) is a MEMS chip, and the second acoustic component (4) is an ASIC chip.

7. The packaging structure of the microphone assembly according to claim 1, characterized in that: The substrate (1) is provided with a sound hole (102) penetrating along the thickness direction thereof, and the first acoustic component (3) covers the sound hole (102).

8. The packaging structure of the microphone assembly according to claim 1, characterized in that: The filtering element (5) comprises at least one of a first-order or multi-order RC filtering circuit, an LC filtering circuit, and an RLC filtering circuit.

9. A packaging structure of a microphone assembly, characterized in that: include: base(1); A shell (2) is arranged on one side of the substrate (1), and the shell (2) and the substrate (1) are arranged to form a cavity; A first acoustic component (3), a second acoustic component (4), an impedance conversion chip (7) and a filter element (5), wherein the first acoustic component (3), the second acoustic component (4), the impedance conversion chip (7) and the filter element (5) are arranged on the substrate (1) and accommodated in the cavity; The second acoustic component (4) is provided with a signal processing module (42), the impedance conversion chip (7) and the signal processing module (42) are connected to form a signal path, a filter element (5) is provided on the signal path, and the filter element (5) is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion chip (7).

10. A packaging structure of a microphone assembly, characterized in that: include: base(1); A shell (2) is arranged on one side of the substrate (1), and the shell (2) and the substrate (1) are arranged to form a cavity; A first acoustic component (3), a second acoustic component (4), and an integrated chip (8), wherein the first acoustic component (3), the second acoustic component (4), and the integrated chip (8) are arranged on the substrate (1) and accommodated in the cavity; The second acoustic component (4) is provided with a signal processing module, the integrated chip (8) is provided with an impedance conversion module (81) and a filter module (82), the impedance conversion module (81) and the signal processing module are connected to form a signal path, the filter module (82) is arranged on the signal path, and the filter module (82) is used to filter out high-frequency signals and / or low-frequency signals in the electrical signal output by the impedance conversion module (81).

11. A microphone, characterized in that: It comprises the packaging structure of the microphone assembly as claimed in any one of claims 1 to 8, the packaging structure of the microphone assembly as claimed in claim 9, and the packaging structure of the microphone assembly as claimed in claim 10.

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