Power supply module

Abstract

The utility model relates to the technical field of power supply devices, in particular to a power supply module capable of preventing a Hipot screw from falling into an inner cavity of the power supply module, which comprises a casing containing a charging module, a PCB (printed circuit board) with a screw fixed at an opening at the top of the casing and electrically connected with the charging module, and a cover plate fixed on the PCB, the edge of the PCB is provided with a Hipot screw at the connection part of the PCB and the casing, the baffle structure is arranged adjacent to the Hipot screw, the baffle structure comprises a mounting plate and a surrounding plate, the mounting plate is fixedly connected with the edge of the upper surface of the cover plate, the surrounding plate is fixedly connected with the mounting plate and extends along the thickness direction of the mounting plate, the tail end of the surrounding plate is propped against the upper surface of the PCB, and the edge of the PCB is fixedly connected with the edge of the upper surface of the cover plate. The hoarding half surrounds the Hipot screw, and the hoarding and the PCB define a limiting cavity at the Hipot screw, wherein the limiting cavity is separated from the area between the PCB and the cover plate.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply devices, in particular to a power supply module. Background Art

[0002] Hipot test (High Potential Test) is a test method used to detect the insulation performance of electrical equipment. Before the client application power module leaves the factory, it needs to pass the Hipot test to evaluate its insulation performance under high voltage to ensure that the power module will not have short circuit, leakage or other safety problems under normal use conditions. During the hipot test, the leakage current generated by the product under test under the test high voltage output by the high-voltage machine is detected and compared with the preset value. If the detected leakage current is greater than the judgment current (preset value), the product under test cannot pass the test, the test voltage will be instantly cut off and an alarm will be sounded; if the detected leakage current is less than the preset value, the product under test passes the test, thereby determining the withstand voltage strength of the test piece. During the above test operation, when high voltage is passed into the power module, the resistance value of the varistor on the PCB board decreases, and the voltage is transmitted to the casing through the discharge tube connected to the varistor and a screw fixed on the PCB board (i.e., the Hipot screw), and then forms a loop with the ground to interfere with the Hipot test. Therefore, the Hipot screw needs to be removed during the test to improve the reliability of the Hipot test. Since the Hipot screw is relatively small, it is very easy to fall into the interior of the power module during the disassembly process. The complex module layout of the inner cavity of the power module will increase the difficulty of removing the screw, thereby affecting the installation of the Hipot screw after the Hipot test. Utility Model Content

[0003] Based on this, it is necessary to provide a power supply module that can prevent the Hipot screws from falling into its inner cavity in order to address the above-mentioned shortcomings.

[0004] A power module comprises a casing accommodating a charging module, a PCB board fixed by screws at an opening at the top of the casing and electrically connected to the charging module, and a cover plate fixed on the PCB board, wherein a Hipot screw is provided at an edge of the PCB board at a connection position between the PCB board and the casing, and further comprises a baffle structure arranged adjacent to the Hipot screw, wherein the baffle structure comprises a mounting plate fixedly connected to an edge of an upper surface of the cover plate, and an enclosure plate fixedly connected to the mounting plate and extending along a thickness direction of the mounting plate, wherein an end of the enclosure plate abuts against an upper surface of the PCB board, the enclosure plate semi-encloses the Hipot screw, and the enclosure plate and the PCB board form a limiting cavity separated from an area between the PCB board and the cover plate at the Hipot screw.

[0005] In one of the embodiments, a mounting notch is provided on the edge of the upper surface of the cover plate, and the height of the mounting notch is greater than or equal to the thickness of the mounting plate.

[0006] In one embodiment, the inner contour of the mounting notch is adapted to the outer contour of the mounting plate.

[0007] In one of the embodiments, two limiting holes are provided in the installation notch on the upper surface of the cover plate, and two elastic clips are provided on the lower surface of the installation plate, which are inserted into the limiting holes one by one and abutted against the edges of the limiting holes, and the distance between the two elastic clips is greater than the distance between the two limiting holes.

[0008] In one of the embodiments, the distance between the side end surface of the enclosure plate and the side surface of the cover plate on the side where the enclosure plate is located is smaller than the screw head diameter of the Hipot screw.

[0009] In one of the embodiments, one end surface of the enclosure is flush with the side surface of the cover plate on one side of the Hipot screw, and the other end surface of the enclosure is flush with the side surface of the cover plate on the other side of the Hipot screw.

[0010] In one embodiment, the cross-section of the enclosure is L-shaped.

[0011] In one embodiment, the cross-section of the enclosure is an arc-shaped structure.

[0012] In one embodiment, the Hipot screw is arranged at a corner or a straight edge of the PCB board.

[0013] In one of the embodiments, a reinforcing rib is provided on a side of the enclosure facing away from the limiting cavity.

[0014] When implementing the power module of the utility model, a baffle structure is arranged between the cover plate and the PCB board. The Hipot screw is surrounded by the baffle structure plate, and the Hipot screw is confined in a limiting cavity separated from the area between the PCB board and the cover plate. The problem of difficulty in picking up the Hipot screw due to the Hipot screw falling into the inside of the power module during the removal of the Hipot screw can be avoided, thereby ensuring the effective installation of the Hipot screw after the Hipot test. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of a power supply module in one embodiment of the utility model;

[0016] Figure 2 A top view of a power module in one embodiment of the utility model;

[0017] Figure 3 This is a schematic structural diagram of a cover plate in one embodiment of the utility model;

[0018] Figure 4 A schematic diagram of a baffle structure in one embodiment of the utility model;

[0019] Figure 5 It is a schematic structural diagram of the assembled cover plate and baffle structure in one embodiment of the utility model. DETAILED DESCRIPTION

[0020] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0021] Please combine Figure 1-5 The utility model discloses a power module that can prevent Hipot screws from falling into its inner cavity. The power module includes a housing 100 that accommodates a charging module, a PCB board 200 that is screwed to the top opening of the housing 100 and electrically connected to the charging module, and a cover plate 300 fixed to the PCB board 200. The housing 100 is a hollow rectangular parallelepiped structure as a whole. An opening is provided on the upper surface of the housing 100. The opening is used to provide a passage for the charging module to enter or leave the inner cavity of the housing 100, and the opening runs through the entire upper surface of the housing 100 to reduce the processing difficulty of the housing 100. The outer contour shape of the PCB board 200 and the outer contour shape of the cover plate 300 are both adapted to the inner contour shape of the opening. In this embodiment, a heat dissipation strip 110 is provided on the side of the housing 100, which is used to transfer the heat generated by the operation of the charging module inside the housing 100 to the outside of the housing 100 by heat transfer to prevent the charging module from being overheated and damaged. A Hipot screw 400 is provided at the edge of the PCB board 200 at the connection position between the PCB board 200 and the housing 100. There are multiple options for the location of the Hipot screw 400 according to the arrangement of components of the charging module. In one embodiment, the Hipot screw 400 is provided at the corner of the PCB board 200, that is, the angle between the side surfaces of the PCB board 200 on both sides of the Hipot screw 400 is less than 180. In another embodiment, the Hipot screw 400 is provided at the straight edge of the PCB board 200, that is, the side surfaces of the PCB board 200 on both sides of the Hipot screw 400 are the same surface.

[0022] The power module of this embodiment also includes a baffle structure 500 disposed adjacent to the Hipot screw 400, and the baffle structure 500 is used to separate the Hipot screw 400 from the area between the PCB board 200 and the cover plate 300, so as to prevent the Hipot screw 400 from falling into the area between the PCB board 200 and the cover plate 300 during the disassembly process. In this embodiment, the baffle structure 500 is fixed on the cover plate 300 and abuts against the PCB board 200, and the mounting position of the baffle structure 500 on the cover plate 300 is adapted to the setting position of the Hipot screw 400. Specifically, the baffle structure 500 includes a mounting plate 510 fixedly connected to the edge of the upper surface of the cover plate 300, and a surrounding plate 520 fixedly connected to the mounting plate 510 and extending along the thickness direction of the mounting plate 510, and the end of the surrounding plate 520 abuts against the upper surface of the PCB board 200. That is, the mounting plate 510 is extended along the plane where the upper surface of the cover plate 300 is located, the extension direction of the enclosure 520 is perpendicular to the extension direction of the mounting plate 510, the vertical section of the baffle structure 500 is an inverted L-shaped structure, the mounting plate 510 is used to provide a connection portion between the baffle structure 500 and the cover plate 300, and the enclosure 520 is used to provide a limiting protection portion for the Hipot screw 400. In this embodiment, the baffle structure 500 is made of plastic material, and the mounting plate 510 and the enclosure 520 are integrally formed. In this embodiment, the enclosure 520 semi-surrounds the Hipot screw 400, and the enclosure 520 and the PCB board 200 form a limiting cavity 530 separated from the area between the PCB board 200 and the cover plate 300 at the Hipot screw 400. In this way, during the disassembly and assembly process of the Hipot screw 400, the Hipot screw 400 is always located in the limiting cavity 530, which can avoid the difficulty in picking up the Hipot screw 400 caused by the Hipot screw 400 falling into the area between the PCB board 200 and the cover plate 300.

[0023] In one embodiment, the upper surface edge of the cover plate 300 is provided with a mounting notch 310, and the height of the mounting notch 310 is greater than or equal to the thickness of the mounting plate 510. Thus, when the mounting plate 510 is fixed at the mounting notch 310 of the cover plate 300, the upper surface of the mounting plate 510 is lower than the upper surface of the cover plate 300 or is kept flush with the upper surface of the cover plate 300, so as to avoid the protruding mounting plate 510 on the cover plate 300 interfering with the installation of the power module during the later installation process of the power module. Furthermore, the inner contour shape of the mounting notch 310 is adapted to the outer contour shape of the mounting plate 510, so as to facilitate the rapid positioning of the mounting plate 510, and avoid the problem of difficulty in aligning the mounting position on the mounting plate 510 with the mounting position on the mounting notch 310 caused by the shaking of the mounting plate 510 in the mounting notch 310, thereby reducing the installation difficulty of the baffle structure 500.

[0024] In this embodiment, the upper surface of the cover plate 300 is provided with two limiting holes 320 in the installation notch 310, and the lower surface of the mounting plate 510 is provided with two elastic clips 540 which are inserted into the limiting holes 320 one by one and abutted against the edges of the limiting holes 320, and the distance between the two elastic clips 540 is greater than the distance between the two limiting holes 320. Further preferably, a guide portion 550 is provided at the lower portion of the elastic buckle 540, and a side of the guide portion 550 adjacent to the other elastic buckle 540 is a vertical plane, and a side of the guide portion 550 facing away from the other elastic buckle 540 is a conical surface, and the width of the lower end of the guide portion 550 is smaller than the width of the upper end of the guide portion 550. In this way, during the process of inserting the elastic buckle 540 into the corresponding limiting hole 320, the conical surface on the guide portion 550 slides with the inner surface of the limiting hole 320, and drives the elastic buckle 540 to be inserted into the limiting hole 320. As the insertion depth of the guide portion 550 in the limiting hole 320 increases, the distance between the ends of the two elastic buckles 540 decreases, and the elastic buckle 540 is deformed and abuts against the inner surface of the limiting hole 320, thereby firmly locking the mounting plate 510 in the mounting notch 310. In addition, in this embodiment, two semicircular operating holes 511 corresponding to the two limiting holes 320 are formed on the mounting plate 510. The semicircular operating holes 511 are used to provide a gripping portion for the mounting plate 510 so as to grip the mounting plate 510 during the disassembly and assembly of the power module.

[0025] In one embodiment, the distance between the side end surface of the enclosing plate 520 and the side surface of the cover plate 300 on the side thereof is smaller than the screw head diameter of the Hipot screw 400, so as to prevent the Hipot screw 400 from entering the area between the PCB board 200 and the cover plate 300 through the gap between the side end surface of the enclosing plate 520 and the edge of the cover plate 300. When the difference between the distance between the side end surface of the enclosing plate 520 and the side surface of the cover plate 300 on the side thereof and the screw head diameter of the Hipot screw 400 is non-zero, the gap between the side end surface of the enclosing plate 520 and the edge of the cover plate 300 is filled with sealant, so as to prevent rainwater from entering the area between the cover plate 300 and the PCB board 200. Further preferably, one side end face of the enclosure 520 is flush with the side face of the cover plate 300 on one side of the Hipot screw 400, and the other side end face of the enclosure 520 is flush with the side face of the cover plate 300 on the other side of the Hipot screw 400, that is, the difference between the distance between the side end face of the enclosure 520 and the side face of the cover plate 300 on its side and the screw head diameter of the Hipot screw 400 is zero.

[0026] In one embodiment, the cross section of the enclosure 520 is an L-shaped structure or an arc-shaped structure, and a connection notch adapted to the cross-sectional shape of the enclosure 520 is provided on one side of the mounting plate 510 adjacent to the enclosure 520. Further, a reinforcing rib 560 is provided on one side of the enclosure 520 facing away from the limiting cavity 530, and the reinforcing rib 560 extends along the height direction of the enclosure 520, and is used to improve the mechanical strength of the enclosure 520, and prevent the enclosure 520 from breaking when subjected to external impact, so as to improve the reliability of the baffle structure 500 in protecting the Hipot screw 400.

[0027] During the Hipot test operation of the above-mentioned power module, the Hipot screw 400 is removed and the test connector of the charging module is connected to the output terminal of the high-voltage machine. High voltage electricity is passed into the casing, so that the leakage current of the charging module under high voltage can be detected, thereby completing the Hipot test of the charging module.

[0028] The above-mentioned power module is provided with a baffle structure 500 between the cover plate 300 and the PCB board 200. The baffle structure 500 surrounds the Hipot screw 400, and the Hipot screw 400 is confined in a limiting cavity 530 separated from the area between the PCB board 200 and the cover plate 300. The problem of difficulty in picking up the Hipot screw 400 due to the Hipot screw 400 falling into the inside of the power module during the removal process can be avoided, thereby ensuring the effective installation of the Hipot screw after the Hipot test.

[0029] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0030] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A power module, comprising a housing containing a charging module, a PCB board fixed at the top opening of the housing by screws and electrically connected to the charging module, and a cover board fixed on the PCB board, wherein a Hipot screw is provided at the edge of the PCB board at the connection position between the PCB board and the housing, characterized in that: It also includes a baffle structure arranged adjacent to the Hipot screw, the baffle structure includes a mounting plate fixedly connected to the edge of the upper surface of the cover plate, and an enclosure fixedly connected to the mounting plate and extending along the thickness direction of the mounting plate, the end of the enclosure abuts against the upper surface of the PCB board, the enclosure half surrounds the Hipot screw, and the enclosure and the PCB board form a limiting cavity separated from the area between the PCB board and the cover plate at the Hipot screw.

2. The power module according to claim 1, characterized in that: An installation notch is provided on the edge of the upper surface of the cover plate, and the height of the installation notch is greater than or equal to the thickness of the installation plate.

3. The power module according to claim 2, characterized in that: The inner contour shape of the installation notch is adapted to the outer contour shape of the installation plate.

4. The power module according to claim 2, characterized in that: The upper surface of the cover plate is provided with two limiting holes in the installation notch, and the lower surface of the installation plate is provided with two elastic clips which are inserted into the limiting holes one by one and abut against the edges of the limiting holes, and the distance between the two elastic clips is greater than the distance between the two limiting holes.

5. The power module according to claim 1, characterized in that: The distance between the side end surface of the enclosure plate and the side surface of the cover plate on the side where the enclosure plate is located is smaller than the screw head diameter of the Hipot screw.

6. The power module according to claim 5, characterized in that: One end surface of the enclosure is flush with the side surface of the cover plate on one side of the Hipot screw, and the other end surface of the enclosure is flush with the side surface of the cover plate on the other side of the Hipot screw.

7. The power module according to claim 1, characterized in that: The cross section of the enclosure plate is an L-shaped structure.

8. The power module according to claim 1, characterized in that: The cross section of the enclosure plate is in an arc-shaped structure.

9. The power module according to claim 1, characterized in that: The Hipot screw is arranged at a corner portion or a straight edge portion of the PCB board.

10. The power module according to claim 1, characterized in that: A reinforcing rib is provided on the side of the enclosure facing away from the limiting cavity.

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