SMA chip batch transfer device

By using the conveyor mechanism of electric walking wheel, synchronous wheel and belt transmission in the SMA chip batch transfer device, combined with the multi-layer frame structure and groove body design, the problems of low transport efficiency and inconvenient operation in the existing technology are solved, and the more Safe and efficient chip pallet transport.

CN222311247UActive Publication Date: 2025-01-07ZIBO CHENQI ELECTRONICS
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Patent Information

Application Number
CN202422966575.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-01-07
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

The existing SMA chip batch transfer devices have low transport efficiency and are inconvenient to pull and insert, which can easily lead to pallet displacement or fall, affecting safety and efficiency.

Method used

A transfer box including electric walking wheel, forward and reverse motor, conveying mechanism and multi-layer frame structure is designed. The pallet is uniformly placed and removed through synchronous wheel and belt transmission, and the groove structure and rotating door are combined to ensure safety and reliability. The transport process.

Benefits of technology

It improves the transport efficiency and safety of SMA chip pallets, reduces the complexity of operations and the risks brought by artificial misoperation, and achieves more efficient insertion and removal of chips and pallets.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an SMA chip batch transfer device, which relates to the technical field of chip transfer and comprises a transfer box, forward and reverse rotation motors are fixedly mounted below two sides of the transfer box, and a conveying mechanism and a multilayer frame structure are mounted in the transfer box. The conveying mechanism is used for driving a multi-layer frame structure to enter an inner cavity of the transfer box or move out of the inner cavity of the transfer box, the multi-layer frame structure comprises a plurality of placing frames distributed up and down, and vertical rods are fixedly connected to the positions, close to an opening of the transfer box, between the placing frames. Handles are fixedly connected to the two sides of the top of the uppermost placing frame. Through the arrangement of the conveying mechanism, the multi-layer frame structure and the groove body structure, the operation of uniformly putting multiple layers of trays loaded with SMA chips into the transfer box or uniformly moving the trays out of the transfer box can be realized, the transfer is safer and more reliable, and the transfer efficiency is further improved.
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Description

Technical Field

[0001] The utility model relates to the field of chip transfer, in particular to a SMA chip batch transfer device. Background Art

[0002] The diode chip is made by SMA packaging, which is called SMA chip. Its size is the smallest compared with SMB and SMC. When transporting in batches, multiple SMA chips need to be placed in a special tray, and the chips are fixed by partition materials or card slots to prevent them from colliding with each other on the tray. The SMA chip in the tray can be processed by various processing techniques, such as photolithography, etching, coating, packaging, etc. Therefore, in the processing of SMA, the SMA chip should be transported between various processing equipment by using a tray. During the specific transportation, the tray needs to be stacked on multiple racks of the transport mechanism, and then the racks are inserted into the transport mechanism one by one. When the transport mechanism is transferred to the predetermined location, the racks need to be taken out one by one, and the trays carrying the chips need to be lifted to the next station. Multiple pulling and inserting racks not only lead to slow transportation efficiency, but also easily cause the trays on the lower racks to move or even fall when pulling the upper racks, which is inconvenient to use. Therefore, the existing technology still has room to further improve the operating efficiency by improving the structure. Utility Model Content

[0003] The purpose of the utility model is to provide a SMA chip batch transport device in order to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an SMA chip batch transfer device, comprising a transfer box with electric walking wheels installed at the four corners of the bottom, forward and reverse motors are fixedly installed under both sides of the transfer box, a conveying mechanism and a multi-layer frame structure are installed inside the transfer box, the conveying mechanism is used to drive the multi-layer frame structure to enter the inner cavity of the transfer box or move out of the inner cavity of the transfer box, the multi-layer frame structure includes a plurality of vertically distributed placement racks, vertical rods are fixedly connected between the plurality of placement racks and near the opening position of the transfer box, and handles are fixedly connected on both sides of the top of the placement rack at the top; a trough structure that passes through the top of the transfer box is provided at the opening of the transfer box, and two rotating doors are rotatably installed at the opening of the transfer box.

[0005] As a further solution of the utility model: the conveying mechanism includes synchronous wheels rotatably installed on both sides of the inner wall of the transfer box, the number of the synchronous wheels is four, two synchronous wheels distributed along the length direction of the transfer box are connected by belt drive, and the two synchronous wheels distributed along the width direction of the transfer box are coaxially connected by a synchronous shaft, and a tensioning wheel for tensioning the belt is rotatably installed on the inner wall of the transfer box, and the output end of the forward and reverse motor passes through the inner cavity of the transfer box and is fixedly connected to one of the synchronous wheels.

[0006] As a further solution of the utility model: the trough structure includes a top trough opened on the top plate of the transfer box and vertical troughs opened on the two side plates of the transfer box, and the top trough is connected to the vertical troughs and is aligned in the up and down directions.

[0007] As a further solution of the utility model: a sealing plate is integrally formed at the top end of the rotating door, and the sealing plate that is closed with the rotating door is used to close the top groove.

[0008] As a further solution of the utility model: slide plates are fixedly connected to both sides of the display rack, the length of the slide plates is smaller than the length of the display rack and the conveying length of the belt, and the tail end of the slide plates is aligned with the tail end of the display rack, and slide grooves for sliding of the slide plates are provided on both sides of the inner wall of the transfer box.

[0009] As a further solution of the utility model: a protrusion is integrally formed at the tail end of the transfer box, and the protrusion is used to accommodate the two synchronous wheels located at the tail end.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] By setting up a conveying mechanism, a multi-layer rack structure and a trough structure, it is possible to uniformly place pallets carrying SMA chips in multiple layers into a transfer box or uniformly move them out of the transfer box. This not only makes the transfer safer and more reliable, but also further improves the transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0014] Figure 3 It is a structural schematic diagram of the conveying mechanism of the utility model;

[0015] Figure 4 It is a structural schematic diagram of the multi-layer frame structure of the utility model.

[0016] In the figure: 1. transfer box; 2. protrusion; 3. trough structure; 4. forward and reverse motor; 5. electric walking wheel; 6. rotating door; 7. sealing plate; 8. top trough; 9. display rack; 10. handle; 11. vertical rod; 12. vertical trough; 13. slide; 14. synchronous wheel; 15. belt; 16. synchronous shaft; 17. tensioning wheel; 18. slide plate. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1 to Figure 4 In the embodiment of the utility model, the SMA chip batch transfer device includes a transfer box 1 with electric walking wheels 5 installed at the four corners of the bottom, and forward and reverse motors 4 are fixedly installed at the bottom of both sides of the transfer box 1. A conveying mechanism and a multi-layer frame structure are installed inside the transfer box 1. The conveying mechanism is used to drive the multi-layer frame structure into the inner cavity of the transfer box 1 or move out of the inner cavity of the transfer box 1. The multi-layer frame structure includes a plurality of placement racks 9 distributed up and down, and vertical rods 11 are fixedly connected between the plurality of placement racks 9 and near the opening position of the transfer box 1. Handles 10 are fixedly connected on both sides of the top of the placement rack 9 located at the top; a trough structure 3 that runs through the top of the transfer box 1 is opened at the opening of the transfer box 1, and two rotating doors 6 are rotatably installed at the opening of the transfer box 1.

[0019] In this embodiment: first, the SMA chip after packaging is placed in the tray, and stacked flatly on the top of each display rack 9 in turn, and then the multi-layer rack mechanism is driven by the handle 10 to transfer into the inner cavity of the transfer box 1, and the bottom end of the display rack 9 located on the second layer is in contact with the conveying mechanism, and the conveying mechanism is started. The conveying mechanism runs and drags the multi-layer rack structure toward the inner cavity of the transfer box 1 until the multi-layer rack structure completely enters the transfer box 1 and closes the rotating door 6; the operation and start of the electric walking wheel 5 are remotely controlled by the remote control, and its travel direction and speed are controlled until the transfer box 1 transfers the chip to the predetermined location, and the rotating door 6 is opened first. At this time, the conveying mechanism is started in the reverse direction, and the conveying mechanism drags the multi-layer rack structure toward the outside of the transfer box 1. During the movement, the handle 10 is held with both hands until the tail end of the display rack 9 enters the slot structure 3. At this time, the handle 10 is pulled upward to synchronously take out the multi-layer rack structure and the chip placed on the display rack 9; the above method can effectively improve the efficiency of putting in and taking out chips and trays, thereby improving the transfer efficiency.

[0020] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The conveying mechanism includes synchronous wheels 14 rotatably installed on both sides of the inner wall of the transfer box 1. There are four synchronous wheels 14. Two synchronous wheels 14 distributed along the length direction of the transfer box 1 are connected by belts 15. Two synchronous wheels 14 distributed along the width of the transfer box 1 are coaxially connected by a synchronous shaft 16. A tensioning wheel 17 for tensioning the belt 15 is rotatably installed on the inner wall of the transfer box 1. The output end of the forward and reverse motor 4 passes through the inner cavity of the transfer box 1 and is fixedly connected to a synchronous wheel 14.

[0021] In this embodiment: first, the forward and reverse motor 4 is started, and the forward and reverse motor 4 drives the synchronous wheel 14 connected to its output end to rotate. The synchronous wheel 14 drives another synchronous wheel 14 to rotate synchronously through the belt 15. The above two synchronous wheels 14 respectively drive the other two synchronous wheels 14 to rotate synchronously through the synchronous shaft 16. Therefore, the two belts 15 have the same transmission direction. When the belt 15 is transmitting, its top forms a drag on the display rack 9 in contact with it, so that the multi-layer rack structure moves inward or outward. The setting of the tensioning wheel 17 can ensure the effective transmission of the belt 15.

[0022] Please refer to Figure 2 and Figure 3 The trough structure 3 includes a top trough 8 opened on the top plate of the transfer box 1 and vertical troughs 12 opened on the two side plates of the transfer box 1. The top trough 8 is connected to the vertical trough 12 and is aligned in the up and down directions. Slide plates 18 are fixedly connected to both sides of the display rack 9. The length of the slide plate 18 is less than the length of the display rack 9 and the conveying length of the belt 15, and the tail end of the slide plate 18 is aligned with the tail end of the display rack 9. Slide grooves 13 for the slide plate 18 to slide are opened on both sides of the inner wall of the transfer box 1.

[0023] In this embodiment: since the length of the slide plate 18 is less than the length of the display rack 9 and the conveying length of the belt 15, the conveying lengths of the display rack 9 and the belt 15 are substantially the same. When the conveying mechanism drives the multi-layer frame structure to move outward, when the slide plate 18 is completely separated from the slide groove 13, the belt 15 still has a supporting effect on the multi-layer frame structure, so that the multi-layer frame structure will not suddenly lose its supporting force and fall suddenly. At this time, the staff has a certain reaction time, and lifts the multi-layer frame structure by pulling the handle 10 while still maintaining its contact transmission with the belt 15. After the multi-layer frame structure is completely separated from the belt 15, it moves upward along the inner wall of the vertical groove 12 and moves outward from the top groove 8, which facilitates the overall removal.

[0024] Please refer to Figure 1 , Figure 2 and Figure 3A sealing plate 7 is integrally formed at the top of the rotating door 6 , and the sealing plate 7 that is closed with the rotating door 6 is used to seal the top groove 8 .

[0025] In this embodiment: when the rotating door 6 is closed, it drives the sealing plate 7 to rotate synchronously. The fully closed rotating door 6 can drive the sealing plate 7 to close the top groove 8, thereby achieving complete closure of the transfer box 1 during the transfer process.

[0026] Please refer to Figure 1 The tail end of the transfer box 1 is integrally formed with a protrusion 2, and the protrusion 2 is used to accommodate two synchronous wheels 14 located at the tail end.

[0027] In this embodiment: this design method can conveniently increase the contact area between the belt 15 and the multi-layer frame structure, making it convenient for the belt 15 to drag and transport the multi-layer frame structure.

[0028] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A SMA chip batch transfer device, comprising a transfer box (1) with electric running wheels (5) installed at the four corners of the bottom, and forward and reverse motors (4) fixedly installed under both sides of the transfer box (1), characterized in that: A conveying mechanism and a multi-layer frame structure are installed inside the transfer box (1), and the multi-layer frame structure includes a plurality of vertically distributed placement racks (9), vertical rods (11) are fixedly connected between the plurality of placement racks (9) and near the opening of the transfer box (1), and handles (10) are fixedly connected on both sides of the top of the placement rack (9) located at the top; a trough structure (3) extending through the top of the transfer box (1) is provided at the opening of the transfer box (1), and two rotating doors (6) are rotatably installed at the opening of the transfer box (1).

2. The SMA chip batch transport device according to claim 1, characterized in that: The conveying mechanism comprises synchronous wheels (14) rotatably mounted on both sides of the inner wall of the transfer box (1), the number of the synchronous wheels (14) being four, two synchronous wheels (14) distributed along the length direction of the transfer box (1) being connected by a belt (15), and two synchronous wheels (14) distributed along the width direction of the transfer box (1) being coaxially connected by a synchronous shaft (16), a tensioning wheel (17) for tensioning the belt (15) being rotatably mounted on the inner wall of the transfer box (1), and the output end of the forward and reverse motor (4) passing through the inner cavity of the transfer box (1) and being fixedly connected to one of the synchronous wheels (14).

3. The SMA chip batch transport device according to claim 2, characterized in that: The trough structure (3) comprises a top trough (8) opened on the top plate of the transfer box (1) and vertical troughs (12) opened on two side plates of the transfer box (1); the top trough (8) is connected to the vertical trough (12) and is aligned in the up and down direction.

4. The SMA chip batch transport device according to claim 3, characterized in that: A sealing plate (7) is integrally formed at the top end of the rotating door (6); the sealing plate (7) that is closed with the rotating door (6) is used to seal the top groove (8).

5. The SMA chip batch transport device according to claim 4, characterized in that: Slide plates (18) are fixedly connected to both sides of the placement rack (9); the length of the slide plate (18) is less than the length of the placement rack (9) and the conveying length of the belt (15); and the rear end of the slide plate (18) is aligned with the rear end of the placement rack (9); and slide grooves (13) for the slide plate (18) to slide are provided on both sides of the inner wall of the transfer box (1).

6. The SMA chip batch transport device according to claim 5, characterized in that: The rear end of the transfer box (1) is integrally formed with a protrusion (2), and the protrusion (2) is used to accommodate the two synchronous wheels (14) located at the rear end.