Semiconductor die bonder and positioning system thereof

Abstract

The utility model provides a semiconductor die bonder and a positioning system thereof, the positioning system comprises a visual acquisition device and a heat insulation protection device, and the heat insulation protection device comprises a heat insulation cylinder, a light transmitting mirror and an air source. An air inlet hole and an air outlet hole are formed in the cylinder wall of the heat insulation cylinder, and the air source is communicated with the air inlet hole and used for filling normal-temperature or low-temperature air into the air inlet hole. Normal-temperature gas enters the thermal insulation protection device through the gas inlet, hot gas generated in the thermal insulation protection device is exhausted through the gas outlet, the interior of the thermal insulation protection device is cooled, meanwhile, the normal-temperature gas is continuously and slowly input for circulation, the gas in the thermal insulation protection device is kept in a normal-temperature state all the time, and therefore image shaking caused by hot air is eliminated; the problem that the picture position and the real position deviate is avoided, the reality of the picture is well ensured, the calculated coordinate is the real position coordinate, the accurate positioning of the die bonding workbench is ensured, the die bonding precision is improved, and the product quality is ensured.

Description

Technical Field

[0001] The utility model belongs to the field of devices used in semiconductor crystal bonding machines, and in particular relates to a semiconductor crystal bonding machine and a positioning system thereof. Background Art

[0002] Semiconductor die bonders are widely used in semiconductor packaging equipment. Some die bond products require heating of the die bond material before they can be bonded, such as eutectic, thermal adhesive sheet, DAF die bond film heating and bonding, etc. Therefore, the workbench needs to add a heating function to heat the material, but due to the influence of the heating temperature, the air above the material will also be heated, and the heated air will be distorted, causing the light to be distorted. The picture taken by the camera above for image positioning and capture will be distorted due to the distortion of light, causing the image and the actual position to be offset, and the higher the temperature, the greater the image offset, and the capture coordinates calculated from the offset image will also be offset. After the offset coordinates are sent to the slide through the PC, the slide will move to the offset position instead of the actual position, causing the final die bond position to be offset, greatly affecting the accuracy of the die bond and the quality of the product. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor die bonding machine and a positioning system thereof, which can solve the problem that the existing image positioning capture technology is affected by the hot air above the material, resulting in inaccurate position capture of the material to be bonded, affecting the bonding accuracy and product quality.

[0004] The utility model is implemented as follows: a positioning system for a semiconductor crystal bonding machine includes a visual acquisition device and a thermal insulation protection device, wherein the thermal insulation protection device includes an insulation tube, a light-transmitting mirror and an air source, the top end of the insulation tube is connected to the visual acquisition device, the bottom end of the insulation tube is equipped with the light-transmitting mirror, and an air inlet and an air outlet are provided on the tube wall of the insulation tube; the air source is connected to the air inlet for filling the air inlet with gas at normal temperature or low temperature.

[0005] Furthermore, the visual acquisition device includes a camera and a lens, the lens is installed at the light inlet of the camera, and the top end of the insulation tube is connected to the lens.

[0006] Furthermore, the thermal insulation protection device also includes a visual combination light, which is installed above the thermal insulation cylinder and is used to provide a light source for the camera.

[0007] Furthermore, the gas source adjusts the amount of gas filled into the insulation cylinder through a throttle valve or by switching gas pipes with different diameters.

[0008] To achieve the above-mentioned purpose, the utility model also provides a semiconductor crystal bonding machine, including a positioning system, a moving mechanism, a crystal bonding workbench and a crystal bonding mechanism, the crystal bonding workbench is used to place the material to be bonded, the moving mechanism is used to drive the crystal bonding workbench to translate, and the crystal bonding mechanism is used to bond the material on the crystal bonding station; the positioning system is located above the crystal bonding workbench, the positioning system sends the collected image information to the host computer, and the host computer then sends a control signal to the moving mechanism to control the crystal bonding workbench to move to the set crystal bonding station.

[0009] Furthermore, the moving mechanism includes an X-axis translation module and a Y-axis translation module, the Y-axis translation module is fixed to the power output end of the X-axis translation module, and the crystal bonding workbench is fixed to the power output end of the Y-axis translation module. When the moving mechanism is working, it can drive the crystal bonding workbench to translate along the X-axis and / or Y-axis direction.

[0010] Furthermore, the semiconductor die bonding machine also includes a pressure plate mechanism and a roller mechanism, wherein the pressure plate mechanism is used to press the frame loaded with the material to be bonded, and the roller mechanism is used to replace the frame.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] The positioning system of the utility model is used in a semiconductor crystal bonding machine, and comprises a visual acquisition device, a heat insulation protection device and an air source. Normal temperature gas enters the heat insulation protection device through an air inlet, and the hot air generated inside is discharged through an air outlet to cool the inside of the device. At the same time, the normal temperature gas is continuously and slowly input for circulation, so that the gas inside the heat insulation protection device is always kept at a normal temperature state, thereby eliminating image shaking caused by hot air, avoiding the problem of offset between the image position and the real position, and ensuring the authenticity of the image well, so that the calculated coordinates are the real position coordinates, ensuring the accurate positioning of the crystal bonding workbench, improving the crystal bonding accuracy, and ensuring product quality.

[0013] The air source can be used to fill the thermal insulation protection device with compressed air or flowing atmosphere, and the air volume can be adjusted by the size of the throttle valve or the air pipe, thereby achieving the effect of image stability and low cost.

[0014] The positioning system has low requirements on the precision of mechanical parts, is easy to assemble, has low manufacturing and maintenance costs, and is easy to debug. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a positioning system of a semiconductor die bonder provided by an embodiment of the utility model;

[0016] Figure 2 yes Figure 1A schematic diagram of the exploded structure of the thermal insulation protection device in the positioning system shown;

[0017] Figure 3 It is a structural schematic diagram of a semiconductor die bonding machine provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0019] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a communication between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0020] Please see Figure 1 , shows a positioning system 10 for a semiconductor die bonder provided in this embodiment, including a visual acquisition device and a thermal insulation protection device, the thermal insulation protection device including a thermal insulation cylinder 1, a light-transmitting mirror 2 and a gas source 3. The thermal insulation cylinder 1 is hollow, and its top end is connected to the visual acquisition device, and the light-transmitting mirror 2 is installed at the bottom end of the thermal insulation cylinder 1 and seals the opening at its bottom end.

[0021] Please see Figure 2 The wall of the heat-insulating cylinder 1 is provided with an air inlet 11 and an air outlet 12, and the air source 3 is connected with the air inlet 11. The air source 3 is a gas pumping device, so that the air source 3 can be used to fill the air inlet 11 with air at normal temperature or low temperature.

[0022] The visual acquisition device includes a camera 5 and a lens 6 . The lens 6 is installed at the light inlet of the camera 5 , and the top end of the heat-insulating tube 1 is connected to the lens 6 .

[0023] Specifically, the heat insulation protection device of this embodiment further includes a visual combination lamp 4 , which is installed above the heat insulation cylinder 1 and is used to provide a light source for the camera 5 .

[0024] Please see Figure 3 The present embodiment further provides a semiconductor die bonding machine, including a positioning system 10, a moving mechanism 20, a die bonding workbench 30, a die bonding mechanism, a pressure plate mechanism 40 and a roller mechanism 50. The die bonding workbench 30 is used to place the material to be bonded, the moving mechanism 20 is used to drive the die bonding workbench 30 to translate, the positioning system 10 is located above the die bonding workbench 30, the positioning system 10 sends the collected image information to the host computer, and the host computer then sends a control signal to the moving mechanism to control the die bonding workbench 30 to move to the set die bonding position, the pressure plate mechanism 40 is used to press the frame loaded with the material to be bonded, the die bonding mechanism is used to bond the material on the die bonding station, and the roller mechanism 50 is used to replace the frame.

[0025] Specifically, the moving mechanism 20 includes an X-axis translation module and a Y-axis translation module. The Y-axis translation module is fixed at the power output end of the X-axis translation module, and the crystal bonding workbench 30 is fixed at the power output end of the Y-axis translation module. When the moving mechanism 20 is working, it can drive the crystal bonding workbench 30 to translate along the X-axis and / or Y-axis direction.

[0026] To summarize, the positioning system 10 of this embodiment is applied to a semiconductor die bonding machine, and room temperature gas enters the insulation tube 1 through the air inlet, and the hot air generated inside is discharged through the air outlet 12 to cool the inside. At the same time, the room temperature gas is continuously and slowly input for circulation, so that the gas inside the insulation tube 1 is always kept at room temperature, thereby eliminating the image shaking caused by hot air and achieving the effect of stabilizing the image. At the same time, with the precise positioning of the die bonding workbench 30, the image capture position of the camera 5 is accurate, the die bonding accuracy is improved, and the product quality is guaranteed.

[0027] The air source 3 can fill the heat insulation protection device with compressed air or flowing atmosphere, and the air volume can be adjusted by the size of the throttle valve or the air pipe, so as to achieve the effect of image stability and low cost.

[0028] The positioning system 10 has low requirements on the precision of mechanical parts, is easy to assemble, has low manufacturing and maintenance costs, and is easy to debug.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning system for a semiconductor die bonder, comprising a visual acquisition device, characterized in that: It also includes a heat insulation protection device, which includes an insulation tube, a light-transmitting mirror and an air source. The top end of the insulation tube is connected to the visual collection device, and the light-transmitting mirror is installed on the bottom end. An air inlet and an air outlet are provided on the wall of the insulation tube; the air source is connected to the air inlet and is used to fill the air inlet with gas at normal temperature or low temperature.

2. The positioning system according to claim 1, characterized in that The visual acquisition device comprises a camera and a lens, wherein the lens is mounted at the light inlet of the camera, and the top end of the heat-insulating cylinder is connected to the lens.

3. The positioning system according to claim 2, characterized in that The heat insulation protection device also includes a visual combination lamp, which is installed above the heat insulation cylinder and is used to provide a light source for the camera.

4. The positioning system according to claim 1, characterized in that The gas source adjusts the amount of gas filled into the heat insulation cylinder through a throttle valve or by switching gas pipes with different diameters.

5. A semiconductor die bonding machine, comprising a moving mechanism, a die bonding workbench and a die bonding mechanism, wherein the die bonding workbench is used to place materials to be bonded, the moving mechanism is used to drive the die bonding workbench to translate, and the die bonding mechanism is used to bond materials on the die bonding station; characterized in that: It also includes a positioning system as described in any one of claims 1 to 4, wherein the positioning system is located above the crystal bonding workbench, and the positioning system sends the collected image information to a host computer, and the host computer then sends a control signal to the moving mechanism to control the crystal bonding workbench to move to a set crystal bonding station.

6. The semiconductor die bonding machine according to claim 5, characterized in that: The moving mechanism includes an X-axis translation module and a Y-axis translation module. The Y-axis translation module is fixed to the power output end of the X-axis translation module, and the crystal bonding workbench is fixed to the power output end of the Y-axis translation module. When the moving mechanism is working, it can drive the crystal bonding workbench to translate along the X-axis and / or Y-axis direction.

7. The semiconductor die bonding machine according to claim 5 or 6, characterized in that: It also includes a pressing plate mechanism and a roller mechanism, wherein the pressing plate mechanism is used to press the frame loaded with the material to be solidified, and the roller mechanism is used to replace the frame.

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