Three-dimensional vapor chamber heat dissipation device

Abstract

The utility model provides a three-dimensional uniform temperature plate heat dissipation device which comprises a body, a heat pipe, a fin assembly and a working fluid. The body comprises a bottom plate and a vertical plate, the vertical plate is vertically arranged on the bottom plate, a first cavity is formed in the bottom plate in a surrounding mode, a second cavity is formed in the vertical plate in a surrounding mode, and the first cavity is communicated with the second cavity. The heat pipe extends from one side of the vertical plate and is communicated with the second chamber. The fin assembly is arranged on the heat pipe. The working fluid is filled in the bottom plate in a liquid state, and when vaporized, the working fluid can flow to the vertical plates and the heat pipes. Therefore, the utility model provides the three-dimensional uniform-temperature plate heat dissipation device which is provided with the heat pipes which extend in parallel to the side direction of the bottom plate and are tightly arranged.

Description

Technical Field

[0001] This utility model relates to a three-dimensional heat dissipation plate, and more particularly to a three-dimensional heat dissipation device with a structure that extends in a plane and is closely arranged. Background Technology

[0002] A 3D vapor chamber is a phase-change heat transfer device. Its structure combines a vapor chamber with heat pipes, and its internal cavities are interconnected, allowing substances undergoing gas-liquid interaction to move freely between the two cavities, achieving better heat dissipation. However, existing 3D vapor chambers require a significant amount of space for the heat pipes and heat dissipation fins, limiting their application, especially in flat spaces. Utility Model Content

[0003] This utility model provides a three-dimensional heat dissipation device with heat pipes that extend laterally parallel to the base plate and are closely arranged.

[0004] This invention provides a three-dimensional heat dissipation device with a vapor chamber, comprising a body, a heat pipe, a fin assembly, and a working fluid. The body includes a base plate and a vertical plate, with the vertical plate erected on the base plate. A first chamber is formed within the inner perimeter of the base plate, and a second chamber is formed within the inner perimeter of the vertical plate, with the first and second chambers connected. The heat pipe extends from one side of the vertical plate and connects to the second chamber. The fin assembly is disposed on the heat pipe. The working fluid is liquid and filled within the base plate, and when the working fluid vaporizes, it flows to the vertical plate and the heat pipe.

[0005] In one embodiment of this utility model, the heat pipe is parallel to the base plate.

[0006] In one embodiment of this utility model, a first capillary structure is attached to the inner wall of the base plate. A second capillary structure is attached to the inner wall of the upright plate, and the first capillary structure is connected to the second capillary structure. A third capillary structure is attached to the inner wall of the heat pipe, and the second capillary structure is connected to the third capillary structure.

[0007] In one embodiment of this invention, a buffer space extends from the second chamber. The first chamber is connected to the buffer space.

[0008] In one embodiment of this utility model, the upright plate is disposed on one side of the edge of the base plate.

[0009] In one embodiment of this invention, another heat pipe extends from one side of the base plate and connects to the first chamber. Another fin assembly is disposed on the other heat pipe.

[0010] In one embodiment of the present invention, the main body includes another upright plate, which is erected on the base plate and disposed opposite to each other on the two sides of the base plate. A heat pipe is connected between the upright plate and the other upright plate.

[0011] The three-dimensional heat dissipation plate of this utility model has heat pipes extending laterally from its vertical plate, so that the heat pipes can be arranged parallel to the base plate, thereby avoiding the overall height of the three-dimensional heat dissipation plate being too high. Attached Figure Description

[0012] Figure 1 This is a three-dimensional schematic diagram of the three-dimensional heat dissipation device of the first embodiment of the present utility model.

[0013] Figure 2 This is a three-dimensional exploded view of the three-dimensional heat dissipation device of the first embodiment of this utility model.

[0014] Figure 3 and Figure 4 This is a cross-sectional view of the three-dimensional heat dissipation device of the first embodiment of this utility model.

[0015] Figure 5 This is a cross-sectional view of the three-dimensional heat dissipation device of the second embodiment of the present invention.

[0016] Figure 6 This is a cross-sectional view of the three-dimensional heat dissipation device of the third embodiment of this utility model.

[0017] Figure 7 This is a cross-sectional view of the three-dimensional heat dissipation device of the fourth embodiment of this utility model.

[0018] Figure 8 This is a cross-sectional view of the three-dimensional heat dissipation device of the fifth embodiment of this utility model.

[0019] In the picture:

[0020] 100: Ontology;

[0021] 101: First chamber;

[0022] 102: Second chamber;

[0023] 103: Buffer space;

[0024] 110: Base plate;

[0025] 120, 120a, 120b, 120c: Vertical panels;

[0026] 111: First capillary structure;

[0027] 121: Second capillary structure;

[0028] 200, 200a, 200b, 200c: Heat pipes;

[0029] 201, 201c: Third capillary structure;

[0030] 300, 300a, 300b, 300c: Fin assembly. Detailed Implementation

[0031] In the description of this utility model, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting conditions of this utility model.

[0032] Unless otherwise defined, the terms "substantially" and "approximately" are used to describe and narrate small changes. When used in connection with an event or situation, the term may include the exact moment the event or situation occurred, or an approximate point in time. For example, when used in connection with a numerical value, the term may include a range of variation less than or equal to ±10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0033] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0034] See Figures 1 to 4 This utility model provides a three-dimensional heat dissipation device with a heat exchange plate, which includes a body 100, at least one heat pipe 200, at least one fin assembly 300 and a working fluid (not shown).

[0035] In this embodiment, the body 100 includes a base plate 110 and a vertical plate 120. The vertical plate 120 is erected on the top surface of the base plate 110, specifically, the vertical plate 120 is disposed on one side of the edge of the base plate 110. The base plate 110 is hollow and forms a first chamber 101 within it, and the vertical plate 120 is hollow and forms a second chamber 102 within it, and the first chamber 101 and the second chamber 102 are connected. A first capillary structure 111 is attached to the inner wall of the base plate 110, and a second capillary structure 121 is attached to the inner wall of the vertical plate 120, and the first capillary structure 111 is connected to the second capillary structure 121.

[0036] In this embodiment, a portion of the upright plate 120 may be selectively configured as a boss to form a buffer space 103 within it, the buffer space 103 extending from the second chamber 102. The first chamber 101 and the buffer space 103 may be selectively configured to communicate with each other.

[0037] In its simplest implementation, a single heat pipe 200 can achieve the desired effect. The heat pipe 200 extends from one side of the vertical plate 120 and connects to the second chamber 102. In this embodiment, the heat pipe 200 extends parallel to the bottom plate 110 beyond its boundary, but this invention is not limited thereto. A third capillary structure 201 is attached to the inner wall of the heat pipe 200, and the second capillary structure 121 is connected to the third capillary structure 201. The fin assembly 300 is disposed on the outer wall of the heat pipe 200. Although multiple heat pipes 200 with the same structure and function are arranged on the same side of the vertical plate 120 in this embodiment, this invention does not limit the number of heat pipes 200.

[0038] The working fluid is filled in a liquid state within the base plate 110, and when the working fluid vaporizes, it can flow to the vertical plate 120 and the heat pipe 200. In this embodiment, the bottom surface of the base plate 110 is used to contact a heat source (not shown). The heat source is generally located on a circuit board (not shown), and the base plate 110 of the three-dimensional heat dissipation device is stacked on the circuit board. After the base plate 110 absorbs heat from the heat source, the working fluid vaporizes in the first chamber 101 due to heat, and the vaporized working fluid can then flow to the second chamber 102 and the heat pipe 200. The buffer space 103 can be used to regulate the gaseous working fluid, preventing insufficient heat dissipation caused by a sudden increase in the heating power of the heat source not being able to enter the heat pipe 200. The gaseous working fluid condenses into a liquid state after dissipating heat energy through the fin assembly 300 in the heat pipe 200. The liquid working fluid in the heat pipe 200 is adsorbed by the third capillary structure 201 and then flows back to the first chamber 101 through the second capillary structure 121 and the first capillary structure 111.

[0039] The three-dimensional vapor chamber heat dissipation device of this utility model has a heat pipe 200 extending laterally from its vertical plate 120, allowing the heat pipe 200 to be arranged parallel to the circuit board, thereby avoiding excessive height of the overall three-dimensional vapor chamber heat dissipation device. Depending on different configuration requirements, the three-dimensional vapor chamber heat dissipation device of this utility model can have various possible configuration variations as described below.

[0040] See Figure 5 The second embodiment of the present invention is shown. The three-dimensional heat dissipation device of this embodiment includes a body 100, a plurality of heat pipes 200, a plurality of fin assemblies 300, and a working fluid. The body 100 has a base plate 110 as described in the first embodiment, but in this embodiment, a vertical plate 120a is erected in the middle of the body 100, and heat pipes 200 are respectively arranged on two sides of the vertical plate 120a. The heat pipes 200 on both sides of the vertical plate 120a are all connected to the second chamber 102. In this embodiment, each heat pipe 200 extends parallel to the base plate 110, and at least a portion of each heat pipe 200 is stacked with the base plate 110. A third capillary structure 201 is attached to the inner wall of each heat pipe 200, and the second capillary structure 121 in the vertical plate 120a connects to each third capillary structure 201. The fin assemblies 300 are respectively arranged on both sides of the vertical plate 120a, and each heat pipe 200 is connected in series with the corresponding fin assembly 300. In this way, the space on both sides of the vertical plate 120a can be effectively utilized to arrange the heat pipes 200 and the fin assemblies 300.

[0041] In this embodiment, a portion of the upright plate 120a may be selectively configured with a buffer space 103 as described in the first embodiment, and a portion of the heat pipe 200 may also be directly connected to the buffer space 103.

[0042] See Figure 6 The third embodiment of this utility model is shown. The three-dimensional vapor chamber heat dissipation device of this embodiment includes a body 100, a plurality of heat pipes 200b, a fin assembly 300b, and a working fluid. The body 100 has a base plate 110 as described in the first embodiment and a vertical plate 120b. Each heat pipe 200b has the same structure as in the previous embodiment and is disposed on one side of the vertical plate 120b. In this embodiment, each heat pipe 200b extends parallel to the base plate 110, and at least a portion of each heat pipe 200b is stacked with the base plate 110. Each heat pipe 200b is connected in series with the fin assembly 300b, thereby making the heat pipes 200b, the fin assembly 300b, and the base plate 110 closely arranged. In this embodiment, a portion of the upright plate 120b can be selectively configured as a boss and surrounded by a buffer space 103. The buffer space 103 extends from the second chamber 102 and is respectively disposed on two sides of the upright plate 120b along with the heat pipes 200b to effectively utilize the space on both sides of the upright plate 120b.

[0043] See Figure 7 The fourth embodiment of the present invention is shown. The three-dimensional heat dissipation device of this embodiment includes a body 100, a plurality of heat pipes 200, 200c, a plurality of fin assemblies 300, 300c, and a working fluid. The body 100 has a base plate 110 as described in the first embodiment, but the body 100 in this embodiment has a pair of upright plates 120c, which are arranged opposite each other on both sides of the base plate 110. The heat pipes 200, 200c extend parallel to the base plate 110 from both sides of each upright plate 120c. Specifically, a portion of the heat pipes 200c are connected between the upright plates 120c and stacked with the base plate 110, while the remaining heat pipes 200 extend from each upright plate 120c to the outside of the base plate 110. The fin assemblies 300, 300c are respectively disposed on two sides of each upright plate 120c. That is, a portion of the fin assemblies 300c are disposed between the two upright plates 120c, while the remaining fin assemblies 300 are disposed on opposite sides outside the base plate 110. Furthermore, each heat pipe 200, 200c is connected in series with its corresponding fin assembly 300, 300c. In this embodiment, the heat pipes 200, 200c and the fin assemblies 300, 300c extend to their maximum extent in a direction parallel to the base plate 110.

[0044] See Figure 8 The fifth embodiment of the present invention is shown. The structure of the three-dimensional heat dissipation device of this embodiment is roughly the same as that of the first embodiment. However, according to the heat dissipation requirements, a heat pipe 200a and a fin assembly 300a can be erected on the top surface of the base plate 110 to directly dissipate the heat energy of the base plate 110.

[0045] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A three-dimensional temperature radiating plate heat dissipation device, characterized in that: Include: A body, comprising a bottom plate and a vertical plate, wherein the vertical plate is vertically arranged on the bottom plate, a first chamber is formed within the bottom plate, a second chamber is formed within the vertical plate, and the first chamber is communicated with the second chamber; a heat pipe extending from one side of the vertical plate and communicating with the second chamber; a fin assembly disposed on the heat pipe; and A working fluid is filled in the bottom plate in liquid form, and can flow to the vertical plate and the heat pipe when the working fluid vaporizes.

2. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: The heat pipe is parallel to the bottom plate.

3. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: The inner wall of the bottom plate is provided with a first capillary structure.

4. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 3, characterized in that: A second capillary structure is attached to the inner wall of the vertical plate, and the first capillary structure is connected to the second capillary structure.

5. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 4, characterized in that: A third capillary structure is attached to the inner wall of the heat pipe, and the second capillary structure is connected to the third capillary structure.

6. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: The second chamber extends out a buffer space.

7. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 6, characterized in that: The first chamber is communicated with the buffer space.

8. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: The vertical plate is arranged on one side of the edge of the bottom plate.

9. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: Another heat pipe extends from one side of the bottom plate and is connected to the first chamber.

10. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 9, characterized in that: Another fin assembly is arranged on the other heat pipe.

11. The three-dimensional temperature homogenizing plate heat dissipation device according to claim 1, characterized in that: The main body comprises another vertical plate. The vertical plate and the other vertical plate are vertically arranged on the bottom plate and are arranged on two sides of the bottom plate facing the ground. The heat pipe is connected between the vertical plate and the other vertical plate.

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