Temperature control equipment for semiconductor production

Abstract

The utility model belongs to the technical field of semiconductor production, and discloses a temperature control device for semiconductor production. Comprising a temperature control box, a mounting hole is formed in one end of the temperature control box, a cover plate is mounted in the mounting hole through bolts, and a temperature sensor is mounted at one end of the cover plate; heat dissipation nets are embedded in the two sides of the temperature control box, a water tank is installed at the bottom of the other end of the temperature control box, a connecting box is installed at the top of the other end of the temperature control box, a water pump is installed at one end of the water tank, and a circulating pipe is installed at the output end of the water pump. When the external environment temperature drops suddenly, the telescopic rubber pipe is in an unfolded state to close the heat dissipation net, the heat preservation effect is achieved, the equipment is prevented from being affected by the external environment, the equipment is cooled through matched use of the water tank, the water pump, the circulating pipe, the connecting box and the connecting pipe in the heat dissipation process, and the reciprocating mechanism is additionally arranged; when the cooling liquid flows, the telescopic rubber pipe is driven by the reciprocating mechanism to be folded and stored, so that the heat dissipation net is opened, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, and more specifically, to a temperature control device for semiconductor production. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of semiconductors. In semiconductor production, semiconductor temperature control uses the thermal sensitivity of semiconductor materials to control temperature. When current passes through the semiconductor material, the material absorbs part of the electrical energy and converts it into heat energy, causing the device to heat up or cool down. By controlling the current size and on-off time, the temperature of the semiconductor can be precisely controlled to increase or decrease the temperature.

[0003] After searching, the utility model with patent number "CN219533687U" provides a temperature control device for semiconductor production. The temperature control device for semiconductor production, through the second heat dissipation hole, can directly discharge the heat through the second heat dissipation hole when the internal temperature of the device is not high. The circulating cooling pipe is set to cool the load device when the temperature generated by the load device cannot be fully discharged through the second heat dissipation hole. The fan and the first heat dissipation hole are set to reduce the temperature inside the outer shell in time when the internal temperature of the device is too high, avoiding the situation that the internal temperature of the outer shell is too high and causing the service life of the equipment to be reduced. However, during the semiconductor production process, the device does not take into account that the heat dissipation holes are in a normally open state when not in use, the temperature drops suddenly, and the device is affected by the external environment, which will cause the device to be affected and unusable. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides a temperature control device for semiconductor production.

[0005] To achieve the above object, the utility model provides the following technical solution: a temperature control device for semiconductor production, comprising a temperature control box, one end of which is provided with a mounting hole, a cover plate is installed inside the mounting hole by bolts, and one end of the cover plate is installed with a temperature sensor;

[0006] Heat dissipation nets are embedded on both sides of the temperature control box;

[0007] A water tank is installed at the bottom of the other end of the temperature control box, a connection box is installed at the top of the other end of the temperature control box, a water pump is installed at one end of the water tank, a circulation pipe is installed at the output end of the water pump, the circulation pipe is located in the inner cavity of the temperature control box, a reciprocating mechanism is provided on the outside of the circulation pipe, the upper end of the circulation pipe is fixedly connected to one end of the connection box, and a connection pipe is connected between the connection box and the water tank;

[0008] The other end of the temperature control box is connected to a telescopic rubber tube, one end of the telescopic rubber tube is connected to a connecting frame, a fixing plate is symmetrically installed on the inner side of the connecting frame, and one end of the fixing plate is elastically connected to the inner wall of the temperature control box through a limit spring.

[0009] Furthermore, the reciprocating mechanism includes a fixed rod, a belt drive assembly, a side plate, a limit plate and a mounting box. The fixed rod is installed on both sides of the circulation pipe. The upper end of the fixed rod is rotatably connected to a rotating rod. The rotating rod is inserted into the outer array of the circulation pipe and is installed with blades.

[0010] Furthermore, belt drive assemblies are installed on both sides of the rotating rod and the inner wall of the temperature control box. The belt drive assembly consists of two pulleys with belts tensioned on the outside. One pulley is installed on one side of the rotating rod, and the other pulley is rotatably installed on the inner wall of the temperature control box.

[0011] Furthermore, a mounting plate is installed on the outer side of the belt, a crown gear 1 is installed on the inner side of the mounting plate, a baffle is rotatably connected to the outer side of the crown gear 1 via a torsion spring, and the side plate is installed on the inner side of the fixed plate and slidably contacts the baffle.

[0012] Furthermore, both sides of the baffle are provided with rotation grooves rotatably connected to the crown gear 1, the interior of the rotation groove is elastically connected to the crown gear 2 slidingly meshing with the crown gear 1 through a positioning spring, and the outer side of the crown gear 2 is symmetrically equipped with limit blocks slidably connected to the rotation groove, and the sliding part of the rotation groove and the limit block is linearly recessed.

[0013] Furthermore, a pressing rod is installed on the outer side of the crown gear 2, and a through hole matching the size of the pressing rod is opened on the side where the crown gear 1 and the mounting plate are in contact. The limit plate is installed on the inner wall of the temperature control box and is slidably connected to the pressing rod.

[0014] Furthermore, the installation box is installed on the outside of the temperature control box, a cylinder is installed inside the installation box, a fixed frame is installed at the output end of the cylinder, the inner wall of the temperature control box is provided with a groove slidably connected to the fixed frame, one side of the fixed frame is provided with an opening, the inside of the opening is elastically connected with a positioning block through a buffer spring, and one side of the positioning block is provided with an inclined surface slidably connected to the connecting frame.

[0015] Compared with the prior art, the utility model has the following beneficial effects: when the external ambient temperature drops suddenly, the telescopic rubber tube is in an expanded state to close the heat dissipation net, which plays a role in heat preservation and prevents the equipment from being affected by the external environment. When dissipating heat, the equipment is cooled by the coordinated use of the water tank, water pump, circulation pipe, connection box and connection pipe, and a reciprocating mechanism is added. When the coolant flows, the reciprocating mechanism drives the telescopic rubber tube to be folded and stored, thereby realizing the opening of the heat dissipation net and increasing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a cross-sectional view of the internal structure of the temperature control box of the utility model;

[0018] Figure 3 For the utility model Figure 2 A magnified view of the structure at center;

[0019] Figure 4 This is a cross-sectional view of the internal structure of the baffle of the utility model;

[0020] Figure 5 This is a top view of the internal structure of the temperature control box of the utility model;

[0021] Figure 6 For the utility model Figure 5 Enlarged view of the structure at point B in the middle.

[0022] In the figure:

[0023] 1. Temperature control box; 101. Cover plate; 102. Temperature sensor; 2. Heat dissipation net; 3. Water tank; 4. Circulation pipe; 5. Connection box; 6. Connection pipe; 7. Telescopic rubber tube; 8. Connection frame; 9. Fixed plate; 10. Limit spring; 11. Fixed rod; 12. Rotating rod; 13. Blade; 14. Belt drive assembly; 1401. Mounting plate; 15. Baffle; 16. Side plate; 17. Limit plate; 18. Crown gear one; 19. Crown gear two; 1901. Limit block; 20. Positioning spring; 21. Press rod; 22. Mounting box; 23. Cylinder; 24. Fixed frame; 25. Buffer spring; 26. Positioning block. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-6 The utility model provides the following technical solutions: a temperature control device for semiconductor production, including a temperature control box 1, a mounting hole is provided at one end of the temperature control box 1, a cover plate 101 is installed inside the mounting hole by bolts, the cover plate 101 is removed by bolts, and the internal parts of the temperature control box 1 are conveniently repaired, a temperature sensor 102 is installed at one end of the cover plate 101, during specific implementation, a pt100 temperature sensor can be selected, and the internal temperature of the temperature control box 1 is monitored by the temperature sensor 102, the temperature sensor 102 is electrically connected to the water pump and the cylinder 23, and heat dissipation nets 2 are embedded on both sides of the temperature control box 1, and dense mesh holes are opened inside the heat dissipation net 2, and the internal and external air of the temperature control box 1 are conducted through the mesh holes, thereby realizing the heat dissipation inside the temperature control box 1.

[0026] A water tank 3 is installed at the bottom of the other end of the temperature control box 1, and a connecting box 5 is installed at the top of the other end of the temperature control box 1. A water pump is installed at one end of the water tank 3, and a circulating pipe 4 is installed at the output end of the water pump. The circulating pipe 4 is located in the inner cavity of the temperature control box 1, and a reciprocating mechanism is provided on the outer side of the circulating pipe 4. The upper end of the circulating pipe 4 is fixedly connected to one end of the connecting box 5. A connecting pipe 6 is connected between the connecting box 5 and the water tank 3. The connecting pipe 6 is spiral, which increases the residence time of the coolant in the connecting pipe 6 and improves the heat dissipation effect of the coolant in the connecting pipe 6. The water tank 3, the connecting box 5, the circulating pipe 4 and the connecting pipe 6 are internally connected. A water injection hole is provided at one end of the water tank 3, and coolant can be added to the water tank 3 through the water injection hole. The coolant is circulated in the water tank 3, the connecting box 5, the circulating pipe 4 and the connecting pipe 6 through the water pump.

[0027] The other end of the temperature control box 1 is connected to a telescopic rubber tube 7, one end of the telescopic rubber tube 7 is connected to a connecting frame 8, a fixing plate 9 is symmetrically installed on the inner side of the connecting frame 8, one end of the fixing plate 9 is elastically connected to the inner wall of the temperature control box 1 through a limit spring 10, and the expansion action of the telescopic rubber tube 7 after compression is realized by the limit spring 10.

[0028] The installation box 22 is installed on the outside of the temperature control box 1, and a cylinder 23 is installed inside the installation box 22. A fixed frame 24 is installed at the output end of the cylinder 23. A groove is provided on the inner wall of the temperature control box 1 for sliding connection with the fixed frame 24. An opening is provided on one side of the fixed frame 24. A positioning block 26 is elastically connected to the inside of the opening through a buffer spring 25. A slope is provided on one side of the positioning block 26 for sliding connection with the connecting frame 8. The slope serves to reduce the friction resistance between the positioning block 26 and the connecting frame 8. The fixed frame 24 is moved by the cylinder 23 to adjust the position of the positioning block 26, thereby releasing the limit of the positioning block 26 on the connecting frame 8.

[0029] The reciprocating mechanism includes a fixed rod 11, a belt transmission assembly 14, a side plate 16, a limit plate 17 and a mounting box 22. The fixed rod 11 is installed on both sides of the circulation pipe 4. The upper end of the fixed rod 11 is rotatably connected with a rotating rod 12. The rotating rod 12 is inserted into the outer array of the circulation pipe 4 and a blade 13 is installed. The outer side of the circulation pipe 4 is provided with a rotating hole rotatably connected to the rotating rod 12. When the coolant flows inside the circulation pipe 4, the blade 13 is driven by the resistance of the coolant to drive the rotating rod 12 to rotate. The belt transmission assembly 1 is installed on both sides of the rotating rod 12 and the inner wall of the temperature control box 1. 4. The belt transmission assembly 14 is composed of a belt tensioned on the outer side of two pulleys. One pulley is installed on one side of the rotating rod 12, and the other pulley is rotatably installed on the inner wall of the temperature control box 1. A mounting plate 1401 is installed on the outer side of the belt, and a crown gear 18 is installed on the inner side of the mounting plate 1401. The outer side of the crown gear 18 is rotatably connected with a baffle 15 through a torsion spring. The rotation angle of the baffle 15 is limited by the torsion spring. The side plate 16 is installed on the inner side of the fixed plate 9 and slides against the baffle 15. The side plate 16 is located at the upper end of the belt. A gap is provided between the belt and the baffle plate 15 for sliding against the baffle plate 15. A rotation groove is provided on both sides of the baffle plate 15 for rotationally connecting with the crown gear 18. The inside of the rotation groove is elastically connected with the crown gear 19 for sliding engagement with the crown gear 18 through a positioning spring 20. A limit block 1901 for sliding engagement with the rotation groove is symmetrically installed on the outside of the crown gear 19. The sliding parts of the rotation groove and the limit block 1901 are linearly concave. The crown gear 19 can only slide in the rotation groove by limiting the rotation groove and the limit block 1901. The crown gear 18 is meshed with the crown gear 19. When closed, the baffle 15 is fixed by the limit block 1901 and the rotation groove limit baffle 15, a pressing rod 21 is installed on the outer side of the crown gear 2 19, and a through hole matching the size of the pressing rod 21 is opened on the side where the crown gear 1 18 and the mounting plate 1401 are in contact. The pressing rod 21 is cylindrical and can rotate and slide in the through hole. The limit plate 17 is installed on the inner wall of the temperature control box 1 and is slidably connected with the pressing rod 21. The side of the pressing rod 21 that contacts the limit plate 17 is circular and protrudes, which plays a role in reducing the friction resistance between the pressing rod 21 and the limit plate 17.

[0030] Working principle: When not in use, the telescopic rubber tube 7 is in the unfolded state, and the telescopic rubber tube 7 is in close contact with the heat dissipation net 2 to close the heat dissipation net 2. When the equipment is in use, the water pump is started, and the water pump drives the coolant in the water tank 3 to enter the circulation pipe 4. The circulation pipe 4 brings heat into the connecting box 5 through the inner cavity of the temperature control box 1. The coolant in the connecting box 5 enters the spiral-shaped connecting pipe 6 for cooling. The cooled coolant circulates into the water tank 3. When the coolant in the circulation pipe 4 flows, it drives the blades 13 to rotate, and the blades 13 drive the rotating rod 12 to rotate, and the rotating rod 12 drives the belt drive assembly 14 to rotate. The belt in the belt drive assembly 14 drives the baffle 15 to move through the mounting plate 1401, and the baffle 15 moves to fit the side plate 16, driving the connecting frame 8 to move, and the connecting frame 8 squeezes the telescopic rubber tube 7 to compress the telescopic rubber tube 7, and the connecting frame 8 drives the fixing plate 9 to move and squeeze the limit spring 10, and the baffle 15 moves to be slidably connected with the limit plate 17, and the pressing rod 21 is squeezed by the limit plate 17 to drive the crown gear 2 19 to slide, and the crown gear 2 19 squeezes the positioning spring 20. At this time, the crown gear 2 19 is not in contact with the crown gear 1 18, and the baffle 15 continues to move and is squeezed by the side plate 1 6 resistance to rotation, squeezing the torsion spring, the baffle 15 moves from the bottom of the side plate 16 to the point where it is out of contact with the side plate 16, and then it is rotated back to its original position in the opposite direction by the rebound force of the torsion spring. At this time, the pressing rod 21 is not in contact with the limiting plate 17, and the thrust of the positioning spring 20 drives the crown gear 2 19 to mesh with the crown gear 1 18, and the baffle 15 is fixed by the limiting block 1901 and the rotating groove. When the connecting frame 8 slides, it is squeezed and contacted with the positioning block 26. The positioning block 26 slides toward the opening of the fixed frame 24 under pressure and compresses the buffer spring 25. When the baffle 15 is out of contact with the side plate 16, the connecting frame 8 slides. At one end of the movable positioning block 26, the rebound force of the buffer spring 25 drives the positioning block 26 to contact one end of the connecting frame 8. At this time, the telescopic rubber tube 7 is in a folded state, the mesh of the heat dissipation net 2 is opened, and the internal heat of the temperature control box 1 is dissipated through the heat dissipation net 2. When not in use, the cylinder 23 is started to drive the fixed frame 24 to slide toward the groove of the temperature control box 1, and the positioning block 26 is driven by the buffer spring 25 to enter the groove of the temperature control box 1. At this time, the connecting frame 8 is not contacted by the positioning block 26, and the rebound force of the limit spring 10 drives the fixed plate 9 and the connecting frame 8 to slide in the opposite direction, thereby realizing the expansion of the telescopic rubber tube 7.

[0031] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0032] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A temperature control device for semiconductor production, comprising a temperature control box (1), characterized in that: One end of the temperature control box (1) is provided with a mounting hole, a cover plate (101) is mounted inside the mounting hole via bolts, and a temperature sensor (102) is mounted on one end of the cover plate (101); Heat dissipation nets (2) are embedded on both sides of the temperature control box (1); A water tank (3) is installed at the bottom of the other end of the temperature control box (1), a connection box (5) is installed at the top of the other end of the temperature control box (1), a water pump is installed at one end of the water tank (3), a circulation pipe (4) is installed at the output end of the water pump, the circulation pipe (4) is located in the inner cavity of the temperature control box (1), a reciprocating mechanism is provided on the outer side of the circulation pipe (4), the upper end of the circulation pipe (4) is fixedly connected to one end of the connection box (5), and a connection pipe (6) is connected between the connection box (5) and the water tank (3); The other end of the temperature control box (1) is connected to a telescopic rubber tube (7), one end of the telescopic rubber tube (7) is connected to a connection frame (8), a fixing plate (9) is symmetrically mounted on the inner side of the connection frame (8), and one end of the fixing plate (9) is elastically connected to the inner wall of the temperature control box (1) via a limit spring (10).

2. A temperature control device for semiconductor production according to claim 1, characterized in that: The reciprocating mechanism comprises a fixed rod (11), a belt transmission assembly (14), a side plate (16), a limit plate (17) and a mounting box (22); the fixed rod (11) is mounted on both sides of a circulation pipe (4); the upper end of the fixed rod (11) is rotatably connected to a rotating rod (12); and the rotating rod (12) is inserted into the circulation pipe (4) and an outer array is mounted with blades (13).

3. A temperature control device for semiconductor production according to claim 2, characterized in that: Belt drive assemblies (14) are installed on both sides of the rotating rod (12) and the inner wall of the temperature control box (1). The belt drive assembly (14) is composed of two pulleys with belts tensioned on the outer sides thereof, one of the pulleys being installed on one side of the rotating rod (12) and the other pulley being rotatably installed on the inner wall of the temperature control box (1).

4. A temperature control device for semiconductor production according to claim 3, characterized in that: A mounting plate (1401) is installed on the outer side of the belt, a crown gear (18) is installed on the inner side of the mounting plate (1401), the outer side of the crown gear (18) is rotatably connected to a baffle (15) via a torsion spring, and the side plate (16) is installed on the inner side of the fixed plate (9) and is in sliding contact with the baffle (15).

5. A temperature control device for semiconductor production according to claim 4, characterized in that: The baffle (15) has a rotation groove on both sides thereof which is rotatably connected to the crown gear 1 (18); the interior of the rotation groove is elastically connected to the crown gear 2 (19) which is slidably meshed with the crown gear 1 (18) via a positioning spring (20); a limit block (1901) which is slidably connected to the rotation groove is symmetrically mounted on the outer side of the crown gear 2 (19); the sliding portion between the rotation groove and the limit block (1901) is linearly concave.

6. A temperature control device for semiconductor production according to claim 5, characterized in that: A pressing rod (21) is installed on the outer side of the crown gear 2 (19); a through hole matching the size of the pressing rod (21) is opened on the side where the crown gear 1 (18) and the mounting plate (1401) are in contact; the limiting plate (17) is installed on the inner wall of the temperature control box (1) and is slidably connected to the pressing rod (21).

7. The temperature control equipment for semiconductor production according to claim 2, characterized in that: The installation box (22) is installed on the outside of the temperature control box (1), a cylinder (23) is installed inside the installation box (22), a fixed frame (24) is installed at the output end of the cylinder (23), the inner wall of the temperature control box (1) is provided with a groove slidably connected to the fixed frame (24), one side of the fixed frame (24) is provided with an opening, the inside of the opening is elastically connected to a positioning block (26) via a buffer spring (25), and one side of the positioning block (26) is provided with an inclined surface slidably connected to the connection frame (8).

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